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Relevant bibliographies by topics / Bulk micro-machining

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Academic literature on the topic 'Bulk micro-machining'

Author: Grafiati

Published: 4 June 2021

Last updated: 19 February 2022

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Journal articles on the topic "Bulk micro-machining"

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Brinksmeier, Ekkard, and Werner Preuss. "Micro-machining." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 370, no. 1973 (August 28, 2012): 3973–92. http://dx.doi.org/10.1098/rsta.2011.0056.

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Manipulating bulk material at the atomic level is considered to be the domain of physics, chemistry and nanotechnology. However, precision engineering, especially micro-machining, has become a powerful tool for controlling the surface properties and sub-surface integrity of the optical, electronic and mechanical functional parts in a regime where continuum mechanics is left behind and the quantum nature of matter comes into play. The surprising subtlety of micro-machining results from the extraordinary precision of tools, machines and controls expanding into the nanometre range—a hundred times more precise than the wavelength of light. In this paper, we will outline the development of precision engineering, highlight modern achievements of ultra-precision machining and discuss the necessity of a deeper physical understanding of micro-machining.

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Zhang, Lin, and Hu Huang. "Micro machining of bulk metallic glasses: a review." International Journal of Advanced Manufacturing Technology 100, no. 1-4 (September 27, 2018): 637–61. http://dx.doi.org/10.1007/s00170-018-2726-y.

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CHOI, Eui-Seong, Jinwoo SUNG, Qi-min WANG, Kwang-Ho KIM, Ahmed BUSNAINA, and Myung Chang KANG. "Material properties and machining performance of hybrid Ti2AlN bulk material for micro electrical discharge machining." Transactions of Nonferrous Metals Society of China 22 (December 2012): s781—s786. http://dx.doi.org/10.1016/s1003-6326(12)61804-4.

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Yeo, Swee Hock, Peng Cheong Tan, Erwin Aligiri, Shu Beng Tor, and Ngiap Hiang Loh. "Processing of Zirconium-Based Bulk Metallic Glass (BMG) Using Micro Electrical Discharge Machining (Micro-EDM)." Materials and Manufacturing Processes 24, no. 12 (December 21, 2009): 1242–48. http://dx.doi.org/10.1080/10426910903129661.

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Chandrasekaran, Arvind, Muthukumaran Packirisamy, Ion Stiharu, and Andre Delage. "Hybrid bulk micro-machining process suitable for roughness reduction in optical MEMS devices." International Journal of Manufacturing Technology and Management 9, no. 1/2 (2006): 144. http://dx.doi.org/10.1504/ijmtm.2006.009992.

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Singaravel, B., and Thangiah Selvaraj. "A Review of Micro Hardness Measurement in Turning Operation." Applied Mechanics and Materials 813-814 (November 2015): 274–78. http://dx.doi.org/10.4028/www.scientific.net/amm.813-814.274.

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Surface integrity estimation is used to enhance the functional behavior of the machined component. Enhancement of surface integrity in a turning operation by one of the reliable factor is micro hardness. Micro hardness measurement used to measure the degree of work hardening, sub surface alteration, functional attribute and analyzes the difference between machining affected zone and bulk material. The objective of this present work is an effort to review some of the importance of micro hardness measurement done in turning operation. In conclusion a summary of the importance of micro hardness measurement is outlined.

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Zaehringer, Sandy, Elisabeth Widamnn, and Norbert Schwesinger. "Surface Micro Machined Actuators on Piezoelectric Bulk Material." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000099–104. http://dx.doi.org/10.4071/cicmt-2011-tp22.

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Using circular discs of piezoelectric material an easy adaptation to well-known silicon surface micro machining technologies is possible. Thus, several interdigitated electrodes layouts have been positioned on a planar lead-zirconate-titanate disc via lift off processes. Because of an inhomogeneous electric field distribution the actuated areas on the disc conduct a symmetric deformation of the bulk material without any need of a further passive membrane, as is necessary regarding common piezoelectric membrane actuators. The most interesting deformation was shown by star shaped interdigitated electrodes. It was an overall downward movement (i.e. the side opposite the electrodes) of the actuated area and a center movement in the opposite direction about 25% of the downward movement. This phenomenon is further investigated, especially with regard to increasing the upward movement. Therefore, the behavior of the actuated area has been more thoroughly tested, using laser vibrometry, speckle imaging and white light interferometry. Based on the thus salvaged data, those actuators have been investigated especially concerning their deformation behavior in various clamping modes either during polarization and/or during actuation.

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Xu, Jian Ting, and Dong Qing Yuan. "Periodic Nano-Structure Formation with Femtosecond Laser Ablation and Patterning of Silicon." Applied Mechanics and Materials 275-277 (January 2013): 2186–89. http://dx.doi.org/10.4028/www.scientific.net/amm.275-277.2186.

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Regular micro-apparatus which covered with periodic nano-hole, nano-ridge and ripple structures on silicon bulk were formed by laser micro-machining with tightly focused beam of the femtosecond laser with wavelength of 800 nm, repetition rate of 1 kHz and the pulse length of 130 fs in air. The periodic nano-hole structures which focus with a 20× focusing objective lens (NA = 0.4) is reported. Investigating the relationship between the width of structures and the speed of processing.

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Yan, Ji Wang, Tooru Asami, and Tsunemoto Kuriyagawa. "Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation." Key Engineering Materials 389-390 (September 2008): 469–74. http://dx.doi.org/10.4028/www.scientific.net/kem.389-390.469.

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Ultraprecision diamond-cut silicon wafers were irradiated by a nanosecond pulsed Nd:YAG laser, and the resulting specimens were characterized using transmission electron microscopy and micro-Raman spectroscopy. The results indicate that at specific laser energy density levels, machining-induced amorphous layers and dislocated layers were both reconstructed to a complete single-crystal structure identical to the bulk region. Similar effects were confirmed for diamond-ground silicon wafers. Effects of overlapping irradiation were investigated and perfect crystallographic uniformity was achieved in the boundary region. The recovery process involved rapid melting of the near-surface amorphous layer, followed by epitaxial regrowth from the damage-free crystalline bulk.

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Bolar, Gururaj, and Shrikrishna N. Joshi. "Experimental Study on Surface Integrity, Dimensional Accuracy, and Micro-Hardness in Thin-Wall Machining of Aluminum Alloy." International Journal of Materials Forming and Machining Processes 5, no. 2 (July 2018): 13–31. http://dx.doi.org/10.4018/ijmfmp.2018070102.

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This article presents an experimental investigation into the influence of process parameters viz. feed per tooth, axial depth of cut on milling force, surface finish, wall deflection and micro-hardness during thin-wall machining of an aerospace grade aluminum alloy 2024-T351. Results revealed that the process parameters significantly influence the surface finish and dimensional accuracy of machined thin-walls. High feed rate promoted the formation of built-up-edge (BUE). Combination of high feed and axial depth of cut aided in catastrophic failure of tools. Surface damages such as material plucking, material shearing, material adhesion and deformed feed mark layer formation were observed. Axial depth of cut negatively influenced the wall deflection leading to loss of dimensional accuracy. Interestingly, the micro-hardness at the machined surface was found to be lower than that of the bulk material hardness. These results will be useful in selection of suitable process parameters for quality and precise machining of thin-wall parts.

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Dissertations / Theses on the topic "Bulk micro-machining"

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Zhou, Zhijian. "Microcapteurs de hautes fréquences pour des mesures en aéroacoustique." Phd thesis, Université de Grenoble, 2013. http://tel.archives-ouvertes.fr/tel-00947304.

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L'aéroacoustique est une filière de l'acoustique qui étudie la génération de bruit par un mouvement fluidique turbulent ou par les forces aérodynamiques qui interagissent avec les surfaces. Ce secteur en pleine croissance a attiré des intérêts récents en raison de l'évolution de la transportation aérienne, terrestre et spatiale. Les microphones avec une bande passante de plusieurs centaines de kHz et une plage dynamique couvrant de 40Pa à 4 kPa sont nécessaires pour les mesures aéroacoustiques. Dans cette thèse, deux microphones MEMS de type piézorésistif à base de silicium polycristallin (poly-Si) latéralement cristallisé par l'induction métallique (MILC) sont conçus et fabriqués en utilisant respectivement les techniques de microfabrication de surface et de volume. Ces microphones sont calibrés à l'aide d'une source d'onde de choc (N-wave) générée par une étincelle électrique. Pour l'échantillon fabriqué par le micro-usinage de surface, la sensibilité statique mesurée est 0.4μV/V/Pa, la sensibilité dynamique est 0.033μV/V/Pa et la plage fréquentielle couvre à partir de 100 kHz avec une fréquence du premier mode de résonance à 400kHz. Pour l'échantillon fabriqué par le micro-usinage de volume, la sensibilité statique mesurée est 0.28μV/V/Pa, la sensibilité dynamique est 0.33μV/V/Pa et la plage fréquentielle couvre à partir de 6 kHz avec une fréquence du premier mode de résonance à 715kHz.

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Zhou, Zhijian J. "Microcapteur de hautes fréquences pour des mesures en aéroacoustique." Phd thesis, Université de Grenoble, 2013. http://tel.archives-ouvertes.fr/tel-00838736.

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L'aéroacoustique est une filière de l'acoustique qui étudie la génération de bruit par un mouvement fluidique turbulent ou par les forces aérodynamiques qui interagissent avec les surfaces. Ce secteur en pleine croissance a attiré des intérêts récents en raison de l'évolution de la transportation aérienne, terrestre et spatiale. Alors que les tests sur un objet réel sont possibles, leur implantation est généralement compliquée et les résultats sont facilement corrompus par le bruit ambiant. Par conséquent, les tests plus strictement contrôlés au laboratoire utilisant les modèles de dimensions réduites sont préférables. Toutefois, lorsque les dimensions sont réduites par un facteur de M, l'amplitude et la bande passante des ondes acoustiques correspondantes se multiplient respectivement par 10logM en décibels et par M. Les microphones avec une bande passante de plusieurs centaines de kHz et une plage dynamique couvrant de 40Pa à 4 kPa sont ainsi nécessaires pour les mesures aéroacoustiques. Les microphones MEMS ont été étudiés depuis plus de vingt ans, et plus récemment, l'industrie des semiconducteurs se concentre de plus en plus sur ce domaine. Par rapport à tous les autres principes de fonctionnement, grâce à la miniaturisation, les microphones de type piézorésistif peuvent atteindre une bande passante plus élevée et ils sont ainsi bien adaptés pour les mesures aéroacoustiques. Dans cette thèse, deux microphones MEMS de type piézorésistif à base de silicium polycristallin (poly-Si) latéralement cristallisé par l'induction métallique (MILC) sont conçus et fabriqués en utilisant respectivement les techniques de microfabrication de surface et de volume. Ces microphones sont calibrés à l'aide d'une source d'onde de choc (N-wave) générée par une étincelle électrique. Pour l'échantillon fabriqué par le micro-usinage de surface, la sensibilité statique mesurée est de 0.4 μV/V/Pa, la sensibilité dynamique est de 0.033 μV/V/Pa et la plage fréquentielle commence à 100 kHz avec une fréquence du premier mode de résonance à 400 kHz. Pour l'échantillon fabriqué par le micro-usinage de volume, la sensibilité statique mesurée est de 0.28 μV/V/Pa, la sensibilité dynamique est de 0.33 μV/V/Pa et la plage fréquentielle commence à 6 kHz avec une fréquence du premier mode de résonance à 715 kHz.

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Ngo, Sophie. "Dispositf acoustique pour l'isolation galvanique : le CMUT, une voie innovante." Thesis, Tours, 2013. http://www.theses.fr/2013TOUR4027.

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Les dispositifs d’isolation galvanique intégrés au sein des systèmes de commande d’interrupteurs de puissance doivent répondre à une demande accrue en performance, facilité d’intégration et efficacité énergétique. Les transducteurs ultrasonores capacitifs micro-usinés (cMUT : capacitive Micromachined Ultrasonic Transducer), capables d’émettre et de recevoir des ondes ultrasonores, semblent une alternative tout à fait nouvelle à la fonction d’isolation galvanique. Ces travaux de thèse ont pour objectif de démontrer la faisabilité d’un dispositif basé sur la technologie cMUT. Le principe de fonctionnement consiste à transmettre une information grâce à une communication par onde acoustique de volume entre deux réseaux de cMUT placés de part et d’autre d’un substrat. Nous focalisons, en premier lieu, ces travaux sur le processus de fabrication par micro-usinage de surface des cMUT ainsi que les techniques de réalisation des dispositifs en structure double face sur substrat de silicium. L’étude permet d’identifier le collage de substrat comme une solution de fabrication industrialisable. Suite à la réalisation des dispositifs, la caractérisation électro-mécanique des cMUT est une étapeessentielle à la validation de leur fonctionnalité en tant que dispositifs émetteurs. L’étude débute par uneévaluation des propriétés mécaniques du matériau constituant la membrane et qui impactent directementle comportement global des cMUT. Puis, la caractérisation du comportement statique et dynamique descMUT permet d’extraire les paramètres tels que la fréquence de résonance, la tension de collapse etl’efficacité électro-mécanique qui définissent le mode de pilotage d’un tel système.Finalement, la validation du concept de transmission et de détection d’ondes ultrasonores est réaliséegrâce à des mesures de vibrométrie laser Doppler. Les résultats apportent des éléments de réponse quantau mode de propagation des ondes et permettent d’identifier les topologies de meilleure efficacité entransmission acoustique. Enfin, l’intégration du prototype dans l’application de commanded’interrupteur de puissance démontre la faisabilité du concept de transformateur acoustique basé sur latechnologie cMUT
Galvanic isolation devices integrated into switch command systems must be able to answer all of the increasing demand for performance, energetic efficiency and integration easiness. The capacitive micro machined ultrasonic transducers (cMUT), able to emit and receive ultrasounds, could be an entirely new alternative to the function of galvanic isolation. This work aims to demonstrate the feasibility of a cMUT-based device. The operating principle consists in transmitting information thanks to a bulk acoustic wave between two cMUT arrays located on both sides of a substrate. We first focus on cMUT surface micromachining fabrication process and techniques of double-side device manufacturing. Our study allows us to identify wafer bonding as a realistic industrial solution. After device fabrication, electro-mechanical of cMUT is an essential step to validate their functionality as ultrasonic emitters. The study starts with the mechanical properties evaluation of the membrane material. These properties directly impact the global behavior of cMUT. Then, the characterization of cMUT static and dynamic behavior allows extracting parameters as resonance frequency, collapsing voltage and electro-mechanical efficiency which define the actuation mode of such a system. Finally, the validation of transmission and reception of ultrasonic waves is evaluated by vibrometer laser Doppler measurements. Results bring elements concerning the waves propagation modes and allow identifying the best acoustical efficiency in regard to the topology. In conclusion, the prototype integration in the application of power switch command demonstrates the feasibility of acoustic transformer concept based on cMUT technology

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Book chapters on the topic "Bulk micro-machining"

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Hasan, Md Nazibul, and Mohamed Sultan Mohamed Ali. "Electrical discharge machining for the formation of bulk-shape memory alloy actuators." In Micro Electro-Fabrication, 195–217. Elsevier, 2021. http://dx.doi.org/10.1016/b978-0-12-820049-0.00007-4.

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Conference papers on the topic "Bulk micro-machining"

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Hwang, Tao-Joo, Dan O. Popa, Jian-Qiang Lu, Byoung-Hun Kang, and Harry E. Stephanou. "BCB Wafer Bonding Compatible With Bulk Micro Machining." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35011.

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Adhesive wafer bonding is a good substitute in wafer-to-wafer bonding applications requiring low processing temperatures and electrical potentials, though at the expense of difficulty with chemical, mechanical, and thermal stability over time. In the case of wafer bonding for Micro-Electro-Mechanical System (MEMS) applications, the problem is compounded not just by consideration of bond strength, but also by limitations in the way adhesives are delivered to the interface, since traditional spin-coating methods cannot be directly employed. A typical approach is the formation of micro-fluidic channels via wafer bonding, where the adhesive layer should only be present on the mesa structures. The introduction of BCB (benzocyclobutene), dry-etchable polymers, makes it possible to pattern the adhesive layer in a similar fashion with the rest of the bulk material. In this paper we present a BCB-based wafer bonding process, which is compatible with bulk micro machining. Depending on applications, BCB can replace the silicon oxide or silicon nitride as a hard mask in bulk micro machining. A process using BCB as both bonding adhesive and bulk-etch mask is a good option for stacking microstructures such as building micro-fluidic circuitry.

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Xingchao, Zhang, Zhang Yong, Tong Hao, Li Yong, Chen Xiaohua, and Chen Guoliang. "Micro-electro-discharge Machining of Bulk Metallic Glasses." In High Density Design Packaging and Microsystem Integration, 2007 International Symposium on. IEEE, 2007. http://dx.doi.org/10.1109/hdp.2007.4283595.

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Huang, Chun-An, Jacky Chan, Ming-Hsuan Chen, Jen-Bin Hsu, and Steve Chiu. "The optimal DRIE parameter for bulk micro-machining process." In 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2009. http://dx.doi.org/10.1109/impact.2009.5382158.

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Takahata, Kenichi, and Yogesh B. Gianchandani. "Bulk-Metal-Based Mems Fabricated by Micro-Electro-Discharge Machining." In 2007 Canadian Conference on Electrical and Computer Engineering. IEEE, 2007. http://dx.doi.org/10.1109/ccece.2007.7.

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Mermillod-Blondin, A., B. Klessen, F. J. A. Furch, and M. J. J. Vrakking. "Few-cycle pulses for bulk micro-machining of fused silica." In SPIE LASE, edited by Alexander Heisterkamp, Peter R. Herman, Michel Meunier, and Stefan Nolte. SPIE, 2016. http://dx.doi.org/10.1117/12.2209032.

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Gao, Yanjun, Qingduo Duanmu, Guozheng Wang, Ye Li, and Jingquan Tian. "Formation of electron multiplier by utilizing the MEMS bulk-silicon-micro-machining technology." In International Symposium on Photoelectronic Detection and Imaging: Technology and Applications 2007, edited by Liwei Zhou. SPIE, 2008. http://dx.doi.org/10.1117/12.790590.

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Shukla, Vaibhav, Syed Nadeem Akhtar, S. Kanmani Subbu, and J. Ramkumar. "Fabrication of Complex Micro Channels by Micro Electric Discharge Milling (µ-ED Milling)." In ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-64031.

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Micro electric discharge milling (μ-ED milling) is an effective and economic process for the fabrication of micro channels. In the present work, the bulk approach of μ-ED milling is being attempted to make complex shaped micro channels. For a straight channel the bulk approach of μ-ED milling was found to be a successful approach. A tungsten tool of diameter 500 μm was used to fabricate semi-circular micro channels on EN-24 steel. Important machining parameters had earlier been optimized to make straight channels on EN-24 steel by the same method. The effect of geometrical parameters such as radius of curved channel and aspect ratio on MRR and TWR were studied by full factorial experimental design for single pass at optimized machining parameters. Finally complex shapes like T-type and serpentine channels were made by using optimized conditions of straight and curved channels by bulk approach with multiple passes of μ-ED milling.

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Chen, Xian, Lu Song, and Jing Chen. "Batch Mode Die-Sinking Micro-Electro-Discharge Machining of Stainless Steel using DRIE Bulk Tungsten Electrode." In Proceedings of the 4M/ICOMM2015 Conference. Singapore: Research Publishing Services, 2015. http://dx.doi.org/10.3850/978-981-09-4609-8_010.

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Liu, Chong, Asif Rashid, Muhammad P. Jahan, and Jianfeng Ma. "Investigating the Micro-EDM Machinability of Bulk Metallic Glass in Micro-EDM Drilling." In ASME 2019 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/imece2019-10940.

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Abstract Bulk Metallic Glass (BMG) is a solid metallic material with disordered atomic structure, that has the characteristics of high elasticity, hardness, fracture toughness, and superior corrosion resistance. High aspect ratio micro-through holes on BMG has prospective applications in space, nuclear reactor, thermodynamics engineering, biomedical, and electronics industries. In this study, the micro-EDM machinability of BMG (Vit 1b: Zr67Cu10.6Ni9.8Ti8.8Be3.8 (wt%)) is evaluated. The micro-EDM machinability of BMG has been assessed based on the volume of material removal rate (MRR), tool wear rate (TWR), micro-hole surface quality, and dimensional accuracy. The effect of various electrical and non-electrical parameters is studied. It is found that micro-EDM is capable producing high aspect ratio micro-holes on difficult-to-machine BMG. The deposition of resolidified debris around the edge of the micro-holes, both at the entrance and exit side, are found to be a common phenomenon in micro-EDM of BMG. The reduction of capacitance was found to be the effective way for reducing the resolidified debris around the edges. Capacitance was found to be have more pronounced effect, with gap voltage having little effect on the quality of micro-holes. The electrode rotational speed had insignificant effect on the quality of micro-holes. In terms of dimensional accuracy, which was measured by overcut and taper angle, both the gap voltage and electrode rotational speed had little effect. The lower electrode rpm was found to reduce the taperness of the micro-holes, although the material removal rate decreases and tool wear rate increases. Finally, analysis of the composition of tool electrode before and after machining indicates the migration of materials from the dielectric and workpiece to the tool electrode and vice versa.

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Udeshi, K., M. Richardson, J. J. Hung, L. Que, G. M. Rebeiz, and Y. B. Gianchandani. "A Dual-EDM Reverse Damascene Process for RF Switches and Other Bulk Metal Devices." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-80913.

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This paper reports a manufacturing process suitable for lithography-compatible fabrication of suspended micro-structures from any conductive material (including bulk metal) that is available in sheet form. It uses two aligned steps of batch mode micro-electro-discharge machining followed by a series of filling and lapping steps similar to a damascene process. The process is demonstrated by the fabrication of a bi-stable RF switch from #302 stainless steel foil. The fabricated devices have a footprint of 5 × 5 mm2, with 25 μm thickness, and a minimum feature size of 5 μm.

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