Books on the topic 'Chemical mechanical planarization (CMP)'

Advances in CMP/polishing technologies for the manufacture of electronic devices. Oxford: Elsevier, 2012.

1962-, Kumar Ashok, ed. Science and technology of chemical mechanical planarization (CMP): Symposium held April 14-16, 2009, San Francisco, California, U.S.A. Warrendale, Penn: Materials Research Society, 2010.

Kulawski, Martin. Advanced CMP processes for special substrates and for device manufacturing in MEMS applications. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2006.

1945-, Craven David R., ed. Tribology in chemical-mechanical planarization. Boca Raton, Fla: Taylor & Francis, 2005.

Oliver, Michael R., ed. Chemical-Mechanical Planarization of Semiconductor Materials. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-06234-0.

Oliver, Michael R. Chemical-Mechanical Planarization of Semiconductor Materials. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.

Steigerwald, Joseph M. Chemical mechanical planarization of microelectronic materials. New York: J. Wiley, 1997.

International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (6th 2003 Orlando, Fla.). Chemical mechanical planarization VI: Proceedings of the international symposium. Edited by Seal S, Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2003.

International, Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia Pa ). Chemical mechanical planarization V: Proceedings of the International Symposium. Pennington, NJ: Electrochemical Society, Inc., 2002.

International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (4th 2000 Phoenix, Ariz.). Chemical mechanical planarization IV: Proceedings of the International Symposium. Edited by Opila R. L, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, Inc., 2001.

International Symposium on Chemical Mechanical Planarization (1st 1996 San Antonio, Tex.). Proceedings of the First International Symposium on Chemical Mechanical Planarization. Edited by Ali Iqbal, Raghavan S, Electrochemical Society Electronics Division, Electrochemical Society. Dielectric Science and Technology Division., and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 1997.

Paik, Ungyu. Nanoparticle engineering for chemical-mechanical planarization: Fabrication of next-generation nanodevices. Boca Raton: Taylor & Francis, 2009.

Luo, Jianfeng, and David A. Dornfeld. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-07928-7.

Bartha, Johann W. (Johann Wolfgang) and Materials Research Society Meeting, eds. Advanced interconnects and chemical mechanical planarization for micro- and nanoelectronics: Symposium held April 5-9, 2010, San Francisco, California. Warrendale, Pa: Materials Research Society, 2010.

Gerfried, Zwicker, ed. Advances and challenges in chemical mechanical planarization: Symposium held April 10-12, 2007, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, c2007., 2007.

Luo, Jianfeng. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.

Luo, Jianfeng. Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication: From particle scale to feature, die and wafer scales. Berlin: Springer, 2004.

Luo, Jianfeng. Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication: From particle scale to feature, die and wafer scales. Berlin: Springer, 2005.

Borst, Christopher L. Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: Fundamental mechanisms and application to IC interconnect technology. Boston: Kluwer Academic Publishers, 2002.

Lita, Shon-Roy, and Raisanen Walfred, eds. CMP 2000: Chemical mechanical planarization. Scottsdale, AZ: Integrated Circuit Engineering, 2000.

Advances in Chemical Mechanical Planarization (CMP). Elsevier Science & Technology, 2016.

Advances in Chemical Mechanical Planarization (CMP). Elsevier, 2016. http://dx.doi.org/10.1016/c2014-0-01445-1.

Advances in Chemical Mechanical Planarization (CMP). Elsevier, 2022. http://dx.doi.org/10.1016/c2019-0-03721-1.

Seimitsu Kōgakkai. Puranarizēshon CMP to Sono Ōyō Gijutsu Senmon Iinkai., ed. Handōtai CMP yōgo jiten. Tōkyō: Ōmusha, 2008.

Seimitsu Kōgakkai. Puranarizēshon CMP to Sono Ōyō Gijutsu Senmon Iinkai., ed. Handōtai CMP yōgo jiten. Tōkyō: Ōmusha, 2008.

Vos, Ingrid, Michael R. Oliver, Duane S. Boning, Katia Devriendt, and David J. Stein. Chemical-Mechanical Planarization: Volume 767. University of Cambridge ESOL Examinations, 2014.

Craven, David, and Hong Liang. Tribology In Chemical-Mechanical Planarization. CRC, 2005.

(Editor), D. S. Boning, K. Devriendt (Editor), and M. R. Oliver (Editor), eds. Chemical-Mechanical Planarization: Volume 767. Materials Research Society, 2003.

Texas Engineering Extension Service (TEEX) Staff. CMP (Chemical Mechanical Polishing). TEEX/Technology and Economic Development, 1998.

Murarka, Shyam P., Ronald J. Gutmann, and Joseph M. Steigerwald. Chemical Mechanical Planarization of Microelectronic Materials. Wiley & Sons, Incorporated, John, 2008.

Murarka, Shyam P., Ronald J. Gutmann, and Joseph M. Steigerwald. Chemical Mechanical Planarization of Microelectronic Materials. Wiley & Sons, Limited, John, 2007.

Yuzhuo, Li, ed. Microelectronic applications of chemical mechanical planarization. Hoboken, N.J: John Wiley, 2007.

Li, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley & Sons, Incorporated, John, 2007.

Chemical Mechanical Planarization of Semiconductor Materials. Springer, 2004.

Li, Yuzhuo, ed. Microelectronic Applications of Chemical Mechanical Planarization. Wiley, 2007. http://dx.doi.org/10.1002/9780470180907.

Paik, Ungyu, and Jea-Gun Park. Nanoparticle Engineering for Chemical-Mechanical Planarization. CRC Press, 2019. http://dx.doi.org/10.1201/9780429291890.

Li, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley-Interscience, 2007.

Paik, Ungyu, and Jea-Gun Park. Nanoparticle Engineering for Chemical-Mechanical Planarization (open Access). Taylor & Francis Group, 2020.

Society, Electrochemical. Chemical Mechanical Planarization VI: Proceedings of the International Symposium. Electrochemical Society, 2003.

Philipossian, Ara, Gerfried Zwicker, Christopher Borst, and Laertis Economikos. Advances and Challenges in Chemical Mechanical Planarization: Volume 991. University of Cambridge ESOL Examinations, 2014.

Kumar, Ashok, Chad S. Korach, Subramanian Balakumar, and Higgs C. Fred III. Science and Technology of Chemical Mechanical Planarization: Volume 1157. University of Cambridge ESOL Examinations, 2014.

Opila, R. L. Chemical Mechanical Planarization in Ic Device Manufacturing (Proceedings / Electrochemical Society). Electrochemical Society, 1998.

Lee, Seung-Mahn. Characterization of chemical interactions during chemical mechanical polishing (CMP) of copper. 2003.

Paik, Ungyu, and Jea-Gun Park. Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices. Taylor & Francis Group, 2019.

Paik, Ungyu, and Jea-Gun Park. Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices. Taylor & Francis Group, 2019.

Paik, Ungyu, and Jea-Gun Park. Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices. Taylor & Francis Group, 2019.

Paik, Ungyu, and Jea-Gun Park. Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices. Taylor & Francis Group, 2019.

Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices. CRC, 2008.

S, Boning Duane, Materials research Society Meeting, and Symposium on Chemical-Mechanical Planarization (2003 : San Francisco, Calif.), eds. Chemical-mechanical planarization: Symposium held April 22-24, 2003, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2003.

Choi, Wonseop. Study of interfacial interaction during chemical mechanical polishing (CMP) of dielectric silicon dioxide. 2003.