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1

Estruch, Thomas. "Comment fonctionnent les capteurs CCD et CMOS ?" Photoniques, no. 79 (November 2015): 39–42. http://dx.doi.org/10.1051/photon/20157939.

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2

-Jaffard, J. L. "Applications des capteurs d'images en technologie CMOS." Revue de l'Electricité et de l'Electronique -, no. 10 (2002): 106. http://dx.doi.org/10.3845/ree.2002.117.

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3

-Magnan, P. "Développement de capteurs d'images CMOS dédiés aux applications spatiales." Revue de l'Electricité et de l'Electronique -, no. 10 (2002): 99. http://dx.doi.org/10.3845/ree.2002.116.

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4

-Magnan, P. "Capteurs d'images CCD et CMOS: comparaison des technologies et perspectives." Revue de l'Electricité et de l'Electronique -, no. 10 (2002): 83. http://dx.doi.org/10.3845/ree.2002.114.

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5

Mazza, M., P. Renaud, D. C. Bertrand, and A. M. Ionescu. "CMOS pixels for subretinal implantable prothesis." IEEE Sensors Journal 5, no. 1 (2005): 32–37. http://dx.doi.org/10.1109/jsen.2004.839895.

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6

Wermes, N. "Depleted CMOS pixels for LHC proton–proton experiments." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 824 (July 2016): 483–86. http://dx.doi.org/10.1016/j.nima.2015.09.038.

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7

Choubey, B., S. Aoyoma, S. Otim, D. Joseph, and S. Collins. "An Electronic-Calibration Scheme for Logarithmic CMOS Pixels." IEEE Sensors Journal 6, no. 4 (2006): 950–56. http://dx.doi.org/10.1109/jsen.2006.877983.

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8

Choubey, Bhaskar, and Steve Collins. "Wide dynamic range CMOS pixels with reduced dark current." Analog Integrated Circuits and Signal Processing 56, no. 1-2 (2007): 53–60. http://dx.doi.org/10.1007/s10470-007-9079-z.

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9

Sugie, K., K. Sasagawa, M. C. Guinto, M. Haruta, T. Tokuda, and J. Ohta. "Implantable CMOS image sensor with incident‐angle‐selective pixels." Electronics Letters 55, no. 13 (2019): 729–31. http://dx.doi.org/10.1049/el.2019.1031.

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10

Velichko, Sergey, Jaroslav Jerry Hynecek, Richard Scott Johnson, et al. "CMOS Global Shutter Charge Storage Pixels With Improved Performance." IEEE Transactions on Electron Devices 63, no. 1 (2016): 106–12. http://dx.doi.org/10.1109/ted.2015.2443495.

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11

Chen, H. D., Y. Du, Q. M. Zeng, et al. "Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels." IEE Proceedings - Optoelectronics 147, no. 1 (2000): 2–6. http://dx.doi.org/10.1049/ip-opt:20000380.

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12

Kagawa, Keiichiro. "[Invite Paper] Functional Imaging with Multi-tap CMOS Pixels." ITE Transactions on Media Technology and Applications 9, no. 2 (2021): 114–21. http://dx.doi.org/10.3169/mta.9.114.

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13

Carvalho, Francelino Freitas, Carlos Augusto de Moraes Cruz, Greicy C. Marques, and Thiago Brito Bezerra. "A Novel Hybrid CMOS Pixel-Cluster for Local Light Angle, Polarization and Intensity Detection with Determination of Stokes Parameters." Journal of Integrated Circuits and Systems 13, no. 2 (2018): 1–10. http://dx.doi.org/10.29292/jics.v13i2.7.

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Detecting local light incident angle is a desirable feature for CMOS image sensors for 3D image reconstruction purposes and depth sensing. Advances in the CMOS technologies in the last years have enabled integrated solutions to perform such a job. However, it is still not viable to implement such a feature in regular CMOS image sensors due to the great number of pixels in a cluster to perform incident angle detection. In this paper, a hybrid cluster with only four pixels, instead of eight pixels of previous solutions, that is able to detect both local light intensity, incident angle and Stokes
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14

Chang, Yu-Chi, Cheng-Hsuan Lin, Zong-Ru Tu, et al. "0.8 um Color Pixels with Wave-Guiding Structures for Low Optical Crosstalk Image Sensors." Electronic Imaging 2021, no. 7 (2021): 93–1. http://dx.doi.org/10.2352/issn.2470-1173.2021.7.iss-093.

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Low optical-crosstalk color pixel scheme with wave-guiding structures is demonstrated in a high resolution CMOS image sensor with a 0.8um pixel pitch. The high and low refractive index configuration provides a good confinement of light waves in different color channels in a quad Bayer color filter array. The measurement result of this back-side illuminated (BSI) device exhibits a significant lower color crosstalk with enhanced SNR performance, while the better angular response and higher angular selectivity of phase detection pixels also show the suitability to a new generation of small pixels
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15

Sandeau, Laure, Cassandre Vuillaume, Sylvain Contié, et al. "Large area CMOS bio-pixel array for compact high sensitive multiplex biosensing." Lab on a Chip 15, no. 3 (2015): 877–81. http://dx.doi.org/10.1039/c4lc01025f.

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16

Kim, Dongsoo, Seunghyun Lim, and Gunhee Han. "Single-Chip Eye Tracker Using Smart CMOS Image Sensor Pixels." Analog Integrated Circuits and Signal Processing 45, no. 2 (2005): 131–41. http://dx.doi.org/10.1007/s10470-005-4006-7.

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17

Li, Feng, Ruishuo Wang, Liqiang Han, and Jiangtao Xu. "Design of CMOS active pixels based on finger-shaped PPD." Journal of Semiconductors 41, no. 10 (2020): 102301. http://dx.doi.org/10.1088/1674-4926/41/10/102301.

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18

Clarke, A., K. Stefanov, N. Johnston, and A. Holland. "Fully depleted, thick, monolithic CMOS pixels with high quantum efficiency." Journal of Instrumentation 10, no. 04 (2015): T04005. http://dx.doi.org/10.1088/1748-0221/10/04/t04005.

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19

Park, Sung-Yun, Kyuseok Lee, Hyunsoo Song, and Euisik Yoon. "Simultaneous Imaging and Energy Harvesting in CMOS Image Sensor Pixels." IEEE Electron Device Letters 39, no. 4 (2018): 532–35. http://dx.doi.org/10.1109/led.2018.2811342.

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20

Nakamura, J., S. E. Kemeny, and E. R. Fossum. "CMOS active pixel image sensor with simple floating gate pixels." IEEE Transactions on Electron Devices 42, no. 9 (1995): 1693–94. http://dx.doi.org/10.1109/16.405286.

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21

Wan, Gordon, Xiangli Li, Gennadiy Agranov, Marc Levoy, and Mark Horowitz. "CMOS Image Sensors With Multi-Bucket Pixels for Computational Photography." IEEE Journal of Solid-State Circuits 47, no. 4 (2012): 1031–42. http://dx.doi.org/10.1109/jssc.2012.2185189.

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22

Gao, Tie-Cheng, Su-Ying Yao, and Xiao-Lei Huo. "Optical performance simulation and optimization for CMOS image sensor pixels." Optik 124, no. 23 (2013): 6330–32. http://dx.doi.org/10.1016/j.ijleo.2013.05.058.

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23

Dilhan, L., J. Vaillant, A. Ostrovsky, L. Masarotto, C. Pichard, and R. Paquet. "Planar microlenses for near infrared CMOS image sensors." Electronic Imaging 2020, no. 7 (2020): 144–1. http://dx.doi.org/10.2352/issn.2470-1173.2020.7.iss-144.

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In this paper we present planar microlenses designed to improve the sensitivity of SPAD pixels. We designed diffractive and metasurface planar microlens structures based on rigorous optical simulations. The current melted microlens solution and designed diffractive microlens were implemented on STMicroelectronics 40nm CMOS testchips (32 × 32 SPAD array), and average gains of 1.9 and 1.4 in sensitivity respectively were measured, compared to a SPAD without microlens.
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24

Freitas Carvalho, Francelino, Carlos Augusto de Moraes Cruz, Greicy Costa Marques, and Kayque Martins Cruz Damasceno. "Angular Light, Polarization and Stokes Parameters Information in a Hybrid Image Sensor with Division of Focal Plane." Sensors 20, no. 12 (2020): 3391. http://dx.doi.org/10.3390/s20123391.

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Targeting 3D image reconstruction and depth sensing, a desirable feature for complementary metal oxide semiconductor (CMOS) image sensors is the ability to detect local light incident angle and the light polarization. In the last years, advances in the CMOS technologies have enabled dedicated circuits to determine these parameters in an image sensor. However, due to the great number of pixels required in a cluster to enable such functionality, implementing such features in regular CMOS imagers is still not viable. The current state-of-the-art solutions require eight pixels in a cluster to dete
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25

Onaka-Masada, Ayumi, Takeshi Kadono, Ryosuke Okuyama, et al. "Reduction of Dark Current in CMOS Image Sensor Pixels Using Hydrocarbon-Molecular-Ion-Implanted Double Epitaxial Si Wafers." Sensors 20, no. 22 (2020): 6620. http://dx.doi.org/10.3390/s20226620.

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The impact of hydrocarbon-molecular (C3H6)-ion implantation in an epitaxial layer, which has low oxygen concentration, on the dark characteristics of complementary metal-oxide-semiconductor (CMOS) image sensor pixels was investigated by dark current spectroscopy. It was demonstrated that white spot defects of CMOS image sensor pixels when using a double epitaxial silicon wafer with C3H6-ion implanted in the first epitaxial layer were 40% lower than that when using an epitaxial silicon wafer with C3H6-ion implanted in the Czochralski-grown silicon substrate. This considerable reduction in white
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26

Mustafa, Mohd Amrallah, Min-Woong Seo, Shoji Kawahito, Keita Yasutomi, and Kiichiro Kagawa. "RTS noise reduction of CMOS image sensors using amplifier-selection pixels." IEICE Electronics Express 10, no. 15 (2013): 20130299. http://dx.doi.org/10.1587/elex.10.20130299.

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27

Langfelder, Giacomo. "CMOS Pixels Directly Sensitive to Both Visible and Near-Infrared Radiation." IEEE Transactions on Electron Devices 60, no. 5 (2013): 1695–700. http://dx.doi.org/10.1109/ted.2013.2255056.

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28

Wermes, N. "From hybrid to CMOS pixels ... a possibility for LHC's pixel future?" Journal of Instrumentation 10, no. 12 (2015): C12023. http://dx.doi.org/10.1088/1748-0221/10/12/c12023.

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29

Guerrini, N., R. Turchetta, G. Van Hoften, R. Henderson, G. McMullan, and A. R. Faruqi. "A high frame rate, 16 million pixels, radiation hard CMOS sensor." Journal of Instrumentation 6, no. 03 (2011): C03003. http://dx.doi.org/10.1088/1748-0221/6/03/c03003.

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30

Fesenmaier, Christian C., Yijie Huo, and Peter B. Catrysse. "Optical confinement methods for continued scaling of CMOS image sensor pixels." Optics Express 16, no. 25 (2008): 20457. http://dx.doi.org/10.1364/oe.16.020457.

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31

Joubert, James, and Deepak Sharma. "Using CMOS Cameras for Light Microscopy." Microscopy Today 19, no. 4 (2011): 22–28. http://dx.doi.org/10.1017/s155192951100054x.

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The push in consumer electronics over past decades has been toward smaller, faster, and cheaper products but with same or improved capabilities. The consumer imaging world has been no exception with the integration, for example, of functional complementary metal-oxide-semiconductor (CMOS) cameras into ever smaller cellular phones. The CMOS sensors have continued to develop and improve with increasing numbers of smaller, more sensitive pixels with larger photo-response capacity providing higher dynamic range. This technological expansion has inevitably spilled over into even the scientific imag
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32

Wang, Wei Ling. "High-Definition Imaging and Processing System Based on CMOS Image Sensor." Advanced Materials Research 393-395 (November 2011): 131–34. http://dx.doi.org/10.4028/www.scientific.net/amr.393-395.131.

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A high-definition imaging and processing system is presented, which consists of a color CMOS image sensor, SRAM, CPLD and DSP. The CPLD implements the logic and timing control to the system. SRAM stores the image data, and DSP controls the image acquisition system through the SCCB. The timing sequence of the CMOS image sensor OV9620 is analyzed. The imaging part and the high speed image data memory unit are designed. The hardware design of the imaging system and processing algorithm are given. Because the CMOS digital cameras use color filter arrays to sample different spectral components, suc
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33

Costa, Lidiane Campos, Rubens A. Souza, Davies W. de Lima Monteiro, and Luciana P. Salles. "Design of Transfer-Gated CMOS Active Pixels Deploying Conventional PN-Junction Photodiodes." Journal of Integrated Circuits and Systems 15, no. 3 (2020): 1–7. http://dx.doi.org/10.29292/jics.v15i3.180.

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This paper presents a comparative study of six active pixel sensor (APS) schemes by means of simulations and experiments. The optical sensor used was a silicon photodiode with integrated electronics in a standard 0.35 µm CMOS technology. We analyzed how the transistor characteristics, such as channel resistance and leakage current, among others, can influence the APS response. Furthermore, we demonstrated how the choice of APS model affects sensor parameters such as output swing and fill factor, among others. The results presented and the understanding of the operational cycle of the CMOS tran
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34

Jayakumar, Ganesh, Per-Erik Hellström, and Mikael Östling. "Monolithic Wafer Scale Integration of Silicon Nanoribbon Sensors with CMOS for Lab-on-Chip Application." Micromachines 9, no. 11 (2018): 544. http://dx.doi.org/10.3390/mi9110544.

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Silicon ribbons (SiRi) have been well-established as highly sensitive transducers for biosensing applications thanks to their high surface to volume ratio. However, selective and multiplexed detection of biomarkers remains a challenge. Further, very few attempts have been made to integrate SiRi with complementary-metal-oxide-semiconductor (CMOS) circuits to form a complete lab-on-chip (LOC). Integration of SiRi with CMOS will facilitate real time detection of the output signal and provide a compact small sized LOC. Here, we propose a novel pixel based SiRi device monolithically integrated with
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35

Jang, Yeongheup, Hyungwook Kim, Kundong Kim, Sungsu Kim, Sungyong Lee, and Joonseo Yim. "A new PDAF correction method of CMOS image sensor with Nonacell and Super PD to improve image quality in binning mode." Electronic Imaging 2021, no. 9 (2021): 220–1. http://dx.doi.org/10.2352/issn.2470-1173.2021.9.iqsp-220.

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This paper presents a new PDAF correction method to improve the binning mode image quality in the world’s first 0.8um 108 mega pixel CMOS Image Sensor with Samsung Nonacell and Super PD technology. PDAF pixels had been fixed by bad-pixel-correction (BPC), referring to the adjacent non-PDAF pixels in the conventional correction method. We demonstrated a new method, named Dilution mode which output their own seed value within the 3x3 same color-channel pixels to video images and deliver AF information through the separate embedded data. As a result, the PDAF artifact, such as a false color, brok
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36

Erfanian, Alireza, Hamed Mehrara, Mahdi Khaje, and Ahmad Afifi. "A room temperature 2 × 128 PtSi/Si-nanostructure photodetector array compatible with CMOS process." Sensor Review 35, no. 3 (2015): 282–86. http://dx.doi.org/10.1108/sr-11-2014-0736.

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Purpose – The purpose of this paper is to demonstrate a successful fabrication of 2 × 128 linear array of typical infrared (IR) detectors made of p-type tSi/porous Si Schottky barrier. Design/methodology/approach – Using metal-assisted chemical etching (MaCE) as a unique approach, a sample definition of a porous Si nanostructure region for fabricating of any high-density photodetectors array has been formulated. Besides, the uniformity of pixels at different position along the array has been confirmed by optical images and measurements of photocurrent in IR regime at room temperature. Findings
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37

Cheriguene, Rabia Sarah, and Habib Mahi. "Comparaison entre les méthodes J-SEG et MEANSHIFT : application sur des données THRS." Revue Française de Photogrammétrie et de Télédétection, no. 203 (April 8, 2014): 27–32. http://dx.doi.org/10.52638/rfpt.2013.27.

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L'avènement des données à Très Haute Résolution Spatiale (THRS) rend les méthodes de classification basées pixels inadéquates. En effet, la résolution spatiale fine offerte par ces capteurs engendre une forte variabilité intra-classes. Afin de pallier cette carence, les méthodes de classification actuelles visent à traiter non pas le pixel individuellement mais à opérer sur les objets (ensemble de pixels) qui composent l'image, on parle alors de classification orientée objets. Généralement, elles sont composées de trois étapes : (1) Segmentation; (2) Caractérisation des objets; et enfin (3) La
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38

Cappello, Salvatore, Calogero Pace, Aldo Parlato, Salvatore Rizzo, and Elio Tomarchio. "Gamma-ray irradiation tests of CMOS sensors used in imaging techniques." Nuclear Technology and Radiation Protection 29, suppl. (2014): 14–19. http://dx.doi.org/10.2298/ntrp140ss14c.

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Technologically-enhanced electronic image sensors are used in various fields as diagnostic techniques in medicine or space applications. In the latter case the devices can be exposed to intense radiation fluxes over time which may impair the functioning of the same equipment. In this paper we report the results of gamma-ray irradiation tests on CMOS image sensors simulating the space radiation over a long time period. Gamma-ray irradiation tests were carried out by means of IGS-3 gamma irradiation facility of Palermo University, based on 60Co sources with different activities. To reduce the do
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39

Tie-cheng, Gao, Yao Su-ying, Xu Jiang-tao, and Zhao Shi-bin. "Rigorous Three-dimension Electromagnetic Simulations and Optimization for CMOS Image Sensor pixels." Journal of Physics: Conference Series 276 (February 1, 2011): 012124. http://dx.doi.org/10.1088/1742-6596/276/1/012124.

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40

Mabuchi, K., N. Nakamura, E. Funatsu, et al. "CMOS image sensors comprised of floating diffusion driving pixels with buried photodiode." IEEE Journal of Solid-State Circuits 39, no. 12 (2004): 2408–16. http://dx.doi.org/10.1109/jssc.2004.837085.

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41

Deveaux, M., S. Amar-Youcef, A. Besson, et al. "Radiation tolerance of CMOS monolithic active pixel sensors with self-biased pixels." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 624, no. 2 (2010): 428–31. http://dx.doi.org/10.1016/j.nima.2010.04.045.

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42

Manickam, Arun, Robert G. Kuimelis, Arjang Hassibi, et al. "A CMOS Electrochemical Biochip With 32$\times$ 32 Three-Electrode Voltammetry Pixels." IEEE Journal of Solid-State Circuits 54, no. 11 (2019): 2980–90. http://dx.doi.org/10.1109/jssc.2019.2941020.

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43

Sipauba Carvalho da Silva, Yhang Ricardo, Rihito Kuroda, and Shigetoshi Sugawa. "An Optical Filter-Less CMOS Image Sensor with Differential Spectral Response Pixels for Simultaneous UV-Selective and Visible Imaging." Sensors 20, no. 1 (2019): 13. http://dx.doi.org/10.3390/s20010013.

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This paper presents a complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) capable of capturing UV-selective and visible light images simultaneously by a single exposure and without employing optical filters, suitable for applications that require simultaneous UV and visible light imaging, or UV imaging in variable light environment. The developed CIS is composed by high and low UV sensitivity pixel types, arranged alternately in a checker pattern. Both pixel types were designed to have matching sensitivities for non-UV light. The UV-selective image is captured by extracting the d
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44

Sasagawa, Kiyotaka, Takahiro Yamaguchi, Makito Haruta, et al. "An Implantable CMOS Image Sensor With Self-Reset Pixels for Functional Brain Imaging." IEEE Transactions on Electron Devices 63, no. 1 (2016): 215–22. http://dx.doi.org/10.1109/ted.2015.2454435.

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45

Vigani, L., D. Bortoletto, L. Ambroz, et al. "Study of prototypes of LFoundry active CMOS pixels sensors for the ATLAS detector." Journal of Instrumentation 13, no. 02 (2018): C02021. http://dx.doi.org/10.1088/1748-0221/13/02/c02021.

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46

Johnson, Ben, Shane T. Peace, Albert Wang, Thomas A. Cleland, and Alyosha Molnar. "A 768-Channel CMOS Microelectrode Array With Angle Sensitive Pixels for Neuronal Recording." IEEE Sensors Journal 13, no. 9 (2013): 3211–18. http://dx.doi.org/10.1109/jsen.2013.2266894.

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47

WANG Tian-hui, 王田珲, 李豫东 LI Yu-dong, 文. 林. WEN Lin, et al. "Generation and Annealing of Hot Pixels of CMOS Image Sensor Induced by Proton." Chinese Journal of Luminescence 39, no. 12 (2018): 1697–704. http://dx.doi.org/10.3788/fgxb20183912.1697.

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48

Barjean, Kinia, Kevin Contreras, Jean-Baptiste Laudereau, et al. "Fourier transform acousto-optic imaging with a custom-designed CMOS smart-pixels array." Optics Letters 40, no. 5 (2015): 705. http://dx.doi.org/10.1364/ol.40.000705.

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49

Boussaid, F., A. Bermak, and A. Bouzerdoum. "An ultra-low power operating technique for mega-pixels current-mediated CMOS imagers." IEEE Transactions on Consumer Electronics 50, no. 1 (2004): 46–53. http://dx.doi.org/10.1109/tce.2004.1277840.

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50

Chen, Song, Jiaju Ma, Donald B. Hondongwa, and Eric R. Fossum. "High Conversion-Gain Pinned-Photodiode Pump-Gate Pixels in 180-nm CMOS Process." IEEE Journal of the Electron Devices Society 5, no. 6 (2017): 509–17. http://dx.doi.org/10.1109/jeds.2017.2748883.

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