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Journal articles on the topic 'Backplane'

Author: Grafiati

Published: 4 June 2021

Last updated: 26 July 2025

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1

Morgan, Chad, and Adam Healey. "A Comparison of 25 Gbps NRZ & PAM-4 Modulation Used in Reference, Legacy, & Premium Backplane Channels." International Symposium on Microelectronics 2012, no. 1 (2012): 000283–94. http://dx.doi.org/10.4071/isom-2012-tp21.

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Standards bodies are now examining how to increase the throughput of high-density backplane links to 25 Gbps. One method for achieving this is to construct premium backplane links utilizing advanced materials and connectors. Another approach is to re-use legacy backplanes by employing PAM-4 signaling at half of the baud rate. For PAM-4 to offer an advantage over NRZ, the signal-to-noise ratio (SNR) at the slicer input, i.e. after equalization, must be ∼9.5 dB better than NRZ to overcome loss of separation between signal levels. This paper will examine 25 Gbaud NRZ and 12.5 Gbaud PAM-4 signalin

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2

Sun, Wei Min, Shao Qing Zhang, and Shi Ru Hao. "The Soleplate Materials and Performance of Table Tennis Bat with the Composite Properties of Materials in Material Engineering." Advanced Materials Research 583 (October 2012): 232–35. http://dx.doi.org/10.4028/www.scientific.net/amr.583.232.

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The study analyzed the relationship between the different composite materials, distributions of table tennis backplanes and the backplanes different performances. Although there’re so many brands which are with different price in the market of the table tennis equipment, the sportsmen could also find some principle through observing the functional material and manufacturing processes, and then understand the performance of the backplane; this study analyzed the relationship between the performance of table tennis bat and the composite properties of materials.

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3

Jung, Dongsoon, Ara Cho, Hokwon Kim, Minsu Jeong, and Jeong Hwan Lee. "32‐4: Late‐News Paper: A 1.03‐inch 2560x2560 3514 PPI Low Power OLEDoS Backplane with In‐pixel Up‐scaling Technique." SID Symposium Digest of Technical Papers 54, no. 1 (2023): 465–68. http://dx.doi.org/10.1002/sdtp.16593.

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A 1.03‐inch 2560x2560 low power OLEDoS backplane with a proposed in‐pixel up‐scaling technique is designed and implemented. Due to the proposed technique based on interpolated pixel scheme, the pixel density of the backplane realizes 3514 PPI (Pixels per Inch) with lower power consumption. The backplane has 1280x1280 input video resolution and output video resolution is upscaled to 2560x2560 without additional up‐scaler. A measured power consumption per 1 mega pixel without OLED frontplane is 16.3mW which is less than our previous 0.7‐inch 1920x1080 OLEDoS backplane with the same semiconductor

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4

Reyes, Roy M., and Albert J. Corda. "Cylindrical optical backplane." Applied Optics 31, no. 17 (1992): 3208. http://dx.doi.org/10.1364/ao.31.003208.

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5

Kufner, S., I. Frese, and M. Kufner. "Optisches Backplane-Konzept." wt Werkstattstechnik online 91, no. 12 (2001): 747–50. http://dx.doi.org/10.37544/1436-4980-2001-12-747.

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6

Sejera, Marloun, Takashi Yamauchi, Necmi Cihan Orger, Yukihisa Otani, and Mengu Cho. "Scalable and Configurable Electrical Interface Board for Bus System Development of Different CubeSat Platforms." Applied Sciences 12, no. 18 (2022): 8964. http://dx.doi.org/10.3390/app12188964.

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A flight-proven electrical bus system for the 1U CubeSat platform was designed in the BIRDS satellite program at the Kyushu Institute of Technology. The bus utilizes a backplane board as the mechanical and electrical interface between the subsystems and the payloads. The electrical routes on the backplane are configured by software using a complex programmable logic device (CPLD). It allows for reusability in multiple CubeSat projects while lowering costs and development time; as a result, resources can be directed toward developing the mission payloads. Lastly, it provides more time for integ

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7

An, Gang, Yu Li, and Xin Li. "Architecture Design of Aviation Fault-tolerant Computer Based on ARINC659 Bus Technology." MATEC Web of Conferences 179 (2018): 03025. http://dx.doi.org/10.1051/matecconf/201817903025.

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The ARINC659 backplane bus is suitable for high safety and high reliability requirements of aircraft on-board computer communication systems. This paper analyzes the structure of ARINC 659 serial backplane bus and the bus fault tolerance mechanism. On the basis of backplane bus, a 4 degree of aviation fault-tolerant computer is designed. Moreover, the computer architecture and computer system of the instruction branch and monitoring branch are designed in the computer channel. The fault-tolerant management of the computer is realized by bus fault tolerance, redundancy voting between computers

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8

Wartenberg, Philipp, Andreas Fritscher, Bernd Richter, et al. "3‐4: Invited Paper: A 2.5µm Dot Pitch 0.18” OLED Microdisplay on 28nm CMOS Backplane." SID Symposium Digest of Technical Papers 54, no. 1 (2023): 13–16. http://dx.doi.org/10.1002/sdtp.16475.

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This paper reports on the most recent results of a 2.5um dot pitch 0.18” OLED microdisplay which has been realized in a 28nm CMOS backplane. It proves the general feasibility of small‐node CMOS technologies for microdisplays enabling the integration of far more functionality in the backplane. This has been successfully demonstrated by integrating a complete frame buffer in the backplane which comes with substantial benefits in terms of driving the system from a low‐bandwidth data source. This results in significant power savings and smaller sized systems which improves ergonomics which is anot

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9

Ou, Chung-Jen, Ching-Nan Chuang, Yen-Ni Lin, Shih-Yuan Liu, and Wen-Chun Wang. "P‐244: Late‐News Poster: Flexible mini‐LED Backplane with Laminated QDF for Optimized Illuminating." SID Symposium Digest of Technical Papers 55, no. 1 (2024): 1884–88. http://dx.doi.org/10.1002/sdtp.17953.

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To fulfill the criteria for a lightweight portable device, this report introduces a skin‐friendly flexible backplane featuring laminated Quantum Dot film. Report details the mechanical and optical performance of this backplane and discusses its applicability on curved surfaces, making it suitable for XR and wearable displays.

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10

Chen, Peixuan, Meng Wang, Xiaoli Liu, et al. "P‐11.16: Investigation of Light Leakage on the Thin‐Film‐Transistors Depending on the Micro‐LED Backplane Structures." SID Symposium Digest of Technical Papers 55, S1 (2024): 1339–41. http://dx.doi.org/10.1002/sdtp.17358.

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We investigated the impact of micro‐LED backplane structures on the light leakage by optical simulation. A transparent micro‐LED display with low light leakage, high transparency, and low reflectivity can be achieved by using metal layers and black materials with specific structures on the transparent backplane.

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11

Lee, Myunghee, Jewoo Seong, Jinwoong Jang, Jiehaeng Lee, and Jonggu Jeon. "71‐1: CMOS Backplane Technology and Its Challenge for µLEDoS AR/XR Display." SID Symposium Digest of Technical Papers 55, no. 1 (2024): 976–78. http://dx.doi.org/10.1002/sdtp.17699.

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This paper introduces the latest CMOS (Complementary Metal‐Oxide‐Silicon) backplane technology for µLEDoS AR/XR display engines. The backplane supports a display resolution of 1,280RGB x 720 and has been implemented on a 28nm Fully Depleted Silicon on Insular (FD‐SOI) CMOS process in order to meet the requirements such as performance, power, and pixel size. The area of a single pixel is 4.95µm x 4.95µm achieving higher than 5,000 PPI in RGB‐color mode. Each pixel contains 3 independent sub‐pixel drivers and one dependent driver assigned for a red LED. Each sub‐pixel driver includes a 10‐bit vi

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12

SASAKI, Shinichi, and Katsuhiko OKAZAKI. "Programmable Backplane Interconnection Technology." Journal of Japan Institute of Electronics Packaging 2, no. 7 (1999): 546–51. http://dx.doi.org/10.5104/jiep.2.546.

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13

Yang, Jing, Tobias Lamprecht, Kerstin Wörhoff, et al. "Integrated Optical Backplane Amplifier." IEEE Journal of Selected Topics in Quantum Electronics 17, no. 3 (2011): 609–16. http://dx.doi.org/10.1109/jstqe.2010.2089604.

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14

Sugiura, Nobuaki. "Backplane power source capability." Electronics and Communications in Japan (Part II: Electronics) 77, no. 6 (1994): 90–97. http://dx.doi.org/10.1002/ecjb.4420770611.

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15

Zheng, Shuai, YuanJun Hsu, Yi He, et al. "16.3: A Method to Improve The Reliability of T/G IGZO AMOLED Flex Panel." SID Symposium Digest of Technical Papers 54, S1 (2023): 132–34. http://dx.doi.org/10.1002/sdtp.16243.

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For large OLEDs, the amorphous InGaZnO (a‐IGZO) thin film transistor is considered as the next generation of flexible backplane technology due to its high mobility, good uniformity, low off‐state current and low process temperature. However, the reliability of a‐IGZO TFT with OLED flexible encapsulation material is inferior at high temperature, which is speculated that the downward diffusion of H in flexible encapsulation materials leads to the threshold voltage drifting to negative. We successfully prepared a self‐aligned top‐gate IGZO thin film transistor backplane for flexible AMOLED displa

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16

Miyakawa, Masashi, Hiroshi Tsuji, and Mitsuru Nakata. "5.1: Invited Paper: Highly Stretchable Metal Oxide Island TFTs array for Deformable Display Applications." SID Symposium Digest of Technical Papers 54, S1 (2023): 51–54. http://dx.doi.org/10.1002/sdtp.16218.

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Deformable displays are attracting attention for use in various applications because of their high flexibility and stretchability. This paper describes our recent work on the development of flexible and stretchable thin‐film transistor (TFT) backplane technologies for deformable displays. We developed a flexible bezel‐less TFT backplane with through‐plastic‐vias and dome‐shaped stretchable TFT arrays with acrylic adhesive.

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17

Yuan, Rong, Haiqing Li, and Qingyuan Wang. "Simulation-based design and optimization and fatigue characteristics for high-speed backplane connector." Advances in Mechanical Engineering 11, no. 6 (2019): 168781401985675. http://dx.doi.org/10.1177/1687814019856752.

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In high-speed interconnect systems, high-speed backplane connectors are widely utilized. Its mechanical reliability is related to the stability of entire application systems directly. Insertion–extraction force and fatigue characteristics are important factors that affect the reliability of high-speed backplane connectors. To enhance the reliability of high-speed backplane connectors, in this study, a single CAD/CAE parametric model of the contacts is established. Not only the dynamic analysis of the insertion and extraction process but also the electro-thermal-structure coupling of the contac

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18

Wang, Shuo, and Yan Shi. "Lightweight design and additive manufacturing of load-bearing backplane structure for micro-nano remote sensing satellite camera." Journal of Physics: Conference Series 2954, no. 1 (2025): 012041. https://doi.org/10.1088/1742-6596/2954/1/012041.

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Abstract In response to the demand for the lightweight main load-bearing backplane structure for use on small micro-nano remote sensing satellites, the structural design and additive manufacturing based on laser powder bed fusion were investigated. The results show that the folded edge structure backplane with a hexagonal outer frame has a higher modal frequency than the original circular structure. When the length of the folded edge structure is 4mm, the deformation of the backplane under full load is minimal. To enhance its load-bearing capacity and ensure conformity with the LPBF additive m

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19

Lin, Wei-Zhong, Jia-Hong Ye, Ching-Liang Huang, et al. "32‐3: Late‐News Paper: Development of 540Hz LCD with Low Resistance Gate LTPS Technology." SID Symposium Digest of Technical Papers 54, no. 1 (2023): 461–64. http://dx.doi.org/10.1002/sdtp.16592.

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Rapid growth of the gaming monitor market in recent years has increased the demand for high frame rate display. We have developed a fast‐response liquid crystal LCD with high frame rate driving backplane based on low resistance gate LTPS‐TFT technology. The 540Hz refresh rate LCD with advanced of LTPS backplane technology has good moving picture quality and fulfills the requirement for product reliability test.

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20

Zeng, Liping, Xing Liu, Quan Zhang, Jun Yi, Xianglong Liu, and Huan Su. "Research on Heat Transfer Performance of Micro-Channel Backplane Heat Pipe Air Conditioning System in Data Center." Applied Sciences 10, no. 2 (2020): 583. http://dx.doi.org/10.3390/app10020583.

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This paper deals with the heat transfer performance of a micro-channel backplane heat pipe air conditioning system. The optimal range of the filling rate of a micro-channel backplane heat pipe air conditioning system was determined in the range of 65–75%, almost free from the interference of working conditions. Then, the influence of temperature and air volume flow rate on the heat exchange system were studied. The system maximum heat exchange is 7000–8000 W, and the temperature difference between the inlet and outlet of the evaporator and the condenser is almost 0 °C. Under the optimum refrig

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21

Tanik, Urcun John, Gary J. Grimes, Varadraj Gurupur, and Charles J. Sherman. "AN INTELLIGENT DESIGN FRAMEWORK PROPOSAL LEVERAGING AXIOMATIC DESIGN AND THE SEMANTIC WEB." Journal of Integrated Design and Process Science: Transactions of the SDPS, Official Journal of the Society for Design and Process Science 9, no. 1 (2005): 41–53. http://dx.doi.org/10.3233/jid-2005-9104.

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A new Intelligent Design Framework (IDF) approach that leverages Knowledge-Based Engineering (KBE) techniques for Optical Backplane engineering is proposed leveraging axiomatic design principles and Semantic Web technology. The framework enables the development of KBE systems for improving engineering design and processes utilizing intelligent systems coupled to Web Services. As a proof-of-concept, a prototype KBE system using HP Labs Jena 2 will be built to demonstrate the IDF approach for optical backplane engineering.

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22

Chen, Hao, and Byung-Won Min. "Research on Mobile Phone Backplane Defect Segmentation Based on MDAF-UNet." Electronics 13, no. 7 (2024): 1385. http://dx.doi.org/10.3390/electronics13071385.

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Mobile phone backplanes are an important part of mobile phones, and are often affected by a wide range of factors during the manufacturing process, resulting in defects of various scales and similar backgrounds. Therefore, accurately identifying these defects is crucial for improving mobile phone quality. To address this challenge, this paper proposes a multi-scale and dynamic attention fusion UNet (MDAF-UNet) model. The model innovatively combines normal convolution with dilated convolution. This allows the model to capture subtle features of defects and to perceive a larger range of feature

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23

Lee, Yong Uk. "Backplane Technologies for Flexible Display." Vacuum Magazine 1, no. 2 (2014): 24–29. http://dx.doi.org/10.5757/vacmag.1.2.24.

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24

Sauter, Gerald F. "Gradient-index lens optical backplane." Applied Optics 33, no. 16 (1994): 3446. http://dx.doi.org/10.1364/ao.33.003446.

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25

Zhang, Wei, and Richard R. Spencer. "Timing Recovery for Backplane Ethernet." IEEE Transactions on Circuits and Systems I: Regular Papers 54, no. 8 (2007): 1711–23. http://dx.doi.org/10.1109/tcsi.2007.902525.

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26

Zwolinski, M., C. Garagate, Z. Mrcarica, T. J. Kazmierski, and A. D. Brown. "Anatomy of a simulation backplane." IEE Proceedings - Computers and Digital Techniques 142, no. 6 (1995): 377. http://dx.doi.org/10.1049/ip-cdt:19952128.

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27

Karanassios, V., and G. Horlick. "Backplane bus structures and systems." Talanta 32, no. 8 (1985): 583–99. http://dx.doi.org/10.1016/0039-9140(85)80155-7.

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28

Zhu, Dongsheng, Jinming Shi, Chongyang Li, et al. "57‐2: High performance LTPS TFT Backplane Using Blue Laser Diode Annealing for Mini/Micro LED Display." SID Symposium Digest of Technical Papers 55, S1 (2024): 494–96. http://dx.doi.org/10.1002/sdtp.17121.

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In this paper, BLDA technology has been applied to realize the preparation of a LTPS TFT without ion implantation. The BLDA LTPS TFT gives the advantages of high mobility (~ 290.5 cm2/Vs), a smaller subthreshold voltage swing, kink‐free output curve, and excellent device stability under PBTS. The backplane technology has been successfully applied in 7.1‐inch Mini‐LED display products, and the lighting effect is uniform. This low‐cost technique is very suitable for the LTPS TFT backplane for large area, high resolution Mini/Micro LED displays.

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29

Wang, Qiang, Yan Wang, Xiu-Zhi Tang, Xiaozhong Huang, Yijun Xiong, and Fen Zhang. "Analysis of triple-band binary metamaterial absorber based on low-permittivity all-dielectric resonance surface." Journal of Advanced Dielectrics 08, no. 03 (2018): 1850021. http://dx.doi.org/10.1142/s2010135x18500212.

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Different from the conventional metamaterial absorbers (MAs), which used metal resonance surface and ternary structure (metal–dielectric-backplane), as an alternative route, the all-dielectric resonance surface (ADRS) made of single low-permittivity dielectric is proposed to design binary (dielectric backplane) metamaterial absorber (BMA). As an illustration, a triple-band BMA composed of ADRS with a metallic backplane is designed and fabricated, where the ADRS incorporates two dielectric layers with different hole-array structures. The absorbing mechanisms of this kind of absorber are analyze

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30

Dong, Xiaobiao, Xuan Cao, Xiuqi Huang, et al. "23‐5: Application of Non‐Conductive Paste (NCP)‐assisted bonding for Interconnection between Micro‐LED and Backplane." SID Symposium Digest of Technical Papers 55, S1 (2024): 204–7. http://dx.doi.org/10.1002/sdtp.17038.

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Micro‐LED, as one of the most promising advanced display technologies, has attracted increasing research interest from academia and display industry. With the outstanding performance in brightness, lifetime, and contrast, Micro‐LED display shows tremendous potential for applications in various electronic terminals. The bonding between Micro‐LED and backplane is the key technology that affects the industrialization of Micro‐LED display at present. The common bonding technology can be classified as metal bonding and ACF bonding. Metal bonding has the advantages of low cost and high bonding stren

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31

Oppenheimer, Charles. "Acoustic Dissipation and Modal Coupling in Server Computers." INTER-NOISE and NOISE-CON Congress and Conference Proceedings 266, no. 2 (2023): 203–13. http://dx.doi.org/10.3397/nc_2023_0030.

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Interest in the interior acoustics of server computers is growing as noise generated by air movers (fans) is increasingly observed to impact the performance of hard disk drives (HDD) inside these computers. In a typical server, a backplane cavity is located between an array of air movers and an array of HDD such that the HDD may be within a fan diameter of the air movers. The possibility of functional degradation requires careful management of air mover noise with respect to HDD susceptibility to acoustic noise disturbances and motivates understanding the physical phenomena underlying the acou

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32

Wu, Hao, Yang Wu, Guodong Wu, and Zide Liu. "Penetration resistance of spliced of constrained ceramic-metal composite structures." Journal of Physics: Conference Series 2891, no. 13 (2024): 132001. https://doi.org/10.1088/1742-6596/2891/13/132001.

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Abstract Aiming at the problems of edge weakening effect and gap defects in ceramic metal composite structure, the anti-penetration performance of ceramic metal composite structure was studied. Based on the experimental study of ceramic metal composite structure against 7.62 mm armor-piercing incendiary projectile penetration, the numerical model of ceramic metal composite structure against penetration was established. According to the experimental results, the reliability of the numerical simulation method was verified, and the anti-penetration performance at the ceramic joint was analyzed. T

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33

Zheng, Yu, Xiaoming Li, Wenjie Zhang, et al. "Experimental Study of Phase Change Microcapsule Suspensions Applied in BIPV Construction." Sustainability 14, no. 17 (2022): 10819. http://dx.doi.org/10.3390/su141710819.

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In this paper, a phase change microcapsule suspension MPCMS25 with a mass fraction of 10% was prepared with TH-ME25 as the phase change microcapsule particles and deionized water as the base fluid. The experimental benches of the Building Integrated Photovoltaic (BIPV) system and BIPV-MPCMS system were set up, and the comparative tests were carried out in Nanjing to study the optimization effect of phase change microcapsule suspension on the thermal and electrical properties of the BIPV system. The results show that MPCMS25 reduces the component temperature of the system by 8.8 °C and the back

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34

Miyakawa, Masashi, Hiroshi Tsuji, Tatsuya Takei, Toshihiro Yamamoto, Yoshihide Fujisaki, and Mitsuru Nakata. "93‐2: Highly Stretchable Liquid Metal‐based Deformable Micro‐LED Displays." SID Symposium Digest of Technical Papers 55, no. 1 (2024): 1317–20. http://dx.doi.org/10.1002/sdtp.17787.

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Stretchable displays represent a cutting‐edge technology for creating novel freeform deformable displays. In this study, we developed a highly stretchable liquid metal‐based stretchable backplane technology for deformable micro‐LED displays. We developed a fine liquid metal patterning process and highly stretchable backplane fabrication technology to implement micro‐LED stretchable displays utilizing liquid metal electrodes. The developed stretchable display demonstrated exceptional flexibility allowing it to transition from planar to hemispherical shapes with up to 50% stretchability without

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35

Kim, R. C., E. Chen, and F. Lin. "An optical holographic backplane interconnect system." Journal of Lightwave Technology 9, no. 12 (1991): 1650–56. http://dx.doi.org/10.1109/50.108710.

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36

Chen, A. R., A. I. Akinwande, and Hae-Seung Lee. "CMOS-based microdisplay with calibrated backplane." IEEE Journal of Solid-State Circuits 40, no. 12 (2005): 2746–55. http://dx.doi.org/10.1109/jssc.2005.858482.

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37

van Hoof, J., M. J. Worswick, and K. Williams. "Backplane response of ballistically impacted composites." Le Journal de Physique IV 10, PR9 (2000): Pr9–659—Pr9–664. http://dx.doi.org/10.1051/jp4:20009110.

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38

Kim, G., and R. T. Chen. "Three-dimensionally interconnected bidirectional optical backplane." IEEE Photonics Technology Letters 11, no. 7 (1999): 880–82. http://dx.doi.org/10.1109/68.769739.

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39

Atac, R., A. Cook, J. Deppe, et al. "Crossbar switch backplane and its application." IEEE Transactions on Nuclear Science 36, no. 1 (1989): 726–30. http://dx.doi.org/10.1109/23.34536.

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40

Kufner, S., M. Kufner, I. Frese, T. Paatzsch, H. D. Bauer, and W. Ehrfeld. "Novel Optical Backplane for Automotive Applications." IFAC Proceedings Volumes 33, no. 9 (2000): 55–57. http://dx.doi.org/10.1016/s1474-6670(17)38123-5.

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41

Abileah, Adi. "A Short History of Backplane Technology." Information Display 30, no. 2 (2014): 4–49. http://dx.doi.org/10.1002/j.2637-496x.2014.tb00694.x.

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42

Wilson, Rob. "The physics of driving backplane buses." Microprocessors and Microsystems 10, no. 2 (1986): 61–64. http://dx.doi.org/10.1016/0141-9331(86)90027-x.

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43

Han, Jun-Han, Yun Wang, and Brian Wheelwright. "19‐4: Invited Paper: Digital Driving on Silicon Microdisplay for XR." SID Symposium Digest of Technical Papers 55, no. 1 (2024): 231–35. http://dx.doi.org/10.1002/sdtp.17497.

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Microdisplay on silicon backplane is a promising architecture for XR systems. While digital circuitry is advantageous on silicon backplane, digital driving display introduces visual artifacts. First, we investigated the mechanism and solution of visual artifacts relevant for XR displays. Next, we proposed a intraframe time warp (ITW) to compensate for visual artifacts from head motion. ITW provide benefits to µOLED displays in XR systems by utilizing the higher frequency of digital driving. Lastly, we studied a 4K resolution digital µOLED displays expecting more than 40% of power saving in dri

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Cui, Yongxin, Xiaobiao Dong, Zehao Ma, Yitao Wang, Xuan Cao, and XiuQi Huang. "23‐3: Application of Laser‐Assisted Bonding in Micro‐LED display technology." SID Symposium Digest of Technical Papers 55, S1 (2024): 197–200. http://dx.doi.org/10.1002/sdtp.17036.

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Micro‐LED is considered as the new generation of display with the long‐lifetime, high contrast and brightness, splicing capability, etc. Mass transfer is the bottleneck that limits the manufacturing of Micro‐LED display at large volume, due to factors such as laser‐ lift off, pick‐up, metal bonding, and so on. Metal bonding between the Micro‐LED chip and the substrate is one of the most important impactors to the light‐up yield. To solve the key thermal mismatch issue between the backplane and Micro‐LED donor during heating, the laser‐assisted bonding process could be a viable solution. We pre

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Liu, Jie, Kai Zhang, Qiang Wu, Li Peng, Kai Yao, and Hu Liu. "Optimization and Design of Passive Link with Single Channel 25 Gbps Based on High-Speed Backplane." Electronics 10, no. 15 (2021): 1773. http://dx.doi.org/10.3390/electronics10151773.

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In recent years, with the development of the communication industry, the need to use Ethernet switches to transmit big data has become more urgent, and its protocol standards are iterating towards higher return loss, wider bandwidth, lower impedance fluctuations and insertion loss. Based on the research of high-speed backplane with a single channel 25 Gbps transmission rate, a novel double grounded planar strip coplanar waveguide design is presented, which significantly improved return loss to 20 dB and reduced insertion loss, which meet the loss standard of 100GBASE-KR4. The resonant cavity m

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Kim, Soo Young. "(Invited) Active Matrix Organic/Perovskite Light Emitting Diodes Based on MoS₂ Thin Film Transistors." ECS Meeting Abstracts MA2024-02, no. 35 (2024): 2447. https://doi.org/10.1149/ma2024-02352447mtgabs.

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Electronic applications are continuously developing and taking new forms, including foldable, rollable and wearable displays. These wearable displays are applicable in human healthcare monitoring and robotics, and their operation relies on organic light emitting diodes (OLEDs). The development of semiconducting materials with high mechanical flexibility has remained a challenge and has restricted application to unusual format electronics. This talk presents a wearable full color OLED display using a two-dimensional (2D) material-based backplane transistor.[1,2] The 18x18 thin-film transistor a

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Lee, Heung Jo, Pil Sang Yun, Jong Uk Bae, Yoo Seok Park, Woo Sup Shin, and Hyeon Woo Lee. "14‐3: Late‐News Paper: Channel Etched Coplanar TFTs for Applying a‐IGZO to High‐resolution and IT Applications." SID Symposium Digest of Technical Papers 55, no. 1 (2024): 158–60. http://dx.doi.org/10.1002/sdtp.17478.

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Self‐aligned a‐IGZO coplanar TFTs have high mobility, excellent large‐area uniformity, and are structurally free of parasitic caps. Accordingly, it is being adopted and mass‐produced as the backplane of OLED TV. Currently, the scope of application of OLED displays using oxide TFT backplanes is expanding to high‐resolution monitors for gaming. With this expansion, not only the size of the TFT but also its storage capacity has become an important factor in terms of aperture ratio. Instead of using a thick Passivation (PAS) Layer for storage capacity, we developed a structure that maximizes the a

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Lee, S. Y., J. S. Lee, and M. K. Han. "(Invited) Issues of Backplane Technologies for AMOLED." ECS Transactions 50, no. 8 (2013): 237–48. http://dx.doi.org/10.1149/05008.0237ecst.

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Cideciyan, Roy, Mark Gustlin, Mike Li, John Wang, and Zhongfeng Wang. "Next generation backplane and copper cable challenges." IEEE Communications Magazine 51, no. 12 (2013): 130–36. http://dx.doi.org/10.1109/mcom.2013.6685768.

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Li, M., S. Wang, and T. Kwasniewski. "DFE architectures for high-speed backplane applications." Electronics Letters 41, no. 20 (2005): 1115. http://dx.doi.org/10.1049/el:20052206.

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