Relevant bibliographies by topics / Blind-Holes

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  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Blind-Holes'

Author: Grafiati
Published: 4 June 2021
Last updated: 11 February 2022

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Journal articles on the topic "Blind-Holes"

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Mooney, Ted. "Rusting in blind holes." Metal Finishing 94, no. 2 (February 1996): 86. http://dx.doi.org/10.1016/s0026-0576(96)93893-3.

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Bujak, Jan, and Paweł Hermanowicz. "Controlled gas nitriding of the surfaces of blind holes using the two-component NH3+NH3diss atmospheres during the heating-up stage." Inżynieria Powierzchni 23, no. 1 (May 14, 2018): 27–31. http://dx.doi.org/10.5604/01.3001.0011.8028.

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The paper presents the preliminary research results of the influence of the chemical composition of the two-component nitriding atmospheres on the structure and properties of the nitrided layers in the surfaces of the blind holes. The results showed that the utilization during the heating-up stage of in the controlled gas nitriding process the two-component atmospheres NH3 + NH3diss enables the production of the nitrided layers with a limited thickness of an iron nitrides layer as well as and a sufficiently high hardness on the surfaces of the blind holes. The nitrided layers obtained on the surfaces of the blind holes, depending on the position in the hole, show similar differentiation of the structures and properties, regardless of the dilution rate of ammonia in the atmospheres that were used during the heating-up stage. This differentiation is caused by the weak inflow of the fresh nitriding atmosphere to the interior of the blind holes due to their small diameters, which in turn is manifested as a gradual slowdown of the growth kinetics, a reduction of the thickness and hardness of a nitrided layer along with the increase in the depth of the blind holes.
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Latypov, Radic R., Alexandra O. Desyatova, Sergey V. Golybev, Larisa N. Maskaeva, and Vyacheslav F. Markov. "Comparative assessment of the conditions of direct and electrochemical metallization of blind holes of multilayer printed circuit boards." Butlerov Communications 58, no. 5 (May 31, 2019): 98–104. http://dx.doi.org/10.37952/roi-jbc-01/19-58-5-98.

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The metal blind holes acting as interconnectors allow significantly reduce the number of layers, increase the efficiency of trace and decrease interference between the holes and signal conductors in the high frequency printed circuit boards. In this work, a comparative assessment of the conditions of direct and electrochemical metallization blind holes with diameters: 0,2; 0.25; 0.3; 0.4; 0.6; 0.8; 1.0 mm and a drilling depth of 0.5 mm located on experimental four-layer multilayer printed circuit boards, differing in the method of applying a conductive and copper coating was carried out. It has been established that in case non-fulfillment of mandatory conditions for the production of blind holes, in particular the aspect ratio is less than or equal to unity, incomplete metallization of the walls and especially the bottom of the holes is observed. The ways of combining the processes of direct and electrochemical metallization of holes, which provide the required thickness and quality of the copper coating at reduction of general duration of operations have been proposed based on the experimental data obtained during the work with multilayer printed boards. Also it has been established that the joint placement of blind holes with a smaller and larger diameter on one multilayer printed circuit board requires a more long direct metallization in combination with electrochemical at low values of current density. Copper films deposited on the walls of the holes and on the surface of the contact pads, regardless of the proposed way of metallization, have a highly dispersed structure. The composition of the palladium catalyst layers has been studied by energy dispersive analysis. The conductive coating on the blind hole’s walls contains between 1.55 and 6.77 at.% palladium.
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Hu, You Zuo, Wei He, Wei Dong Xue, Zhi Hua Tao, Yu Xing Huang, Huan Xu, and Wen Qu Lv. "A Parameters Optimization of the CO2 Laser Drilling Process for HDI Microvia Fabrication." Applied Mechanics and Materials 214 (November 2012): 451–54. http://dx.doi.org/10.4028/www.scientific.net/amm.214.451.

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The blind via holes formation by laser drilling is one of the key technologies for demanding high density interconnect printed circuit boards. In this paper , the drilling conditions of drilling the blind via holes and the quality of the drilled holes are examined using a CO2 laser source against the FR4 board without copper foil.We chose laser energy,pulse shot,pulse width and diameter of beam as the experimental parameter . The results showed that laser energy and beam diameter played a more important role on changing the blind vias’ diameter than pulse shot and pulse width .While the pulse shot and pulse width take more important role in changing the depth of vias.
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Raedts, S., A. V. Silhanek, M. J. Van Bael, R. Jonckheere, and V. V. Moshchalkov. "Flux pinning properties of holes and blind holes arranged periodically in a superconductor." Physica C: Superconductivity 404, no. 1-4 (May 2004): 298–301. http://dx.doi.org/10.1016/j.physc.2003.09.095.

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Zhang, G. X., and S. M. Yang. "A 3D Probe for Measuring Small Blind Holes." CIRP Annals 44, no. 1 (1995): 461–64. http://dx.doi.org/10.1016/s0007-8506(07)62363-4.

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Calvanese, L., R. De Stefano, and V. Longobardi. "Stress concentrations from small blind holes in plates." Engineering Failure Analysis 6, no. 5 (October 1999): 355–61. http://dx.doi.org/10.1016/s1350-6307(98)00047-8.

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Owen, M., E. Roelants, and J. Van Puymbroeck. "Laser drilling of blind holes in FR4/glass." Circuit World 24, no. 1 (January 1998): 45–49. http://dx.doi.org/10.1108/030561201998000008.

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Willis, Bob. "Assessment of blind via holes – an alternative approach." Circuit World 34, no. 2 (May 16, 2008): 34–38. http://dx.doi.org/10.1108/03056120810874564.

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Domingo, Rosario, José M. Arenas Reina, Mariano Marcos Bárcena, and M. A. Sebastián. "Evaluation of Thrust Forces in Dry Drilling of UNS A97050 Alloy." Advanced Materials Research 83-86 (December 2009): 711–17. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.711.

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This paper presents a study of the thrust forces in the aluminium alloy, UNS A97050-T7. The measurement of these forces during the dry drilling in plates is evaluated under cutting different conditions and in through and blind holes. The experiments have been performed in a CNC milling and HSS Co drills have been utilised with unlike diameters (6.3 mm and 4 mm). The thrust forces have been measured by means of a piezoelectric dynamometer. In addition, the results have been compared with theoretical forces, obtained by the Kronenberg equation. The ANOVA study has allowed confirming the similitude between the forces obtained, independently of number of holes drilled, with the exception of through holes of 4 mm, in whose case the Kruskal-Wallis test has corroborated the dissimilitude. Moreover, the comparison with Kronenberg forces is coherent for diameters 6.3 mm, but it is very different for diameter 4 mm. Thus, the results respect to through and blind holes are dependent of diameter of drill, and also the differences found in the theoretical forces. The high variability of the forces for minor drills, in through and blind holes, points to an inadvisable use in this material.
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Dissertations / Theses on the topic "Blind-Holes"

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Shepherd, Jason F. "Interval Matching and Control for Hexahedral Mesh Generation of Swept Volumes." BYU ScholarsArchive, 1999. https://scholarsarchive.byu.edu/etd/3452.

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Surface meshing algorithms require certain relationships among the number of intervals on the curves that bound the surface. Assigning the number of intervals to all of the curves in the model such that all relationships are satisfied is called interval assignment. Volume meshing algorithms also require certain relationships among the numbers of intervals on each of the curves on the volume. These relationships are not always captured by surface meshing requirements. This thesis presents a news technique for automatically identifying volume constraints. In this technique, volume constraints are grouped with surface constraints and are solved simultaneously. A sweepable volume has source, target and linking surfaces. The technique described in this thesis uses graph algorithms to identify independent, parallel sets of linking surfaces, and determine if they correspond to through-holes or blind-holes. For blind-holes, the algorithm generates constraints that prevent the hole from being too deep in interval parameter space and, thus, penetrating opposite target surfaces. For each linking set, the adjoining source and target surfaces are partially ordered by the structure of the linking set. A small set of representative paths for each linking set is found, and the representative paths for all linking sets are gathered and distilled by Gaussian elimination into a small set of constraints.
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Book chapters on the topic "Blind-Holes"

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Shi, Z., J. Lin, and H. Lai. "Study of Passive Control of Jet Noise by Blind Holes on Nozzle Inner Wall." In Fluid-Structure-Sound Interactions and Control, 343–49. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-7542-1_52.

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Zhang, Feng-lian, and Jing Zhu. "An Experimental Study of Drilling Small and Deep Blind Holes with an Abrasive Water Jet." In Proceedings of 20th International Conference on Industrial Engineering and Engineering Management, 33–40. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013. http://dx.doi.org/10.1007/978-3-642-40063-6_4.

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Sharma, A., V. Jain, and D. Gupta. "Tool Wear Analysis While Creating Blind Holes on Float Glass Using Conventional Drilling: A Multi-shaped Tools Study." In Lecture Notes in Mechanical Engineering, 175–83. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-1724-8_17.

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Akhtar, Imtisal, Malik Abdul Rehman, and Yongho Seo. "Measuring the Blind Holes: Three-Dimensional Imaging of through Silicon via Using High Aspect Ratio AFM Probe." In 21st Century Surface Science - a Handbook. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.92739.

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Three-dimensional integration and stacking of semiconductor devices with high density, its compactness, miniaturization and vertical 3D stacking of nanoscale devices highlighted many challenging problems in the 3D parameter’s such as CD (critical dimension) measurement, depth measurement of via holes, internal morphology of through silicon via (TSV), etc. Current challenge in the high-density 3D semiconductor devices is to measure the depth of through silicon via (TSV) without destructing the sample; TSVs are used in 3D stacking devices to connect the wafers stacked vertically to reduce the wiring delay, power dissipation, and of course, the form factor in the integration system. Special probes and algorithms have been designed to measure 3D parameters like wall roughness, sidewall angle, but these are only limited to deep trench-like structures and cannot be applied to structures like via holes and protrusions. To address these problems, we have proposed an algorithm based nondestructive 3D Atomic Force Microscopy (AFM). Using the high aspect ratio (5, 10, 20, 25) multiwall carbon nanotubes (MWCNTs) AFM probe, the depth of holes up to 1 micron is faithfully obtained. In addition to this, internal topography, side walls, and location of via holes are obtained faithfully. This atomic force microscopy technique enables to 3D scan the features (of any shape) present above and below the surface.
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Adelman, Ron A., and Patricia Pahk. "Visual Field Defects in Chorioretinal Disorders." In Visual Fields. Oxford University Press, 2010. http://dx.doi.org/10.1093/oso/9780195389685.003.0012.

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Pathologic processes involving the retina or choroid can present with a wide variety of visual field defects. Usually visual field defects of retinal diseases directly correlate with the fundus findings. Visual field changes are often the result of damage to the retina or scarring but, in conjunction with other clinical findings, they may help narrow the differential diagnosis. Most of the macular lesions result in visual field defects that do not respect the vertical or horizontal midline. Occasionally inflammatory disorders result in visual field defects that do not directly correlate with the retinal findings. For example, patients with multiple evanescent white dot syndrome (MEWDS) may have an enlarged blind spot. Macular disorders can cause central or paracentral scotomas depending on the location of the lesion. Causes of macular pathology include drusen, atrophy from dry age-related macular degeneration (AMD), retinal hemorrhage, choroidal neovascular membrane, macular edema, macular hole, macular scar, pathologic myopia, and macular dystrophies of the retina or choroid. Central serous chorioretinopathy (CSCR) can show a relative defect that is anatomically correlated with the area of subretinal or sub RPE (retinal pigment epithelium) fluid accumulation. Residual pigmentary changes in inactive CSCR can also cause a relative depression in the corresponding visual field. Pathologic myopia can present with a variety of visual field defects depending on the retinal findings, such as posterior staphyloma or choroidal neovascular membrane. AMD may show nonspecific changes in the central or paracentral visual field that correlate with the structural damage to the retina and choroid. Geographic atrophy in dry AMD can cause a dense scotoma correlated with the pattern of the atrophy. Choroidal neovascular membranes can cause a depression in the correlating visual field due to edema or hemorrhage. Disciform scars in endstage AMD can also cause a dense scotoma. Macular holes may cause a small central scotoma. Pattern dystrophies are a family of disorders with a common pathology at the level of the RPE. Butterfly dystrophy, an autosomal dominant disorder, and Sjögren reticular dystrophy, an autosomal recessive disorder, are two examples of pattern dystrophies.
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Conference papers on the topic "Blind-Holes"

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Yu, Xiaofei, Wei He, Shouxu Wang, Guoyun Zhou, and Meng Zhu. "Research on etching blind holes and desmear with plasma." In 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2011. http://dx.doi.org/10.1109/impact.2011.6117162.

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Fang, Zhong P., and V. W. McGlure. "Precision noncontact measurement of blind holes by machine vision technology." In ISMA '97 International Symposium on Microelectronics and Assembly, edited by Anthony T. S. Ho, Sreenivas Rao, and Lee Ming Cheng. SPIE, 1997. http://dx.doi.org/10.1117/12.284041.

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Ogawa, Keiji, Toshiki Hirogaki, Eiichi Aoyama, and Heisaburo Nakagawa. "Circuit Connection Reliability Analysis of Laser-Drilled Blind Via Holes Using Data-Mining Method." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33077.

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The purpose of the present study is to analyze the circuit connection reliability of printed wiring boards (PWBs) with respect to thermal stresses on drilled hole walls. Micro-via drilling using laser technology has become the predominant method of machining smaller blind via holes. Moreover, a technique that uses copper foil in forming the circuit has been considered as a means of limiting the hole depth more accurately. After forming the blind via holes, copper plating must be used in order to maintain high reliability in circuit interconnectivity. In the present study, using the finite element method (FEM), we evaluated the effects of both the shape of the holes and the thickness of the copper plating on thermal stress occurring at the hole bottom. However, numerous factors are associated with the thermal stress, making the proper material composition and hole shape design difficult to determine. FEM must be applied to large amounts of data in order to identify quantitative tendencies. In addition, we applied a data-mining method to the thermal stress data, in an attempt to elucidate the factors that influence the reliability of blind via holes. The data-mining method revealed new factors that were hidden in the data; notably, the coefficient of thermal expansion in the thickness direction, despite the presence of other complex factors.
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Chengkai Tang, Baowang Lian, and Lingling Zhang. "Cyclo-stationary detection of the Spectrum holes under blind parameters in cognitive radio." In 2010 IEEE International Conference on Intelligent Systems and Knowledge Engineering (ISKE). IEEE, 2010. http://dx.doi.org/10.1109/iske.2010.5680800.

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Tian, Zhenhua, and Lingyu Yu. "Damage Imaging and Quantification Using Spectral Field." In ASME 2015 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/smasis2015-9091.

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This paper presents damage imaging and quantification by using the spectral field of Lamb waves. The spectral field is acquired through a piezoelectric transducer (PZT)-scanning laser Doppler vibrometer (SLDV) sensing. A wideband chirp signal is used for PZT excitation in order to generate wideband Lamb waves. With the SLDV, the time-space wavefield is acquired, and transformed into the spectral field representation through Fourier transform. The spectral field, which contains wideband Lamb wave responses of the structure, is further analyzed for damage detection and quantification. Using the spatial wavenumber analysis, the local wavenumber at each location are obtained, and represented as a spatial wavenumber image which can be used for damage detection and evaluation. Moreover, the dispersion curve regression method is developed to quantify the thickness change of a defect. For verification, experiments are performed on aluminum plates with blind holes of different depths. The experimental results show that the blind holes can be detected by both the spatial wavenumber imaging and dispersion curve regression. In addition, the dispersion curve regression can further quantify the depths of the blind holes.
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Martin, C. A., and K. A. Thole. "A CFD Benchmark Study: Leading Edge Film-Cooling With Compound Angle Injection." In ASME 1997 International Gas Turbine and Aeroengine Congress and Exhibition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/97-gt-297.

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This paper presents a blind CFD benchmark of a simulated leading edge for a turbine airfoil. The geometry studied was relevant for current designs with two rows of staggered film-cooling holes located at the stagnation location (θ = 0°) and at θ = 25°. Both rows of cooling holes were blowing in the same direction which was 90° relative to the streamwise direction and had an injection angle with respect to the surface of 20°. Realistic engine conditions were simulated including a density ratio of DR = 1.8 and an average blowing ratio of M = 2 for both rows of cooling holes. This blind benchmark coincided with an experimental study that took place in a wind tunnel simulation of a quarter cylinder followed by a flat afterbody. At the stagnation region, the CFD calculation overpredicted the adiabatic effectiveness because the model failed to predict a small separation region that was measured in the experiments. Good agreement was achieved, however, between the CFD predictions and the experimentally measured values of the laterally averaged adiabatic effectiveness downstream of the stagnation location. The coolant pathlines showed that flow passed from the first row of holes over the second row of cooling holes indicating a waste of the coolant.
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Aoyama, Eiichi, Hisaya Kondou, Ryu Minagi, Tsutao Katayama, Toshiki Hirogaki, and Hisahiro Inoue. "Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35086.

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The printed wiring board (PWB) has becomes relatively smaller due to the downsizing of electric devices. Higher densification has been advanced by the circuit formation of multi-layer PWBs in the current manufacturing of these boards. In current manufacturing of multi-layer printed wiring boards, a method frequently used is to laminate the core with insulating resin as build-up layers. Microvia drilling using laser technology has become the prevailing method of machining smaller blind via holes. Aramid fiber reinforced plastic (AFRP) is considered suitable material for the build-up layers, because it is efficient in laser drilling. However, heat damage in the hole has been a problem because the laser drilling cause a heat damage to the PWB materials. The poor hole quality, such as the carbonization of the resin and the peel around circuit copper foil/core material, causes decrease in the reliability of circuit connections. In the present report, first, we took multi layer PWB-reinforced by aramid unwoven cloth, and measured the temperature distribution of the circuit copper foil during laser drilling using a thermocouple. Second, we proposed a heat input prediction model using a finite element method (FEM), considering the change of laser absorption of the circuit copper foil surface. Finally, we carried out a thermal stress analysis based on the temperature distribution, and confirmed the efficiency of this analysis. As a result, the calculated temperatures by this model, considering the variation of the absorption of foil surface during laser drilling, are in good agreement with the experimental temperatures. It is confirmed that this model is effective in estimating the temperatures and thermal stresses in the bottom copper foil during laser drilling of the build-up layers.
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Zhou, Yuliang, Haiyan Jin, Yong Mao Huang, Du Xu, and Maurizio Bozzi. "Metallized Blind Via Holes and Surface Etching Incorporation for Miniaturization Enhancement in Slow-wave Substrate Integrated Waveguide." In 2019 Photonics & Electromagnetics Research Symposium - Fall (PIERS - Fall). IEEE, 2019. http://dx.doi.org/10.1109/piers-fall48861.2019.9021899.

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Tol, Serife, F. Levent Degertekin, and Alper Erturk. "Dramatic Enhancement of Elastic Wave Energy Harvesting Using a Gradient-Index Phononic Crystal Lens." In ASME 2016 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/smasis2016-9264.

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In this paper, we explore structure-borne elastic wave energy harvesting, both numerically and experimentally, by exploiting a Gradient-Index Phononic Crystal Lens (GRIN-PCL) structure. The proposed GRIN-PCL is formed by an array of blind holes with different diameters on an aluminum plate where the orientation and size of the blind holes are tailored to obtain a hyperbolic secant gradient distribution of refractive index guided by finite-element simulations of the lowest asymmetric mode Lamb wave band diagrams. Under plane wave excitation from a line source, experimentally measured wave field successfully validates the numerical simulation of wave focusing within the GRIN-PCL domain. A piezoelectric energy harvester disk located at the first focus of the GRIN-PCL yields an order of magnitude larger power output as compared to the baseline case of energy harvesting without the GRIN-PCL on the uniform plate counterpart for the same incident plane wave excitation. The power output is further improved by a factor of five using complex electrical load impedance matching through resistive-inductive loading as compared to purely resistive loading case.
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Hu, Wenqian, Galen B. King, and Yung C. Shin. "Micromachining of Metals, Alloys and Ceramics by Picosecond Laser Ablation." In ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing. ASMEDC, 2008. http://dx.doi.org/10.1115/msec_icmp2008-72247.

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Microhole drilling and microstructure machining with a picosecond (ps) Nd:YVO4 laser (pulse duration of 10 ps) in metals, alloys and ceramics are reported. Blind and through microholes were drilled by percussion drilling as well as trepanning drilling. The diameters of the holes were in the range from 20 μm to 1000 μm. Microfeatures were machined and the flexibility of ps laser machining was demonstrated. The quality of drilled holes, e.g., recast layer, microcrack and conicity, and that of the microstructures, were investigated by optical microscope, surface profilometer, or scanning electron microscope (SEM). Ps laser ablation rate was investigated by experiments as well as a simplified laser ablation model.
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