Relevant bibliographies by topics / Ball grid array technology

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Ball grid array technology'

Author: Grafiati
Published: 4 June 2021
Last updated: 15 February 2022

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Journal articles on the topic "Ball grid array technology"

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Lall, Pradeep, Nokibul Islam, John Evans, and Jeff Suhling. "Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments." Journal of Electronic Packaging 129, no. 4 (2007): 382–90. http://dx.doi.org/10.1115/1.2804086.

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Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased shock, vibration, and higher temperatures necessitate the fundamental understanding of damage mechanisms, which will be active in these environments. Electronics typical of office benign environments uses FR-4 printed circuit boards (PCBs). Automotive applications typically use high glass-transition temperature laminates such as FR4-06 glass∕epoxy laminate material (Tg=164.9°C). In application environments, metal backing of printed circuit boards is being targeted for thermal dissipation, mechanical stability, and interconnections reliability. In this study, the effect of metal-backed boards on the interconnect reliability has been evaluated. Previous studies on electronic reliability for automotive environments have addressed the damage mechanics of solder joints in plastic ball-grid arrays on non-metal-backed substrates (Lall et al., 2003, “Model for BGA and CSP in Automotive Underhood Environments,” Electronic Components and Technology Conference, New Orleans, LA, May 27–30, pp. 189–196;Syed, A. R., 1996, “Thermal Fatigue Reliability Enhancement of Plastic Ball Grid Array (PBGA) Packages,” Proceedings of the 1996 Electronic Components and Technology Conference, Orlando, FL, May 28–31, pp. 1211–1216;Evans et al., 1997, “PBGA Reliability for Under-the-Hood Automotive Applications,” Proceedings of InterPACK ’97, Kohala, HI, Jun. 15–19, pp. 215–219;Mawer et al., 1999, “Board-Level Characterization of 1.0 and 1.27mm Pitch PBGA for Automotive Under-Hood Applications,” Proceedings of the 1999 Electronic Components and Technology Conference, San Diego, CA, Jun. 1–4, pp. 118–124) and ceramic ball-grid arrays (BGAs) on non-metal-backed substrates (Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” IEEE Trans-CPMT-A, Vol. 15, No. 6, pp. 1013–1024;Darveaux et al., 1995, “Reliability of Plastic Ball Grid Array Assembly,” Ball Grid Array Technology, Lau, J., ed., McGraw-Hill, New York, pp. 379–442;Darveaux, R., 2000, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,” Proceedings of 50th ECTC, May, pp. 1048–1058). Delamination of PCBs from metal backing has also been investigated. The test vehicle is a metal-backed FR4-06 laminate. The printed circuit board has an aluminum metal backing, attached with pressure sensitive adhesive (PSA). Component architectures tested include plastic ball-grid array devices, C2BGA devices, QFN, and discrete resistors. Reliability of the component architectures has been evaluated for HASL. Crack propagation and intermetallic thickness data have been acquired as a function of cycle count. Reliability data have been acquired on all these architectures. Material constitutive behavior of PSA has been measured using uniaxial test samples. The measured constitutive behavior has been incorporated into nonlinear finite element simulations. Predictive models have been developed for the dominant failure mechanisms for all the component architectures tested.
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Dudek, Rainer, Ralf Do¨ring, and Bernd Michel. "Reliability Prediction of Area Array Solder Joints." Journal of Electronic Packaging 125, no. 4 (2003): 562–68. http://dx.doi.org/10.1115/1.1604802.

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Packages for high pin counts using the ball grid array technology or its miniaturized version, the chip scale package, inherently require reliability concepts as an integral part of their development. This is especially true for the latter packages, if they are combined with the flip chip technology. Accordingly, thermal fatigue of the solder balls is frequently investigated by means of the finite element method. Various modeling assumptions and simplifications are common to restrict the calculation effort. Some of them, like geometric modeling assumptions, assumptions concerning the homogeneity of the cyclic temperature fields, simplified creep characterization of solder, and the related application of Manson-Coffin failure criteria, are discussed in the paper. The packages chosen for detailed analyses are a PBGA 272 and a FC-CSP 230.
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Chen, Shih Feng. "An Optical System for the Ball Grid Array Inspection and Measurement Using the Back-Propagation Neural Network Technology." Key Engineering Materials 364-366 (December 2007): 92–97. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.92.

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In this study, the back-propagation neural network technology (BPN) is utilized to identify the shape of the defective solder ball of ball grid array (BGA) so as to promote the accuracy of the optical inspection and measurement. The two dimensional BGA optical inspecting system is implemented by Visual Basic as the developing tool incorporated with the Halcon’s function which is the database of the image processing on Windows operation system. For the development of the processing procedure of the automatic optical inspecting system, the precise geometrical information of the solder ball is evaluated by the sub-pixel method to identify the shape of solder ball and its location which are acquired to classify the defects of solder ball including the ball offset, the ball over scale, the ball absence, and the ball shape under the BGA board is offset and rotated at any angle. From the experimental results, the back-propagation neural network technology is proved to properly identify and classify the shape defects, especially for the ball deformation and the ball bridging of the solder ball which can achieve and contribute the requirements for the automatic inspection and the high identification efficiency.
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Tian, Yan Hong, and Chun Qing Wang. "Shape Prediction and Reliability Design of Ball Grid Array Solder Joints." Key Engineering Materials 353-358 (September 2007): 2944–47. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2944.

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Reliability optimization design of Ball Grid Array (BGA) solder joints is a major concern in area array electronics packaging technology. In this paper, shapes of the solder joints and their reliability were predicted and analyzed. Through the variations of lower pads’ diameters, the shapes of full array BGA solder joints with different solder volumes were predicted by using surface evolver software. Based on the results of shape prediction, 3-D finite element models were established with MSC.MARC and the distribution of the stress and strain in the BGA solder joints under thermal cyclic loading were simulated. Finally, fatigue lives of the BGA solder joints with different solder volumes were calculated, and the diameter ratios of lower pad to upper pad for these two kinds of BGA assemblies with the best reliability were optimized.
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Yoon, Seung Wook. "Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–20. http://dx.doi.org/10.4071/2017dpc-tp2_presentation5.

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FO-WLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent past and is already accounting for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduce the total form factor as well as cost-effectiveness. The emerging of advanced of silicon node technology down to 10 nanometer (nm) in support of higher performance, bandwidth and better power efficiency in mobile products pushes the boundaries of emerging packaging technologies to smaller form-factor packaging designs with finer line/spacing as well as improved thermal electrical/performance and integration of SiP or 3D capabilities. Advanced eWLB FO-WLP technology provides a versatile platform for the semiconductor industry's technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D System-in-Package (SiP) configurations. This paper reports developments that extend multi-die and 3D SiP applications with eWLB technology, including ultra thin devices or/and with an interposer substrate attachment. Test vehicles have been designed and fabricated to demonstrate and characterize integrated packaging solutions for network, mobile products including IoT and wearable electronics. The test vehicles have ranged from ~30mm2 to large sizes up to ~230mm2 and 0.4mm ball pitch. Assembly process details including 3D vertical interconnect, laser ablation, RDL processes and mechanical reliability characterizations are to be discussed with component and board level reliability results. In addition, warpage behavior and the PoP stacking process will also be presented. Innovative structure optimization that provides dual advantages of both height reduction and enhanced package reliability are reported. To enable higher interconnection density and signal routing, packages with multiple redistribution layers (RDL) and fine line/width spacing are fabricated and implemented on the eWLB platform. Successful reliability and electrical characterization results on multi-die and 3D eWLB-SiP configurations are reported as an enabling technology for highly integrated, miniaturized, low profile and cost effective solutions.
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Babaeihaselghobi, Akbar, and Habib Badri Ghavifekr. "Development of a planar helix slow-wave structure based on ball-grid array technology." Journal of Electromagnetic Waves and Applications 34, no. 13 (2020): 1771–81. http://dx.doi.org/10.1080/09205071.2020.1787235.

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Chiang, Kuo-Ning, and Chang-Ming Liu. "A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads." Journal of Electronic Packaging 123, no. 2 (1999): 127–31. http://dx.doi.org/10.1115/1.1339196.

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As electronic packaging technology moving to the CSP, wafer level packaging, fine pitch BGA (ball grid array) and high density interconnections, the wireability of the PCB/substrate and soldering technology are as important as reliability issues. In this work, a comparison of elliptical/round pads of area array type packages has been studied for soldering, reliability, and wireability requirements. The objective of this research is to develop numerical models for predicting reflow shapes of solder joint under elliptical/round pad boundary conditions and to study the reliability issue of the solder joint. In addition, a three-dimensional solder liquid formation model is developed for predicting the geometry, the restoring force, the wireability, and the reliability of solder joints in an area array type interconnections (e.g., ball grid array, flip chip) under elliptical and round pad configurations. In general, the reliability of the solder joints is highly dependent on the thermal-mechanical behaviors of the solder and the geometry configuration of the solder ball. These reliability factors include standoff height/contact angle of the solder joint, and the geometry layout/material properties of the package. An optimized solder pad design cannot only lead to a good reliability life of the solder joint but also can achieve a better wireability of the substrate. Furthermore, the solder reflow simulation used in this study is based on an energy minimization engine called Surface Evolver and the finite element software ABAQUS is used for thermal stress/strain nonlinear analysis.
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Gao, Huijun, Wanxin Jin, Xianqiang Yang, and Okyay Kaynak. "A Line-Based-Clustering Approach for Ball Grid Array Component Inspection in Surface-Mount Technology." IEEE Transactions on Industrial Electronics 64, no. 4 (2017): 3030–38. http://dx.doi.org/10.1109/tie.2016.2643600.

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Bachman, Mark A., Jerry Liao, John Osenbach, Zafer Kutlu, Jaeyun Gim, and Danny Brady. "Large Die Size Lead Free Flip Chip Ball Grid Array Packaging Considerations for 40nm Fab Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 000570–85. http://dx.doi.org/10.4071/2012dpc-ta23.

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To reduce the RC latency, leading edge silicon nodes employ porous SiO2 dielectrics in the interconnect stack. Introduction of porosity lowers the dielectric constant, k, but also significantly decreases both the elastic modulus and fracture toughness of the dielectric. As such, devices manufactured in silicon processes that use low K (90nm, 65nm, and 55nm) and even more so extremely low K ( 45nm, 40nm, and 28nm) interlayer dielectrics are substantially more prone to fracture as a result of package induced stresses than non porous higher K dielectrics. Since the package stresses scale with die size and package body size and inversely with bump pitch, manufacture of large die and package size flip chip devices made with extremely low K dielectrics has proven to be challenging. The stress challenge is further exacerbated by the RoHS requirements for lead free packaging which requires higher process temperatures and somewhat higher yield point solders. The combination of increased stress and reduced mechanical robustness of porous dielectrics has lead to significant reliability and assembly yield issues that have in some cases slowed the introduction of 45nm and 40nm large die lead free flip chip into the market. The work summarized in this paper shows that devices designed to withstand stresses in combination with appropriate assembly processes and bill of materials, yield highly reliable, lead free flip chip packaged devices, with die sizes greater than 400mm2 and package sizes greater than 42.5mm on a side in commercial assembly production lines.
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Rooks, S. M., B. Benhabib, and K. C. Smith. "Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 18, no. 4 (1995): 851–61. http://dx.doi.org/10.1109/95.477473.

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Dissertations / Theses on the topic "Ball grid array technology"

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Liang, Hongwei. "Development of microwave and millimeter-wave pin grid array and ball grid array packages." Diss., Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/14867.

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Elkady, Yasser Ahmed Suhling J. C. Knight Roy Ward. "Thermal performance of ball grid arrays and thin interface materials." Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/EL-KADY_YASSER_48.pdf.

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Song, Fubin. "Experimental investigation on testing conditions of solder ball shear and pull tests and the correlation with board level mechanical drop test /." View abstract or full-text, 2007. http://library.ust.hk/cgi/db/thesis.pl?MECH%202007%20SONG.

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Jordy, Daniel Edward. "Computational drop testing of printed circuit boards with BGA components." Diss., Online access via UMI:, 2007.

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Lui, Hoi Wai. "Experimental evaluation of board level solder joint reliability of plastic ball grid array assemblies with eutectic Pb-Sn and Pb-free solders /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?MECH%202003%20LUI.

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Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003.<br>Includes bibliographical references (leaves 103-114). Also available in electronic version. Access restricted to campus users.
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Panchagade, Dhananjay R. "Damage prediction of lead free ball grid array packages under shock and drop environment." Auburn, Ala., 2007. http://repo.lib.auburn.edu/2007%20Spring%20Dissertations/PANCHAGADE_DHANANJAY_35.pdf.

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Lau, Chung Yin. "Computational stress analysis for ball grid array reliability and passive component reliability in board level assemblies /." View abstract or full-text, 2005. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20LAU.

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Drake, Jonathan Luke Lall Pradeep. "Thermo-mechanical reliability models for life prediction of ball grid arrays on Cu-core PCBs in extreme environments." Auburn, Ala., 2007. http://hdl.handle.net/10415/1400.

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Huang, Xingjia. "Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic Pb-Sn and Pb-free solders /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?MECH%202003%20HUANG.

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Hariharan, Ganesh Lall Pradeep. "Models for thermo-mechanical eliability trade-offs for ball grid array and flip chip packages in extreme environments." Auburn, Ala., 2007. http://repo.lib.auburn.edu/2006%20Fall/Theses/HARIHARAN_GANESH_55.pdf.

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Books on the topic "Ball grid array technology"

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Tegehall, P. E. Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages. ESA Publications Division, 2003.

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Schon̈beck, J. Evaluation of a process for the repair of area array and other surface mounted packages. ESA Publications Division, 2004.

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Gilleo, Ken. Area array packaging handbook. McGraw-Hill, 2002.

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Area array packaging materials: Adhesives, pastes, and lead-free. McGraw-Hill, 2004.

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Tegehall, P. E. Impact of reworking ceramic area array packages on the integrity of the printed board laminate. ESA Publications Division, ESTEC, 2005.

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Hwang, Jennie S. Ball grid array & fine pitch peripheral interconnections: A handbook of the technology & applications for microelectronics/electronics manufacturing. Electrochemical Publications Ltd, 1995.

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InterSociety, Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th 2000 Las Vegas Nev ). ITherm 2000: The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000. IEEE, 2000.

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InterSociety, Conference on Thermal Phenomena in Electronic Systems (5th 1996 Orlando Fla ). I-THERM V: May 29-June 1, 1996, Buena Vista Palace Hotel, Orlando, FL, U.S.A. Institute of Electrical and Electronics Engineers, 1996.

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InterSociety Conference on Thermal Phenomena in Electronic Systems (6th 1998 Seattle, Washington). ITherm'98: The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electric Systems : Seattle, Washington, USA, May 27-30, 1998. IEEE, 1998.

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InterSociety, Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (8th 2002 San Diego Calif ). ITherm 2002: ITherm 2002 is the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : presented at San Diego, California, USA, May 30-June 1, 2002. IEEE, 2002.

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Book chapters on the topic "Ball grid array technology"

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Meyer, Thorsten, and Steffen Kroehnert. "Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform." In Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies. John Wiley & Sons, Inc., 2019. http://dx.doi.org/10.1002/9781119313991.ch3.

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Bai, Rui Xiang, H. Jiang, and Cheng Yan. "Nonlinear Analysis of a Ball Grid Array Package under Thermal Cycles." In Frontiers in Materials Science and Technology. Trans Tech Publications Ltd., 2008. http://dx.doi.org/10.4028/0-87849-475-8.57.

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Yoon, S. W. "Ultrathin 3D FO-WLP eWLB-PoP (Embedded Wafer-Level Ball Grid Array-Package-on-Package) Technology." In Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies. John Wiley & Sons, Inc., 2019. http://dx.doi.org/10.1002/9781119313991.ch4.

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Chen, Shih Feng. "An Optical System for the Ball Grid Array Inspection and Measurement Using the Back-Propagation Neural Network Technology." In Optics Design and Precision Manufacturing Technologies. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-458-8.92.

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Kuzawinski, Mark J., and Thomas R. Homa. "Plastic Ball Grid Array." In Area Array Interconnection Handbook. Springer US, 2001. http://dx.doi.org/10.1007/978-1-4615-1389-6_15.

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Andros, Frank. "Tape Ball Grid Array." In Area Array Interconnection Handbook. Springer US, 2001. http://dx.doi.org/10.1007/978-1-4615-1389-6_16.

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Cole, Marie S., Karl J. Puttlitz, and Robert Lanzone. "Ceramic Ball and Column Grid Arrays." In Area Array Interconnection Handbook. Springer US, 2001. http://dx.doi.org/10.1007/978-1-4615-1389-6_17.

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Yeh, Meng Kao, and In Shung Lee. "Delamination Growth in Ball Grid Array Electronic Package." In Fracture and Strength of Solids VI. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-989-x.363.

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Fromont, Thierry. "Thermal and Thermomechanical Modelling of Ball Grid Array Packages." In Thermal Management of Electronic Systems II. Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5506-9_32.

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Ghosal, Balaram, Richard Sigliano, and Y. Kunimatsu. "Ceramic and Plastic Pin Grid Array Technology." In Area Array Interconnection Handbook. Springer US, 2001. http://dx.doi.org/10.1007/978-1-4615-1389-6_14.

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Conference papers on the topic "Ball grid array technology"

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Brunnbauer, M., E. F�rgut, G. Beer, and T. Meyer. "Embedded wafer level ball grid array (eWLB)." In 2006 8th Electronics Packaging Technology Conference. IEEE, 2006. http://dx.doi.org/10.1109/eptc.2006.342681.

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Meyer, T., G. Ofner, S. Bradl, M. Brunnbauer, and R. Hagen. "Embedded Wafer Level Ball Grid Array (eWLB)." In 2008 10th Electronics Packaging Technology Conference (EPTC). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763559.

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Brunnbauer, M., T. Meyer, G. Ofner, K. Mueller, and R. Hagen. "Embedded Wafer Level Ball Grid Array (eWLB)." In 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2008. http://dx.doi.org/10.1109/iemt.2008.5507866.

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Rudakov, Vatery I., Boris V. Mochalov, and Nikolai I. Plis. "Thermomigration technology for silicon ball grid array package fabrication." In SPIE Proceedings, edited by Kamil A. Valiev and Alexander A. Orlikovsky. SPIE, 2006. http://dx.doi.org/10.1117/12.683487.

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Ang, Simon S., D. A. Arnn, D. J. Meyer, L. W. Schaper, and William D. Brown. "Low-cost flexible ball-grid-array multichip module technology." In ISMA '97 International Symposium on Microelectronics and Assembly, edited by Yong Khim Swee, HongYu Zheng, and Ray T. Chen. SPIE, 1997. http://dx.doi.org/10.1117/12.280574.

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Lu, Charlie Tsung-hsing. "Review on the Ball Drop-off Mechanisms of Lead-free Ball Grid Array Package." In Circuits Technology Conference (IMPACT). IEEE, 2008. http://dx.doi.org/10.1109/impact.2008.4783838.

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Chou, Sheng-Hung, Yan Liu, Maria Durham, Sze Pei Lim, Te-Hua Fang, and Yu-Jen Hsiao. "Test method to evaluate a robust ball grid array (BGA) ball mount flux." In 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). IEEE, 2016. http://dx.doi.org/10.1109/eptc.2016.7861555.

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Alam, M. O., H. Lu, Chris Bailey, B. Y. Wu, and Y. C. Chan. "Shear Strength Analysis of Ball Grid Array (BGA) Solder Interfaces." In 2007 9th Electronics Packaging Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/eptc.2007.4469797.

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Pressel, K., G. Beer, T. Meyer, et al. "Embedded wafer level ball grid array (eWLB) technology for system integration." In 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan). IEEE, 2010. http://dx.doi.org/10.1109/cpmtsympj.2010.5679657.

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Li, Huaicheng, Tong An, Tao Tang, and Fei Qin. "Vibration reliability test and analysis of plastic ball grid array." In 2016 17th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2016. http://dx.doi.org/10.1109/icept.2016.7583350.

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Reports on the topic "Ball grid array technology"

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Gonzalez, C. A. Porosity in collapsible Ball Grid Array solder joints. Office of Scientific and Technical Information (OSTI), 1998. http://dx.doi.org/10.2172/663270.

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Chanchani, R., K. Treece, and P. Dressendorfer. Mini ball grid array (mBGA) assembly on MCM-L boards. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/463644.

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McClung, J. S., Rick Fling, and Christina McClung. Standardized UXO Technology Demonstration Site Blind Grid Record No. 904 (Sky Research, Inc.). EM61 MKII/Towed Array. Defense Technical Information Center, 2008. http://dx.doi.org/10.21236/ada489301.

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Fling, Rick, Christina McClung, Matthew Banta, Michael Karwatka, William Burch, and Patrick McDonnell. Standardized UXO Technology Demonstration Site Blind Grid Scoring Record No. 806 (U.S. Geological Survey, TMGS Magnetometer/Towed Array). Defense Technical Information Center, 2007. http://dx.doi.org/10.21236/ada469692.

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