Relevant bibliographies by topics / BCB polymer

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  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'BCB polymer'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "BCB polymer"

1

Wang, Zidong, Michael Gallagher, Kevin Wang, Elissei Iagodkine, Mark Oliver, Joe Lachowski, Greg Prokopowicz, et al. "Development of Laser and Photodefinable Toughened Benzocyclobutene Dielectric Materials for 3D-TSV Integration." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000067–71. http://dx.doi.org/10.4071/isom-2013-ta31.

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3D IC integration based on TSV technology has been recognized as a key enabler for next generation of electronic devices with reduced size factor and improved performances. The adoption of 3D-TSV technology also requires the development of innovative interconnect solutions that reduces the size of signal routing and therefore imposes new demands on dielectric materials used to isolate the copper interconnects. Benzocyclobutene polymers (Dow's CYCLOTENE™ Advanced Electronic Resins) have been used to isolate copper interconnects in packaging applications for more than 20 years, due to a number of good attributes of the BCB polymer including low copper drift rate, low dielectric constant and low loss, low moisture absorption and proven reliability. However, the low fracture toughness and low elongation of BCB polymer has limited its use in stress buffer applications due to solder bump failure. Here we report the development of new laser and photodefinable toughened benzocyclobutene (BCB) dielectric materials that have following improved properties and benefits over commercial materials including: 1) Higher elongation to break at 25%, 2) Higher fracture toughness, 3) Improved lithographic performance, < 8μm minimal size feature, 4) Better stability, no change in Eo after 30 days at room temperature. The patterning and integration of these toughened benzocyclobutene materials and the processing conditions are also discussed. We believe this toughened BCB material will find wide applications as a stress buffer layer in 3-D IC.
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Kawahara, J., A. Nakano, K. Kinoshita, Y. Harada, M. Tagami, M. Tada, and Y. Hayashi. "Highly thermal-stable, plasma-polymerized BCB polymer film." Plasma Sources Science and Technology 12, no. 4 (October 7, 2003): S80—S88. http://dx.doi.org/10.1088/0963-0252/12/4/023.

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Im, Jang-hi, Edward O. Shaffer, Theodore Stokich,, Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, et al. "On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications." Journal of Electronic Packaging 122, no. 1 (October 20, 1999): 28–33. http://dx.doi.org/10.1115/1.483128.

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This work examines the mechanical performance of thin film coatings from Photosensitive-benzocyclobutene (Photo-BCB) formulations (Cyclotene2 4024, 4026 and 7200), on various substrate surfaces such as Al, Cu, Si, and SiN. The adhesion promoter used was designated AP-3000 and was based on vinyltriacetoxysilane (VTAS), which had been properly hydrolyzed and advanced. Measurement of the interfacial adhesion was performed primarily using the modified Edge Liftoff Test m-ELT. It was found that, by applying the newly developed adhesion promoter, AP-3000, the interfacial energy of Photo-BCB to Al, Cu, Si, and SiN was significantly improved, often approaching the toughness of Photo-BCB, ca. 45 J/m2. The x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) analyses of the delaminated surfaces of the Photo-BCB/Al structure revealed distinct differences in surface roughness and the chemical composition depending on whether or not adhesion promoter was used. Other parameters important for long term stability (e.g., moisture uptake and thermal stability) of Photo-BCB were also measured. The equilibrium moisture content at 84 percent RH in ambient temperature was low, 0.14 wt percent and the thermally induced weight loss at 330°C in helium atmosphere was less than 1 percent/h. The low moisture absorption and good thermal stability, together with the given mechanical toughness and adhesion, allow the Photo-BCB to be widely usable for various microelectronic packaging applications, for up to 40 μm thick build in the case of silicon substrate. [S1043-7398(00)00701-5]
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Hadjloum, Massinissa, Mohammed El Gibari, Hongwu Li, and Afshin S. Daryoush. "Broadband capacitively grounded coplanar to coupled microstrip transition for planar microwave photonic components." International Journal of Microwave and Wireless Technologies 9, no. 4 (September 9, 2016): 815–19. http://dx.doi.org/10.1017/s1759078716000969.

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Broadband transitions are presented in this paper for capacitively grounded coplanar waveguide to coupled microstrip (CMS) lines. These transitions are realized on both thick Rogers RO3003 substrate (thickness of 10 mils) and a thin benzocyclobutene (BCB) polymer film (thickness of 20 µm). A flat bandwidth of 4–20 GHz and 3.2 to over 40 GHz are measured for the RO3003 and BCB polymer substrates, respectively. These performances are obtained without making via-hole in the substrate or patterning the bottom ground plane, which makes this broadband transition easier to fabricate compared with the via-hole-based grounded CPW–CMS transitions.
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Kremensas, Arūnas, Agnė Kairytė, Saulius Vaitkus, Sigitas Vėjelis, and Giedrius Balčiūnas. "Mechanical Performance of Biodegradable Thermoplastic Polymer-Based Biocomposite Boards from Hemp Shivs and Corn Starch for the Building Industry." Materials 12, no. 6 (March 13, 2019): 845. http://dx.doi.org/10.3390/ma12060845.

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Bio-sourced materials combined with a polymer matrix offer an interesting alternative to traditional building materials. To contribute to their wider acceptance and application, an investigation into the use of wood-polymer composite boards is presented. In this study, biocomposite boards (BcB) for the building industry are reported. BcB are fabricated using a dry incorporation method of corn starch (CS) and hemp shiv (HS) treatment with water at 100 °C. The amount of CS and the size of the HS fraction are evaluated by means of compressive bending and tensile strength, as well as microstructure. The results show that the rational amount of CS independently of HS fraction is 10 wt.%. The obtained BcB have compressive stress at 10% of deformation in the range of 2.4–3.0 MPa, bending of 4.4–6.3 MPa, and tensile strength of 0.23–0.45 MPa. Additionally, the microstructural analysis shows that 10 wt.% of CS forms a sufficient amount of contact zones that strengthen the final product.
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Eriguchi, Takeshi, Orson Wang, Kaori Tsuruoka, Yuichiro Ishibashi, and Yong Zhang. "ALX Polymer for Wafer Level Packaging: Mechanical Property Evaluation After Multiple Lead-Free Solder Reflows." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 001054–79. http://dx.doi.org/10.4071/2010dpc-tp34.

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For bumping and wafer level packaging (WLP) applications, BCB and polyimide are the predominant spin-on dielectric materials used for re-passivation, redistribution, interlayer dielectric, and stress buffer layers. Each of these materials has their respective strengths and weaknesses. BCB has exceptionally low shrinkage on cure and moisture absorption, low curing temperature, and a low dielectric constant, but is a mechanically brittle material which limits its application in bump-on-polymer applications. Polyimides are superior mechanically to BCB and are utilized more in bump-on-polymer structures, but suffer from much higher shrinkage on cure and moisture absorption (which can lead to blistering if not carefully processed), have higher dielectric constants, and have much higher cure temperatures. ALX spin-on polymer dielectric was developed to combine low shrinkage, low moisture absorption, low dielectric constant, and excellent mechanical and stress buffering properties with a cure temperature between 190C to 250C, depending on the application(1-3). Previous papers have reported the mechanical properties at 190C and the application of ALX in eutectic SnPb solder bump structures. The use of lead-free solder requires reflow temperatures up to 260C. Although ALX polymer is curable at less than 200C, the influence of lead-free solder reflow wasnft investigated. In this presentation we evaluate mechanical property changes of ALX Polymer films after different cure schedules and multiple reflows at lead-free solder temperatures. The impact of these parameters on WLP will be discussed.
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Li, Minghui, Jing Sun, and Qiang Fang. "A fluoropolymer with a low dielectric constant at a high frequency derived from bio-based anethole." Polymer Chemistry 12, no. 31 (2021): 4501–7. http://dx.doi.org/10.1039/d1py00573a.

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The copolymerization between a fluoro-containing monomer derived from bio-based anethole and a benzocyclobutene (BCB)-containing monomer gave a polymer with good dielectric properties and low water uptake.
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Toepper, Michael, Tanja Braun, Robert Gernhardt, Martin Wilke, Piotr Mackowiak, Klaus-Dieter Lang, Corey O'Connor, et al. "BCB-Based Dry Film low k Permanent Polymer with sub 4-μm Vias for Advanced WLP and FO-WLP Applications." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000079–85. http://dx.doi.org/10.4071/isom-2015-tp33.

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There is a strong demand to increase the routing density of the RDL to match the requirements for future microelectronic systems which are mainly miniaturization and performance. Photo-resists for structuring the metallization or acting as a mold for electroplating are common for very fine lines and spaces due to the developments in the front-end processing. For example chemical amplified Photo-resists are now moving in the back-end and wafer level packaging process. The results are mainly governed by the performance of the equipment i.e. the photo-tool. This is different for the permanent dielectric polymer material. The major difference in photo-resists and dielectric photo-polymer are the different functions of the material systems. Photo-resists are only temporary masks for subsequent process steps like etching and plating. This is different for the photo-polymers which are a permanent part of the future systems. In this paper a new technology is discussed which uses a laser scanning ablation process and BCB-Based Dry Film low k Permanent Polymer. Laser ablation of polymers is in principle not a new technology. Low speed and high cost was the major barrier. But the combination of a scanning technology together with quartz masks has opened this technology to overcome the limitation of the current photo-polymer process. The new technology is described in detail and the results of structuring BCB-Based Films down to less than 4 μm via diameter in a 15 μm thick film has been shown. The via side wall can be controlled by the fluence of the laser pulse. Test structures have been designed and fabricated to demonstrate the excellent electrical resistivity of the vias using a two-layer metallization process.
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Mills, Michael E., Paul Townsend, Dan Castillo, Steve Martin, and Albert Achen. "Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material." Microelectronic Engineering 33, no. 1-4 (January 1997): 327–34. http://dx.doi.org/10.1016/s0167-9317(96)00061-5.

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Sung, Taehyun, Sue A. Bidstrup Allen, and Paul A. Kohl. "Low Temperature Rapid Curing of Polymer Dielectrics on Metallized Organic Laminates by Variable Frequency Microwave Processing." Journal of Microelectronics and Electronic Packaging 2, no. 2 (April 1, 2005): 142–54. http://dx.doi.org/10.4071/1551-4897-2.2.142.

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The curing of polymer dielectrics on organic laminates by variable frequency microwave (VFM) processing was studied. Polymer dielectrics, such as polyimides, normally require long cure times at elevated temperatures resulting in processing incompatibility with epoxy-based laminates due to the low thermal stability of the organic laminates. In this study, VFM processing was investigated as an alternative, low temperature technique for curing polyimide and benzycyclobutene (BCB) on metallized bismaleimide triazine/epoxy (BT) board. The VFM heating characteristics of the metallized (BT) boards were studied. The VFM heating rates of the BT boards strongly depended on the configuration, size, and shape of the copper patterns on the boards. The VFM curing of polyimide and BCB on the metallized BT boards was also performed. The curing condition was optimized to minimize board degradation. At the same board degradation level, the chemical, thermo-mechanical and electrical properties of the VFM cured film were compared with a film thermally cured using a conventional convection furnace. A higher degree of curing and lower dielectric constant was achieved for benzocyclobutene (BCB) films on BT boards processed using VFM curing than was obtained using conventional curing. VFM cured polyimide (PI 2611) showed a similar degree of curing and Young's modulus to conventionally cured PI 2611. However, the VFM cured PI 2611 showed a higher residual content solvent and a higher dielectric constant than conventionally cured PI 2611.
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Dissertations / Theses on the topic "BCB polymer"

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Frank, Niklaus. "Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems." Doctoral thesis, KTH, Signals, Sensors and Systems, 2002. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3410.

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Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. The main advantages of adhesive wafer bondingare the relatively low bonding temperatures, the lack of needfor an electric voltage or current, the compatibility withstandard CMOS wafers and the ability to join practically anykind of wafer materials. Adhesive wafer bonding requires nospecial wafer surface treatmentssuch as planarisation.Structures and particles at the wafer surfaces can be toleratedand compensated for some extent by the adhesive material.Adhesive wafer bonding is a comparably simple, robust andlowcost bonding process. In this thesis, adhesive wafer bondingtechniques with different polymer adhesives have beendeveloped. The relevant bonding parameters needed to achievehigh quality and high yield wafer bonds have been investigated.A selective adhesive wafer bonding process has also beendeveloped that allows localised bonding on lithographicallydefined wafer areas.

Adhesive wafer bonding has been utilised in variousapplication areas. A novel CMOS compatible film, device andmembrane transfer bonding technique has been developed. Thistechnique allows the integration of standard CMOS circuits withthin film transducers that can consist of practically any typeof crystalline or noncrystalline high performance material(e.g. monocrystalline silicon, gallium arsenide,indium-phosphide, etc.). The transferred transducers or filmscan be thinner than 0.3 µm. The feature sizes of thetransferred transducers can be below 1.5 µm and theelectrical via contacts between the transducers and the newsubstrate wafer can be as small as 3x3 µm2. Teststructures for temperature coefficient of resistancemeasurements of semiconductor materials have been fabricatedusing device transfer bonding. Arrays of polycrystallinesilicon bolometers for use in uncooled infrared focal planearrays have been fabricated using membrane transfer bonding.The bolometers consist of free-hanging membrane structures thatare thermally isolated from the substrate wafer. Thepolycrystalline silicon bolometers are fabricated on asacrificial substrate wafer. Subsequently, they are transferredand integrated on a new substrate wafer using membrane transferbonding. With the same membrane transfer bonding technique,arrays of torsional monocrystalline silicon micromirrors havebeen fabricated. The mirrors have a size of 16x16 µm2 anda thickness of 0.34 µm. The advantages of micromirrorsmade of monocrystalline silicon are their flatness, uniformityand mechanical stability. Selective adhesive wafer bonding hasbeen used to fabricate very shallow cavities that can beutilised in packaging and component protection applications. Anew concept is proposed that allows hermetic sealing ofcavities fabricated using adhesive wafer bonding. Furthermore,microfluidic devices, channels and passive valves for use inmicro total analysis systems are presented.

Adhesive wafer bonding is a generic CMOS compatible bondingtechnique that can be used for fabrication and integration ofvarious microsystems such as infrared focal plane arrays,spatial light modulators, microoptical systems, laser systems,MEMS, RF-MEMS and stacking of active electronic films forthree-dimensional high-density integration of electroniccircuits. Adhesive wafer bonding can also be used forfabrication of microcavities in packaging applications, forwafer-level stacking of integrated circuit chips (e.g. memorychips) and for fabrication of microfluidic systems.

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Do, Minh-Nhut. "Co-conception et caractérisation de circuits actifs et passifs tri-dimensionnels en bande K pour l'intégration de mycrosystèmes sur silicium aux fréquences milimétriques." Phd thesis, Université Paul Sabatier - Toulouse III, 2007. http://tel.archives-ouvertes.fr/tel-00196619.

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Les travaux menés dans le cadre de cette thèse proposent de tirer profit des nouvelles technologies disponibles pour répondre aux besoins de la montée en fréquence et de la miniaturisation des systèmes de communication tout en améliorant le niveau des performances. Les études se sont axées vers la conception d'une structure à mélangeur de réjection de fréquence image permettant de relâcher les contraintes sur les structures critiques de filtrage amont. L'intégration des parties actives et passives de ce système, a ainsi été menée avec comme objectifs de tirer au maximum partie des potentialités de chaque technologie, de proposer des solutions techniques pour palier aux inconvénients de chaque technologie, et d'optimiser l'architecture globale en partitionnant le système suivant les contraintes technologiques et/ou techniques. La première partie des travaux a ainsi porté sur le développement en bande K d'une nouvelle topologie de mélangeur à base de transistors à hétérojonction Si-SiGe à linéarité améliorée. Se basant sur une compréhension des phénomènes intrinsèques du circuit, des topologies modifiées ont de plus été proposés afin de repousser l'ensemble des performances atteignables sur cette technologie. La seconde partie des travaux concerne la conception de coupleurs passifs, toujours en bande K, avec pour objectif la miniaturisation maximale de ces fonctions. Une méthodologie de conception a, dans ce cadre, été développée et validée par une intégration sur une technologie spécifiquement développée au LAAS-CNRS et compatible avec une future intégration avec les circuits actifs. Nous avons ainsi obtenu des performances optimales (à l'état de l'art) avec un gain d'intégration d'un facteur 2. Enfin, en amont et en aval de ces travaux, une étude sur l'architecture globale du système de mélangeur à réjection de fréquence image a été conduite, et sans cesse raffinée, afin de partitionner les contraintes de performances entre les différents blocs et de vérifier l'obte ntion des performances.
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Kristen, Juliane Ute. "Amphiphilic BAB-triblock copolymers bearing fluorocarbon groups : synthesis and self-organization in aqueous media." Phd thesis, Universität Potsdam, 2011. http://opus.kobv.de/ubp/volltexte/2012/6178/.

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In this work new fluorinated and non-fluorinated mono- and bifunctional trithiocarbonates of the structure Z-C(=S)-S-R and Z-C(=S)-S-R-S-C(=S)-Z were synthesized for the use as chain transfer agents (CTAs) in the RAFT-process. All newly synthesized CTAs were tested for their efficiency to moderate the free radical polymerization process by polymerizing styrene (M3). Besides characterization of the homopolymers by GPC measurements, end- group analysis of the synthesized block copolymers via 1H-, 19F-NMR, and in some cases also UV-vis spectroscopy, were performed attaching suitable fluorinated moieties to the Z- and/or R-groups of the CTAs. Symmetric triblock copolymers of type BAB and non-symmetric fluorine end- capped polymers were accessible using the RAFT process in just two or one polymerization step. In particular, the RAFT-process enabled the controlled polymerization of hydrophilic monomers such as N-isopropylacrylamide (NIPAM) (M1) as well as N-acryloylpyrrolidine (NAP) (M2) for the A-blocks and of the hydrophobic monomers styrene (M3), 2-fluorostyrene (M4), 3-fluorostyrene (M5), 4-fluorostyrene (M6) and 2,3,4,5,6-pentafluorostyrene (M7) for the B-blocks. The properties of the BAB-triblock copolymers were investigated in dilute, concentrated and highly concentrated aqueous solutions using DLS, turbidimetry, 1H- and 19F-NMR, rheology, determination of the CMC, foam height- and surface tension measurements and microscopy. Furthermore, their ability to stabilize emulsions and microemulsions and the wetting behaviour of their aqueous solutions on different substrates was investigated. The behaviour of the fluorine end-functionalized polymers to form micelles was studied applying DLS measurements in diluted organic solution. All investigated BAB-triblock copolymers were able to form micelles and show surface activity at room temperature in dilute aqueous solution. The aqueous solutions displayed moderate foam formation. With different types and concentrations of oils, the formation of emulsions could be detected using a light microscope. A boosting effect in microemulsions could not be found adding BAB-triblock copolymers. At elevated polymer concentrations, the formation of hydrogels was proved applying rheology measurements.
Im Rahmen dieser Arbeit wurden neue fluorierte und unfluorierte mono- und bifunktionelle Trithiocarbonate der Typen Z-C(=S)-S-R und Z-C(=S)-S-R-S-C(=S)-Z zur Anwendung als CTAs (chain- transfer agents) im RAFT-Polymerisationsverfahren hergestellt. Alle CTAs wurden erfolgreich auf ihre Effizienz zur Steuerung des radikalischen Polymerisationsverfahrens hin durch Polymerisation von Styrol (M3) getestet. Neben GPC-Messungen wurden Endgruppenanalysen der synthetisierten Blockcopolymere mittels 1H-, 19F-NMR und in manchen Fällen auch UV-Vis Spektroskopie durchgeführt. Dazu wurden die Z- und/oder R-Gruppen der CTAs mit geeigneten fluorierten Gruppen versehen. Durch Anwendung des RAFT Verfahrens konnten symmetrische Triblockcopolymere vom Typ BAB bzw. mit einer Fluoralkylgruppe endgecappte unsymmetrische Polymere in nur zwei bzw. einem Polymerisationsschritt hergestellt werden. Das RAFT- Polymerisationsverfahren ermöglicht sowohl die Polymerisation hydrophiler Monomere wie N-Isopropylacrylamid (NIPAM) (M1) oder N-Acryloylpyrrolidin (NAP) (M2) für die A-Blöcke als auch der hydropoben Monomere Styrol (M3), 2-Fluorostyrol (M4), 3-Fluorostyrol (M5), 4- Fluorostyrol (M6) und 2,3,4,5,6- Pentafluorostyrol (M7) für die B-Blöcke. Die Eigenschaften der Blockcopolymere in verdünnten, konzentrierten und hochkonzentrierten wässrigen Lösungen wurden mittels DLS, Trübungsphotometrie, 1H- und 19F-NMR, Rheologie, CMC- sowie Schaumhöhen- und Oberflächenspannungsmessungen und Lichtmikroskopie untersucht. Weiterhin wurden ihre Eigenschaften als Emulgatoren und in Mikroemulsion untersucht. Das Micellbildungsverhalten der hydrophob endfunktionalisierten Polymere wurde mittels DLS Messungen in verdünnter organischer Lösung untersucht. Alle untersuchten BAB-Triblöcke bildeten Micellen und zeigten Oberflächenaktivität bei Raumtemperatur in verdünnter, wässriger Lösung. Weiterhin zeigen die wässrigen Lösungen der Polymere mäßige Schaumbildung. Mit verschiedenen Öltypen und Ölkonzentrationen wurden Emulsionen bzw. Mikroemulsionen gebildet. In Mikroemulsion wurde durch Zugabe von BAB-Triblockopolymeren kein Boosting-Effekt erzielt werden. Bei Untersuchung höherer Polymerkonzentrationen wurde die Bildung von Hydrogelen mittels rheologischer Messungen nachgewiesen. Verschiedene Substrate konnten benetzt werden. Die hydrophob endgecappten Polymere bilden in verdünnter organischer Lösung Micellen, die mittels DLS untersucht wurden, und zeigen somit Tensidverhalten in nichtwässriger Lösung.
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Soundararajan, R. "Enhancing the bioavailability of BCS Class IV drugs using polymeric nanoparticles." Thesis, University College London (University of London), 2016. http://discovery.ucl.ac.uk/1479729/.

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Hydrophobic drugs that are P-gp substrates (BCS Class IV) such as paclitaxel, CUDC-101 etc. pose a serious challenge for oral drug delivery. Polymeric amphiphiles such as N-palmitoyl-N-monomethyl-N,N-dimethyl-N,N,N-trimethyl-6-O-glycolchitosan (GCPQ) are capable of enhancing the bioavailability of hydrophobic drugs by forming nanoparticles. The general hypothesis is that the physicochemical properties of the polymer will affect the colloidal stability, encapsulation efficiency and absorption of hydrophobic drugs. The main aims of the project are as follows: a) to examine the feasibility of using GCPQ with different characteristics, for the oral and subcutaneous delivery of CUDC-101 and b) to examine the effect of N-(2-phenoxyacetamide)-6-O-glycolchitosan (GCPh) on the P-gp efflux of paclitaxel. GCPh, a new polymeric amphiphile was synthesized by conjugating glycol chitosan to phenoxy acetic acid. Paclitaxel and CUDC-101 were encapsulated with GCPh and GCPQ of different molecular weights and hydrophobicity. The in vivo oral drug absorption profile for paclitaxel-GCPh nanoparticles and paclitaxel-Taxol® nanoparticles were determined in mice with and without verapamil, a P-gp inhibitor. In another study, the oral and subcutaneous drug absorption profile for CUDC-101 – GCPQ nanoparticles were conducted in mice and rat models respectively. Results indicated that GCPh improved the oral absorption of paclitaxel by improving the dissolution and promoting particle uptake through enterocytes. Experiments with Taxol® suggested that it is possible to saturate the P-gp pumps by improving the drug’s dissolution. Oral absorption of CUDC-101 was poor due to the drug’s extremely poor water solubility. The subcutaneous absorption of CUDC-101 – GCPQ nanoparticles were excellent. The colloidal stability and absorption of these nanoparticles can be improved by increasing polymer concentration and its hydrophobicity. These nanoparticles also prolonged the life span of human A431 tumour bearing mice by 28 days (p < 0.001). To conclude, the new polymeric amphiphile (GCPh), capable of improving the oral absorption of BCS Class IV P-gp substrates was developed. A new strategy to nullify the P-gp efflux was developed. A clinically relevant subcutaneous dosage form for CUDC-101 was also successfully developed.
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Rusli, Rafeadah. "Interfacial micromechanics of natural cellulose whisker polymer nanocomposites using Raman spectroscopy." Thesis, University of Manchester, 2011. https://www.research.manchester.ac.uk/portal/en/theses/interfacial-micromechanics-of-natural-cellulose-whisker-polymer-nanocomposites-using-raman-spectroscopy(2eab8693-78b1-4241-bcfb-f7d2ae39fbf6).html.

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Raman spectroscopy has been used to monitor the deformation of natural cellulose whisker polymer nanocomposites. Cotton and tunicate whiskers were used as reinforcements in polymer matrices. Raman spectra from the nanocomposites highlight an intense band located at the 1095 cm-1 position. This band is reported to shift towards a lower wavenumber under the application of tensile deformation. On the other hand, the compressive deformation of the composite gives rise to an increase in the position of this Raman band. The shifts correspond to the direct deformation of the molecular backbone of cellulose, which is dominated by a C-O stretching mode. The Raman band located at 1095 cm-1 is shown to shift non-linearly before it reaches a plateau due to the breakdown of the whisker-matrix interface. The initial shift rate is associated with the stiffness of the cellulose whiskers. The stiffnesses of single whiskers of cotton and tunicate are found to be 58 and 155 GPa respectively, assuming two dimensional (2D) in-plane distribution of whiskers. Cyclic deformation tests of the composites provide an insight into understanding the behaviour of the whisker-polymer matrix interface under tension and compression. It is found that residual compressive stress occurs during each cycle of the deformation. The level of disruption at the whisker-matrix interface is determined by estimating the energy dissipation, which is proportional to the hysteresis area. Local orientation is also observed in the nanocomposites produced by solution casting and subsequent melt pressing. Dark regions of the composites viewed under a polarised optical microscopy are found to represent areas in which the cellulose whiskers form a randomly oriented whisker network. A shift rate for the Raman band initially located at 1095 cm-1 obtained in the dark regions of 12.2 vol% tunicate whisker poly(vinyl acetate) nanocomposites is found to be -0.5±0.07 cm-1%-1, which is lower than -1.2±0.04 cm-1%-1 from the bright regions. Exposure to water and temperature during the deformation of the nanocomposites results in significant changes in stress transfer between the whiskers and the matrix. It is shown that the interface can be 'switched-off' for the poly(vinyl acetate)/whisker system in the presence of water and also at temperature above the glass transition.
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Bin, Ahmad Sobri Sharizal. "Mechanical and laser drilling of thick carbon fibre reinforced polymer composites (CFRP)." Thesis, University of Manchester, 2018. https://www.research.manchester.ac.uk/portal/en/theses/mechanical-and-laser-drilling-of-thick-carbon-fibre-reinforced-polymer-composites-cfrp(e5c5182e-a8b2-49c9-bceb-bd7ba9342eb1).html.

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Carbon fibre reinforced polymer, or CFRP composite materials, play an increasingly important role in modern manufacturing. They are widely used in aerospace, and their use is currently spreading to other industries where high strength-to-weight ratios are required. However, machining of composites is still a challenging task and often hampered by poor quality. Despite the extensive research that was conducted on the machining of composite materials over the last few years, mechanical drilling still suffers from delamination, fibre pull-out and poor surface finish, whereas laser cutting produces microstructured defects and a taper problem. This thesis reports on the drilling of CFRP composites by demonstrating the possibility of drilling small diameter holes (i.e. 8mm) into 25.4mm thick carbon fibre reinforced polymer composites (CFRPs) using mechanical drilling and laser drilling as stand-alone processes and as a sequential combination. The research involved four main phases of experimental testing. The first part of Phase 1 involved!preliminary experiments of drilling thick CFRP to identify the most suitable drilling strategy. Three mechanical drilling strategies conducted in the same parameter by using a 2-flute uncoated WC twist drill that was assessed with respect to feasibility of drilling thick CFRP. The results showed that the single-step strategy was the most feasible strategy to drill thick CFRP compared to 2- and 4-peck drilling strategies. The second part of Phase 1 concerned the influence of speed-feed combinations on hole quality by utilising three twist drills with different materials and geometries in both an uncoated and coated condition. The results indicated that a significant increase in peel-up delamination was found with increasing feed rate. In contrast, using a constant feed rate but increasing the spindle speed seemed to reduce peel-up delamination. Furthermore, the hole entry for 2-flute uncoated WC drill bits was an uncommon study finding because most of the previous researchers experienced more damages at the hole exit and their investigation focused on the hole exit only. Currently, implementation of laser technology in cutting and drilling composites is becoming popular as an alternative solution. Various experiments were conducted with the goal of identifying the effects of machining parameters on key output measures (i.e. heat affected zone (HAZ), hole depth and other damages) in drilling of 25.4 mm thick CFRP by using a fibre laser. Phase 2 involved a number of machining parameters selected to identify the potential of a fibre laser in drilling thick CFRP composites (i.e. laser power, scanning speed, focal point plane position (FPP), assisted-gas type and gas pressure). The results proved that a fibre laser could penetrate thick CFRP to a 22mm depth only. Moreover, the spiral trepanning strategy was able to penetrate 80% out of the total thickness of the CFRP in continuous wave (CW) mode, whereas the modulated laser beam (i.e. laser pulse mode) can penetrate 67% only. This result was a major recorded breakthrough because previous research attempts cut up to 5mm only. Laser power proved to be the most influential factor for hole depth in laser drilling of thick CFRP when the spiral trepanning strategy was applied. Machining trials were conducted in Phase 3 by using a 16kW fibre laser in modulated pulsed laser mode. In this phase, laser power of more than 1kW was attempted to cut the whole thickness of CFRP composites in CW mode, but it was unsuccessful. However, a new parameter was discovered (i.e. the cooling time between passes in modulated pulsed mode), which proved a considerable reduction of HAZ when the higher cooling time was imposed. Finally, phase 4 involved the experiments of sequential laser-mechanical drilling. A 1kW fibre laser was selected as a pre-drilling or initial step and followed by mechanical drilling as the final step. The sequential drilling method successfully reduced thrust force and torque for mechanical drilling by an overall average of 61%, resulting in high productivity and decreasing the thermal and mechanical stresses in the cutting tool and, in turn, promoting higher tool life. The highest delamination factor (Fda) ratio was experienced by the sequential laser 8mm – mechanical 8mm for both tools (i.e. 2- and 3-flute uncoated tungsten carbide) and laser pre-drilling strategies (i.e. single- and double-side). Thus, a novel laser-mechanical sequential drilling technique was developed, evaluated and tested in the drilling of thick CFRP composites; this is the first time ever in drilling thick CFRP (i.e. 25.4mm).
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Al, Rifaie Mohammed Jamal. "Resilience and Toughness Behavior of 3D-Printed Polymer Lattice Structures: Testing and Modeling." Wright State University / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=wright1502760172343413.

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Bhonsle, Amrata. "Improved Solubility and Dissolution of BCS Class II drug Spironolactone by Formulating in Ternary Solid Dispersion with Carrier Beta-Cyclodextrin and Adjuvant Water Soluble Vitamin [Pyridoxine HCl (Vit B6)]." University of Toledo Health Science Campus / OhioLINK, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=mco1404735377.

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Fuligni, Matteo. "PEDOT:PSS-based conductive Textile for simultaneous detection of sweat analytes." Bachelor's thesis, Alma Mater Studiorum - Università di Bologna, 2020. http://amslaurea.unibo.it/21204/.

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This thesis is part of the wearable electronic field, and in particular of the Organic BioElecteonic Sensors that have the in-situ real-time monitoring of the health and performance status of the subject as the main goals. With this purpose, textile-based wearable sensors for continuous and simultaneous detection of [Cl–] and pH level have been developed. PEDOT:PSS is the intrinsic conductive polymer used to make the commercial yarns conductive. The coated threads have been functionalized with Ag/AgCl NPs and BTB to make them able to detect [Cl–] and pH level, respectively. The developed sensors end up to be easy-to-make, reproducible with excellent sensitivity and stability both in single and multiple configurations without any interference. The results achieved in this work allow future improvements to develop a new textile-based device that can be easily integrated into clothing, allowing worn it in dealy life.
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Tiwari, Housila. "INVESTIGATION OF THE FEASIBILTY OF METALS, POLYMERIC FOAMS, AND COMPOSITE FOAM FOR ON-BOARD VEHICULAR HYDROGEN STORAGE VIA HYDROSTATIC PRESSURE RETAINMENT (HPR) USING IDEAL BCC MICROSTRUCTURE." Ohio University / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1186967436.

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Book chapters on the topic "BCB polymer"

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Borst, Christopher L., William N. Gill, and Ronald J. Gutmann. "CMP of BCB and Silk Polymers." In Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses, 71–95. Boston, MA: Springer US, 2002. http://dx.doi.org/10.1007/978-1-4615-1165-6_4.

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Gooch, Jan W. "BCF Yarns." In Encyclopedic Dictionary of Polymers, 70. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_1144.

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Mansouri, Mohammad, Gholam Hossein Zohuri, and Navid Ramezanian. "Effect of Ethylene Monomer Pressure on BCE Ziegler-Nata Catalyst Fragmentation in the Early Stage of Polymerization." In Eco-friendly and Smart Polymer Systems, 446–48. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-45085-4_108.

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"BCF yarns." In Encyclopedic Dictionary of Polymers, 94. New York, NY: Springer New York, 2007. http://dx.doi.org/10.1007/978-0-387-30160-0_1113.

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Ho, Yeek-Chia, Siong-Chin Chua, and Fai-Kait Chong. "Coagulation-Flocculation Technology in Water and Wastewater Treatment." In Handbook of Research on Resource Management for Pollution and Waste Treatment, 432–57. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-7998-0369-0.ch018.

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Coagulation and flocculation processes are widely used in potable water treatment due to its high efficiency in turbidity removal. Egyptians discovered this method in 1500 BC by using alum to settle the suspended solids in the water. Today, the coagulation and flocculation processes are implemented with the purpose of agglomerate colloids and fine particles in water into larger particles, which is also known as floc. Therefore, reduction of turbidity and pollutants e.g. organic matter, inorganic matter, suspended solid, etc. can be achieved. This chapter covers the principle of coagulation and flocculation process which includes the charge neutralization and various binding mechanisms e.g. interparticle bridging, sweeping coagulation, and absorption. Besides, various types of coagulants and flocculants that have been discovered and their respective effectiveness in potable water treatment are discussed as well in this chapter. Polymer modifications to synthesize new coagulant/flocculant i.e. grafting and crosslinking are also included.
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Conference papers on the topic "BCB polymer"

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Havreland, Andreas, Martin Ommen, Chantal Silvestre, Mathias Engholm, Jorgen Jensen, and Erik Thomsen. "BCB polymer based row-column addressed CMUT." In 2017 IEEE International Ultrasonics Symposium (IUS). IEEE, 2017. http://dx.doi.org/10.1109/ultsym.2017.8091939.

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Havreland, Andreas Spandet, Martin Lind Ommen, Chantal Silvestre, Mathias Engholm, Jorgen Arendt Jensen, and Erik Vilain Thomsen. "BCB polymer based row-column addressed CMUT." In 2017 IEEE International Ultrasonics Symposium (IUS). IEEE, 2017. http://dx.doi.org/10.1109/ultsym.2017.8092524.

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Cao, W., M. Du, Y. Kim, W. Herman, and C. Lee. "Ultrafast transient photoconductivity of bisbenzocyclobutene (BCB) polymer films." In Ultrafast Electronics and Optoelectronics. Washington, D.C.: OSA, 2003. http://dx.doi.org/10.1364/ueo.2003.wc6.

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Wang, C. H., J. Zeng, K. Zhao, and H. L. Chan. "Chip scale studies of BCB based polymer bonding for MEMS packaging." In 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4550236.

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Yeap, Siew Bee, Zhi Ning Chen, Xianming Qing, Li Rui, David Soon Wee Ho, and Lim Teck Guan. "135GHz antenna array on BCB membrane backed by polymer-filled cavity." In 2012 6th European Conference on Antennas and Propagation (EuCAP). IEEE, 2012. http://dx.doi.org/10.1109/eucap.2012.6206579.

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Seonho Seok, N. Rolland, and P. A. Rolland. "A 60 GHz quarter-wave patch antenna based on BCB polymer." In 2008 IEEE Antennas and Propagation Society International Symposium and USNC/URSI National Radio Science Meeting. IEEE, 2008. http://dx.doi.org/10.1109/aps.2008.4619747.

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Venneri, I., A. Borgia, L. Boccia, G. Amendola, and G. Di Massa. "Millimeter waves patch antenna design and realization on BCB polymer substrates." In 2008 IEEE Antennas and Propagation Society International Symposium and USNC/URSI National Radio Science Meeting. IEEE, 2008. http://dx.doi.org/10.1109/aps.2008.4619869.

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Seonho Seok, Nathalie Rolland, and Paul-Alain Rolland. "Quarter-wave patch antenna based on BCB polymer for sensor network applications." In 2007 European Microwave Conference. IEEE, 2007. http://dx.doi.org/10.1109/eumc.2007.4405470.

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Seonho Seok, Nathalie Rolland, and Paul-Alain Rolland. "Quarter-wave patch antenna based on BCB polymer for sensor network applications." In 2007 European Microwave Integrated Circuit Conference. IEEE, 2007. http://dx.doi.org/10.1109/emicc.2007.4412789.

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Phansalkar, Sukrut Prashant, Yu-Hsiang Yang, Changsu Kim, Bongtae Han, Young Kun Jee, Choong Seon Lee, Un Byung Kang, Jong Ho Lee, and Sang Cheon. "Mechanical Characterization of Benzene cyclobutene (BCB) Used in Cu/polymer Hybrid Bonding." In 2021 IEEE 71st Electronic Components and Technology Conference (ECTC). IEEE, 2021. http://dx.doi.org/10.1109/ectc32696.2021.00280.

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