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Journal articles on the topic 'BCB polymer'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

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1

Wang, Zidong, Michael Gallagher, Kevin Wang, Elissei Iagodkine, Mark Oliver, Joe Lachowski, Greg Prokopowicz, et al. "Development of Laser and Photodefinable Toughened Benzocyclobutene Dielectric Materials for 3D-TSV Integration." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000067–71. http://dx.doi.org/10.4071/isom-2013-ta31.

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3D IC integration based on TSV technology has been recognized as a key enabler for next generation of electronic devices with reduced size factor and improved performances. The adoption of 3D-TSV technology also requires the development of innovative interconnect solutions that reduces the size of signal routing and therefore imposes new demands on dielectric materials used to isolate the copper interconnects. Benzocyclobutene polymers (Dow's CYCLOTENE™ Advanced Electronic Resins) have been used to isolate copper interconnects in packaging applications for more than 20 years, due to a number of good attributes of the BCB polymer including low copper drift rate, low dielectric constant and low loss, low moisture absorption and proven reliability. However, the low fracture toughness and low elongation of BCB polymer has limited its use in stress buffer applications due to solder bump failure. Here we report the development of new laser and photodefinable toughened benzocyclobutene (BCB) dielectric materials that have following improved properties and benefits over commercial materials including: 1) Higher elongation to break at 25%, 2) Higher fracture toughness, 3) Improved lithographic performance, < 8μm minimal size feature, 4) Better stability, no change in Eo after 30 days at room temperature. The patterning and integration of these toughened benzocyclobutene materials and the processing conditions are also discussed. We believe this toughened BCB material will find wide applications as a stress buffer layer in 3-D IC.
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2

Kawahara, J., A. Nakano, K. Kinoshita, Y. Harada, M. Tagami, M. Tada, and Y. Hayashi. "Highly thermal-stable, plasma-polymerized BCB polymer film." Plasma Sources Science and Technology 12, no. 4 (October 7, 2003): S80—S88. http://dx.doi.org/10.1088/0963-0252/12/4/023.

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3

Im, Jang-hi, Edward O. Shaffer, Theodore Stokich,, Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, et al. "On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications." Journal of Electronic Packaging 122, no. 1 (October 20, 1999): 28–33. http://dx.doi.org/10.1115/1.483128.

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This work examines the mechanical performance of thin film coatings from Photosensitive-benzocyclobutene (Photo-BCB) formulations (Cyclotene2 4024, 4026 and 7200), on various substrate surfaces such as Al, Cu, Si, and SiN. The adhesion promoter used was designated AP-3000 and was based on vinyltriacetoxysilane (VTAS), which had been properly hydrolyzed and advanced. Measurement of the interfacial adhesion was performed primarily using the modified Edge Liftoff Test m-ELT. It was found that, by applying the newly developed adhesion promoter, AP-3000, the interfacial energy of Photo-BCB to Al, Cu, Si, and SiN was significantly improved, often approaching the toughness of Photo-BCB, ca. 45 J/m2. The x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) analyses of the delaminated surfaces of the Photo-BCB/Al structure revealed distinct differences in surface roughness and the chemical composition depending on whether or not adhesion promoter was used. Other parameters important for long term stability (e.g., moisture uptake and thermal stability) of Photo-BCB were also measured. The equilibrium moisture content at 84 percent RH in ambient temperature was low, 0.14 wt percent and the thermally induced weight loss at 330°C in helium atmosphere was less than 1 percent/h. The low moisture absorption and good thermal stability, together with the given mechanical toughness and adhesion, allow the Photo-BCB to be widely usable for various microelectronic packaging applications, for up to 40 μm thick build in the case of silicon substrate. [S1043-7398(00)00701-5]
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Hadjloum, Massinissa, Mohammed El Gibari, Hongwu Li, and Afshin S. Daryoush. "Broadband capacitively grounded coplanar to coupled microstrip transition for planar microwave photonic components." International Journal of Microwave and Wireless Technologies 9, no. 4 (September 9, 2016): 815–19. http://dx.doi.org/10.1017/s1759078716000969.

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Broadband transitions are presented in this paper for capacitively grounded coplanar waveguide to coupled microstrip (CMS) lines. These transitions are realized on both thick Rogers RO3003 substrate (thickness of 10 mils) and a thin benzocyclobutene (BCB) polymer film (thickness of 20 µm). A flat bandwidth of 4–20 GHz and 3.2 to over 40 GHz are measured for the RO3003 and BCB polymer substrates, respectively. These performances are obtained without making via-hole in the substrate or patterning the bottom ground plane, which makes this broadband transition easier to fabricate compared with the via-hole-based grounded CPW–CMS transitions.
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5

Kremensas, Arūnas, Agnė Kairytė, Saulius Vaitkus, Sigitas Vėjelis, and Giedrius Balčiūnas. "Mechanical Performance of Biodegradable Thermoplastic Polymer-Based Biocomposite Boards from Hemp Shivs and Corn Starch for the Building Industry." Materials 12, no. 6 (March 13, 2019): 845. http://dx.doi.org/10.3390/ma12060845.

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Bio-sourced materials combined with a polymer matrix offer an interesting alternative to traditional building materials. To contribute to their wider acceptance and application, an investigation into the use of wood-polymer composite boards is presented. In this study, biocomposite boards (BcB) for the building industry are reported. BcB are fabricated using a dry incorporation method of corn starch (CS) and hemp shiv (HS) treatment with water at 100 °C. The amount of CS and the size of the HS fraction are evaluated by means of compressive bending and tensile strength, as well as microstructure. The results show that the rational amount of CS independently of HS fraction is 10 wt.%. The obtained BcB have compressive stress at 10% of deformation in the range of 2.4–3.0 MPa, bending of 4.4–6.3 MPa, and tensile strength of 0.23–0.45 MPa. Additionally, the microstructural analysis shows that 10 wt.% of CS forms a sufficient amount of contact zones that strengthen the final product.
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6

Eriguchi, Takeshi, Orson Wang, Kaori Tsuruoka, Yuichiro Ishibashi, and Yong Zhang. "ALX Polymer for Wafer Level Packaging: Mechanical Property Evaluation After Multiple Lead-Free Solder Reflows." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 001054–79. http://dx.doi.org/10.4071/2010dpc-tp34.

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For bumping and wafer level packaging (WLP) applications, BCB and polyimide are the predominant spin-on dielectric materials used for re-passivation, redistribution, interlayer dielectric, and stress buffer layers. Each of these materials has their respective strengths and weaknesses. BCB has exceptionally low shrinkage on cure and moisture absorption, low curing temperature, and a low dielectric constant, but is a mechanically brittle material which limits its application in bump-on-polymer applications. Polyimides are superior mechanically to BCB and are utilized more in bump-on-polymer structures, but suffer from much higher shrinkage on cure and moisture absorption (which can lead to blistering if not carefully processed), have higher dielectric constants, and have much higher cure temperatures. ALX spin-on polymer dielectric was developed to combine low shrinkage, low moisture absorption, low dielectric constant, and excellent mechanical and stress buffering properties with a cure temperature between 190C to 250C, depending on the application(1-3). Previous papers have reported the mechanical properties at 190C and the application of ALX in eutectic SnPb solder bump structures. The use of lead-free solder requires reflow temperatures up to 260C. Although ALX polymer is curable at less than 200C, the influence of lead-free solder reflow wasnft investigated. In this presentation we evaluate mechanical property changes of ALX Polymer films after different cure schedules and multiple reflows at lead-free solder temperatures. The impact of these parameters on WLP will be discussed.
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7

Li, Minghui, Jing Sun, and Qiang Fang. "A fluoropolymer with a low dielectric constant at a high frequency derived from bio-based anethole." Polymer Chemistry 12, no. 31 (2021): 4501–7. http://dx.doi.org/10.1039/d1py00573a.

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The copolymerization between a fluoro-containing monomer derived from bio-based anethole and a benzocyclobutene (BCB)-containing monomer gave a polymer with good dielectric properties and low water uptake.
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8

Toepper, Michael, Tanja Braun, Robert Gernhardt, Martin Wilke, Piotr Mackowiak, Klaus-Dieter Lang, Corey O'Connor, et al. "BCB-Based Dry Film low k Permanent Polymer with sub 4-μm Vias for Advanced WLP and FO-WLP Applications." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000079–85. http://dx.doi.org/10.4071/isom-2015-tp33.

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There is a strong demand to increase the routing density of the RDL to match the requirements for future microelectronic systems which are mainly miniaturization and performance. Photo-resists for structuring the metallization or acting as a mold for electroplating are common for very fine lines and spaces due to the developments in the front-end processing. For example chemical amplified Photo-resists are now moving in the back-end and wafer level packaging process. The results are mainly governed by the performance of the equipment i.e. the photo-tool. This is different for the permanent dielectric polymer material. The major difference in photo-resists and dielectric photo-polymer are the different functions of the material systems. Photo-resists are only temporary masks for subsequent process steps like etching and plating. This is different for the photo-polymers which are a permanent part of the future systems. In this paper a new technology is discussed which uses a laser scanning ablation process and BCB-Based Dry Film low k Permanent Polymer. Laser ablation of polymers is in principle not a new technology. Low speed and high cost was the major barrier. But the combination of a scanning technology together with quartz masks has opened this technology to overcome the limitation of the current photo-polymer process. The new technology is described in detail and the results of structuring BCB-Based Films down to less than 4 μm via diameter in a 15 μm thick film has been shown. The via side wall can be controlled by the fluence of the laser pulse. Test structures have been designed and fabricated to demonstrate the excellent electrical resistivity of the vias using a two-layer metallization process.
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9

Mills, Michael E., Paul Townsend, Dan Castillo, Steve Martin, and Albert Achen. "Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material." Microelectronic Engineering 33, no. 1-4 (January 1997): 327–34. http://dx.doi.org/10.1016/s0167-9317(96)00061-5.

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10

Sung, Taehyun, Sue A. Bidstrup Allen, and Paul A. Kohl. "Low Temperature Rapid Curing of Polymer Dielectrics on Metallized Organic Laminates by Variable Frequency Microwave Processing." Journal of Microelectronics and Electronic Packaging 2, no. 2 (April 1, 2005): 142–54. http://dx.doi.org/10.4071/1551-4897-2.2.142.

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The curing of polymer dielectrics on organic laminates by variable frequency microwave (VFM) processing was studied. Polymer dielectrics, such as polyimides, normally require long cure times at elevated temperatures resulting in processing incompatibility with epoxy-based laminates due to the low thermal stability of the organic laminates. In this study, VFM processing was investigated as an alternative, low temperature technique for curing polyimide and benzycyclobutene (BCB) on metallized bismaleimide triazine/epoxy (BT) board. The VFM heating characteristics of the metallized (BT) boards were studied. The VFM heating rates of the BT boards strongly depended on the configuration, size, and shape of the copper patterns on the boards. The VFM curing of polyimide and BCB on the metallized BT boards was also performed. The curing condition was optimized to minimize board degradation. At the same board degradation level, the chemical, thermo-mechanical and electrical properties of the VFM cured film were compared with a film thermally cured using a conventional convection furnace. A higher degree of curing and lower dielectric constant was achieved for benzocyclobutene (BCB) films on BT boards processed using VFM curing than was obtained using conventional curing. VFM cured polyimide (PI 2611) showed a similar degree of curing and Young's modulus to conventionally cured PI 2611. However, the VFM cured PI 2611 showed a higher residual content solvent and a higher dielectric constant than conventionally cured PI 2611.
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11

Adamo, Cristina B., Alexander Flacker, Hercílio M. Cavalcanti, Ricardo C. Teixeira, Antonio L. P. Rotondaro, and Leandro T. Manera. "Development of MCM-D Technology with Photosensitive Benzocyclobutene." Journal of Integrated Circuits and Systems 11, no. 1 (December 28, 2016): 19–26. http://dx.doi.org/10.29292/jics.v11i1.426.

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This paper evaluates and compares the development of Multi-Chip Module Deposited (MCM-D) technology using photosensitive benzocyclobutene (BCB) with the non-photosensitive BCB to fabricate passive devices. The polymer was used to isolate the metal/interconnection layers and also as the dielectric for the capacitors. Ni-P/Au was used as the conductor film and Ta2N as the resistor film. The resistors’ sheet resistance was measured with both transfer length method (TLM) and direct measurement while the measurements of the capacitors and inductors required the use of a Vector Network Analyzer (VNA) and some mathematical algorithms.
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12

O'Connor, Corey, Robert Barr, Jeff Calvert, Anupam Choubey, Mike Gallagher, Elissei Iagodkine, Joon-Seok Oh, Andrew Politis, and Kevin Wang. "Photopatternable Laminate BCB Dielectric." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000580–84. http://dx.doi.org/10.4071/isom-poster6.

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Divinylsiloxane-bis-benzocyclobutene (DVS-bis-BCB, or BCB) is a well-known dielectric material that has been used in high volume manufacturing for many years (Dow's CYCLOTENE™ 3000/4000-series Advanced Electronic Resins). Typically, the application of these products has been by spincoating or spray coating of the dielectric material from a solvent-based formulation. However, for certain applications - for example, those involving large area, square substrates such as glass panels - it is desirable to be able to apply the BCB-based dielectric material using a dry film coating process, such as vacuum or hot roll lamination. In this paper, we describe the concept of creating a laminate film utilizing DVS-bis-BCB as the primary dielectric material component. In creating the laminate dielectric material, it is important to maintain the unique combination of thermal and electrical properties of DVS-bis-BCB, including high thermal stability, excellent copper barrier properties, low moisture uptake, low dielectric constant, and low dielectric loss. However, DVS-bis-BCB alone is too rigid to produce a high quality laminate film, therefore, it is necessary to modify the formulation to improve flexibility and lamination quality. As the flexibility of the film is increased, higher fracture toughness (K1C) and higher elongation values should result. Novel formulation adjustments to the base DVS-bis-BCB polymer system have resulted in an experimental laminate dielectric product that will be the focus of this discussion. Depending on the application, laminate films can vary in thickness from 2μm to 50μm or even thicker. A typical laminate film construct includes the BCB-based dielectric film with a base sheet of an optically-clear polyester (PET) film and a polyethylene (PE) cover sheet. The DVS-bis-BCB-based laminate can be tuned with appropriate additives to either pattern with UV exposure from a tool such as a Süss MicroTec Mask Aligner (50mJ/cm2 – 100mJ/cm2 exposure energy) or laser pattern with a tool such as a Süss MicroTec 248nm Excimer Laser. Aspect ratios of 1:1.5 have been achieved with a photopatternable DVS-bis-BCB film and aspect ratios of >1:1 are possible with a laser-patterned film. Beside the photopackage added to the film to enable UV patterning, toughening additives have also been incorporated to enhance the fracture toughness (K1C) and elongation properties. K1C for the laminate has been improved to 0.55Mpa·m1/2 vs. 0.35Mpa·m1/2 for DVS-bis-BCB. Elongation has been improved to 13% for the laminate vs. 8% for DVS-bis-BCB. Electrical properties are similar to DVS-bis-BCB. An additional attribute of the laminate dielectric is the ability to tent over and protect vias. Vias >100μm diameter have successfully been tented with a 10μm thick film. A DVS-bis-BCB-based laminate has been demonstrated with continued optimization and evaluation to follow.
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13

Aras, Fikret G., E. Oz Orhan, and I. Karaçali. "Benzocyclobutene (BCB 4022-35) Polymer Thin Films by Spin Coating Method." Lecture Notes on Photonics and Optoelectronics 1, no. 1 (2013): 9–13. http://dx.doi.org/10.12720/lnpo.1.1.9-13.

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14

Lee, Shuh-Ying. "Multimode interference optical splitter based on photodefinable benzocyclobutene (BCB 4024-40) polymer." Optical Engineering 46, no. 1 (January 1, 2007): 013401. http://dx.doi.org/10.1117/1.2432110.

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15

Wu, Yun, Jianjun Zou, Shuai Huo, Haiyan Lu, Yuecan Kong, Tangshen Chen, Wei Wu, and Jingxia Xu. "Benzocyclobutene (BCB) Polymer as Amphibious Buffer Layer for Graphene Field-Effect Transistor." Journal of Nanoscience and Nanotechnology 15, no. 8 (August 1, 2015): 5706–10. http://dx.doi.org/10.1166/jnn.2015.10034.

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16

Ibrahim, M. H., Shuh-Ying Lee, Mee-Koy Chin, N. M. Kassim, and A. B. Mohammad. "Single mode optical waveguides based on photodefinable benzocyclobutene (BCB 4024–40) polymer." Microwave and Optical Technology Letters 49, no. 2 (2006): 479–81. http://dx.doi.org/10.1002/mop.22150.

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17

Chen, Xiao, Jiajie Tang, Gaowei Xu, and Le Luo. "A Novel Wafer-Level Double Side Packaging and Its Microwave Performance." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000040–45. http://dx.doi.org/10.4071/isom-2012-ta17.

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In this paper, a wafer-level System-in-Packaging structure using through silicon via (TSV) for integration on both sides of the silicon wafer is presented. It is composed of BCB/ metal multilayers, high-resistivity silicon substrate with TSV. To reduce the transmission loss in microwave frequency, not only the high-resistivity silicon is used, but also a special TSV structure with 6 grounded shielding vias around the core via are adopted. Microstrip line (MSL) is used to transmit high-frequency signal on package plane together with the low permittivity intermediate dielectric polymer, BCB. Descriptions on the interconnection structure and the fabrication process are included. The microwave measurement result of the MSL connected by TSVs is measured up to 35GHz. The results of both the simulation and the measurement are presented.
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18

Ehteshami, Gholamreza, Amarjit Singh, Gene Coryell, Stephen Massia, Jiping He, and Gregory Raupp. "Glial cell and fibroblast cytotoxicity study on 4026-cyclotene photosensitive benzocyclobutene (BCB) polymer films." Journal of Biomaterials Science, Polymer Edition 14, no. 10 (January 2003): 1105–16. http://dx.doi.org/10.1163/156856203769231592.

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19

Shih, Jian-Yu, Wen-Chun Huang, Cheng-Ta Ko, Zheng Yang, Sheng-Hsiang Hu, Jihperng Leu, Keng C. Chou, and Kuan-Neng Chen. "Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications." IEEE Transactions on Device and Materials Reliability 14, no. 3 (September 2014): 914–20. http://dx.doi.org/10.1109/tdmr.2014.2343793.

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20

Borst, Christopher L., Dipto G. Thakurta, William N. Gill, and Ronald J. Gutmann. "Chemical-Mechanical Planarization of Low-k Polymers for Advanced IC Structures." Journal of Electronic Packaging 124, no. 4 (December 1, 2002): 362–66. http://dx.doi.org/10.1115/1.1510138.

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Successful integration of copper and low dielectric constant (low-k) materials is dependent on robust chemical-mechanical planarization (CMP) during damascene patterning. This process includes the direct removal of copper and interaction of the copper slurry with the underlying dielectric. Experiments were designed and performed to examine the CMP of two low-k polymers from Dow Chemical Company, bis-benzocyclobutene (BCB*, k=2.65) and “silicon-application low-k material” (SiLK* resin, k=2.65) with both acidic slurries suitable for copper damascene patterning and a KH phthalate-based model slurry developed for SiLK. Blanket polymer films were polished in order to determine the interactions that occur when copper and liner materials are removed by the damascene CMP process. Removal rates were obtained from material thickness measurements, post-CMP surface topography from AFM scans, and post-CMP surface chemistry from XPS measurements. Physically based wafer-scale models are presented which are compatible with the experimental results.
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21

Woehrmann, Markus, M. Toepper, H. Walter, and K. D. Lang. "Next generation thin film polymers for WLP applications and their mechanical and electrical characterization." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (January 1, 2015): 000656–78. http://dx.doi.org/10.4071/2015dpc-tp25.

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Thin film polymers, like PI, PBO and BCB are used in every wafer level packaging device. The improvement of the reliability of wafer-level packages and chip I/Os consider the choice of the polymer, which is used as dielectric on the chip, as a minor point. Because the production lines are normally fixed on one polymer and the high investments to evaluate the processing of an alternative polymer formulation in combination with costly reliability test seems to be not attractive till today. But the increased demands of advanced WLP and 3-D-Integration, which includes thin chips, chips stacking and higher routing densities, leads to reaching the limits of the common used material system combinations. The demand of better polymer films becomes evident by the fact that dozens of “next generation polymers” have entered the marked in the last years, which are tailored to get higher mechanical toughness and electrical performance aside of a nearly unchanged resolution capacity. The challenge for new polymer formulation is the evaluation of the processing and the generation of a reliable material property data base, which set the basics for any benchmarking to the already used polymer materials. The processing evaluation is done typically by the material supplier or the fab himself, where no special equipment is needed. The material property generation is a quite more complex topic because you need special equipment and partly the material need to be free standing without any substrate. This is also a handling issue, if we talk about thin films in the range of 5 to 20μm. This paper presents the reliable thin film polymer properties characterization of mechanical and electrical values. The measurements of the mechanical properties include the estimation of parameters like young's modulus, tensile strength, elongation at break, coefficient of thermal expansion, stress and time-temperature related effects. The evident topic of warpage related impacts by “new generation polymers” will be presented and discussed. Measurement structures on wafer-level are developed for the estimation of the electrical parameters, which allows a high accuracy and a device relevant value estimation. Parameters like break down voltage, leakage current, dielectric constant, loss factor are measured related to frequencies by MIM and resonator structures. We demonstrate with analyzing of the time-dependent dielectric breakdown (TDDB) of thin film polymers that there is an exponential linkage between field strength and the time till the breakthrough occurs. The mechanical and electrical properties were also investigated related to aging effects, when the application is running on elevated temperature. We examine a degradation of the mechanical and electrical performance, which should be taken into account for the mechanical system reliability and also for impedance controlled HF-application. This paper present advanced material characterization of thin film polymers which gives a guideline for the decision of the polymer related to the demands of the application.
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Pacchini, Sébastien, David Dubuc, Emmanuel Flahaut, and Katia Grenier. "Double-walled carbon nanotube-based polymer composites for electromagnetic protection." International Journal of Microwave and Wireless Technologies 2, no. 5 (October 2010): 487–95. http://dx.doi.org/10.1017/s1759078710000668.

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In this paper, we present a microwave absorber based on carbon nanotubes (CNT) dispersed inside a BenzoCycloButen® (BCB) polymer. The high aspect ratio and remarkable conductive characteristics of CNT give rise to good absorbing properties for electromagnetic protecting in microelectronic devices with very low concentration. In this article, nanocomposites are prepared using a solution-mixing method and are then evaluated and modeled by means of coplanar test structures. First, CNT concentrations are quantified by image processing. The nanocomposites implemented with coplanar test waveguides are then characterized using a vector network analyzer from 40 MHz to 20 GHz. An algorithm is developed to calculate the propagation constant “γ”, attenuation constant “α”, and relative effective complex permittivity (ɛreff = ɛreff′ − jɛreff″) for each CNT concentration. The extracted effective parameters are verified using the electromagnetic FEM-based Ansoft's® high frequency structure simulator (HFSS). Power absorption (PA) of 7 dB at 15 GHz is obtained with only 0.37 weight percent of CNT concentration in the polymer matrix. The resulting engineerable and controllable composite provides consequently a novel degree of freedom to design and optimize innovative microwave components.
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Seok, S., N. Rolland, and P. A. Rolland. "A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications." Sensors and Actuators A: Physical 147, no. 2 (October 2008): 677–82. http://dx.doi.org/10.1016/j.sna.2008.06.008.

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Ibrahim, M. H., Shuh-Ying Lee, Mee-Koy Chin, N. Mohd Kassim, and A. B. Mohammad. "Multimode interference wavelength multi/demultiplexer for 1310 and 1550nm operation based on BCB 4024-40 photodefinable polymer." Optics Communications 273, no. 2 (May 2007): 383–88. http://dx.doi.org/10.1016/j.optcom.2007.01.006.

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Ibrahim, M. H., N. M. Kassim, A. B. Mohammad, Shuh-Ying Lee, and Mee-Koy Chin. "A novel 1 × 2 multimode interference optical wavelength filter based on photodefinable benzocyclobutene (BCB 4024–40) polymer." Microwave and Optical Technology Letters 49, no. 5 (2007): 1024–28. http://dx.doi.org/10.1002/mop.22327.

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Makihata, Mitsutoshi, Masanori Muroyama, Shuji Tanaka, Takahiro Nakayama, Yutaka Nonomura, and Masayoshi Esashi. "Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin." Sensors 18, no. 7 (July 21, 2018): 2374. http://dx.doi.org/10.3390/s18072374.

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Covering a whole surface of a robot with tiny sensors which can measure local pressure and transmit the data through a network is an ideal solution to give an artificial skin to robots to improve a capability of action and safety. The crucial technological barrier is to package force sensor and communication function in a small volume. In this paper, we propose the novel device structure based on a wafer bonding technology to integrate and package capacitive force sensor using silicon diaphragm and an integrated circuit separately manufactured. Unique fabrication processes are developed, such as the feed-through forming using a dicing process, a planarization of the Benzocyclobutene (BCB) polymer filled in the feed-through and a wafer bonding to stack silicon diaphragm onto ASIC (application specific integrated circuit) wafer. The ASIC used in this paper has a capacitance measurement circuit and a digital communication interface mimicking a tactile receptor of a human. We successfully integrated the force sensor and the ASIC into a 2.5 × 2.5 × 0.3 mm die and confirmed autonomously transmitted packets which contain digital sensing data with the linear force sensitivity of 57,640 Hz/N and 10 mN of data fluctuation. A small stray capacitance of 1.33 pF is achieved by use of 10 μm thick BCB isolation layer and this minimum package structure.
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Hsieh, Yen-Hui, Yen-Jun Huang, Jian-Yu Shih, Jihperng Leu, and Kuan-Neng Chen. "Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface." IEEE Transactions on Components, Packaging and Manufacturing Technology 8, no. 2 (February 2018): 195–201. http://dx.doi.org/10.1109/tcpmt.2017.2786031.

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Liew, Li-Anne, Ching-Yi Lin, and Y. C. Lee. "Polymer-Based Hermetic Packaging for Flexible Micro Devices." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 001139–62. http://dx.doi.org/10.4071/2012dpc-tp36.

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In recent years, polymers have been widely adopted as a low-cost, light-weight and high-flexibility alternative to traditional silicon materials for MEMS. However, the majority of polymers do not provide hermetic protection because of their high moisture- and gas permeation rates. Yet, hermetic packaging is critical for many applications such as medical devices [1], RF MEMS [2] and micro heat pipes [3]. In particular, our group has been developing flexible thermal ground planes based on heat pipe technology [3] for advanced electronics cooling applications. Heat pipes require hermetic sealing, while flexibility requires the structural material to be polymer-based. Hermetic packaging methods for MEMS typically include welding, soldering [4], and various epoxies and polymers [1, 2, 5] to bond the parts in a package together. The bond interface is a major potential source of gas and moisture leakage. Although welds and solder joints offer effective hermetic seals, the bond interface is mechanically rigid. On the other hand, flexible bond materials like epoxies typically possess high moisture absorption rate and bonding strength degradation at high temperature [6] while polymers such as BCB [2] or LCP [7] either provide only semi-hermetic sealing or degrade at high temperature. We report a polymer-based hermetic packaging approach using fluorinated ethylene propylene (FEP), which possesses flexibility, high operating temperature compatibility (204°C), chemical resistance, and low water absorption rate. We report results of hermeticity tests in which FEP, solder, and epoxy were used to bond a copper-clad kapton “lid” onto a water-containing copper vessel which is then kept in an oven at 100 °C. The only path for water loss is through the bond interface. We show that the FEP-bonded test vehicles result in negligible water loss comparable to the solder-bonded containers, and far outperforming the epoxy-bonded containers. References: [1] G. Jiang and D. D. Zhou (Ed.), Implantable Neural Prostheses 2, (2010). [2] A Jourdain, P De Moor, K Baert, I DeWolf and H A C Tilmans, J. Micromech. Microeng.,15 (2005) S89–S96. [3] C.J. Oshman, B. Shi, C. Li, R. Yang, Y.C. Lee, G.P. Peterson, and V.M. Bright, J. Microelectromechanical Systems, 20, 2 (2011), 410–417. [4] T. Rude, J. Subramanian, J. Levin, D. Van Heerden, O. Knio, Proc. IMAPS 2005. [5] G. B. Tepolt, M. J. Meschera, J. J. LeBlanca, R. Lutwakb, M. Varghesec, Proc. of SPIE, Vol. 7592, 2010, 759207. [6] E. M. Petrie, Handbook of Adhesives and Sealants, 1st Ed. (McGraw-Hill, 1999), p. 707. [7] C.-D. Ghiu, S. Dalmia, J. Vickers, L. Carastro, W. Czakon, V. Sundaram, G. White, Proc. 1st European Microwave Integrated Circuits Conference, 2006, pp.545–547.
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Xing, Ying, Yao Shuai, Xiaoxue Wang, Lu Lv, Xiaoyuan Bai, Shitian Huang, Ke Jian, et al. "Fabrication of single crystalline LiNbO3 thin films for wideband bulk acoustic wave filters." Materials Express 10, no. 9 (September 30, 2020): 1504–10. http://dx.doi.org/10.1166/mex.2020.1783.

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Single crystalline lithium niobate (LN) thin films with a Y43-cut are fabricated by crystal-ion-slicing technique, and the B-staged benzocyclobutene (BCB) polymer is used as the bonding medium for the transferring of the LN thin film on to a homogeneous LN substrate. The thickness of the LN film is about 910 nm, and low energy ion irradiation is used to treat the surface of the film, which reduces the roughness from 12.4 nm down to 3.6 nm. Bulk acoustic wave (BAW) resonator is fabricated based on the thin LN layer, and the electromechanical coefficient (k2t) of the LN film reaches 16.3%. A 3-stage BAW filter is obtained, and the 3 dB bandwidth of the filter is 8.5%, demonstrating the single crystalline LN thin film with large k2t is promising for wide band filter.
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30

Ibrahim, M. H., Mee-Koy Chin, N. M. Kassim, and A. B. Mohammad. "A Novel 1×2 Thermo-Optic Multimode Interference Switch Structure Based on Photodefinable Benzocyclobutene (BCB 4024-40) Polymer on Silica." Chinese Physics Letters 23, no. 10 (September 27, 2006): 2796–98. http://dx.doi.org/10.1088/0256-307x/23/10/047.

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31

Kamsah, Nazri, Todd S. Gross, and Igor I. Tsukrov. "Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures." Journal of Electronic Packaging 124, no. 1 (March 8, 2001): 12–21. http://dx.doi.org/10.1115/1.1402629.

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The finite element method was used to estimate the stresses in single level, 1 μm thick Cu-dielectric interconnect line arrays with Ta liners resulting from heating from 20°C to 400°C assuming that the structure was stress free at 20°C. Benzocyclobutene (BCB) and SiO2 were chosen to represent typical polymer and ceramic dielectric materials being evaluated for Cu damascene interconnect structures. Experimentally observed Cu-Ta and Cu-Cu interfacial sliding was incorporated into the model using a 1 nm thick creep element that was calibrated to match the predictions of a classical diffusion-accommodated sliding model. The effect of Cu-Ta and Cu-Cu interfacial sliding was evaluated by comparing the relaxed and unrelaxed stresses. The effect of line width-to-thickness (w/t) ratio and Ta liner thickness on the shear, normal, and Ta liner-plane stresses at the Cu-Ta-dielectric interface was investigated because this interface is a likely failure site.
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32

Tvedt, Lars G. W., Nicolas Lietaer, Thor Bakke, Keith Redford, and Helge Kristiansen. "Wafer-Level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 002483–508. http://dx.doi.org/10.4071/2012dpc-tha32.

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As opposed to planar ICs, micro-electro mechanical systems (MEMS) are three dimensional structures with movable parts, membranes and cavities. Fragile movable structures are generally encapsulated inside a cavity by bonding a cap wafer to a MEMS device wafer. The use of through silicon vias (TSVs) in MEMS allows a significant miniaturization of the devices. TSVs through the cap wafer require an electrical connection between the TSVs and bond pads on the device wafer. This paper presents a novel bonding method that allows to do this in a simple and cost-effective way. We demonstrate the use of Benzocyclobutene (BCB) containing metal coated monodisperse polymer spheres (MPS) as an anisotropic conductive adhesive (ACA) for wafer-to-wafer bonding. The technology is demonstrated by bonding glass cap wafers with cavities and a patterned metallization to silicon wafers with a patterned metallization. The ACA is spray-coated onto the cap wafer and the bonding is performed in vacuum at 250 °C for 60 minutes with 300 mbar pressure applied. The electrical performance is evaluated using daisy-chain and kelvin structures, and the bond strength is verified by shear testing. Variations in bond frame size, contact area and minimum distance between conductor lines are investigated. Four wafers with a total of 880 dies are electrically tested. An average resistance of34 ±14mΩ is obtained for a contact area of 300 × 300 μm2 and 78 ±55 mΩ for 200 x 200 μm2. Daisy chains with 16 contact areas have a yield of 98 % for a 300 × 300 μm2 contact area and 95 % for 200 x 200 μm2. The technology is expected to be scalable to smaller contact areas by increasing the amount of MPS in the BCB. An average bond shear strength of 36 ± 9MPa is measured.
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Gallagher, Michael, Ed Anzures, Robert Auger, Rosemary Bell, Berry Paul, Hua Dong, Michelle Ho, et al. "Key Enabling Materials for 3DIC Fabrication and Device Performance." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (January 1, 2019): 001145–64. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_tha1_076.

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As the electronics industry reaches the limits of lithographic processing at sub-10nm dimensions, alternate approaches to meet the demand for increasing device density, reducing package size and improving device performance are being explored. Die stacking approaches to reduce the path length between CPU, GPU and memory devices using a heterogeneous 3DIC chip stacking technology have recently been announced, while memory manufacturers have been creating HBM die stacks for use in servers and highspeed applications. At DuPont Electronics & Imaging (E&I), we have been working to enable 3DIC technology through the development of chemicals and processes such as CMP pads and slurries for polishing all the critical materials, chemical cleaners to remove residues, and photoresists to pattern TSVs, pads and pillars. In addition to these materials, E&I also provides permanent materials for hybrid bonding, including electrodeposited copper for TSVs, pads and pillars as well as tin-silver for pillar capping. Another critical part of hybrid bonding is the adhesive bonding material, which needs to be planarized and yet still have sufficient flow to bond at the same time as the Cu-Cu or Cu-SnAg interconnect. This paper will demonstrate how these critical materials can be used together to fabricate 3DIC devices using a conventional bonding tool. Processing of wafers with sub-20 micron pillars has been completed with good metal joining and void-free bonding of the BCB-based polymer adhesive.
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Li, Hui Ling, Ya Wen Hang, Ke Cao, Fang Hua Zhu, and Jun Xiao Yang. "Preparation, Cross-Linking and Characterization of Novel Benzocyclobutene-Siloxane Polymers with Polysiloxane Mainchain and Silylbenzocyclobutene Pendant Groups." Advanced Materials Research 534 (June 2012): 178–83. http://dx.doi.org/10.4028/www.scientific.net/amr.534.178.

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A series of BCB-siloxane polymers with benzocyclobutene (BCB) pendant groups and polysiloxane mainchain was prepared by the hydrosilylation reaction between 4-(1,1-di-methyl-1-vinyl) silylbenzocyclobutene (4-DMVSBCB) and poly (methylhydrosiloxane) (PHMS) employing Pt/C as catalyst. Upon heating the BCB-siloxane polymers, the cross-linking occurred via ring-opening of benzocyclobutene as evidenced by on-line FT-IR, 1H NMR and 13C NMR. TGA examination indicates that the thermal stability was enhanced with increasing the incorporation ratio of BCB. Most importantly, the initial decomposition temperature of crosslinked BCB-siloxane resins is as high as 429 oC, showing a superior thermal resistance over most other BCB resins.
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35

Jahnes, Christopher, Eric Huenger, and Scott Kisting. "Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution Layers." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (January 1, 2011): 000666–98. http://dx.doi.org/10.4071/2011dpc-ta32.

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To increase performance of semiconductor devices advances in packaging such as chip stacking (3D) and silicon carrier technologies (SoC) are being developed. Adaptation of these packaging fabrication methods offers the ability to incorporate functionality as well as provide memory and power distribution on one IC with increased signal bandwidth. An enabling element in both the stacking and silicon carrier technologies is through silicon vias (TSV) which electrically connect dies to a silicon carrier or via stacked chips (1). Creation of TSV involves via fabrication, wafer thinning and back side wafer finishing, to name a few, some of which are relatively new to semiconductor processing. Furthermore, because the wafer backside is accessible it can now be utilized to route wiring to further increase package density. The focus of this research was to evaluate photo-sensitive spin on dielectric materials (SOD) that can be used as the backside wiring levels, commonly referred to as redistribution layers (RDL) in TSV technologies. The two materials evaluated are; the epoxy based Dow INTERVIA™ 8023 Dielectric and the Benzocyclobutene (BCB) polymer, Dow CYCLOTENE™ 4000 product series. These dielectric materials have low stress and provide good planarization (2). Test vehicles with a chip size of 3.7 cm x 2.26 cm were fabricated with a 6 um wide copper RDL layer using the SOD materials of interest as well as conventional PECVD SiO2/SiN dielectric layers. The large chip size accommodated parallel Cu lines running 1.8 cm long with a spacing of 3 m and represented an aggressive shorting test for the SOD materials. It also enhances chip distortion after thinning and is evaluated for all three test vehicles. Chips were then electrically tested through simulated 260° C reflow cycles (for flip chip joining) and accelerated thermal reliability tests from −55° C to 125° C for 1000 cycles.
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Kong, Lingqiang, Yuanrong Cheng, Yunxia Jin, Zhidong Ren, Yan Li, and Fei Xiao. "Adamantyl-based benzocyclobutene low-k polymers with good physical properties and excellent planarity." Journal of Materials Chemistry C 3, no. 14 (2015): 3364–70. http://dx.doi.org/10.1039/c4tc02854f.

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37

Yamsani, Vamshi, Ramesh Gannu, Chandrasekhar Kolli, M. Rao, and Madhusudan Yamsani. "Development and in vitro evaluation of buccoadhesive carvedilol tablets." Acta Pharmaceutica 57, no. 2 (June 1, 2007): 185–97. http://dx.doi.org/10.2478/v10007-007-0015-7.

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Development andin vitroevaluation of buccoadhesive carvedilol tabletsBuccoadhesive tablets of carvedilol were prepared using HPMC K4M, HPMC K15M and Carbopol 934 as mucoadhesive polymers. Fifteen formulations were developed with varying concentrations of polymers. Formulations of the BC or BD series were composed of HPMC K4M or HPMC K15M in ratios of 1:1 to 1:5 whereas in the BE series Carbopol 934 was used (1:0.25 to 1:1.50). The formulations were tested forin vitrodrug release,in vitrobioadhesion, moisture absorption andin vitrodrug permeation through porcine buccal mucosa. Formulation BC3 showed maximum release of the drug (88.7 ± 0.4%) with the Higuchi model release profile and permeated 21.5 ± 2.9% of the drug (flux 8.35 ± 0.291 μg h-1cm-2) permeation coefficient 1.34 ± 0.05 cm h-1) through porcine buccal membrane. BC3 formulation showed 1.62 ± 0.15 N of peak detachment force and 0.24 ± 0.11 mJ of work of adhesion. FTIR results showed no evidence of interaction between the drug and polymers. XRD study revealed that the drug is in crystalline form in the polymer matrix. The results indicate that suitable bioadhesive buccal tablets with desired permeability could be prepared.
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38

Cheng, Yuanrong, Wenhao Chen, Zhuo Li, Tangwei Zhu, Ziyu Zhang, and Yunxia Jin. "Hydrolysis and condensation of a benzocyclobutene-functionalized precursor for the synthesis of high performance low-K polymers." RSC Advances 7, no. 24 (2017): 14406–12. http://dx.doi.org/10.1039/c7ra00141j.

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39

Gallagher, Michael, Jong-Uk Kim, Eric Huenger, Kai Zoschke, Christina Lopper, and Michael Toepper. "Low Temperature Wafer Level Bonding Using Benzocyclobutene Adhesive Polymers." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 1–24. http://dx.doi.org/10.4071/2012dpc-wp13.

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3D stacking, one of the 3D integration technologies using through silicon vias (TSVs), is considered as a desirable 3D solution due to its cost effectiveness and matured technical background. For successful 3D stacking, precisely controlled bonding of the two substrates is necessary, so that various methods and materials have been developed over the last decade. Wafer bonding using polymeric adhesives has advantages. Surface roughness, which is critical in direct bonding and metal-to-metal bonding, is not a significant issue, as the organic adhesive can smooth out the unevenness during bonding process. Moreover, bonding of good quality can be obtained using relatively low bonding pressure and low bonding temperature. Benzocyclobutene (BCB) polymers have been commonly used as bonding adhesives due to their relatively low curing temperature (~250 °C), very low water uptake (<0.2%), excellent planarizing capability, and good affinity to Cu metal lines. In this study, we present wafer bonding with BCB at various conditions. In particular, bonding experiments are performed at low temperature range (180 °C ~ 210 °C), which results in partially cured state. In order to examine the effectiveness of the low temperature process, the mechanical (adhesion) strength and dimensional changes are measured after bonding, and compared with the values of the fully cured state. Two different BCB polymers, dry-etch type and photo type, are examined. Dry etch BCB is proper for full-area bonding, as it has low degree of cure and therefore less viscosity. Photo-BCB has advantages when a pattern (frame or via open) is to be structured on the film, since it is photoimageable (negative tone), and its moderate viscosity enables the film to sustain the patterns during the wafer bonding process. The effect of edge beads at the wafer rim area and the soft cure (before bonding) conditions on the bonding quality are also studied. Alan/Rey ok move from Flip Chip and Wafer Level Packaging 1-6-12.
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Beechinor, J. T., E. McGlynn, M. O'Reilly, and G. M. Crean. "Optical characterisation of thin film benzocyclobutene (BCB) based polymers." Microelectronic Engineering 33, no. 1-4 (January 1997): 363–68. http://dx.doi.org/10.1016/s0167-9317(96)00066-4.

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41

Su, Tao, Weiwei Men, Zhiqiang Wang, Lixin Xuan, and Weiwei Zhao. "POSS-benzocyclobutene (POSS-BCB) resin." High Performance Polymers 30, no. 9 (November 27, 2017): 1123–29. http://dx.doi.org/10.1177/0954008317740194.

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Organic-inorganic hybrid materials with a high thermal stability and a low dielectric constant show great potential in the microelectronics industry. In this work, polyhedral oligomeric silsesquioxane-benzocyclobutenes (POSS-BCBs) were synthesized by a hydrosilylation reaction of octavinyloctasilasesquioxane (OVPOSS) and 4-(1,1-dimethyl-1-hydro)-silyl-benzocyclobutene with H2PtCl6 as a catalyst. The ring-opening reaction of BCB on POSS-BCBs resulted in POSS-BCB resins with a highly cross-linked network structure. This resin exhibited good thermal stability (T5% is 495°C in N2), low dielectric constants (<2.1 at 20 MHz) and low water absorption.
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42

Deng, Bin, Hai Ying Huang, and Qiang Guo Li. "Facile Fabrication and Enhanced Photoluminescence Property of Zn(II) Coordination Polymers with 2,2'-biquinoline-4,4'-dicarboxylic Acid." Advanced Materials Research 881-883 (January 2014): 893–96. http://dx.doi.org/10.4028/www.scientific.net/amr.881-883.893.

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With 2,2'-biquinoline-4,4'-dicarboxylic acid disodium salt (BCA) and Zn (CH3COO)2·2H2O as starting materials, a sheaflike Zn (II)-2,2'-biquinoline-4,4'-dicarboxylic acid disodium salt coordination polymers (Zn-BCA CPs) has been successfully synthesized through a simple and mild one-step process in aqueous solution at room temperature. The effects of reactant molar ratio, temperature and reaction time on the morphology of the coordination polymers have also been examined. It was found that the Zn-BCA CPs showed an greatly enhanced blue photoluminescence emission compared with Zn-free BCA.
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Kulkarni, Akshata, Coleen Pugh, Sadhan C. Jana, Darnell T. Wims, and Ammar Abdel Gawad. "CROSSLINKING OF SBR COMPOUNDS FOR TIRE TREAD USING BENZOCYCLOBUTENE CHEMISTRY." Rubber Chemistry and Technology 92, no. 1 (January 1, 2019): 25–42. http://dx.doi.org/10.5254/rct.18.81512.

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ABSTRACT This research investigates the potential of benzocyclobutene (BCB) chemistry for crosslinking styrene-butadiene rubber in conjunction with sulfur curatives with the objective of achieving curing at lower temperatures and/or in shorter times compared with entirely sulfur-based cure formulations. The reversible polysulfidic linkages produced in sulfur crosslinking allow self-healing characteristics but suffer from poor heat-aging stability. The C–C crosslinks from BCB chemistry are irreversible and offer higher resistance to aging, but they do not present apparent self-healing properties. The hybrid curative package based on C–C, C–S, and S–S linkages developed is expected to provide reduced crosslinking time and/or temperature, along with higher crack-growth resistance, the ability to self-heal, higher resistance to fatigue-to-failure, reduced hysteresis, and increased abrasion resistance. The crosslinking performance of 1-substituted BCB-based compounds in conjunction with sulfur is specifically investigated.
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44

Kano, Arihiro, Takeshi Yamano, Sun Won Choi, and Atsushi Maruyama. "Polymer Brush-Stabilized Polyplex for a siRNA Carrier with Long Blood Circulatory Half-Life." Advanced Materials Research 47-50 (June 2008): 762–64. http://dx.doi.org/10.4028/www.scientific.net/amr.47-50.762.

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Small interfering RNA (siRNA) holds potential as a therapeutic approach to silence targeted gene of disease, but siRNA has limited stability in vivo. Therefore, delivery system of siRNA is the key to siRNA therapeutic application. We attempted to develop a delivery system, which enables siRNA to demonstrate high stability and long blood circulation. We synthesized a series of bottlebrush-type copolymers (BBCs) possessing polycationic backbone (less than 30 wt%) and abundant water-soluble side chains (more than 70 wt%) as siRNA carrier. A siRNA complexed with the BBC was resistant to nuclease and stable in plasma. Especially, the BBC (10 wt% PLL and 90 wt% PEG) having higher grafting ratio (≈ 90 wt%) of water-soluble side chains showed 100-times enhanced stability of siRNA in mouse bloodstream in vivo. Surprisingly, even when the BBC and siRNA separately injected into mouse at 20 min interval, the BBC increased blood half life of the siRNA. These results suggest that the BBC has higher selectivity in its ionic interaction to siRNA than other anionic substance in blood components. To our knowledge, this is the first report of siRNA delivery carrier which prolonged blood circulation of siRNA without resource-consuming preparation process.
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45

Zoschke, Kai, J. U. Kim, M. Wegner, M. Gallagher, R. Barr, J. Calvert, M. Toepper, and K. D. Lang. "Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer Bonding." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (January 1, 2016): 001222–54. http://dx.doi.org/10.4071/2016dpc-wp13.

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To enable advanced wafer level packaging approaches for devices like MEMS, image sensors or optical elements, wafer-to-wafer bonding processes using structured low temperature curable adhesives are required. A lot of Benzocyclobutene (BCB)-based wafer bonding works have been reported in the past showing a broad range of applications and good performance, but also some limitations such as long bond cycles and high cure temperature of 250 °C. In 2013 new process concepts were demonstrated [1], showing that wafer bond cycle time can be reduced to less than 10 min and a post bond batch cure at temperatures below 200 °C can be used to significantly shrink the overall cost of a BCB-based adhesive wafer bonding process. In order to create a patterned BCB bond layer, photo structuring of CYCLOTENE ® 4000 Resin is one solution. However, due to the decreased flow capability of that material after exposure, high bond forces and extended bonding times during wafer bonding as well as nearly flat surfaces with low topography are required for void-free bonding. To overcome these limitations, an increased material flow capability during wafer bonding is required. In this context non-photo sensitive CYCLOTENE ® 3000 Resin is suitable, since it has excellent flow capability in non-cured state. However, non-cured CYCLOTENE ® 3000 Resin cannot be structured with standard dry etching processes using a photo resist layer as mask. In order to enable patterned adhesive bonding based on CYCLOTENE ® 3000 Resin, alternative structuring methods have to be evaluated. One method was presented in [1] which is transfer printing of CYCLOTENE ® 3000 Resin from a help wafer to topography features of the device wafer. Although very good results were obtained, the method is restricted to applications with significant topography to enable the transfer printing. In this work we focus on a new structuring method for non-cured BCB layers formed from CYCLOTENE ® 3000 Resin. The layers were spin coated, baked and subsequently patterned using a 248 nm excimer laser stepper. The system features a 2.5× mask projection with a resulting exposure field of 6.5 × 6.5 mm2 and allows a direct ablation patterning of polymers. By using this method bond frame structures were patterned into 5 μm thick BCB layers at 200 mm silicon wafers. The wafers with the structured adhesive were bonded at 80 °C and 0.2 MPa for 5 minutes with 200 mm glass wafers. The bonded wafer stacks were subsequently post bond batch cured at 190 °C. Wafer dicing and shear tests of the bonded structures revealed excellent mechanical robustness of the BCB bond frames. The paper will review the new BCB wafer bond processes for supporting short cycle times with special focus on the new patterning approach by laser ablation. Process flow description as well as systematical analysis of pattern reproducibility of the new structuring method is part of the discussion.
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46

Anku, Anuja, K. Abbulu, Sowjanya Battu, Kalam Marryswarnalatha, and T. Sri Lakshmi. "COMBINATION OF METFORMIN AND CURCUMIN THERMOREVERSIBLE NASAL IN SITU GEL FORMULATION AND IN VITRO-EX VIVO EVALUATION FOR DIABETES-INDUCED ALZHEIMER’S DISEASE." International Research Journal Of Pharmacy 12, no. 6 (June 30, 2021): 26–34. http://dx.doi.org/10.7897/2230-8407.1206140.

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The present research was focused to prepare the formulation containing combination of Metformin and Curcumin to control diabetes-induced Alzheimer’s in elderly population with the utilization of Poloxamer P188 (8%), a thermoreversible gelling polymer, and mucoadhesive polymers such as Carbopol 940, Sodium alginate and HPMC K100 in varying concentrations (0.5%, 1%, 1.5% and 2% respectively) to improve the absorption of drugs by increasing the contact time with nasal mucosa. The in situ gel was prepared by cold method and administered via nasal route to deliver the drug directly to CNS by bypassing BBB and to improve patient compliance, nasal bioavailability of drugs by cumulative its nasal retention time in nasal mucosa. Total 12 nasal in situ gels were prepared and evaluated for in vitro studies and ex vivo drug diffusion studies (goat nasal mucosa) and results were found to be satisfactory. Moreover, histopathological studies revealed that the preparation was safe to be used on nasal mucosa of goat. The prepared nasal in situ gel is an effective alternative to conventional method and can be used to treat diabetes-induced Alzheimer’s disease.
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Bätz, P., D. Schmeiβer, I. Belaish, D. Davidov, and W. Göpel. "Semiconductor-to-metal transition in the ladder polymer BBB." Synthetic Metals 42, no. 1-2 (May 1991): 1609–13. http://dx.doi.org/10.1016/0379-6779(91)91909-t.

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48

Bittner, Aniela, Fabien Gosselet, Emmanuel Sevin, Lucie Dehouck, Angélique D. Ducray, Véronique Gaschen, Michael H. Stoffel, Hansang Cho, and Meike Mevissen. "Time-Dependent Internalization of Polymer-Coated Silica Nanoparticles in Brain Endothelial Cells and Morphological and Functional Effects on the Blood-Brain Barrier." International Journal of Molecular Sciences 22, no. 4 (February 6, 2021): 1657. http://dx.doi.org/10.3390/ijms22041657.

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Nanoparticle (NP)-assisted procedures including laser tissue soldering (LTS) offer advantages compared to conventional microsuturing, especially in the brain. In this study, effects of polymer-coated silica NPs used in LTS were investigated in human brain endothelial cells (ECs) and blood-brain barrier models. In the co-culture setting with ECs and pericytes, only the cell type directly exposed to NPs displayed a time-dependent internalization. No transfer of NPs between the two cell types was observed. Cell viability was decreased relatively to NP exposure duration and concentration. Protein expression of the nuclear factor ĸ-light-chain-enhancer of activated B cells and various endothelial adhesion molecules indicated no initiation of inflammation or activation of ECs after NP exposure. Differentiation of CD34+ ECs into brain-like ECs co-cultured with pericytes, blood-brain barrier (BBB) characteristics were obtained. The established endothelial layer reduced the passage of integrity tracer molecules. NP exposure did not result in alterations of junctional proteins, BBB formation or its integrity. In a 3-dimensional setup with an endothelial tube formation and tight junctions, barrier formation was not disrupted by the NPs and NPs do not seem to cross the blood-brain barrier. Our findings suggest that these polymer-coated silica NPs do not damage the BBB.
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Caprifico, Anna E., Peter J. S. Foot, Elena Polycarpou, and Gianpiero Calabrese. "Overcoming the Blood-Brain Barrier: Functionalised Chitosan Nanocarriers." Pharmaceutics 12, no. 11 (October 23, 2020): 1013. http://dx.doi.org/10.3390/pharmaceutics12111013.

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The major impediment to the delivery of therapeutics to the brain is the presence of the blood-brain barrier (BBB). The BBB allows for the entrance of essential nutrients while excluding harmful substances, including most therapeutic agents; hence, brain disorders, especially tumours, are very difficult to treat. Chitosan is a well-researched polymer that offers advantageous biological and chemical properties, such as mucoadhesion and the ease of functionalisation. Chitosan-based nanocarriers (CsNCs) establish ionic interactions with the endothelial cells, facilitating the crossing of drugs through the BBB by adsorptive mediated transcytosis. This process is further enhanced by modifications of the structure of chitosan, owing to the presence of reactive amino and hydroxyl groups. Finally, by permanently binding ligands or molecules, such as antibodies or lipids, CsNCs have showed a boosted passage through the BBB, in both in vivo and in vitro studies which will be discussed in this review.
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Ekinci, Duygu, Adam L. Sisson, and Andreas Lendlein. "Quantification of Protein Adsorption on Polyglycerol-based Polymer Network Films." MRS Proceedings 1569 (2013): 79–84. http://dx.doi.org/10.1557/opl.2013.962.

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ABSTRACTNeutral, hydrophilic, polymer-based architectures are widely investigated for a wide range of biomedical applications from drug-conjugates to delivery systems and scaffolds for regenerative therapies. In most cases, it is crucial that biomaterials provide a blank, inert background in order to hinder unspecific cell-material interactions so that protein mediated biological events leading to foreign body reactions are prevented. Hydrophilic polyglycerol-based polymer network films are a recently developed class of amorphous macroscopic materials, which offer great versatility in design and control of resultant properties. In this study, protein adsorption on polyglycerol-based polymer network films is investigated by using Micro BCA protein assay for three types of proteins having critical roles in the human body, and various copolymer networks with differing sidechains and crosslink densities.
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