Relevant bibliographies by topics / BGA pouzdro

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  1. Dissertations / Theses

Academic literature on the topic 'BGA pouzdro'

Author: Grafiati
Published: 4 June 2021
Last updated: 4 February 2022

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Dissertations / Theses on the topic "BGA pouzdro"

1

Otáhal, Alexandr. "Optimalizace faktorů ovlivňujících spolehlivost pájení moderních elektronických pouzder." Doctoral thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2020. http://www.nusl.cz/ntk/nusl-432558.

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The work deals with research and development of a new method for ball-attach process, resp. reballing process of solder bumps on package with solder ball terminals (BGA, CSP, SOP, etc.), based on research and optimization of the parameters of the final terminals. The output is specially modified templates designed for placement of solder balls before reflow soldering. Three materially different templates were investigated in the work, in addition to the commonly used stainless steel, two other newly designed templates, which used ceramic materials (96% Al2O3a AlN) with thick-layer resistance h
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2

Buřival, Tomáš. "Opravy DPS s BGA a FC pouzdry." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2009. http://www.nusl.cz/ntk/nusl-217906.

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Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization.
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3

Skácel, Josef. "Studie srovnání vlastností pouzder QFN a BGA." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2015. http://www.nusl.cz/ntk/nusl-221108.

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This work deals with the issue of packaging and heat transfer. Especially this work focused on QFN and BGA packages. Nowadays most sophisticated conventional solution. First part deals with analysis of the current status of packages. Next part is analyze the issue of heat transfer in electronic systems. The following section is an experimental dealing with simulation in ANSYS Workbench and validation of these simulations by designed test structures. At the end is evaluated properties and behavior of these packages.
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4

Roháček, Peter. "Reballing BGA pouzder na zařízení PACE TF2700." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2016. http://www.nusl.cz/ntk/nusl-254471.

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The Diploma thesis is focused on reballing of BGA packages with the device PACE TF 2700. It describes the general types of BGA packages, their defects, importance of thermal management to the solder techniques, where it is also talked about the meaning of solders and fluxes for the joint. The work informs about the most common methods of reballing, the proper handling of components and the current situation with BGA stencils on the market. It briefly describes the device operation of PACE TF 2700, that is working on the convection and IR principle of heating components. It deals with the manuf
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5

Tomčáková, Anna. "Měření teplotních profilů BGA pouzder u pájení přetavením." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2008. http://www.nusl.cz/ntk/nusl-217626.

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This graduation thesis addresses questions to thermal profile measurement of PBGA package during solder reflow process. The first part of thesis deals with problem of reflow process and reliability factors of solder joint connection. Next part analyses operation principles of thermocouples that are commonly used for temperature measurement. The experimental part deals with methods of thermocouples fixation during tests and measurements of dummy PBGA package. There was realized a method of dummy PBGA thermal profiles measurement and sample testing with and without simulated thermal load on PBGA
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6

Otáhal, Alexandr. "Výzkum jakosti pájených spojů u pouzder BGA a QFN." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2012. http://www.nusl.cz/ntk/nusl-219493.

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This diplomas thesis deals with specific technologies and manufacture of BGA and QFN packages. Also summarizes the most used test methods for assessing the reliability for. Describes the making of equipment for soldering in a nitrogen atmosphere, followed by comparison solder joints of BGA and QFN forming in different atmosphere. Finally, summarizes knowledge about the process of soldering and desoldering lead-free solders for BGA packages, followed by experimental evaluation of the causes of malfunction of repaired samples.
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7

Vala, Martin. "Analýza defektů na DPS za použití moderních optických metod." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2016. http://www.nusl.cz/ntk/nusl-254482.

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This diploma thesis is focused on detecting of defects on BGA (Ball Grid Array) components using of X-ray. Defects are formed during reflow BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection or micro sections. There is disclosed a device NORDSON DAGE XD7600NT its operation and setup. The device enables advanced methods of scanning called X-plane. For creating 3D models used reconstructive software called CERA, which uses raw data from the met
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8

Mlýnek, Martin. "Analýza závad na DPS pomocí X-RAY." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2015. http://www.nusl.cz/ntk/nusl-221093.

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This thesis is focused on BGA packages and fault detection after rework using X – Ray. There is a description of BGA packages by carrier substrate, techniques of connecting on chip, from mounting packages to repair printed circuit boards (hereafter PCB). Thesis summarizes description of defects, which are created after rework process. There is also description of X – Ray as method for analyzing defects. X – PLANE method used to detect internal structure of BGA packages and it was confirmed by microsection and by software for reconstruction. Description of automatic and manual measurement is fo
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