Books on the topic 'Ball grid array technology'

Tegehall, P. E. Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages. ESA Publications Division, 2003.

Schon̈beck, J. Evaluation of a process for the repair of area array and other surface mounted packages. ESA Publications Division, 2004.

Gilleo, Ken. Area array packaging handbook. McGraw-Hill, 2002.

Area array packaging materials: Adhesives, pastes, and lead-free. McGraw-Hill, 2004.

Tegehall, P. E. Impact of reworking ceramic area array packages on the integrity of the printed board laminate. ESA Publications Division, ESTEC, 2005.

Hwang, Jennie S. Ball grid array & fine pitch peripheral interconnections: A handbook of the technology & applications for microelectronics/electronics manufacturing. Electrochemical Publications Ltd, 1995.

InterSociety, Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th 2000 Las Vegas Nev ). ITherm 2000: The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000. IEEE, 2000.

InterSociety, Conference on Thermal Phenomena in Electronic Systems (5th 1996 Orlando Fla ). I-THERM V: May 29-June 1, 1996, Buena Vista Palace Hotel, Orlando, FL, U.S.A. Institute of Electrical and Electronics Engineers, 1996.

InterSociety Conference on Thermal Phenomena in Electronic Systems (6th 1998 Seattle, Washington). ITherm'98: The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electric Systems : Seattle, Washington, USA, May 27-30, 1998. IEEE, 1998.

InterSociety, Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (8th 2002 San Diego Calif ). ITherm 2002: ITherm 2002 is the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : presented at San Diego, California, USA, May 30-June 1, 2002. IEEE, 2002.

Semiconductor Equipment and Materials International., Components, Packaging & Manufacturing Technology Society., and Institute of Electrical and Electronics Engineers., eds. IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium: July 16-18, 2003 the Marriott Hotel, San Jose, CA, USA. IEEE, 2003.

IEEE/CPMT International Electronics Manufacturing Technology Symposium (24th 1999 Austin, Tex.). Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium: Proceedings 1999 IEMT symposium : October 18-19, 1999, Austin, TX, USA. IEEE, 1999.

IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (29th 2004 San Jose, Calif.). IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium: July 14-16, 2004, the Marriott Hotel, San Jose, CA, U.S.A. IEEE, 2004.

IEEE/CPMT International Electronics Manufacturing Technology Symposium (26th 2000 Santa Clara, California). Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium: Proceedings : 2000 IEMT Symposium : October 2-3,2000, Santa Clara, CA, USA. IEEE, 2000.

IEEE/CPMT, International Electronics Manufacturing Technology Symposium (23rd 1998 Austin Tex ). Twenty third IEEE/CPMT International Electronics Manufacturing Technology Symposium: Proceedings 1998 IEMT symposium : October 19-21, 1998, Austin, TX, USA. IEEE, 1998.

IEEE/CPMT International Electronics Manufacturing Technology Symposium (22nd 1998 Berlin, Germany). Twenty second IEEE/CPMT International Electronics Manufacturing Technology Symposium: IEMT-Europe 1998 : electronics manufacturing and development for automotives, April 27th-29th, 1998, Berlin, Germany. IEEE, 1998.

H, Lau John, ed. Ball grid array technology. McGraw-Hill, 1995.

M, Wickham, ed. An investigation into ball grid array inspection techniques. ESA Publications Division, 1999.

Gilleo, Ken. Area Array Packaging Materials: Adhesives, Pastes, and Lead-Free. McGraw-Hill Professional, 2003.

Gilleo, Ken. Area Array Packaging Materials: Adhesives, Pastes, and Lead-Free. McGraw-Hill Professional, 2003.

Gilleo, Ken. Area Array Packaging Handbook: Manufacturing and Assembly. McGraw-Hill Professional, 2001.

Gilleo, Ken. Area Array Packaging Handbook: Manufacturing and Assembly. McGraw-Hill Professional, 2001.

(Editor), C. H. Amon, K. Ramakrishna (Editor), B. G. Sammakia (Editor), G. Subbarayan (Editor), S. B. Sathe (Editor), and Y. K. Joshi (Editor), eds. Therm 2002: Ithem 2002 Is the Eighth Intersociey Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Ieee, 2001.

IEMT. Electronics Manufacturing Technology (Iemt), 2000 Ieee/Cpmt 24th. Amer Inst of Chemical Engineers, 2000.

Institute Of Electrical and Electronics Engineers and Calif.) CPMT International Electronics Manufacturing Technology Symposium (26th : 2000 : Santa Clara. 2000 Twenty-Sixth Ieee/Cpmt International Electronics Manufacturing Technology Symposium. Ieee, 2001.

Institute Of Electrical and Electronics Engineers and Tex.) CPMT International Electronics Manufacturing Technology Symposium (23rd : 1998 : Austin. 1998 Ieee/Cpmt 23rd Electronics Manufacturing Technology, Iemt. Institute of Electrical & Electronics Enginee, 1998.

Twenty second IEEE/CPMT International Electronics Manufacturing Technology Symposium: IEMT-Europe 1998 : Electronics manufacturing and development for ... April 27th-29th, 1998, Berlin, Germany. IEEE Service Center, 1998.

Institute Of Electrical and Electronics Engineers and Germany) CPMT International Electronics Manufacturing Technology Symposium (22nd : 1998 : Berlin. Electronics Manufacturing Tehnology Symposium, 1998 22nd IEEE/CPMT. Institute of Electrical & Electronics Enginee, 1998.