Academic literature on the topic 'Chip-Set Manufacturers'

Radio frequency identification (RFID) is a generic term that is used to describe a system that transmits the identity of an object or person wirelessly using radio waves (RFID Journal, 2005). It falls under the broad category of automatic identification technologies. RFID tags, in the simplest of terms, are “intelligent chips that can be embedded in or attached to a product to transmit descriptive data” (Gelinas, Sutton, & Fedorowicz, 2004, p. 6). According to the online RFID Journal (2005), there are several methods of identifying objects using RFID, including the most common of storing a serial number that identifies a product on a microchip that is attached to an RFID tag. RFID is not a new technology, but it has only recently been in the spotlight as more businesses are receiving press for putting the technology to work in their supply chains. RFID tag technology is sometimes associated with the term electronic product code (EPC). An EPC uniquely identifies objects in a supply chain. According to EPCGlobal, “EPC is divided into numbers that identify the manufacturer and product type. The EPC uses an extra set of digits, a serial number, to identify unique items.” The EPC number is placed on a tag composed of a silicon chip and an antenna, which is then attached to an item. Using RFID, a tag communicates its numberto a reader (EPCGlobal, 2005). In broad terms, RFID tags are placed into one of two categories: active or passive. According to the Association for Automatic Identification and Mobility (AIM, 2005), active RFID tags are powered by an internal battery and are typically designated as read-write tags. When a tag has read-write capabilities, the tag data can be modified. Passive tags, according to AIM, operate without a power source and obtain operating power from the tag reader. Passive tags are typically read-only tags, having only read-only memory. Active tags generally have a longer read range than passive tags.

Defects associated with drilling of Carbon Fiber-Reinforced Polymers (CFRPs) are of major economic and safety concerns for aerospace manufacturers. One of the most critical defects associated with drilling of CFRP laminates is delamination of layers which can be avoided by keeping the drilling forces below some threshold levels. Orbital Drilling (OD) is an emerging drilling process that exhibits lower cutting forces and temperatures, easier chip removal, higher produced surface quality, longer tool life, and a high possibility for dry machining. The OD process is featured by cyclic engagement

With the development of very large scale integration, the chip heat dissipation is a problem that needs to be solved urgently. Vapor compression refrigeration system is a valid method to cool the electric chip. However, a particular challenge is to make a small and efficient gas compressor. In this paper, a mini-type single screw compressor was manufactured in Beijing University of Technology and a corresponding performance test system was set up. Experimental results show that the heat created by the single screw compressor is higher, which led to an extreme high exhaust temperature. An effec

Flip chip package is widely used in the electronic device manufacturing industry. The top side of a flip chip device is manufactured with solder bumps. The device is then flipped on its top so that the solder bumps can be bonded to a substrate, forming the mechanical and electrical connection between the device and substrate. As a result, the solder bumps are sandwiched between the silicon die and the substrate, making them no longer visible for usual inspection. A novel solder joint inspection system capable of evaluating the quality of the hidden solder bumps on a flip chip package has been

The purpose of this undergraduate research project was to develop a test section and prototype heat sinks that will be used in an existing electronics cooling wind tunnel for a project in a future Advanced Thermal Systems course. During the course, students will design and manufacture their own prototype heat sinks. Heat sinks are made of highly conductive materials with various geometries and are attached to computer chips to dissipate heat from them to the surroundings. The prototype heat sinks will be manufactured in the school’s facilities which will limit the complexity of the geometry. T

Silicon (Si) wafers are the most commonly used substrates for manufacturing semiconductor devices. The design rule is miniaturized, and the chip size is increasing to improve the degree of the device integration. Then Si wafer is required to be manufactured with the higher flatness and larger diameter to meet above demands. The double-sided polishing is widely adopted as the finishing process of the wafer manufacturing, because the wafers with the good surface quality and flatness can be obtained economically. However, the polishing technology has serious problems: It is very difficult to set