Relevant bibliographies by topics / Backplane

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Backplane'

Author: Grafiati
Published: 4 June 2021
Last updated: 26 July 2025

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Backplane.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Backplane"

1

Morgan, Chad, and Adam Healey. "A Comparison of 25 Gbps NRZ & PAM-4 Modulation Used in Reference, Legacy, & Premium Backplane Channels." International Symposium on Microelectronics 2012, no. 1 (2012): 000283–94. http://dx.doi.org/10.4071/isom-2012-tp21.

Full text
Abstract:
Standards bodies are now examining how to increase the throughput of high-density backplane links to 25 Gbps. One method for achieving this is to construct premium backplane links utilizing advanced materials and connectors. Another approach is to re-use legacy backplanes by employing PAM-4 signaling at half of the baud rate. For PAM-4 to offer an advantage over NRZ, the signal-to-noise ratio (SNR) at the slicer input, i.e. after equalization, must be ∼9.5 dB better than NRZ to overcome loss of separation between signal levels. This paper will examine 25 Gbaud NRZ and 12.5 Gbaud PAM-4 signalin
APA, Harvard, Vancouver, ISO, and other styles
2

Sun, Wei Min, Shao Qing Zhang, and Shi Ru Hao. "The Soleplate Materials and Performance of Table Tennis Bat with the Composite Properties of Materials in Material Engineering." Advanced Materials Research 583 (October 2012): 232–35. http://dx.doi.org/10.4028/www.scientific.net/amr.583.232.

Full text
Abstract:
The study analyzed the relationship between the different composite materials, distributions of table tennis backplanes and the backplanes different performances. Although there’re so many brands which are with different price in the market of the table tennis equipment, the sportsmen could also find some principle through observing the functional material and manufacturing processes, and then understand the performance of the backplane; this study analyzed the relationship between the performance of table tennis bat and the composite properties of materials.
APA, Harvard, Vancouver, ISO, and other styles
3

Jung, Dongsoon, Ara Cho, Hokwon Kim, Minsu Jeong, and Jeong Hwan Lee. "32‐4: Late‐News Paper: A 1.03‐inch 2560x2560 3514 PPI Low Power OLEDoS Backplane with In‐pixel Up‐scaling Technique." SID Symposium Digest of Technical Papers 54, no. 1 (2023): 465–68. http://dx.doi.org/10.1002/sdtp.16593.

Full text
Abstract:
A 1.03‐inch 2560x2560 low power OLEDoS backplane with a proposed in‐pixel up‐scaling technique is designed and implemented. Due to the proposed technique based on interpolated pixel scheme, the pixel density of the backplane realizes 3514 PPI (Pixels per Inch) with lower power consumption. The backplane has 1280x1280 input video resolution and output video resolution is upscaled to 2560x2560 without additional up‐scaler. A measured power consumption per 1 mega pixel without OLED frontplane is 16.3mW which is less than our previous 0.7‐inch 1920x1080 OLEDoS backplane with the same semiconductor
APA, Harvard, Vancouver, ISO, and other styles
4

Reyes, Roy M., and Albert J. Corda. "Cylindrical optical backplane." Applied Optics 31, no. 17 (1992): 3208. http://dx.doi.org/10.1364/ao.31.003208.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Kufner, S., I. Frese, and M. Kufner. "Optisches Backplane-Konzept." wt Werkstattstechnik online 91, no. 12 (2001): 747–50. http://dx.doi.org/10.37544/1436-4980-2001-12-747.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Sejera, Marloun, Takashi Yamauchi, Necmi Cihan Orger, Yukihisa Otani, and Mengu Cho. "Scalable and Configurable Electrical Interface Board for Bus System Development of Different CubeSat Platforms." Applied Sciences 12, no. 18 (2022): 8964. http://dx.doi.org/10.3390/app12188964.

Full text
Abstract:
A flight-proven electrical bus system for the 1U CubeSat platform was designed in the BIRDS satellite program at the Kyushu Institute of Technology. The bus utilizes a backplane board as the mechanical and electrical interface between the subsystems and the payloads. The electrical routes on the backplane are configured by software using a complex programmable logic device (CPLD). It allows for reusability in multiple CubeSat projects while lowering costs and development time; as a result, resources can be directed toward developing the mission payloads. Lastly, it provides more time for integ
APA, Harvard, Vancouver, ISO, and other styles
7

An, Gang, Yu Li, and Xin Li. "Architecture Design of Aviation Fault-tolerant Computer Based on ARINC659 Bus Technology." MATEC Web of Conferences 179 (2018): 03025. http://dx.doi.org/10.1051/matecconf/201817903025.

Full text
Abstract:
The ARINC659 backplane bus is suitable for high safety and high reliability requirements of aircraft on-board computer communication systems. This paper analyzes the structure of ARINC 659 serial backplane bus and the bus fault tolerance mechanism. On the basis of backplane bus, a 4 degree of aviation fault-tolerant computer is designed. Moreover, the computer architecture and computer system of the instruction branch and monitoring branch are designed in the computer channel. The fault-tolerant management of the computer is realized by bus fault tolerance, redundancy voting between computers
APA, Harvard, Vancouver, ISO, and other styles
8

Wartenberg, Philipp, Andreas Fritscher, Bernd Richter, et al. "3‐4: Invited Paper: A 2.5µm Dot Pitch 0.18” OLED Microdisplay on 28nm CMOS Backplane." SID Symposium Digest of Technical Papers 54, no. 1 (2023): 13–16. http://dx.doi.org/10.1002/sdtp.16475.

Full text
Abstract:
This paper reports on the most recent results of a 2.5um dot pitch 0.18” OLED microdisplay which has been realized in a 28nm CMOS backplane. It proves the general feasibility of small‐node CMOS technologies for microdisplays enabling the integration of far more functionality in the backplane. This has been successfully demonstrated by integrating a complete frame buffer in the backplane which comes with substantial benefits in terms of driving the system from a low‐bandwidth data source. This results in significant power savings and smaller sized systems which improves ergonomics which is anot
APA, Harvard, Vancouver, ISO, and other styles
9

Ou, Chung-Jen, Ching-Nan Chuang, Yen-Ni Lin, Shih-Yuan Liu, and Wen-Chun Wang. "P‐244: Late‐News Poster: Flexible mini‐LED Backplane with Laminated QDF for Optimized Illuminating." SID Symposium Digest of Technical Papers 55, no. 1 (2024): 1884–88. http://dx.doi.org/10.1002/sdtp.17953.

Full text
Abstract:
To fulfill the criteria for a lightweight portable device, this report introduces a skin‐friendly flexible backplane featuring laminated Quantum Dot film. Report details the mechanical and optical performance of this backplane and discusses its applicability on curved surfaces, making it suitable for XR and wearable displays.
APA, Harvard, Vancouver, ISO, and other styles
10

Chen, Peixuan, Meng Wang, Xiaoli Liu, et al. "P‐11.16: Investigation of Light Leakage on the Thin‐Film‐Transistors Depending on the Micro‐LED Backplane Structures." SID Symposium Digest of Technical Papers 55, S1 (2024): 1339–41. http://dx.doi.org/10.1002/sdtp.17358.

Full text
Abstract:
We investigated the impact of micro‐LED backplane structures on the light leakage by optical simulation. A transparent micro‐LED display with low light leakage, high transparency, and low reflectivity can be achieved by using metal layers and black materials with specific structures on the transparent backplane.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Backplane"

1

Rajendra, Prasad Gunda, Kumar Thenmatam Ajay, and Rao Kurapati Srinivasa. "Reconfigurable Backplane Topology." Thesis, Halmstad University, School of Information Science, Computer and Electrical Engineering (IDE), 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:hh:diva-289.

Full text
Abstract:
<p>In the field of embedded computer and communication systems, the demands for the </p><p>interconnection networks are increasing rapidly. To satisfy these demands much advancement has </p><p>been made at the chip level as well as at the system level and still the research works are going </p><p>on, to make the interconnection networks more flexible to satisfy the demands of the real-time </p><p>applications. </p><p> </p><p>This thesis mainly focuses on the interconnection between the nodes in an embedded system via a </p><p>reconfigurable backplane. To satisfy the project goals, an algorithm
APA, Harvard, Vancouver, ISO, and other styles
2

Wang, Xingang. "Multi-solver simulation with simulation backplane." Thesis, University of Southampton, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.296386.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Lundström, Petter, and Josef Toma. "Raspberry pi to backplane through SGMII." Thesis, Linköpings universitet, Fysik och elektroteknik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-150129.

Full text
Abstract:
This thesis explores a method on how communication with a backplane through SGMII via a Raspberry Pi Compute Module 3 is achieved. The thesis focuses on the steps required to design a carrier board that can mount the module and incorporate a bridge between SGMII and USB. The different steps required to achieve this were to find the components, design a power solution, draw the schematics and eventually designing the PCB.
APA, Harvard, Vancouver, ISO, and other styles
4

So, Chiu Ming. "Silicon backplane design for active matrix displays /." View Abstract or Full-Text, 2002. http://library.ust.hk/cgi/db/thesis.pl?ELEC%202002%20SO.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Boisset, Guillaume C. "Active alignment for a free-space optical backplane." Thesis, McGill University, 1994. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=26370.

Full text
Abstract:
Future high-performance digital computing systems will demand extremely high throughput backplanes to meet massive connectivity requirements between computing subsystems. This thesis begins by analyzing the characteristics of high-performance electronic backplanes and argues that electronic backplanes face fundamental cost/performance limitations which free-space optical backplanes can overcome provided key problems such as maintaining mechanical alignment in an industrial setting are resolved. An analysis of misalignment mechanisms indicates that active alignment is a powerful solution to the
APA, Harvard, Vancouver, ISO, and other styles
6

Pang, Ka Lun Carleton University Dissertation Engineering Electrical. "Empirical modelling of a high-speed backplane connector." Ottawa, 1991.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

Wilson, Andrew Kirk 1977. "In-situ backplane inspection of fiber optic ferrules." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/35625.

Full text
Abstract:
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2006.<br>Includes bibliographical references (p. 193-200).<br>The next generation of supercomputers, routers, and switches are envisioned to have hundreds and thousands of optical interconnects among components. An optical interconnect attains a bandwidth-distance product as high as 90 GHz.km, about 200 times higher than can be attained by a copper interconnect. But defects (such as dust or scratches) as small as 1 micron on the connector endfaces can seriously degrade performance. Therefore, for every mat
APA, Harvard, Vancouver, ISO, and other styles
8

Ho, Ka Veng. "Performance modelling of the terabit free space optical backplane." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp04/mq29715.pdf.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Brammer, Marko [Verfasser], and V. [Akademischer Betreuer] Saile. "Modulare Optoelektronische Mikrofluidische Backplane / Marko Brammer ; Betreuer: V. Saile." Karlsruhe : KIT Scientific Publishing, 2012. http://d-nb.info/1184477450/34.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Beals, Joseph. "Polymer waveguide technology enabling high-bandwidth optical backplane architectures." Thesis, University of Cambridge, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.611492.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Backplane"

1

Hammer, J. M. Optical Backplane Interconnect Technology (OBIT). Langley Research Center, 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

United States. National Aeronautics and Space Administration. Scientific and Technical Information Division., ed. Optical backplane interconnect technology (OBIT). National Aeronautics and Space Administration, Scientific and Technical Information Division, 1989.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

IEEE Computer Society. Technical Committee on Microprocessors and Microcomputers., IEEE Standards Board, and American National Standards Institute, eds. IEEE standard for a versatile backplane bus: VMEbus. Institute of Electrical and Electronics Engineers, 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

Institute Of Electrical and Electronics Engineers. IEEE standard for a versatile backplane bus: VMEbus. Institute of Electrical and Electronic Engineers, 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

Instruments, Texas. Futurebus [plus] interface family data manual: Protocol, arbitration and backplane tranceiver logic. 6th ed. Texas Instruments, 1994.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

IEEE Computer Society. Technical Committee on Microprocessors and Microcomputers. and Institute of Electrical and Electronics Engineers., eds. IEEE standard for a versatile backplane bus: VMEbus: An American national standard. Institute of Electrical and Electronics Engineers, 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

IEEE Computer Society. Technical Committee on Microprocessors and Microcomputers., ed. IEEE standard backplane bus specification for multiprocessor architectures, futurebus: Includes ANSI/IEEE Std 1101-1987, IEEE standard for mechanical core specifications for microcomputers. The Institute of Electrical and Electronics Engineers, Inc., 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

Institute Of Electrical and Electronics Engineers. IEEE standard for a simple 32-bit backplane bus : NuBus: Includes ANSI/IEEE Std 1101-1987, IEEE standard for mechanical core specifications for microcomputers. Institute of Electrical and Electronic Engineers, 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Conference on Real-time Computer Applications in Nuclear, Particle and Plasma Physics. (1991 Jülich, Germany). Seventh Conference Real Time '91 on Computer Applications in Nuclear, Particle and Plasma Physics: Conference record : June 24-28, 1991, Jülich, Fed. Rep. of Germany : together with: Short course on new backplane bus architectures and Seminar on Real Time Operating Systems. IEEE, 1991.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
10

Conference on Real-Time Computer Applications in Nuclear, Particle, and Plasma Physics (7th 1991 Jülich, Germany). REAL TIME '91: Seventh Conference REAL TIME '91 on Computer Applications in Nuclear, Particle, and Plasma Physics : June 24-28, 1991, Jülich, Fed. Rep. of Germany : together with short course on new backplane bus architectures and seminar on real time operating systems. Institute of Electrical and Electronics Engineers, 1991.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Backplane"

1

Tam, Kimo, William Ellersick, and Richard Soenneker. "Backplane Transceivers." In Analog Circuit Design. Springer US, 2003. http://dx.doi.org/10.1007/0-306-48707-1_18.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Serrano, Martín, Achille Zappa, Waheed Ashraf, et al. "Backplane API Gateway." In Technical Innovation, solving the Data Spaces and Marketplaces Interoperability Problems for the Global Data-Driven Economy. River Publishers, 2024. http://dx.doi.org/10.1201/9781003498841-3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Kim, Chiwoo. "TFT Backplane and Issues for OLED." In Flat Panel Display Manufacturing. John Wiley & Sons Ltd, 2018. http://dx.doi.org/10.1002/9781119161387.ch7.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Curling, Cathy J., and Seamus E. Burns. "Plastic Backplane Technology for Mobile Displays." In Mobile Displays. John Wiley & Sons, Ltd, 2008. http://dx.doi.org/10.1002/9780470994641.ch22.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Li, Guiqin, Hanlin Wang, Shengyi Lin, Tao Yu, and Peter Mitrouchev. "Feature Detection Technology of Communication Backplane." In Lecture Notes in Electrical Engineering. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-2341-0_28.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Sarma, Kalluri R. "Amorphous Silicon: Flexible Backplane and Display Application." In Flexible Electronics. Springer US, 2009. http://dx.doi.org/10.1007/978-0-387-74363-9_4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Machiraju, Vijay, Akhil Sahai, and Aad van Moorsel. "Managed Utility Computing: The Grid as Management Backplane." In Lecture Notes in Computer Science. Springer Berlin Heidelberg, 2003. http://dx.doi.org/10.1007/978-3-540-45214-0_3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Kellermeier, Kai, Carsten Pieper, Holger Flatt, Lukasz Wisniewski, and Alexander Biendarra. "Performance Evaluierung von PROFINET RT Geräten in einem TSN-basierten Backplane." In Technologien für die intelligente Automation. Springer Berlin Heidelberg, 2017. http://dx.doi.org/10.1007/978-3-662-55232-2_4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Serunjogi, Solomon Micheal, and Mihai Sanduleanu. "3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect." In IFIP Advances in Information and Communication Technology. Springer Nature Switzerland, 2024. https://doi.org/10.1007/978-3-031-70947-0_12.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Zhao, Chunhe, and Ray T. Chen. "Bi-Directional Optical Backplane Bus with Multiple Bus Lines for High Performance Bus Systems." In Applications of Photonic Technology 2. Springer US, 1997. http://dx.doi.org/10.1007/978-1-4757-9250-8_44.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Backplane"

1

Ha, Song Son, Florian Foerster, Henry Beuster, Thomas Robert Doebbert, Dominik Merli, and Gerd Scholl. "Attacking Automation Systems via the PLC Backplane Bus." In 2024 IEEE 20th International Conference on Automation Science and Engineering (CASE). IEEE, 2024. http://dx.doi.org/10.1109/case59546.2024.10711831.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Li, Linsen, Lorenzo De Santis, Isaac Harris, et al. "Heterogeneous Integration of Spin-photon Interfaces with a Scalable CMOS Platform." In CLEO: Fundamental Science. Optica Publishing Group, 2024. http://dx.doi.org/10.1364/cleo_fs.2024.fw3k.2.

Full text
Abstract:
We introduce a quantum system-on-chip (QSoC) architecture based on (I) a co-designed diamond quantum memory array, (II) a custom CMOS backplane, and (III) a protocol for fully connected cluster state generation.
APA, Harvard, Vancouver, ISO, and other styles
3

O‘Hara, A., G. Bodammer, M. Begbie, et al. "Investigation of novel structures on silicon backplane SLMs." In Spatial Light Modulators. Optica Publishing Group, 1997. http://dx.doi.org/10.1364/slmo.1997.swb.4.

Full text
Abstract:
Post-processing of commercial silicon backplanes have resulted in improved optical performance of liquid crystal (LC) over silicon spatial light modulators (SLMs). The use of chemical mechanical polishing (CMP) to planarise the wafers eliminates the topographical effect of the the underlying circuitry and allows the production of high optical quality pixel mirrors with large fill factors [1]. Having control of the top layer metal process permits the optical optimization of the SLM backplane and allows the investigation of other interconnect structures to enhance the device. We are currently ex
APA, Harvard, Vancouver, ISO, and other styles
4

Ruggeri, Serena, Vito Basile, Gianmauro Fontana, and Irene Fassi. "Design and Development of a Fully Automated Assembly Solution for Optical Backplane Interconnection Circuits." In ASME 2015 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/detc2015-47095.

Full text
Abstract:
The paper presents the design and development of a new robotized assembly system of optical backplanes in high-capacity ICT (Information and Communication Technology) apparatus, mainly used for switching stations and distribution networks. The optical backplane solution consists of several optical fiber ribbons positioned on a planar backplane according to an innovative and optimized full-mesh layout where the overall optical interconnection is partialized into a plurality of different independent sub-circuits. Each optical interconnection sub-circuit consists of optical fiber ribbons with sta
APA, Harvard, Vancouver, ISO, and other styles
5

Drury, David. "Satellite optical backplane." In 2011 IEEE Avionics, Fiber- Optics and Photonics Technology Conference (AVFOP). IEEE, 2011. http://dx.doi.org/10.1109/avfop.2011.6082105.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Mendoza-Bonilla, Jesus-Andres, Alejandro Cortez-Ibarra, Edgar-Andrei Vega-Ochoa, Francisco Rangel-Patino, and Brandon Gore. "Backplane/FDA correlation-FDA replacing commercial backplanes for SoC ethernet electrical validation." In 2014 22nd International Conference on Very Large Scale Integration (VLSI-SoC). IEEE, 2014. http://dx.doi.org/10.1109/vlsi-soc.2014.7004190.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Johnson, Howard W. "High-speed backplane connectors." In 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011. IEEE, 2011. http://dx.doi.org/10.1109/isemc.2011.6038384.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Coster, A. J. "Behind the connector backplane." In IEE Colloquium Interconnections from DC to Microwaves. IEE, 1999. http://dx.doi.org/10.1049/ic:19990100.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Jared, David A., and Kristina M. Johnson. "Fundamental limits of VLSI liquid-crystal spatial light modulators." In OSA Annual Meeting. Optica Publishing Group, 1990. http://dx.doi.org/10.1364/oam.1990.fk5.

Full text
Abstract:
A new class of spatial light modulator based on very-large-scale integration (VLSI) semiconductor/liquid-crystal technology has been developed. Devices in this class consist of a liquid-crystal modulator atop an active semiconductor backplane.1,2 The liquid-crystal modulator may consist of combinations of photodetectors, analog/digital electronics, and metal pads on the semiconductor backplane. The liquid-crystal material is sandwiched between the semiconductor backplane and a sheet of glass coated with a transparent conductor. Optically or electronically addressed devices can be, fabricated d
APA, Harvard, Vancouver, ISO, and other styles
10

Liu, Yue, Julian Bristow, Terry Marta, et al. "Polymer Waveguide Applications in Multichip Modules (MCMs) and Board Level Optical Interconnects." In Organic Thin Films for Photonic Applications. Optica Publishing Group, 1995. http://dx.doi.org/10.1364/otfa.1995.ma.4.

Full text
Abstract:
Optical backplanes are of increasing interest for commercial and military avionics processors. For such systems that competes on the basis of throughput per unit volume (and/or weight), increased component counts dictates a move from conventional packaging and board assembly technology to chip-on-board or multichip module (MCM) technologies as clock speeds and number of I/Os increase, and greater functionality are being demanded in a given system. Optical interconnects is likely to find its first introduction in such systems where practical density limits are being reached. Such situations inc
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Backplane"

1

Le Bas, Pierre-Yves. Olympus System Backplane Definition. Office of Scientific and Technical Information (OSTI), 2022. http://dx.doi.org/10.2172/1861279.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Aldrich, Susan. AmberPoints Web Services Backplane Solutions. Patricia Seybold Group, 2003. http://dx.doi.org/10.1571/pr3-28-03cc.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Aldrich, Susan. Grand Central Communications: Web Services Backplane. Patricia Seybold Group, 2003. http://dx.doi.org/10.1571/pr6-12-03cc.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Utes, M. SVX Sequence Crate Custom J1 Backplane. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/1032122.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Aldrich, Susan. Web Services Backplane: Infrastructure for Web Services. Patricia Seybold Group, 2003. http://dx.doi.org/10.1571/la1-2-03cc.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Aldrich, Susan. Blue Titan Network Director: Web Services Backplane. Patricia Seybold Group, 2002. http://dx.doi.org/10.1571/pr12-19-02cc.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Utes, M. SVX Sequence Crate Custom J2/J3 Backplane. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/1032121.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Haldeman, Merle, Cecil Needles, and J. Urish. SSD Backplane Tests: Prototype Module Version BP1. Office of Scientific and Technical Information (OSTI), 1990. https://doi.org/10.2172/2510813.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Aldrich, Susan. EASI Security Unifier Suite: Security Backplane from Quadrasis. Patricia Seybold Group, 2003. http://dx.doi.org/10.1571/pr2-6-03cc.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Baert, Mark. D0 Silicon Upgrade: CTF Front End Crate J1 BAckplane Specification. Office of Scientific and Technical Information (OSTI), 1995. http://dx.doi.org/10.2172/1033308.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Backplane' for particular source types:
Journal articles Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography