Journal articles: 'Blind-Holes'

1

Mooney, Ted. "Rusting in blind holes." Metal Finishing 94, no. 2 (February 1996): 86. http://dx.doi.org/10.1016/s0026-0576(96)93893-3.

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2

Bujak, Jan, and Paweł Hermanowicz. "Controlled gas nitriding of the surfaces of blind holes using the two-component NH3+NH3diss atmospheres during the heating-up stage." Inżynieria Powierzchni 23, no. 1 (May 14, 2018): 27–31. http://dx.doi.org/10.5604/01.3001.0011.8028.

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The paper presents the preliminary research results of the influence of the chemical composition of the two-component nitriding atmospheres on the structure and properties of the nitrided layers in the surfaces of the blind holes. The results showed that the utilization during the heating-up stage of in the controlled gas nitriding process the two-component atmospheres NH3 + NH3diss enables the production of the nitrided layers with a limited thickness of an iron nitrides layer as well as and a sufficiently high hardness on the surfaces of the blind holes. The nitrided layers obtained on the surfaces of the blind holes, depending on the position in the hole, show similar differentiation of the structures and properties, regardless of the dilution rate of ammonia in the atmospheres that were used during the heating-up stage. This differentiation is caused by the weak inflow of the fresh nitriding atmosphere to the interior of the blind holes due to their small diameters, which in turn is manifested as a gradual slowdown of the growth kinetics, a reduction of the thickness and hardness of a nitrided layer along with the increase in the depth of the blind holes.

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3

Latypov, Radic R., Alexandra O. Desyatova, Sergey V. Golybev, Larisa N. Maskaeva, and Vyacheslav F. Markov. "Comparative assessment of the conditions of direct and electrochemical metallization of blind holes of multilayer printed circuit boards." Butlerov Communications 58, no. 5 (May 31, 2019): 98–104. http://dx.doi.org/10.37952/roi-jbc-01/19-58-5-98.

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The metal blind holes acting as interconnectors allow significantly reduce the number of layers, increase the efficiency of trace and decrease interference between the holes and signal conductors in the high frequency printed circuit boards. In this work, a comparative assessment of the conditions of direct and electrochemical metallization blind holes with diameters: 0,2; 0.25; 0.3; 0.4; 0.6; 0.8; 1.0 mm and a drilling depth of 0.5 mm located on experimental four-layer multilayer printed circuit boards, differing in the method of applying a conductive and copper coating was carried out. It has been established that in case non-fulfillment of mandatory conditions for the production of blind holes, in particular the aspect ratio is less than or equal to unity, incomplete metallization of the walls and especially the bottom of the holes is observed. The ways of combining the processes of direct and electrochemical metallization of holes, which provide the required thickness and quality of the copper coating at reduction of general duration of operations have been proposed based on the experimental data obtained during the work with multilayer printed boards. Also it has been established that the joint placement of blind holes with a smaller and larger diameter on one multilayer printed circuit board requires a more long direct metallization in combination with electrochemical at low values of current density. Copper films deposited on the walls of the holes and on the surface of the contact pads, regardless of the proposed way of metallization, have a highly dispersed structure. The composition of the palladium catalyst layers has been studied by energy dispersive analysis. The conductive coating on the blind hole’s walls contains between 1.55 and 6.77 at.% palladium.

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4

Hu, You Zuo, Wei He, Wei Dong Xue, Zhi Hua Tao, Yu Xing Huang, Huan Xu, and Wen Qu Lv. "A Parameters Optimization of the CO₂ Laser Drilling Process for HDI Microvia Fabrication." Applied Mechanics and Materials 214 (November 2012): 451–54. http://dx.doi.org/10.4028/www.scientific.net/amm.214.451.

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The blind via holes formation by laser drilling is one of the key technologies for demanding high density interconnect printed circuit boards. In this paper , the drilling conditions of drilling the blind via holes and the quality of the drilled holes are examined using a CO2 laser source against the FR4 board without copper foil.We chose laser energy,pulse shot,pulse width and diameter of beam as the experimental parameter . The results showed that laser energy and beam diameter played a more important role on changing the blind vias’ diameter than pulse shot and pulse width .While the pulse shot and pulse width take more important role in changing the depth of vias.

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5

Raedts, S., A. V. Silhanek, M. J. Van Bael, R. Jonckheere, and V. V. Moshchalkov. "Flux pinning properties of holes and blind holes arranged periodically in a superconductor." Physica C: Superconductivity 404, no. 1-4 (May 2004): 298–301. http://dx.doi.org/10.1016/j.physc.2003.09.095.

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6

Zhang, G. X., and S. M. Yang. "A 3D Probe for Measuring Small Blind Holes." CIRP Annals 44, no. 1 (1995): 461–64. http://dx.doi.org/10.1016/s0007-8506(07)62363-4.

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7

Calvanese, L., R. De Stefano, and V. Longobardi. "Stress concentrations from small blind holes in plates." Engineering Failure Analysis 6, no. 5 (October 1999): 355–61. http://dx.doi.org/10.1016/s1350-6307(98)00047-8.

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8

Owen, M., E. Roelants, and J. Van Puymbroeck. "Laser drilling of blind holes in FR4/glass." Circuit World 24, no. 1 (January 1998): 45–49. http://dx.doi.org/10.1108/030561201998000008.

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9

Willis, Bob. "Assessment of blind via holes – an alternative approach." Circuit World 34, no. 2 (May 16, 2008): 34–38. http://dx.doi.org/10.1108/03056120810874564.

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10

Domingo, Rosario, José M. Arenas Reina, Mariano Marcos Bárcena, and M. A. Sebastián. "Evaluation of Thrust Forces in Dry Drilling of UNS A97050 Alloy." Advanced Materials Research 83-86 (December 2009): 711–17. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.711.

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This paper presents a study of the thrust forces in the aluminium alloy, UNS A97050-T7. The measurement of these forces during the dry drilling in plates is evaluated under cutting different conditions and in through and blind holes. The experiments have been performed in a CNC milling and HSS Co drills have been utilised with unlike diameters (6.3 mm and 4 mm). The thrust forces have been measured by means of a piezoelectric dynamometer. In addition, the results have been compared with theoretical forces, obtained by the Kronenberg equation. The ANOVA study has allowed confirming the similitude between the forces obtained, independently of number of holes drilled, with the exception of through holes of 4 mm, in whose case the Kruskal-Wallis test has corroborated the dissimilitude. Moreover, the comparison with Kronenberg forces is coherent for diameters 6.3 mm, but it is very different for diameter 4 mm. Thus, the results respect to through and blind holes are dependent of diameter of drill, and also the differences found in the theoretical forces. The high variability of the forces for minor drills, in through and blind holes, points to an inadvisable use in this material.

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11

Fan, Junling, Xinglin Guo, Chengwei Wu, Yanguang Zhao, and Qiang Guo. "Stress assessment and fatigue behavior evaluation of components with defects based on the finite element method and lock-in thermography." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 229, no. 7 (June 27, 2014): 1194–205. http://dx.doi.org/10.1177/0954406214541432.

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The relationships between the stress concentration factors Kts to the depths h and diameters Φ of blind holes were investigated based on the finite element method. The E-Mode, built-in the lock-in thermographic technique, was used to determine the stress distribution around blind holes and to predict the variation of Kts. Good predictions were achieved between the thermography and finite element method. The Altair Li software and Altair software were, separately, used to study the variations of the intrinsic dissipation and temperature increment during fatigue process for the purpose of damage status analysis. These two signals were considered as fatigue damage markers to rapidly predict the fatigue limits of components with different blind holes and then to determine the fatigue notch coefficient Kf. Theoretical results validate the capability of the lock-in thermography for fatigue evaluation.

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12

Sola, D., J. I. Peña, and Miguel A. Buñuel. "Glass Ceramic Laser Machining for Cooktop Appliances." Advanced Materials Research 83-86 (December 2009): 777–84. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.777.

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This paper presents a study of glass ceramic laser machining for cooktop appliances. Blind holes and special shape cross section blind holes can be created for functional purposes. A Q-switched Nd:YAG laser at its fundamental wavelength of 1064 nm with pulsewidths in the nanosecond range has been used. The material can be machined by focusing the laser beam at different depths under the back side of the glass panel, in such a way that blind holes of 2-6 mm diameter and 1-3 mm depth can be drilled. Several cross section shapes can be obtained using additional galvanometric mirrors to deflect the laser beam in the desired direction, controlling the incidence angle. These holes can be used for fastening directly components to the glass panel, avoiding gluing processes, or for approaching thermal sensors to the upper surface, controlling the work temperature in a better way. Several tests have been performed to check the modifications in glass ceramic mechanical properties. Thermal tests have verified the improvement in work temperature accuracy measurement.

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13

Adapa, Sathish Kumar, Dowluru Sreeramulu, and Jagadish. "Classification and Automatic Feature-Based Extraction Approach for Cylindrical and Milling Parts." International Journal of Manufacturing, Materials, and Mechanical Engineering 11, no. 3 (July 2021): 55–73. http://dx.doi.org/10.4018/ijmmme.2021070104.

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This paper reports classification and automatic extraction of various cylindrical and milling features in conventional machining process parts. In this work, various algorithms like hole recognition algorithm (HRA) and milling feature recognition algorithm (MFRA) have been used for identification of different cylindrical and milling features. A cylindrical feature is identified based on specific logical rules, and milling feature is identified based on the concept of concave decomposition of edges. In-house developed JAVA program is used to write algorithm, and then validation of the algorithm is done through two case studies. The HRA and MFRA algorithms extract the cylindrical features (through holes, blind holes, taper holes, and bosses) and milling features (slot, blind slot, step, blind step, pockets) precisely. The current work is well suitable to extract the features in conventional machining parts and thereby improve the downstream applications likes process planning, CAPP, CAM, etc.

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14

Kisiel, Ryszard, Janusz Borecki, Grażyna Kozioł, and Jan Felba. "Conductive adhesives for through holes and blind vias metallization." Microelectronics Reliability 45, no. 12 (December 2005): 1935–40. http://dx.doi.org/10.1016/j.microrel.2005.03.005.

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15

HAGIWARA, Yoshihiko, and Hiroki KASAI. "Through fatigue crack propagation behavior near the blind holes." Transactions of the Japan Society of Mechanical Engineers Series A 54, no. 501 (1988): 964–69. http://dx.doi.org/10.1299/kikaia.54.964.

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16

Lühn, O., A. Radisic, C. Van Hoof, W. Ruythooren, and J. P. Celis. "Monitoring the Superfilling of Blind Holes with Electrodeposited Copper." Journal of The Electrochemical Society 157, no. 4 (2010): D242. http://dx.doi.org/10.1149/1.3301623.

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17

Liu Xiaodong, 刘晓东, 陈亮 Chen Liang, 王曦照 Wang Xizhao, and 熊政军 Xiong Zhengjun. "Micromilling Blind Holes in Al2O3 Ceramics Using UV Laser." Laser & Optoelectronics Progress 58, no. 5 (2021): 0514005–514005202. http://dx.doi.org/10.3788/lop202158.0514005.

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18

Kraus, Matthias, Martin Klaus, and Björn Wittor. "Experimental Analyses on the Resistance of Tapped Blind Holes." ce/papers 4, no. 2-4 (September 2021): 141–47. http://dx.doi.org/10.1002/cepa.1273.

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19

Yakovlev, V. A., and A. E. Tretyakov. "Development and analysis of tool design for precision blind holes." IOP Conference Series: Materials Science and Engineering 862 (May 28, 2020): 032089. http://dx.doi.org/10.1088/1757-899x/862/3/032089.

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20

Antonini, G., A. C. Scogna, and A. Orlandi. "S-parameters characterization of through, blind, and buried via holes." IEEE Transactions on Mobile Computing 2, no. 2 (April 2003): 174–84. http://dx.doi.org/10.1109/tmc.2003.1217237.

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21

Chen, Dong, Shi-bin Liu, Shi-min Yin, and Jin-tao Liang. "Light-addressable potentiometric sensor with the micro blind holes substrate." IET Science, Measurement & Technology 11, no. 1 (January 1, 2017): 57–62. http://dx.doi.org/10.1049/iet-smt.2016.0175.

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22

Goiogana, M., J. A. Sarasua, and J. M. Ramos. "Ultrasonic Assisted Electrical Discharge Machining for High Aspect Ratio Blind Holes." Procedia CIRP 68 (2018): 81–85. http://dx.doi.org/10.1016/j.procir.2017.12.026.

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23

Schafer, Soren, Catherin Gemmel, Sarah Kajari-Schroder, and Rolf Brendel. "Light Trapping and Surface Passivation of Micron-Scaled Macroporous Blind Holes." IEEE Journal of Photovoltaics 6, no. 2 (March 2016): 397–403. http://dx.doi.org/10.1109/jphotov.2015.2505179.

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24

Berdiyorov, G. R., M. V. Milošević, and F. M. Peeters. "Composite vortex ordering in superconducting films with arrays of blind holes." New Journal of Physics 11, no. 1 (January 20, 2009): 013025. http://dx.doi.org/10.1088/1367-2630/11/1/013025.

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25

Yu, Z. Y., K. P. Rajurkar, and H. Shen. "High Aspect Ratio and Complex Shaped Blind Micro Holes by Micro EDM." CIRP Annals 51, no. 1 (2002): 359–62. http://dx.doi.org/10.1016/s0007-8506(07)61536-4.

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26

Mao, Xuanyu, Xiangzhi Wang, Chaojiang Li, John Mo, and Songlin Ding. "Effects of stepped cylindrical electrode in electrical discharge machining of blind holes." International Journal of Advanced Manufacturing Technology 110, no. 5-6 (August 24, 2020): 1457–69. http://dx.doi.org/10.1007/s00170-020-05941-3.

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27

Teng, Guoyang, Xiaojun Zhou, Chenlong Yang, and Xiang Zeng. "A Nonlinear Method for Characterizing Discrete Defects in Thick Multilayer Composites." Applied Sciences 9, no. 6 (March 20, 2019): 1183. http://dx.doi.org/10.3390/app9061183.

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Discrete defects in thick composites are difficult to detect for the small size and the structure noise that appears in multilayer composites. In this paper, a nonlinear method, called recurrence analysis, has been used for characterizing discrete defects in thick section Carbon Fiber Reinforced Polymer (CFRP) with complex lay-up. A 10 mm thick CFRP specimen with nearly zero porosity was selected, and blind holes with different diameters were artificially constructed in the specimen. The second half of the backscattered signal was analyzed by recurrence analysis for areas with or without a defect. The recurrence plot (RP) visualized the chaotic behavior of the ultrasonic pulse, and the statistical results of recurrence quantification analysis (RQA) characterized the instability of the signal and the effect of defects. The results show that the RQA variable differences are related to the size of blind holes, which give a probable detection of discrete geometric changes in thick multilayer composites.

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28

Yang, Jian Dong, Chuang Liu, and Hui Yan. "Lapping Tool Wearing Uniformly in Machining Blind Hole of Workpiece in Manufacturing System." Applied Mechanics and Materials 252 (December 2012): 310–14. http://dx.doi.org/10.4028/www.scientific.net/amm.252.310.

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This paper proposes a new method of controlling abrasives density distribution on the machining surface of a lapping tool making full use of controllability of abrasives density distribution in solid abrasive lapping, based on the present actual problems in solid abrasive lapping blind holes in manufacturing process. This method makes the abrasives density distribution on the lapping tool surface fit the wear intensity distribution of lapping tool, which makes the lapping tool wear uniformly in this manufacturing process, does not lose its original surface accuracy, ensures shape accuracy of the machined holes of the workpiece, also avoids the trouble of dressing lapping tools, reduces auxiliary machining time, improves machining efficiencies, reduces the consumption of abrasives and reduces machining costs of the manufacturing process.

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29

Chen, Ming, Xiao Hui Zhang, Bing Han, Bin Rong, and Gang Liu. "Wear Performance Evaluation of Tungsten Carbide Taps in Blind Hole Tapping Cast Iron." Advanced Materials Research 126-128 (August 2010): 755–59. http://dx.doi.org/10.4028/www.scientific.net/amr.126-128.755.

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The engineblock and cylinderhead of automobile are usually made of cast iron, and tapping of blind holes is one of the most demanding operations. As usual, tapping is the final process for an engineblock, and the failure of taps can disable the engineblock possibly. The productivity is restricted because of the low cutting speed and poor wear resistance of high speed steel (HSS) taps. Thereby, according to the demand on high speed cutting and low tact time of modern engine production lines, several new typical special tungsten carbide taps are developed and their cutting performance are evaluated in comparison with the commercial taps. In the process of tapping blind holes in gray cast iron and ductile cast iron, several aspects are studied comparatively such as wear mechanism of the first complete and the last incomplete tooth, tap structure, wear of TiCN coating and effects of coolant on cutting performance of taps. This study indicates that straight coated taps with fewer flutes are suitable for high speed tapping of cast iron.

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30

Zhu, Li, Chunxiao Fan, Huarui Wu, and Zhigang Wen. "A Coverage Algorithm based on Key Node Scheduling." International Journal of Online Engineering (iJOE) 11, no. 9 (October 29, 2015): 67. http://dx.doi.org/10.3991/ijoe.v11i9.5068.

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Network coverage rate is a key standard of measuring the quality of network coverage. This thesis aims at solving the differences between node energy and task, which causes coverage holes and blind spots of Wireless Sensor Network, and proposes a coverage algorithm, based on key node scheduling, divides node subsets, and adjusts the states of individual nodes according to node energy and coverage rate. This algorithm ensures network connectivity while reducing coverage holes and redundancy. Simulation results show that, the proposed algorithm can effectively reduce failure nodes, energy consumption, improve network coverage rate, and demonstrates network convergence and stability.

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31

Nie, Lan Jian, Ya Nan Jia, Lei Wang, Zai Kui Xiang, Fei Xiang Liu, and Hui Wang. "Microstructural Study on the Low Density SiO₂ Soot Body." Key Engineering Materials 726 (January 2017): 383–87. http://dx.doi.org/10.4028/www.scientific.net/kem.726.383.

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Low density SiO2 soot body, with a certain strength and porosity, is an intermediate of silica glass prepared by the indirect synthetic method. The microstructures of SiO2 soot body have an important influence on the post-sintering process, such as micro-morphologies, pore structures and so on. These microstructures, including micro-morphologies, phase structure, hydroxyl structure, pore structure, pore size distribution and specific surface area, were studied by ESEM, XRD, FTIR, mercury intrusion method and nitrogen adsorption method. Experimental results indicate that, the low density SiO2 soot body is composed of amorphous nano-SiO2 particles with a particle diameter distribution of 100nm ~ 150nm. The pore structure of SiO2 soot body tends to be irregular and the pore shape contains cross-linked holes, through-holes and blind holes. The pore size distribution is wide and involves macropore, mesopore and micropore.

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32

Ramanathan, Diwakar, and Pal A. Molian. "Micro- and Sub-Micromachining of Type IIa Single Crystal Diamond Using a Ti:Sapphire Femtosecond Laser." Journal of Manufacturing Science and Engineering 124, no. 2 (April 29, 2002): 389–96. http://dx.doi.org/10.1115/1.1459083.

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A 200-fs pulsed Ti:Sapphire laser was used to micromachine Type IIa single crystal diamond. The effects of pulse energy and exposure time were investigated. Both blind and through holes were generated by trepanning and percussion modes. Trenches were produced by the direct-writing mode. Scanning electron and atomic force microscopy analysis revealed that the holes are in the range 0.65–100 μm and are free from taper. In addition, there was little recast layer around the holes. The damage threshold was approximately 4 J/cm2, which is smaller than those obtained from other lasers. A two-temperature model was used to establish the electron temperatures and to predict the ablation depth per pulse. It is evident from this work that femtosecond lasers are capable of producing micron and sub-micron structures with very high precision.

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33

Tang, Qing Ju, Jun Yan Liu, and Yang Wang. "Theoretical and Experimental Study on Nondestructive Pulse Phase Infrared Thermography Testing Technology." Advanced Materials Research 314-316 (August 2011): 1483–86. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.1483.

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The non-destructive pulsed phase thermography technique was used to detect metal specimen with flat blind-bottom holes and composite specimen with sticky areas. An experimental platform was built base on the analysis of the pulsed phase thermography testing principle. Experimental results show the different testing effect of the original thermography, amplitude and phase images.

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34

Popov, Alexander L., Sergei E. Alexandrov, Victor M. Kozintsev, Alexander L. Levitin, and Dmitri A. Chelyubeev. "Effect of plasticity at out-of-plane electronic speckle pattern interferometry diagnostics of axisymmetric stresses by the hole-drilling method." Journal of Strain Analysis for Engineering Design 53, no. 1 (November 5, 2017): 3–14. http://dx.doi.org/10.1177/0309324717738377.

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Theoretical, calculated, and experimental results of studies on the registration of the accounting effect of plasticity in the diagnosis of axisymmetric stresses by the hole method and speckle-interferometric detection of the field of normal displacements in its vicinity are presented. Theoretical and computational studies were carried out on a disk model of finite thickness from an ideally elastic–plastic material. The theoretical model considers the formation of elastoplastic deformations in the vicinity of the through hole; the calculated finite element model considers in the vicinity of both through and blind holes of different depths. It was noted that at the blind hole, the most informative are the movements of the axisymmetric bend caused by the violation by the blind hole of symmetry of the disk with respect to its median plane. At the same time, an approximate analytical method has been developed to calculate the stresses that cause only elastic deformations. Experimental studies were carried out on a series of samples in the form of steel disks with axisymmetric stresses near the yield point. These stresses were induced by the hot fit of grinded rings from hardened high-strength steel onto disks made of steel with a low yield strength. Examples are given which show that the stress values determined from normal displacements in the vicinity of the probe holes from the calculated–theoretical and experimental are similar.

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35

Kauer, Markus, Valentina Belova-Magri, Carlos Cairós, Gerd Linka, and Robert Mettin. "High-speed imaging of ultrasound driven cavitation bubbles in blind and through holes." Ultrasonics Sonochemistry 48 (November 2018): 39–50. http://dx.doi.org/10.1016/j.ultsonch.2018.04.015.

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36

Malayath, Ganesh, Srikanth Katta, Ajay M. Sidpara, and Sankha Deb. "Length-wise tool wear compensation for micro electric discharge drilling of blind holes." Measurement 134 (February 2019): 888–96. http://dx.doi.org/10.1016/j.measurement.2018.12.047.

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37

Feng, Haoren, Daohui Xiang, Bangfu Wu, and Bo Zhao. "Ultrasonic vibration-assisted grinding of blind holes and internal threads in cemented carbides." International Journal of Advanced Manufacturing Technology 104, no. 1-4 (June 27, 2019): 1357–67. http://dx.doi.org/10.1007/s00170-019-04024-2.

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38

Ma, Yu Zhen, Xuan Sun, and Cheng Wang. "The Measurement Technique of Blind Hole Based on Capacitive Probe Sensor." Applied Mechanics and Materials 670-671 (October 2014): 1260–63. http://dx.doi.org/10.4028/www.scientific.net/amm.670-671.1260.

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There are many inconvenience in measuring the diameter of blind and deep holes. The measurement device can hardly stretch into the bottom. The paper is about a capacitive probe measurement system, the whole equipment includes capacitive probe sensor, the measured hole, precision drive part, two-dimensional micro-positioning platform. A simulation analysis was done for the structural parameters, and the eccentricity between the probe and the measured hole, then a reliable measurement results were obtained.

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39

Li, Guang, Wen Tie Niu, Da Wei Zhang, and Wei Guo Gao. "A Flow Path Generation Approach of Hydraulic Manifold Blocks Based on Maze and Genetic Algorithms." Advanced Materials Research 338 (September 2011): 106–10. http://dx.doi.org/10.4028/www.scientific.net/amr.338.106.

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The automatic generation of flow path is the key and most difficult task in Hydraulic Manifold Blocks (HMB) design. This paper divides the HMB layout space into grids, and sets the HMB boundaries and existing flow paths to obstacles, and the paths generated using maze algorithm are regarded as the initial population of genetic algorithm. The optimal path with the shortest path and least turnings can be obtained using genetic algorithm. The ports of flow path can be connected after the generation of technical holes based on the blind holes. The design parameters of holes, such as starting point coordinates, orientations and depths, can be obtained through a series of algorithms, and then drive the secondary development system HMBDesigner based on SolidWorks to generate three-dimensional solid model. This paper also discusses the generation method of multi-port flow path and multiple flow paths.

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40

Obata, Kuniyoshi, Toshiki Hirogaki, Eiichi Aoyama, and Keiji Ogawa. "Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images." Key Engineering Materials 516 (June 2012): 30–35. http://dx.doi.org/10.4028/www.scientific.net/kem.516.30.

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Electrical circuits of Printed Wiring Boards (PWBs) have become multi-layered. Therefore, the formation of micro-blind holes for interlayer electrical connections (blind via holes: BVH) is required. As a result, Cu-direct laser drilling is attracting attention. However, Cu-direct drilling is problematic in that it produces a copper overhang as a result of copper and resin, which have different decomposition points, being melted simultaneously. In addition, the state of PWB surface after the laser drilling is very important. However, this procedure restricts the board density that can be achieved as a result of the limited positional accuracy of the etching process. Consequently, using a Cu-direct drilling process, which does not require etching of the copper foil, to drill BVHs to connect copper foils using a CO2 laser beam has been receiving considerable attention for the next-generation high density PWB manufacturing. However, in the Cu process of generating a direct and overhang problem, there is the problem of accuracy on the substrate surface. In contrast, in-depth research on quality companies has not been performed. Thus, we observe the removal process. Furthermore, we demonstrated reduced overhang.

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41

Zbrowski, Andrzej. "X-Ray Tomography in the Diagnostics of Roller Bearing Rings." Solid State Phenomena 223 (November 2014): 211–20. http://dx.doi.org/10.4028/www.scientific.net/ssp.223.211.

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The article presents the application of computed tomography (CT) for the detection of internal material defects in roller bearing rings made of steel. The tests were conducted using a set of four rings with different defects created artificially by means of electric discharge machining. In each test ring, several defects of the same type could be observed; however, they differed in terms of their size and geometry. The defects analysed had the form of internal blind holes with axes transverse or parallel to the surface of the track of the bearing – internal blind rectangular holes, and through slits in the inner cylindrical surface. The tests were conducted using a “V|tome|x s” X-ray CT scanner (tomograph) by GE. The roentgenograms of test objects were taken and then reconstructed in 3D. Each defect was visualised in different section planes of a reconstructed ring. Selected defects were represented in a solid form, and the measurements were taken in order to determine their geometry and volume. The tests confirmed that CT can be used in studies on such internal material defects in roller bearing rings as subsurface voids. All artificially made model defects were detected.

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42

Zhou, Yang, Xiao Dong Fu, Pei Feng, and Chong Chang Yang. "Research on Special Purpose Machine Tool Used for Ladder-Shaped Micro-Hole Automation Machining." Applied Mechanics and Materials 556-562 (May 2014): 1034–37. http://dx.doi.org/10.4028/www.scientific.net/amm.556-562.1034.

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this paper introduced the existing ladder-shaped micro hole machining method, analyzed the existing problems of present micro hole machining equipment; solved some key problems such as how to clean up the iron filings in micro blind holes rapidly and completely, compensate tool wear and other problems; And finally developed a special purpose machine tool for machining ladder-shaped micro hole, which can achieve fully automated machining.

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Zhang Fei, 张菲, 段军 Duan Jun, 曾晓雁 Zeng Xiaoyan, and 李祥友 Li Xiangyou. "Study of Blind Holes Drilling on Flexible Circuit Board Using 355 nm UV Laser." Chinese Journal of Lasers 36, no. 12 (2009): 3143–48. http://dx.doi.org/10.3788/cjl20093612.3143.

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44

Gerbaldo, R., R. Cherubini, A. Chiodoni, R. Fastampa, G. Ghigo, L. Gozzelino, F. Laviano, E. Mezzetti, and B. Minetti. "Effects induced by crossing columnar defects and blind holes on Bi-2212 single crystals." Physica C: Superconductivity 354, no. 1-4 (May 2001): 173–77. http://dx.doi.org/10.1016/s0921-4534(01)00042-9.

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Blödorn, R., M. R. Viotti, R. B. Schroeter, and A. Albertazzi. "Analysis of Blind-Holes Applied in the Hole-Drilling Method for Residual Stress Measurements." Experimental Mechanics 55, no. 9 (August 7, 2015): 1745–56. http://dx.doi.org/10.1007/s11340-015-0082-5.

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Filipowicz, Michał, Piotr Wach, Kryspin Burdyński, Jerzy Michalski, and Zenon Komorek. "Gas nitriding of inner surfaces of deep holes." Inżynieria Powierzchni 23, no. 2 (August 16, 2018): 24–29. http://dx.doi.org/10.5604/01.3001.0012.2091.

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In industrial applications of thermo-chemical treatments, gas nitriding is a widespread method of nitriding. Machine parts and tools of various shapes and sizes are nitrided, including drills, cutters, dies, shafts, rings, bearing balls, etc. often characterized by a complicated shape. The nitrided layers should have a controlled thickness not only of the diffusion zone, but also the surface layer of iron nitrides to have good exploitation properties. With a properly prepared surface on low alloy steels, we obtain a uniform nitrided layer after nitriding. It may happen that the structure of the nitrided layer is heterogeneous or even completely lacking in the nitrided parts having a complicated shape, and especially thin inner openings, where it is difficult to properly prepare the surface. Therefore, the nitriding problem is not the external surface of the workpieces but the internal one. The aim of the work was to assess the possibility of nitriding deep holes with small diameter. The tests were carried out on cylindrical specimens of unalloyed and low-alloy steel with electro-bored and mechanically hollow through holes and blind holes. The quality of the obtained nitrided layers was evaluated by metallographic and hardness examinations.

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Sharma, A., V. Jain, and D. Gupta. "Multi-shaped tool wear study during rotary ultrasonic drilling and conventional drilling for amorphous solid." Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering 233, no. 3 (May 14, 2018): 551–60. http://dx.doi.org/10.1177/0954408918776724.

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Float glass, which is a hard and brittle material, is generally machined and drilled using rotary ultrasonic machining and conventional drilling to create products such as solar panels, metrological instruments, etc. But researchers are facing serious issues with regard to tool wear and opting for best shape of tool for the drilling purpose. In this study, blind holes are made on float glass specimen using rotary ultrasonic drilling and CNC conventional drilling process with the aid of multi-shaped tools. The opted tools are namely hollow abrasive tool, pin-pointed conical tool, flat cylindrical tools, and concave circular tool. The entire experimental work is accomplished by considering industrial conditions. Multi-shaped tool’s weight is computed at three stages i.e. (a) fresh tool, (b) after rotary ultrasonic drilling, and (c) after conventional drilling to analyze the overall tool wear. Apparently, micro-studies are used to investigate the phenomena of lateral and end face tool wear while creating blind holes at these three stages. It is revealed that the concave circular tool achieved a minimum percentage of weight loss i.e. 4.92% after conventional drilling and 1.96% after rotary ultrasonic drilling process, which could be preferred for drilling purpose followed by the hollow abrasive tool.

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Sedaghati, Adel, Farhang Honarvar, Morteza Tabatabaeipour, and Anthony N. Sinclair. "Investigation of the scattering of Lamb waves from a generalized circular cavity by using Poisson/Mindlin plate theories and numerical simulation." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 234, no. 1 (August 28, 2019): 152–70. http://dx.doi.org/10.1177/0954406219871073.

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A mathematical model for the scattering of a symmetric [Formula: see text] Lamb wave mode from a circular cavity in an isotropic plate is developed that can handle both symmetric and asymmetric single- and double-sided blind holes. The theoretical formulation is based on Mindlin and Poisson plate theories. A finite element model is also utilized to extract the scattering patterns of Lamb waves from various cases of a generalized circular cavity. Two-dimensional FFT analysis is used to determine the transmitted and reflected Lamb wave modes when the incident wave interacts with either symmetric (through-hole and double-sided blind hole) or asymmetric (blind hole and double-sided blind hole) cavities. Results indicate that the remaining thickness of a cavity zone and the type of a cavity are two key parameters in the scattering pattern. For asymmetric cavities, the shape of the scattering pattern of the mode-converted [Formula: see text] mode does not vary significantly. However, the amplitude of the scattering pattern shows noticeable changes in the out-of-plane component of the displacement. Results obtained from the proposed theory and finite element model are in good agreement with previously published data.

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Wang, Jing, Miao Wu, and Chengqiang Cui. "Factors governing filling of blind via and through hole in electroplating." Circuit World 40, no. 3 (July 29, 2014): 92–102. http://dx.doi.org/10.1108/cw-05-2014-0019.

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Purpose – The purpose of this paper is to present a clear picture of the key factors of blind via and through hole filling in electroplating, e.g. shape of via or hole, electroplating solution, process, as well as the developments of mechanisms and models. Design/methodology/approach – First, the paper details the development trends and challenges of via filling. Then the research status of mechanisms, electroplating solutions, including base solution and additives, numerical model and mass transfer is described. Finally, through hole filling is briefly reviewed. Findings – To achieve excellent via filling performance, the characteristics of the via or hole, the ratio of acid/copper, selection of additives and factors of mass transfer are comprehensively considered in terms of optimization of the electroplating process. It is beneficial to design vias with appropriate aspect ratios, to strengthen the adsorption of the accelerator in the via bottom, to inhibit the increase of surface copper thickness and to form butterfly-shaped copper in the centre of through holes. Optimized process parameters should be taken into consideration in superfilling. Originality/value – The paper reviews different sets of additives, mechanisms and superfilling models for state-of-the-art via filling and the developments of filling for through holes.

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Shorey, Aric, Satish Chaparala, Scott Pollard, Garrett Piech, and John Keech. "Glass Interposer Substrates: Fabrication, Characterization and Modeling." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000625–30. http://dx.doi.org/10.4071/isom-2013-wp13.

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There is growing interest in applying glass as a substrate for 2.5D/3D applications. Glass has many material properties that make it well suited for interposer substrates. Glass based solutions provide significant opportunities for cost reduction by leveraging economies of scale as well as forming substrates at design thickness. A lot of work is being done to validate the value of glass as an interposer substrate. One important area is the electrical performance of glass relative to silicon. Because glass is an insulator, an interposer made with glass should have better electrical performance than one made with silicon. Electrical characterization and electrical models confirm this advantage, and its positive impact on functional performance. Further advantages are anticipated in reliability, driven by the ability to tailor thermal properties such as coefficient of thermal expansion (CTE) of glass. Modeling results will be presented that show how the proper choice of CTE can significantly lower stack warpage. Additionally, significant progress has been made in the demonstration of glass interposer fabrication. Fully patterned wafers and panels with through holes and blind holes are being fabricated today. It is equally important to be able to demonstrate the ability to leverage existing downstream processes for metallization of these substrates. The ability to apply existing downstream processes to make functional glass interposers using both through and blind via technology will be presented.

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Journal articles on the topic 'Blind-Holes'

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