Academic literature on the topic 'Bonding ratio'
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Journal articles on the topic "Bonding ratio"
Li, Hong, Miao-Quan Li, Wei-Xin Yu, and Hong-Bin Liu. "Significance and interaction of bonding parameters with bonding ratio in press bonding of TC4 alloy." Rare Metals 35, no. 3 (2014): 235–41. http://dx.doi.org/10.1007/s12598-014-0330-3.
Full textLi, Qingbo, Hongfei Wang, Mowen Xie, and Weinan Liu. "Calculation Method of Bonding Section of Joint Surface of Dangerous Rock Mass Based on Amplitude Ratio." Shock and Vibration 2020 (November 30, 2020): 1–9. http://dx.doi.org/10.1155/2020/8820639.
Full textGuo, Shan Shan, Yuan Yuan Jiang, Hao Zeng, Xiao Yong Wan, and Yong Jun Li. "Diffusion Bonding Performance of Copper Target for 300mm Integrated Circuit." Materials Science Forum 1035 (June 22, 2021): 692–97. http://dx.doi.org/10.4028/www.scientific.net/msf.1035.692.
Full textMei, Han, Lihui Lang, Xiaoxing Li, Hasnain Ali Mirza, and Xiaoguang Yang. "Prediction of Tensile Strength and Deformation of Diffusion Bonding Joint for Inconel 718 Using Deep Neural Network." Metals 10, no. 9 (2020): 1266. http://dx.doi.org/10.3390/met10091266.
Full textYoshida, Yoshinori, Takamasa Matsubara, Keisuke Yasui, Takashi Ishikawa, and Tomoaki Suganuma. "Influence of Processing Parameters on Bonding Conditions in Backward Extrusion Forged Bonding." Key Engineering Materials 504-506 (February 2012): 387–92. http://dx.doi.org/10.4028/www.scientific.net/kem.504-506.387.
Full textLi, Xiujun, Zhipeng Zhang, Hao Liu, et al. "Research on the Milling Characteristics of SBS Modified Asphalt Pavement with Different Service Years Using the Discrete Element Method." Materials 18, no. 14 (2025): 3226. https://doi.org/10.3390/ma18143226.
Full textYan, Lintong, Yunong Ye, Zhe Ji, Yijia Liu, Chenglong Zhou, and Song Liu. "The Stress Induced by the Epoxy Bonding Layer Changing in the Layered Hollow Spheres." Science of Advanced Materials 14, no. 4 (2022): 736–42. http://dx.doi.org/10.1166/sam.2022.4287.
Full textXu, Wei, Chengdong Xia, and Chengyuan Ni. "Numerical Simulation and Experimental Verification of Hot Roll Bonding of 7000 Series Aluminum Alloy Laminated Materials." Metals 14, no. 5 (2024): 551. http://dx.doi.org/10.3390/met14050551.
Full textAggarwal, A., and G. De Souza. "Effect of MDP/VBATDT ratio on zirconia-substrate bonding." Dental Materials 29 (January 2013): e1. http://dx.doi.org/10.1016/j.dental.2013.08.002.
Full textLai, Andre, Nicolas Altemose, Jonathan A. White, and Aaron M. Streets. "On-ratio PDMS bonding for multilayer microfluidic device fabrication." Journal of Micromechanics and Microengineering 29, no. 10 (2019): 107001. http://dx.doi.org/10.1088/1361-6439/ab341e.
Full textDissertations / Theses on the topic "Bonding ratio"
Hofmann, Lutz. "3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias." Doctoral thesis, Universitätsbibliothek Chemnitz, 2017. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-231412.
Full textAguilar, Boris. "Experimental study and numerical modeling of accretion phenomena of snow particles at the origin of the formation of accretions on aeronautical structures or civil engineering." Electronic Thesis or Diss., Toulouse, ISAE, 2024. http://www.theses.fr/2024ESAE0003.
Full textWassermann, Alice. "Quantification multi-échelles de la dégradation d’un sable traité soumis à des cycles hydriques." Electronic Thesis or Diss., Université de Lorraine, 2023. http://www.theses.fr/2023LORR0085.
Full textČižmáriková, Jitka. "Finanční analýza společnosti T-Mobile Czech Republic a.s." Master's thesis, Vysoká škola ekonomická v Praze, 2008. http://www.nusl.cz/ntk/nusl-10370.
Full textHofmann, Lutz. "3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias." Doctoral thesis, 2016. https://monarch.qucosa.de/id/qucosa%3A20832.
Full textAzari, Shahrokh. "Near-threshold Fatigue of Adhesive Joints: Effect of Mode Ratio, Bond Strength and Bondline Thickness." Thesis, 2010. http://hdl.handle.net/1807/32927.
Full textChiou, Guo-Lin, and 邱國麟. "The study for anodic bonding of silicon and Pyrex7740 glass with intermedium metal film by radio frequency magnetron sputtering." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/09001915554678891911.
Full textBooks on the topic "Bonding ratio"
A, Kreigsmann Gregory, and Institute for Computer Applications in Science and Engineering., eds. Microwave heating and joining of ceramic cylinders: A mathematical model. Institute for Computer Applications in Science and Engineering, NASA Langley Research Center, 1994.
Find full textN0AX, H. Ward Silver, and ARRL Inc. Grounding and Bonding for the Radio Amateur. Amer Radio Relay League, 2017.
Find full textBook chapters on the topic "Bonding ratio"
Jiang, Weihong, Wenhong Duan, Jiaquan Yuan, et al. "Experimental Study on Axial Compressive Properties of Early Strength and High Ductility Cement-Based Composite Concrete." In Lecture Notes in Civil Engineering. Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-97-4090-1_16.
Full textDuan, Wenhong, Jiaquan Yuan, Li Xiong, et al. "Research on Axial Tensile Mechanical Properties of Early-Strength High Ductility Cementitious Composites." In Lecture Notes in Civil Engineering. Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-97-4090-1_35.
Full textNing, Yipeng, Biao Ren, Zhihang Wang, Ao Yao, He Huang, and Tengjiao Wang. "Effect of cement ratio on work and bonding properties of styrene acrylic emulsion-based cement composites." In Advances in Measurement Technology, Disaster Prevention and Mitigation. CRC Press, 2022. http://dx.doi.org/10.1201/9781003330172-67.
Full textAsaji, Tetsuo. "Isotope ratio of Cl NQR spin-lattice relaxation times in 1D hydrogen-bonding system of tetramethylpyrazine-chloranilic acid at high temperatures." In HFI / NQI 2012. Springer Netherlands, 2012. http://dx.doi.org/10.1007/978-94-007-6479-8_38.
Full textAtkins, Peter, Julio de Paula, and Ronald Friedman. "Bonding in solids." In Physical Chemistry: Quanta, Matter, and Change. Oxford University Press, 2013. http://dx.doi.org/10.1093/hesc/9780199609819.003.0051.
Full textKeeler, James, and Peter Wothers. "Bonding between the elements." In Chemical Structure and Reactivity. Oxford University Press, 2013. http://dx.doi.org/10.1093/hesc/9780199604135.003.0010.
Full textBurrows, Andrew, John Holman, Simon Lancaster, et al. "Solids." In Chemistry3. Oxford University Press, 2021. http://dx.doi.org/10.1093/hesc/9780198829980.003.0006.
Full textCooke, Kavian, and Tahir Khan. "Nanostructured Ni/Al2O3 Interlayer: Transient Liquid Phase Diffusion Bonding of Al6061-MMC." In Encyclopedia of Aluminum and Its Alloys. CRC Press, 2019. http://dx.doi.org/10.1201/9781351045636-140000277.
Full textPothina, Abhishek, and Saroj Kumar Sarangi. "Analysis of Pineapple Leaf Fiber Reinforced Composite Vehicle Bumper with Varying Fiber Volume Fraction." In Manufacturing and Processing of Advanced Materials. BENTHAM SCIENCE PUBLISHERS, 2023. http://dx.doi.org/10.2174/9789815136715123010017.
Full textGraham J., Man A., Alfaro M., Blatz J.A., and Van Gulck J. "Gypsum cementation and yielding in plastic clay." In Proceedings of the 16th International Conference on Soil Mechanics and Geotechnical Engineering. IOS Press, 2005. https://doi.org/10.3233/978-1-61499-656-9-507.
Full textConference papers on the topic "Bonding ratio"
Wu, Fa, Wei Cui, Jianguo Zhao, et al. "Fabrication of High Aspect Ratio TSV Interposer with Cu-Cu Direct Bonding." In 2024 25th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2024. http://dx.doi.org/10.1109/icept63120.2024.10668458.
Full textGeers, C., and M. Schütze. "New Surface Protection System against Metal Dusting." In CORROSION 2009. NACE International, 2009. https://doi.org/10.5006/c2009-09149.
Full textEsfahani, Zahra Kolahdouz, Henk van Zeijl, and G. Q. Zhang. "High aspect ratio lithography for litho-defined wire bonding." In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, 2014. http://dx.doi.org/10.1109/ectc.2014.6897501.
Full textTani, Hiroshi, Yuki Uesaraie, Renguo Lu, Shinji Koganezawa, and Norio Tagawa. "Hybrid Lubricant Film With High Bonding Ratio and High Coverage." In ASME 2019 28th Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/isps2019-7428.
Full textPinti, Marie, and Shaurya Prakash. "Fabrication of Hybrid Micro-Nanofluidic Devices With Centimeter Long Ultra-Low Aspect Ratio Nanochannels." In ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-65763.
Full textYao, Shu-Wei, Guan-Jun Yang, Cheng-Xin Li, Xiao-Tao Luo, and Chang-Jiu Li. "Understanding the Formation of the Limited Inter-Lamellar Bonding in Thermal Spray Ceramic Coatings Based on the Intrinsic Bonding Temperature Concept." In ITSC2015, edited by A. Agarwal, G. Bolelli, A. Concustell, et al. ASM International, 2015. http://dx.doi.org/10.31399/asm.cp.itsc2015p0767.
Full textSchroder, S., A. C. Fischer, G. Stemme, and F. Niklaus. "Very high aspect ratio through silicon vias (TSVs) using wire bonding." In 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII). IEEE, 2013. http://dx.doi.org/10.1109/transducers.2013.6626728.
Full textLi, Chang-Jiu, Guan-Jun Yang, and Cheng-Xin Li. "Development of the Particle Interface Bonding in Thermal Spray Coatings for Expanding High Performance Applications." In ITSC 2012, edited by R. S. Lima, A. Agarwal, M. M. Hyland, et al. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.itsc2012p0047.
Full textLiu, Tao, Li-Shuang Wang, Shu-Wei Yao, et al. "Improving the Corrosion Resistance of Thermal Barrier Coatings against CMAS by Depositing Top Ceramic Layer of Enhanced Splat Bonding." In ITSC2015, edited by A. Agarwal, G. Bolelli, A. Concustell, et al. ASM International, 2015. http://dx.doi.org/10.31399/asm.cp.itsc2015p0092.
Full textHuang, Jian-Yuan, and Chih Chen. "Effect of (111) Surface Ratio on the Bonding Quality of Cu-Cu Joints." In 2024 IEEE 74th Electronic Components and Technology Conference (ECTC). IEEE, 2024. http://dx.doi.org/10.1109/ectc51529.2024.00104.
Full textReports on the topic "Bonding ratio"
Chutimaworapan, Suchada. Fast release solid dispersion system of nifedipine. Chulalongkorn University, 1999. https://doi.org/10.58837/chula.res.1999.28.
Full textSirivat, Anuvat, and Ladawan Ruangchuay. Preparation and characterization of polypyrrole film for chemical vapor sensor applications. Chulalongkorn University, 2001. https://doi.org/10.58837/chula.res.2001.82.
Full textRujiravanit, Ratana. Preparation and characterization of hydrogel from chitin derivative and silk fibroin. Thailand Research Fund, 2003. https://doi.org/10.58837/chula.res.2003.80.
Full textMcMahan, Tara, Bill Amend, Ken Evans, Tom Bubenik, and Michael Rosenfeld. PR186-223601-R01 Evaluation of Selective Seam Weld Corrosion Susceptibility. Pipeline Research Council International, Inc. (PRCI), 2024. http://dx.doi.org/10.55274/r0000065.
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