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1

Han, Hwang-Jin. Physical processes in hollow cathode discharge sources. Naval Postgraduate School, 1989.

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2

United States. National Aeronautics and Space Administration., ed. Plasma assisted surface coating/modification processes: An emerging technology. National Aeronautics and Space Administration, 1987.

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3

Van Zee, John William, 1952-, Electrochemical Society. Industrial Electrolysis and Electrochemical Engineering Division., Electrochemical Society. Energy Technology Division., Electrochemical Society Meeting, Symposium on Advances in Mathematical Modeling and Simulation of Electrochemical Processes (1998 : San Diego, Calif.), and Symposium on Oxygen Depolarized Cathodes and Activated Cathodes for Chlor-Alkali and Chlorate Processes (1998 : San Diego, Calif.), eds. Proceedings of the Symposium on Advances in Mathematical Modeling and Simulation of Electrochemical Processes and [the Symposium on] Oxygen Depolarized Cathodes and Activated Cathodes for Chlor-Alkali and Chlorate Processes. Electrochemical Society, 1998.

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4

von, Baeckmann W., Schwenk W, Prinz W, and Baeckmann W. von, eds. Handbook of cathodic corrosion protection: Theory and practice of electrochemical protection processes. 3rd ed. Gulf Pub. Co., 1997.

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5

Weale, Christopher John. Cathodic protection of reinforced concrete: Anodic processes in cements and related electrolytes. Aston University. Department of Civil Engineering, 1992.

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6

International Colloquium on Plasmas and Sputtering (6th 1987 Antibes, France). Comptes rendus des travaux du CIP G87. Société française du vide, 1987.

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7

Rittner, Mindy N. Sputtered targets and sputtered films: Technology and markets. Business Communications Company, 1999.

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8

Rittner, Mindy N. Sputtering targets and sputtered films: Technology and markets. Business Communications Co., 2002.

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9

Wasa, Kiyotaka. Thin film materials technology: Sputtering of compound materials. William Andrew Pub., 2004.

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10

Wasa, Kiyotaka. Handbook of sputter deposition technology: Principles, technology, and applications. Noyes Publications, 1992.

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11

(Stijn), Mahieu S., and SpringerLink (Online service), eds. Reactive Sputter Deposition. Springer-Verlag Berlin Heidelberg, 2008.

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12

Kesaev, I. G. Cathode Processes in the Mercury Arc. Springer, 2012.

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13

Fuller, T. F., P. C. Foller, and F. Hine. Advances in Mathematical Modelling & Simulation of Electrochemical Processes & Oxygen Depolarized Cathodes & Activated Cathodes for Chlor-Alkali (Proceedings). Electrochemical Society, 1998.

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14

Kitabatake, Makoto, Hideaki Adachi, and Kiyotaka Wasa. Thin Film Materials Technology: Sputtering of Compound Materials. Noyes Publications, 2003.

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15

Stuart, R. V. Vacuum Technology, Thin Films, and Sputtering: An Introduction. Elsevier Science & Technology Books, 2012.

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16

A Mathematical model of cathodic delamination and blistering processes in paint films on steel. U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology, 1992.

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17

Wasa, Kiyotaka, and Shigeru Hayakawa. Handbook of Sputter Deposition Technology: Principles, Technology and Applications. Elsevier Science & Technology Books, 1992.

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18

Kitabatake, Makoto, Hideaki Adachi, and Kiyotaka Wasa. Thin Film Materials Technology: Sputtering of Compound Materials. Elsevier Science & Technology Books, 2004.

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19

Wasa, Kiyotaka. Handbook of Sputter Deposition Technology: Fundamentals and Applications for Functional Thin Films, Nano-Materials and MEMS. Elsevier Science & Technology Books, 2012.

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20

I Never Thought I'd GROW up to BE a Super Cool CATHODE RAY TUBE SALVAGE PROCESSOR: But HERE I AM Living the Dream ! Independently Published, 2021.

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21

Thin Films Material Technology: Sputtering of Compound Materials. Springer, 2004.

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22

Lu, Toh-Ming, and Edward V. Barnat. Pulsed and Pulsed Bias Sputtering: Principles and Applications. Springer, 2011.

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23

Lu, Toh-Ming, and Edward V. Barnat. Pulsed and Pulsed Bias Sputtering: Principles and Applications. Springer, 2014.

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24

Lu, Toh-Ming, and Edward V. Barnat. Pulsed and Pulsed Bias Sputtering: Principles and Applications. Springer London, Limited, 2013.

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25

Lu, Toh-Ming, and Edward V. Barnat. Pulsed and Pulsed Bias Sputtering: Principles and Applications. Springer, 2003.

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26

Sputtering Materials For Vlsi And Thin Film Devices. William Andrew Publishing, 2012.

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27

Functional Materials: Fundamental Research and Industrial Application. Trans Tech Publications, Limited, 2021.

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28

Pipeline External Corrosion Direct Assessment Methodology. AMPP, 2025. https://doi.org/10.5006/nace_sp0502-2025.

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Scope This standard covers the AMPP external corrosion direct assessment (ECDA) process for buried onshore ferrous pipeline systems. This standard is intended to serve as a guide for applying the AMPP ECDA process on typical pipeline systems. This standard was written to provide flexibility for an operator to tailor the process to specific pipeline situations. ECDA is a continuous improvement process. Through successive applications, ECDA should identify and address locations at which corrosion activity has occurred, is occurring, or may occur and reduce the external corrosion integrity risk o
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