Journal articles: 'Capacitive accelerometer'

1

Tang, William C. "Digital capacitive accelerometer." Journal of the Acoustical Society of America 99, no. 6 (1996): 3280. http://dx.doi.org/10.1121/1.414897.

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2

Gerlach-Meyer, U. E. "Micromachined capacitive accelerometer." Sensors and Actuators A: Physical 27, no. 1-3 (May 1991): 555–58. http://dx.doi.org/10.1016/0924-4247(91)87050-d.

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3

Bontha, Anitha, Amit Kumar Sinha, Shailendra Kumar Mishra, and Gaddam Vinay. "Characterization of MEMS Three-Direction Capacitive Accelerometer." Indian Journal of Applied Research 3, no. 12 (October 1, 2011): 190–96. http://dx.doi.org/10.15373/2249555x/dec2013/57.

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4

Colton, Russell F. "Low cost capacitive accelerometer." Journal of the Acoustical Society of America 77, no. 3 (March 1985): 1284. http://dx.doi.org/10.1121/1.392174.

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5

F. Hraniak, Valerii, Vasyl Kukharchuk, Volodymyr Kucheruk, Samoil Katsyv, D. Zh Karabekova, and A. K. Khassenov. "Mathematical model of capacitance micromechanical accelerometer in static and dynamic operating modes." Bulletin of the Karaganda University. "Physics" Series 98, no. 2 (June 30, 2020): 60–67. http://dx.doi.org/10.31489/2020ph2/60-67.

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Monitoring and early diagnosis systems, on which the protection function of both hydroturbines and auxiliary power equipment rely, are becoming increasingly relevant. One of the most promising methods of technical control and diagnostics of hydo units is the analysis of their vibro-acoustic characteristics. But a significant technical problem that arises in the construction of such systems is the limited use of known sensors of vibration velocity and vibration displacement due to the fact that the rotary speed of hydro units is usually below the lower limit of operation of sensors of this type. One of the promising ways to solve this problem is using capacitive micromechanical accelerometers. However, the existing mathematical models describing this type of accelerometers have low accuracy, which limits their practical using. The mathematical models of the capacitive micromechanical accelerometer for static and dynamic modes of operation are developed in this article. It was established that this accelerometer has a constant sensitivity, therefore its static characteristic is linear. It is shown that in the dynamic mode of operation of a capacitive micromechanical accelerometer has a dynamic error component, the cause of which is its own displacement of the moving part of the sensor, which is due to the inertial properties of the moving part and elastic properties of stretch marks. The mathematical dependence of the absolute dynamic error of the capacitive micromechanical accelerometer is obtained, the removal of w

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Torayashiki, Osamu, Ayumu Takahashi, and Rinzo Tokue. "Capacitive Type 3-Axis Accelerometer." IEEJ Transactions on Sensors and Micromachines 116, no. 7 (1996): 272–75. http://dx.doi.org/10.1541/ieejsmas.116.272.

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7

Benmessaoud, Mourad, and Mekkakia Maaza Nasreddine. "Optimization of MEMS capacitive accelerometer." Microsystem Technologies 19, no. 5 (March 1, 2013): 713–20. http://dx.doi.org/10.1007/s00542-013-1741-z.

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8

van Paemel, Mark. "Interface circuit for capacitive accelerometer." Sensors and Actuators 17, no. 3-4 (May 1989): 629–37. http://dx.doi.org/10.1016/0250-6874(89)80055-1.

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9

Bullis, Robert H., and James L. Swindal. "Capacitive accelerometer with midplane proof mass." Journal of the Acoustical Society of America 91, no. 1 (January 1992): 543. http://dx.doi.org/10.1121/1.402695.

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10

Kraft, Michael, Christopher Lewis, Thomas Hesketh, and Stefan Szymkowiak. "A novel micromachined accelerometer capacitive interface." Sensors and Actuators A: Physical 68, no. 1-3 (June 1998): 466–73. http://dx.doi.org/10.1016/s0924-4247(98)00064-8.

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11

Shirai, Toshihito, Masayoshi Esashi, and Noritake Ura. "A Two-Wire Silicon Capacitive Accelerometer." Electronics and Communications in Japan (Part II: Electronics) 76, no. 4 (1993): 73–83. http://dx.doi.org/10.1002/ecjb.4420760408.

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12

Liu, Dandan, Huafeng Liu, Jinquan Liu, Fangjing Hu, Ji Fan, Wenjie Wu, and Liangcheng Tu. "Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer." Sensors 20, no. 4 (February 21, 2020): 1186. http://dx.doi.org/10.3390/s20041186.

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Capacitive MEMS accelerometers with area-variable periodic-electrode displacement transducers found wide applications in disaster monitoring, resource exploration and inertial navigation. The bonding-induced warpage, due to the difference in the coefficients of thermal expansion of the bonded slices, has a negative influence on the precise control of the interelectrode spacing that is essential to the sensitivity of accelerometers. In this work, we propose the theory, simulation and experiment of a method that can alleviate both the stress and the warpage by applying different bonding temperature on the bonded slices. A quasi-zero warpage is achieved experimentally, proving the feasibility of the method. As a benefit of the flat surface, the spacing of the capacitive displacement transducer can be precisely controlled, improving the self-noise of the accelerometer to 6 ng/√Hz @0.07 Hz, which is about two times lower than that of the accelerometer using a uniform-temperature bonding process.

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13

Dong, Xianshan, Yun Huang, Ping Lai, Qinwen Huang, Wei Su, Shiyuan Li, and Wei Xu. "Research on Decomposition of Offset in MEMS Capacitive Accelerometer." Micromachines 12, no. 8 (August 22, 2021): 1000. http://dx.doi.org/10.3390/mi12081000.

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In a MEMS capacitive accelerometer, there is an offset due to mechanical and electrical factors, and the offset would deteriorate the performance of the accelerometer. Reducing the offset from mechanism would benefit the improvement in performance. Yet, the compositions of the offset are complex and mix together, so it is difficult to decompose the offset to provide guidance for the reduction. In this work, a decomposition method of offset in a MEMS capacitive accelerometer was proposed. The compositions of the offset were first analyzed quantitatively, and methods of measuring key parameters were developed. Based on our proposed decomposition method, the experiment of offset decomposition with a closed-loop MEMS capacitive accelerometer was carried out. The results showed that the offset successfully decomposed, and the major source was from the fabricated gap mismatch in the MEMS sensor. This work provides a new way for analyzing the offset in a MEMS capacitive accelerometer, and it is helpful for purposefully taking steps to reduce the offset and improve accelerometer performance.

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Cabello-Ruiz, Ramon, Margarita Tecpoyotl-Torres, Alfonso Torres-Jacome, Gerardo Vera-Dimas, Svetlana Koshevaya, and Pedro Vargas-Chable. "Displacement mechanical amplifiers designed on poly-silicon." International Journal of Electrical and Computer Engineering (IJECE) 9, no. 2 (April 1, 2019): 894. http://dx.doi.org/10.11591/ijece.v9i2.pp894-901.

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Using Poly-Silicon, the implementation of novel Displacement-amplifying Compliant Mechanisms (DaCM), in two geometries of accelerometers, allows for remarkable improvements in their operation frequency and displacement sensitivity, with different proportions. Similar DaCM´s geometries were previously implemented by us with Silicon. In all mentioned cases, the geometries of DaCM´s are adjusted in order to use them with Conventional Capacitive Accelerometer (CCA) and Capacitive Accelerometer with Extended Beams (CAEB), which operate in-plane mode, (y-axis). It should be noted that CAEB shows improvements (95.33%) in displacement sensitivity compared to ACC. Simulations results, carried out using Ansys Workbench software, validate the system’s performance designed with Poly-Silicon. Finally, a comparison with the similar systems, previously designed with Silicon, is also carried out.

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15

Khan, M. S., A. Iqbal, S. A. Bazaz, and M. Abid. "Physical Level Simulation of PolyMUMPs Based Monolithic Tri-Axis MEMS Capacitive Accelerometer Using FEM Technique." Advanced Materials Research 403-408 (November 2011): 4625–32. http://dx.doi.org/10.4028/www.scientific.net/amr.403-408.4625.

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In this paper, we present the design verification of PolyMUMPs based monolithic tri-axis MEMS capacitive accelerometer. The physical level simulation has been done using the analyzer module of Coventorware to verify the performance of the three-axis accelerometer using Finite Element Method (FEM) and compared with the optimized results obtained in ANSYS and in MATLAB. The 2D model is created in the designer module of Coventorware. The 3D layout is generated in the preprocessor module and mesh is created on solid model. Proposed three axis accelerometer has three individual single axis accelerometers, integrated on a single substrate uniformly centered on single axis. Low mechanical noise, high sensitivity and sense capacitance have been measured for all axes individually and presented. The results obtained from both the analytical and finite element models are found to be in excellent agreement.

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Chen, Huan Yuan, Yong Jun Xie, Dong Song Yan, Hao Liu, and Jing Ming Li. "Thermo-Structural Coupled Topology Optimization of Micro-Capacitive Accelerometer." Advanced Materials Research 433-440 (January 2012): 3080–85. http://dx.doi.org/10.4028/www.scientific.net/amr.433-440.3080.

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In order to enhance the working performance of micro-capacitive accelerometer in high temperature environment, the structure topology optimization of a micro-capacitive accelerometer is proposed. After the study of thermo-structural coupled governing equations and sensitivity analysis, the mass-block and elastic-beam structure of comb micro-capacitive accelerometer topology optimization model is established. Then the optimal topology forms of mass-block and elastic-beam structure are obtained with the MMA (method of moving asymptotes) method. At last, the calculating results indicate that the maximum deformation at acceleration detection direction is only 22nm at the operating temperature range of 0~300°C, which less than the maximum deformation of the limit value (25nm), and provides a reliable way for innovative design of micro-capacitive accelerometer.

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Zhou, Wu, Hongfang Lan, Huijun Yu, Liushan Lai, Bei Peng, and Xiaoping He. "Consideration of the fringe effects of capacitors in micro accelerometer design." Transactions of the Institute of Measurement and Control 40, no. 9 (June 26, 2017): 2881–86. http://dx.doi.org/10.1177/0142331217711245.

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Capacitive micro accelerometer, as one of promising micro devices, utilizes the parallel-plate capacitor arrays to covert input acceleration into differential capacitance, so its characteristics highly depend on an accurate capacitance evaluation. The traditional capacitance formula used in macro-scale systems design could not meet the requirement of micro-scale field because the fringe effects of capacitors have great contribution to the total measured capacitance under a few millimeters of separation distance. In this paper, the theoretical equation of capacitance with fringe effects is utilized to design the sensitivity and nonlinearity of a capacitive micro accelerometer. The proposed analytical method provides a quantitative evaluation of sensing capacitance of micro accelerometers. Experimental results indicate that the theoretical design with fringe effects has a better agreement with experiments than ideal parallel-plate capacitor principle.

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Gomathi, Kumar, Arunachalam Balaji, and Thangaraj Mrunalini. "Design and optimization of differential capacitive micro accelerometer for vibration measurement." Journal of the Mechanical Behavior of Materials 30, no. 1 (January 1, 2021): 19–27. http://dx.doi.org/10.1515/jmbm-2021-0003.

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Abstract This paper deals with the design and optimization of a differential capacitive micro accelerometer for better displacement since other types of micro accelerometer lags in sensitivity and linearity. To overcome this problem, a capacitive area-changed technique is adopted to improve the sensitivity even in a wide acceleration range (0–100 g). The linearity is improved by designing a U-folded suspension. The movable mass of the accelerometer is designed with many fingers connected in parallel and suspended over the stationary electrodes. This arrangement gives the differential comb-type capacitive accelerometer. The area changed capacitive accelerometer is designed using Intellisuite 8.6 Software. Design parameters such as spring width and radius, length, and width of the proof mass are optimized using Minitab 17 software. Mechanical sensitivity of 0.3506 μm/g and Electrical sensitivity of 4.706 μF/g are achieved. The highest displacement of 7.899 μm is obtained with a cross-axis sensitivity of 0.47%.

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Xie, Jin, Rahul Agarwal, Kia Hian Lau, You He Liu, and Ming Lin Julius Tsai. "Three-Axis Capacitive SOI Accelerometer Using Combination of In-Plane and Vertical Comb Electrodes." Advanced Materials Research 254 (May 2011): 203–6. http://dx.doi.org/10.4028/www.scientific.net/amr.254.203.

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A three-axis capacitive accelerometer based on SOI is presented. Acceleration is detected by both in-plane and vertical comb electrodes. Separating the three-axis sensing with different groups of comb electrodes enables direct detection for each axis with full differential capacitive sensing scheme. The capacitance sensitivities of X and Y accelerometer are 160.7 fF/g and Z accelerometer 21.6 fF/g.

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20

Wiegand, Walter J. "Capacitive accelerometer with separable damping and sensitivity." Journal of the Acoustical Society of America 90, no. 1 (July 1991): 623. http://dx.doi.org/10.1121/1.401225.

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21

Weigand, Walter J. "Closed‐loop capacitive accelerometer with spring constraint." Journal of the Acoustical Society of America 90, no. 1 (July 1991): 623. http://dx.doi.org/10.1121/1.401226.

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22

Young, Darrin J., Mark A. Zurcher, Maroun Semaan, Cliff A. Megerian, and Wen H. Ko. "MEMS Capacitive Accelerometer-Based Middle Ear Microphone." IEEE Transactions on Biomedical Engineering 59, no. 12 (December 2012): 3283–92. http://dx.doi.org/10.1109/tbme.2012.2195782.

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23

Matsumoto, Yoshinori, Moritaka Iwakiri, Hidekazu Tanaka, Makoto Ishida, and Tetsuro Nakamura. "A capacitive accelerometer using SDB-SOI structure." Sensors and Actuators A: Physical 53, no. 1-3 (May 1996): 267–72. http://dx.doi.org/10.1016/0924-4247(96)01154-5.

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24

Seidel, H., H. Riedel, R. Kolbeck, G. Mück, W. Kupke, and M. Königer. "Capacitive silicon accelerometer with highly symmetrical design." Sensors and Actuators A: Physical 21, no. 1-3 (February 1990): 312–15. http://dx.doi.org/10.1016/0924-4247(90)85062-9.

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25

Chen, Wei Ping, Zhen Gang Zhao, Xiao Wei Liu, and Yu Min Lin. "Damping Analysis of Asymmetrical Comb Accelerometer." Key Engineering Materials 353-358 (September 2007): 2597–600. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2597.

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The resonance phenomenon is suppressed by adjusting the damping of the comb accelerometer structure to widen the frequency bandwidth of the capacitive accelerometer. The capacitive accelerometer with asymmetrical combs, fabricated with DRIE and anodic bonding, is presented. The damping category of the accelerometer is introduced, in which the squeeze-film damping coefficient and the damping ratio factor are detailed. The damping ratio factor of the accelerometer, measured by a vibration method, is 0.17. The damping ratio factor of the optimized structure is calculated of 0.15 to 0.18 with the change of experiential modulus C from 25 to 30, theoretically.

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26

Cabello-Ruiz, Ramon, Margarita Tecpoyotl-Torres, Alfonso Torres-Jacome, Volodymyr Grimalsky, Jose Gerardo Vera-Dimas, and Pedro Vargas-Chable. "A Novel Displacement-amplifying Compliant Mechanism Implemented on a Modified Capacitive Accelerometer." International Journal of Electrical and Computer Engineering (IJECE) 7, no. 4 (August 1, 2017): 1858. http://dx.doi.org/10.11591/ijece.v7i4.pp1858-1866.

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The micro-accelerometers are devices used to measure acceleration. They are implemented in applications such as tilt-control in spacecraft, inertial navigation, oil exploration, etc. These applications require high operating frequency and displacement sensitivity. But getting both high parameter values at the same time is difficult, because there are physical relationships, for each one, where the mass is involved. When the mass is reduced, the operating frequency is high, but the displacement sensitivity decreases and vice versa. The implementation of Displacement-amplifying Compliant Mechanism (DaCM) supports to this dependence decreases. In this paper the displacement sensitivity and operation frequency of a Conventional Capacitive Accelerometer are shown (CCA). A Capacitive Accelerometer with Extended Beams (CAEB) is also presented, which improves displacement sensitivity compared with CCA, and finally the implementation of DACM´s in the aforementioned devices was also carried out. All analyzed cases were developed considering the in-plane mode. The Matlab code used to calculate displacement sensitivity and operating frequency relationship is given in Appendix A.

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Sanyal, Keya, and Kalyan Biswas. "Design Issues in Beam Structures for Performance Enhancement of MEMS Based Capacitive Accelerometer." International Journal of High Speed Electronics and Systems 26, no. 04 (December 2017): 1740023. http://dx.doi.org/10.1142/s0129156417400237.

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Structure of a MEMS based Capacitive Accelerometer has been analyzed in this paper. The symmetrical beam-mass structure with different interconnection has been investigated using Finite Element methodology. The simulation model is calibrated with the existing structure of H-shaped beam capacitive accelerometer. Then a rigorous simulation and analysis is carried out to propose new beam structure with improved sensitivity. Analytical model has been evaluated using MATLAB software. Output voltage of the device for a given acceleration is calculated and sensitivity of the device is also analyzed. To improve sensitivity of the device, two new connector structures such as Z-shaped beam and Ω-shaped beam capacitive accelerometer has been proposed. For a particular acceleration, displacement of the proof mass with new structures is increased almost 57% and 66% and the sensitivity has been improved from 7.71pF/g to 13.0pF/g and 13.8pF/g respectively. Parametric optimization of the Ω-shaped beam capacitive accelerometer has also been described for further improvement of device performance.

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Cabello, Ramon, Margarita Tecpoyotl, Jose Gerardo Vera, Alfonso Torres, Pedro Vargas, and Svetlana Koshevaya. "Analysis of the range of acceleration for an accelerometer with extended beams." International Journal of Electrical and Computer Engineering (IJECE) 6, no. 4 (August 1, 2016): 1541. http://dx.doi.org/10.11591/ijece.v6i4.9955.

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<span lang="EN-US">The elastic behaviour of a system can be determined by an analysis of stresses. The stress generated in the element loaded of an accelerometer is of interest here. In these devices, the suspension beams are the elements subjected to greater stresses, as they support the mass. The stress that they can support is limited by the elastic limit of the material. Based on this analysis, the operating conditions to prevent permanent deformations are determined. The analysis is focused on the acceleration applied to the accelerometer because this parameter increases considerably the stresses in the device. A relationship between normal stress and gravity applied is obtained. This equation is used in order to avoid exceeding the elastic limit, during the accelerometer operation. This fact determines the acceleration range supported by the device. In the literature, studies about the physics and modelling of accelerometers are performed. However, about the specific acceleration of operation which they are subjected, information about its determination is not provided. In this paper, the analysis is realized considering a Conventional Capacitive Accelerometer (CCA) and a Capacitive Accelerometer with Extended Beams (CAEB), particularly, on the normal stress. When a range of acceleration values are applied, normal stress occur which must not exceed the elastic limit of the material, as it was mentioned before. The Matlab code used to calculate this relationship is given in Appendix A.</span>

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Cabello, Ramon, Margarita Tecpoyotl, Jose Gerardo Vera, Alfonso Torres, Pedro Vargas, and Svetlana Koshevaya. "Analysis of the range of acceleration for an accelerometer with extended beams." International Journal of Electrical and Computer Engineering (IJECE) 6, no. 4 (August 1, 2016): 1541. http://dx.doi.org/10.11591/ijece.v6i4.pp1541-1550.

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<span lang="EN-US">The elastic behaviour of a system can be determined by an analysis of stresses. The stress generated in the element loaded of an accelerometer is of interest here. In these devices, the suspension beams are the elements subjected to greater stresses, as they support the mass. The stress that they can support is limited by the elastic limit of the material. Based on this analysis, the operating conditions to prevent permanent deformations are determined. The analysis is focused on the acceleration applied to the accelerometer because this parameter increases considerably the stresses in the device. A relationship between normal stress and gravity applied is obtained. This equation is used in order to avoid exceeding the elastic limit, during the accelerometer operation. This fact determines the acceleration range supported by the device. In the literature, studies about the physics and modelling of accelerometers are performed. However, about the specific acceleration of operation which they are subjected, information about its determination is not provided. In this paper, the analysis is realized considering a Conventional Capacitive Accelerometer (CCA) and a Capacitive Accelerometer with Extended Beams (CAEB), particularly, on the normal stress. When a range of acceleration values are applied, normal stress occur which must not exceed the elastic limit of the material, as it was mentioned before. The Matlab code used to calculate this relationship is given in Appendix A.</span>

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Ma, Shu Min, Chao Chen, Tao Wang, Huan Zhang, and Hong Xi Zhou. "Study on Parameters of MEMS Accelerometer." Key Engineering Materials 531-532 (December 2012): 496–99. http://dx.doi.org/10.4028/www.scientific.net/kem.531-532.496.

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An accelerometer is a micro- electromechanical device which can sensitive to acceleration . The sensing mechanism of accelerometer is that when accelerated , the mass moves in Z-axis, and the gap between parallel plates changed with the loads, which causes vary of the capacitance of the estimation. This paper presents a newly devel oped sensor for the conventional capacitive MEMS accelerometer in Z-axis . The principle of capacitive acceleration is based on the detection the change of capacitance which results from acceleration changes. The sensor is used for estimation of the size a nd loads variations for accelerometer. This paper has been focused on the design of the MEMS accelerometer and calculation of the major parameters of the sensor.

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Rao, Kang, Xiaoli Wei, Shaolin Zhang, Mengqi Zhang, Chenyuan Hu, Huafeng Liu, and Liang-Cheng Tu. "A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process." Micromachines 10, no. 6 (June 7, 2019): 380. http://dx.doi.org/10.3390/mi10060380.

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This paper presents a micromachined micro-g capacitive accelerometer with a silicon-based spring-mass sensing element. The displacement changes of the proof mass are sensed by an area-variation-based capacitive displacement transducer that is formed by the matching electrodes on both the movable proof mass die and the glass cover plate through the flip-chip packaging. In order to implement a high-performance accelerometer, several technologies are applied: the through-silicon-wafer-etching process is used to increase the weight of proof mass for lower thermal noise, connection beams are used to reduce the cross-sensitivity, and the periodic array area-variation capacitive displacement transducer is applied to increase the displacement-to-capacitance gain. The accelerometer prototype is fabricated and characterized, demonstrating a scale factor of 510 mV/g, a noise floor of 2 µg/Hz1/2 at 100 Hz, and a bias instability of 4 µg at an averaging time of 1 s. Experimental results suggest that the proposed MEMS capacitive accelerometer is promising to be used for inertial navigation, structural health monitoring, and tilt measurement applications.

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He, Qing, and Dong Hai Qiao. "A Silicon Capacitive Seismic Accelerometer with a Simple Fabrication Process." Applied Mechanics and Materials 130-134 (October 2011): 4088–91. http://dx.doi.org/10.4028/www.scientific.net/amm.130-134.4088.

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In this paper, a single-crystal silicon capacitive accelerometer is put forward. The accelerometer is composed of a single-crystal silicon vibration head and two backplates, forming a sandwich structure. With damping holes fabricated on backplates, the squeeze-film damping effect is reduced and a Q factor around 0.7 is obtained. This accelerometer has a simple fabricating process including wet and dry etching and ambient pressure packaging. Its tested sensitivity is 22.6pF/g and calculated noise level is lower than 100ng/√Hz, thus meets the demand of seismic applications.

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He, Yurong, Chaowei Si, Guowei Han, Yongmei Zhao, Jin Ning, and Fuhua Yang. "A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers." Micromachines 12, no. 2 (January 21, 2021): 102. http://dx.doi.org/10.3390/mi12020102.

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In this paper, we report a novel teeter-totter type accelerometer based on glass-silicon composite wafers. Unlike the ordinary micro-electro-mechanical systems (MEMS) accelerometers, the entire structure of the accelerometer, includes the mass, the springs, and the composite wafer. The composite wafer is expected to serve as the electrical feedthrough and the fixed capacitance plate at the same time, to simplify the fabrication process, and to save on chip area. It is manufactured by filling melted borosilicate glass into an etched silicon wafer and polishing the wafer flat. A sensitivity of 51.622 mV/g in the range of ±5 g (g = 9.8 m/s2), a zero-bias stability under 0.2 mg, and the noise floor with 11.28 µg/√Hz were obtained, which meet the needs of most acceleration detecting applications. The micromachining solution is beneficial for vertical interconnection and miniaturization of MEMS devices.

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Jiang, Zhi Hua, Zong Yi Ma, and Ye Yuan. "Signal Detecting and Characteristic Measurement of a Capacitive Triaxial Micro-Accelerometer." Advanced Materials Research 765-767 (September 2013): 2164–67. http://dx.doi.org/10.4028/www.scientific.net/amr.765-767.2164.

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This paper introduces the principle of capacitive detection and specific method of signal detecting based on a triaxial micro-accelerometer. The corresponding detecting circuit is designed, and a suitable test system is set up. The sensitivity and accuracy test results of the triaxial micro-accelerometer show that all the masses sensitivity has nice consistency, the micro-accelerometer is feasible in theory and practice, and with the capability of precisely measuring the input acceleration in three directions.

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Ma, Hong Bo, Bo Li, and Yong Rui Zhao. "Electromechanical Coupled Analysis for a Single-Axis Comb Capacitive Accelerometer." Applied Mechanics and Materials 303-306 (February 2013): 149–54. http://dx.doi.org/10.4028/www.scientific.net/amm.303-306.149.

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This paper presents an electromechanical coupled analysis for a single proof-mass one-axis capacitive accelerometer to supply a reference of design specification for subsequent readout circuit. Considering electrostatic force effect, the displacement of proof mass based on dynamic principle is calculated. Then the output of differential capacitive interface is simulated. It indicates that this accelerometer has a sensitivity of 2.09mV/G and capacitance change of 0.31fF.

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Ma, Shu Min, Chao Chen, Tao Wang, Huan Zhang, and Hong Xi Zhou. "Finite Element Analysis of Four-Leg Capacitive Accelerometer." Applied Mechanics and Materials 184-185 (June 2012): 1562–65. http://dx.doi.org/10.4028/www.scientific.net/amm.184-185.1562.

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MEMS are the manufacturing of a wide variety of items that are mechanical and electronic in nature. This paper describes a capacitive accelerometer technology using sense element structures. The sense element consists of a symmetrically flat plate of mass supported by four L shaped cantilevers, beams and frameworks. Capacitor plates located on the surface are used to detect the displacement. By using the finite element analysis method to build a model, analyzing the maximal displacement of mass, resonant frequency and stress of cantilever beam with different length, width and thickness.

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Lee, Innam, Gil Ho Yoon, Jungyul Park, Seonho Seok, Kukjin Chun, and Kyo-Il Lee. "Development and analysis of the vertical capacitive accelerometer." Sensors and Actuators A: Physical 119, no. 1 (March 2005): 8–18. http://dx.doi.org/10.1016/j.sna.2004.06.033.

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Sun, Chih-ming, ChuanWei Wang, and Weileun Fang. "On the sensitivity improvement of CMOS capacitive accelerometer." Sensors and Actuators A: Physical 141, no. 2 (February 2008): 347–52. http://dx.doi.org/10.1016/j.sna.2007.10.026.

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Li, Baoqing, Deren Lu, and Weiyuan Wang. "Open–loop operating mode of micromachined capacitive accelerometer." Sensors and Actuators A: Physical 79, no. 3 (February 2000): 219–23. http://dx.doi.org/10.1016/s0924-4247(99)00286-1.

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Mukhiya, R., M. Garg, P. Gaikwad, S. Sinha, A. K. Singh, and R. Gopal. "Electrical equivalent modeling of MEMS differential capacitive accelerometer." Microelectronics Journal 99 (May 2020): 104770. http://dx.doi.org/10.1016/j.mejo.2020.104770.

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Mineta, T., S. Kobayashi, Y. Watanabe, S. Kanauchi, I. Nakagawa, E. Suganuma, and M. Esashi. "Three-axis capacitive accelerometer with uniform axial sensitivities." Journal of Micromechanics and Microengineering 6, no. 4 (December 1, 1996): 431–35. http://dx.doi.org/10.1088/0960-1317/6/4/010.

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Ghemari, Zine, and Salah Saad. "Enhancement of capacitive accelerometer operation by parameters improvement." International Journal of Numerical Modelling: Electronic Networks, Devices and Fields 32, no. 3 (February 6, 2019): e2568. http://dx.doi.org/10.1002/jnm.2568.

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Rödjegård, Henrik, Gert I. Andersson, Cristina Rusu, Mikael Löfgren, and Dag Billger. "Capacitive slanted-beam three-axis accelerometer: II. Characterization." Journal of Micromechanics and Microengineering 15, no. 11 (September 20, 2005): 1997–2002. http://dx.doi.org/10.1088/0960-1317/15/11/002.

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Linxi, Dong, Li Yongjie, Yan Haixia, and Sun Lingling. "Characteristics of a novel biaxial capacitive MEMS accelerometer." Journal of Semiconductors 31, no. 5 (May 2010): 054006. http://dx.doi.org/10.1088/1674-4926/31/5/054006.

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Matsumoto, Y., and M. Esashi. "Integrated silicon capacitive accelerometer with PLL servo technique." Sensors and Actuators A: Physical 39, no. 3 (December 1993): 209–17. http://dx.doi.org/10.1016/0924-4247(93)80221-2.

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Zega, Valentina, Luca Martinelli, Riccardo Casati, Emanuele Zappa, Giacomo Langfelder, Alfredo Cigada, and Alberto Corigliano. "A 3D Printed Ti6Al4V Alloy Uniaxial Capacitive Accelerometer." IEEE Sensors Journal 21, no. 18 (September 15, 2021): 19640–46. http://dx.doi.org/10.1109/jsen.2021.3095760.

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Jindal, Sumit Kumar, Srishti Priya, and S. Kshipra Prasadh. "Design Guidelines for MEMS Optical Accelerometer based on Dependence of Sensitivities on Diaphragm Dimensions." Journal of Circuits, Systems and Computers 29, no. 07 (September 12, 2019): 2050107. http://dx.doi.org/10.1142/s0218126620501078.

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This work deals in specifying the design considerations while constructing a Micro Electro Mechanical Systems (MEMS) optical accelerometer working on capacitive sensing technique. Sensitivity is one of the most demanded characteristics of any sensor. The sensor considered is a MEMS capacitive accelerometer in which both displacement and capacitance are the primary sensing characteristics. This differential capacitive accelerometer causes change in displacement due to applied acceleration and further produces change in capacitance. So, the main focus in this work is to improve or select the suitable diaphragm dimensions of the differential capacitor in order to get optimal capacitive and displacement sensitivity. This is done for an Optical MEMS (MOEMS) based sensor where slight change has a large-scale impact. The electrical signal is converted to optical by adding an Optical Interferometer. Mach–Zehnder Interferometer (MZI) is used to carry out the intensity modulation which also gives protection in inflammable surroundings. This makes the system suitable for working in high temperature regions.

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Nguyen, M. N., L. Q. Nguyen, H. M. Chu, and H. N. Vu. "A two degrees of freedom comb capacitive-type accelerometer with low cross-axis sensitivity." Journal of Mechanical Engineering and Sciences 13, no. 3 (September 27, 2019): 5334–46. http://dx.doi.org/10.15282/jmes.13.3.2019.09.0435.

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In this paper, we report on a SOI-based comb capacitive-type accelerometer that senses acceleration in two lateral directions. The structure of the accelerometer was designed using a proof mass connected by four folded-beam springs, which are compliant to inertial displacement causing by attached acceleration in the two lateral directions. At the same time, the folded-beam springs enabled to suppress cross-talk causing by mechanical coupling from parasitic vibration modes. The differential capacitor sense structure was employed to eliminate common mode effects. The design of gap between comb fingers was also analyzed to find an optimally sensing comb electrode structure. The design of the accelerometer was carried out using the finite element analysis. The fabrication of the device was based on SOI-micromachining. The characteristics of the accelerometer have been investigated by a fully differential capacitive bridge interface using a sub-fF switched-capacitor integrator circuit. The sensitivities of the accelerometer in the two lateral directions were determined to be 6 and 5.5 fF/g, respectively. The cross-axis sensitivities of the accelerometer were less than 5%, which shows that the accelerometer can be used for measuring precisely acceleration in the two lateral directions. The accelerometer operates linearly in the range of investigated acceleration from 0 to 4g. The proposed accelerometer is expected for low-g applications.

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Rajgopal, Srihari, Daniel Zula, Steven Garverick, and Mehran Mehregany. "A Silicon Carbide Accelerometer for Extreme Environment Applications." Materials Science Forum 600-603 (September 2008): 859–62. http://dx.doi.org/10.4028/www.scientific.net/msf.600-603.859.

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A polycrystalline silicon carbide (poly-SiC) surface-micromachined capacitive accelerometer is designed, fabricated and tested. Leveraging the superior thermo-mechanical and chemical resistance properties of SiC, the device is a first step toward cost-effective implementation of a new class of extreme environment accelerometers, for example for high temperature vibration and shock measurements, even thought this initial work is at room temperature. The accelerometer described herein is designed for a range of 5000 g and a bandwidth of 18 kHz, specifications consistent with commercially available piezoelectric devices for high-level mechanical impact measurements. Test results demonstrate the sensor achieving a resolution of 350 mg/√Hz at 1kHz with a sensitivity of 12 μV/g and a bandwidth of 10 kHz at room temperature.

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Gomathi, K., A. Senthil Kumar, and M. Raghunath. "Design and Analysis of Micro Accelerometer for Tool Condition Monitoring." Applied Mechanics and Materials 787 (August 2015): 932–36. http://dx.doi.org/10.4028/www.scientific.net/amm.787.932.

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Tool condition monitoring plays a huge role in the CNC machines in which it is used to avoid the breakage of the tools.In this paper area changed capacitive micro accelerometer is designed to measure the vibration exposure of the tool on various applications in the CNC machines. The design process and simulation of the Micro accelerometer are done using INTELLISUITE 8.6. The rectangular folded beamis designed to reduce the residual stress and to obtain a better sensitivity. Static and dynamic analysis shows that sensitivity of the designed capacitive accelerometer is good enough to detect the vibration of the tool.

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Journal articles on the topic 'Capacitive accelerometer'

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