Academic literature on the topic 'Circuit board'

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Journal articles on the topic "Circuit board"

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Yang, Jun, and Jing Liu. "Direct printing and assembly of FM radio at the user end via liquid metal printer." Circuit World 40, no. 4 (2014): 134–40. http://dx.doi.org/10.1108/cw-07-2014-0029.

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Purpose – This paper aims to demonstrate the practicability of the liquid metal printer, developed in the authors’ laboratory, in the direct manufacture and assembly of circuit boards at the end customer side using GaIn24.5 alloy as printing ink at room temperature. Design/methodology/approach – A practical procedure for printing a real designed frequency modulation (FM) radio circuit on flexible and transparent substrate using liquid metal printer was established. Necessary electronic components are then assembled on this circuit board. To enhance the mechanical stability of the FM radio circ
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Vanfleteren, J., M. Gonzalez, F. Bossuyt, et al. "Printed circuit board technology inspired stretchable circuits." MRS Bulletin 37, no. 3 (2012): 254–60. http://dx.doi.org/10.1557/mrs.2012.48.

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Kumagai, Masaaki, and Takashi Emura. "Development of a Universal Interface Board and its Application to Robot Controllers and Signal Processors." Journal of Robotics and Mechatronics 16, no. 2 (2004): 200–207. http://dx.doi.org/10.20965/jrm.2004.p0200.

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Multipurpose digital interface boards for the PCI bus were designed for robot controllers. They used a programmable logic device reconfigured for internal circuits. The user plugs the board in, then downloads circuit data to obtain various interfaces. Optional modules such as analog front ends and support software also were developed. The board enables rapid prototyping and flexible use of high-speed digital circuits. Three applications of the board — robot interfaces of DC servomotors for a walking robot, high-speed digital signal processing for a motion capture system, and pipelined image pr
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Craven, Jeffery D., Ariel R. Oldag, and Robert N. Dean. "A Technique for Detecting Moisture Absorption in Printed Circuit Boards." Journal of Microelectronics and Electronic Packaging 17, no. 1 (2020): 28–33. http://dx.doi.org/10.4071/imaps.1014123.

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Abstract Most circuit boards operate in environments that have the potential to be exposed to moisture, either in vapor or liquid form. Because low-cost circuit boards can readily absorb moisture, this can lead to performance issues, reliability issues, and even catastrophic failure. However, it is difficult to detect if moisture absorption has occurred before the circuit board suffers a complete failure. To alleviate this issue, a fringing field capacitor was implemented in printed circuit board (PCB) technology and used to detect the absorption of moisture in the circuit board through the ac
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Shao, Xian Tao, Wei Lv, and Deng Xin Li. "Electronic Computer Circuit Board Waste Leaching Toxicity Study." Applied Mechanics and Materials 448-453 (October 2013): 625–29. http://dx.doi.org/10.4028/www.scientific.net/amm.448-453.625.

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Select the e-waste in the PC board as the research object, and through microwave-assisted digestion and flip Preparation leaching solution, respectively, using inductively coupled plasma atomic emission spectrometry (ICP-AES) and gas chromatography - mass spectrometry (GC-MS) analysis of the circuit board test results with HJ/T299 set forth in the various elements and organic matter concentration limits comparison shows that a computer circuit board has a leaching toxicity, is hazardous waste for the computer circuit boards harmless and resource provide a reliable theoretical basis.
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Kim, Ernest M., and Thomas F. Schubert. "A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice." International Journal of Electrical Engineering & Education 54, no. 3 (2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.

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Over a 2-year period, printed circuit board layout design and test were included in the laboratory portion of the second of two junior-level electronic circuits courses. Printed circuit board design using industry-accepted board specifications and standard industry Gerber file export experience was developed. The students’ printed circuit board design experience emulated real-world situations and cost criteria. The instructor served as the fabricator in this model of the industrial design situation. Students individually used industry standard schematic capture and layout software to develop a
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Myers, Sharon A., Troy D. Cognata, and Hugh Gotts. "FTIR analysis of printed-circuit board residue." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 264–65. http://dx.doi.org/10.1017/s0424820100163782.

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Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. The failure to boot was originally traced to a suspected bad microcontroller chip. Replacing this chip, or an oscillator tied to the microcontroller circuit, did not consistently solve the boot problem. With further testing, it was found the microcontroller circuit was very sensitive to resistance and was essentially shorted.A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resist
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Das, Rajesha K., Omdeo K. Gohatre, Manoranjan Biswal, Smita Mohanty, and SK Nayak. "Influence of non-metallic parts of waste printed circuit boards on the properties of plasticised polyvinyl chloride recycled from the waste wire." Waste Management & Research: The Journal for a Sustainable Circular Economy 37, no. 6 (2019): 569–77. http://dx.doi.org/10.1177/0734242x19836725.

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Extreme complexity in the range of metallic and non-metallic parts present in waste printed circuit boards leads to incineration for collecting valuable metals. The non-metallic parts of the printed circuit board can be used effectively without affecting the environment. In this study, the non-metallic parts of the printed circuit board, which is made up by cross-linked resin and fibre, was used as a filler in recycled plasticised polyvinyl chloride collected from waste wires and cables. The properties of the plasticised polyvinyl chloride matrix and plasticised polyvinyl chloride–non-metallic
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Lepla, Keith C., and Gary Horlick. "Photodiode Array Systems for Inductively Coupled Plasma-Atomic Emission Spectrometry." Applied Spectroscopy 43, no. 7 (1989): 1187–95. http://dx.doi.org/10.1366/0003702894203462.

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Details are presented for the construction of photodiode array (PDA) measurement systems from commercial components. The PDA systems described include the Hamamatsu S2304–1024Q, a Reticon 1024S using the RC1000 and RC1001 circuit boards, and a Reticon 1024S using the RC1024S circuit board. Detals are presented for computer-controlled clocking and timing circuits, ADC sub-systems, and Peltier cooling subsystems. The measurement characteristics (sensitivity and detection limits) for all arrays are intercompared with the use of analyte emission signals from an inductively coupled plasma.
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OKADA, Yoshio, Takashi ANDOH, and Shingo NISHIKI. "Special issue/Three-dimensional molded circuit boards. Flat patterned circuit board." Journal of the Surface Finishing Society of Japan 41, no. 7 (1990): 728–32. http://dx.doi.org/10.4139/sfj.41.728.

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Dissertations / Theses on the topic "Circuit board"

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Hickam, James William III 1956. "Paperless planning in printed circuit board manufacturing." Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/277250.

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One of the aspects of Computer Integrated Manufacturing is the ability to provide current work instructions to the operator at their workstation on a terminal or graphic monitor. The problem is, today, paperless planning is displayed to the operator one page at a time, making the operator report the completion or not completion of that task before showing the next page. This allows the operator no freedom of choice in how to do the job, which leads to reduced productivity and quality. A possible solution is presented by structuring the planning instructions and enhancing the workstation. The o
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Kubik, Jan [Verfasser]. "Printed Circuit Board Fluxgate Sensors / Jan Kubik." Aachen : Shaker, 2009. http://d-nb.info/1161308342/34.

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Moorhouse, Colin. "Laser processing of printed circuit board materials." Thesis, Heriot-Watt University, 2006. http://hdl.handle.net/10399/195.

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Bergström, Kristoffer. "Sensor system for automated circuit board testing." Thesis, Uppsala universitet, Signaler och System, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-388628.

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This thesis investigates the possibility to automate testing of PCBs with a sensor system.  This PCB testing is today done manually by placing PCBs in a test fixture that determines its condition. This test requires an operator to wait for the test to complete and then place the PCB in the correct section. If this process can be automated time could be saved and the risk of mishandling PCBs could be reduced. A sensors system is made that consists of an Arduino with micro switches, hall effect sensors, a scanner and a LiDAR. The sensor system is designed to achieve a set of requirements that is
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Lim, Geok H. "Vibration analysis of a printed circuit board." Thesis, Aston University, 2000. http://publications.aston.ac.uk/15341/.

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The reliability of the printed circuit board assembly under dynamic environments, such as those found onboard airplanes, ships and land vehicles is receiving more attention. This research analyses the dynamic characteristics of the printed circuit board (PCB) supported by edge retainers and plug-in connectors. By modelling the wedge retainer and connector as providing simply supported boundary condition with appropriate rotational spring stiffnesses along their respective edges with the aid of finite element codes, accurate natural frequencies for the board against experimental natural frequen
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Shina, Sammy G. "A design quality and cost model for printed circuit board assembly /." Thesis, Connect to Dissertations & Theses @ Tufts University, 1998.

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Thesis (Ph.D.)--Tufts University, 1998.<br>Adviser: Anil Saigal. Submitted to the Dept. of Mechanical Engineering. Includes bibliographical references. Access restricted to members of the Tufts University community. Also available via the World Wide Web;
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Rakkarn, Sakchai. "OPERATION ASSIGNMENT WITH BOARD SPLITTING AND MULTIPLE MACHINES IN PRINTED CIRCUIT BOARD ASSEMBLY." Case Western Reserve University School of Graduate Studies / OhioLINK, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=case1201021027.

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Lehmann, Peter W. "Printed circuit board manufacturing process improvement drill optimization." Menomonie, WI : University of Wisconsin--Stout, 2005. http://www.uwstout.edu/lib/thesis/2005/2005lehmannp.pdf.

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Chan, Ching-Yuen. "Cell controller for printed circuit board assembly rework." Thesis, University of Salford, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.386432.

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Tucker, Joseph C. "Ultrasonic welding of copper to laminate circuit board." Link to electronic thesis, 2002. http://www.wpi.edu/Pubs/ETD/Available/etd-0429102-124154.

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Books on the topic "Circuit board"

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Noble, P. J. W. Printed circuit board assembly. Springer US, 1989. http://dx.doi.org/10.1007/978-1-4684-6234-0.

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Prochnow, Dave. 50 powerfulprinted circuit board projects. Tab Books, 1988.

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Castrovilla, Joseph A. The printed circuit board industry. Business Communications Co., 1985.

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Chevalier, Philippe B. Inspection for circuit board assembly. Alfred P. Sloan School of Management, Massachusetts Institute of Technology, 1992., 1992.

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Printed circuit board design with microcomputers. Intertext Publications, 1991.

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Prochnow, Dave. 50 powerful printed circuit board projects. Tab Books, 1988.

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Printed circuit board designer's reference: Basics. Prentice Hall Professional Technical Reference, 2004.

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Montrose, Mark I. EMC and the Printed Circuit Board. John Wiley & Sons, Inc., 1998. http://dx.doi.org/10.1002/047172310x.

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Build your own printed circuit board. McGraw-Hill, 2004.

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Schroeder, Chris. Printed circuit board design using AutoCAD. Newnes, 1998.

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Book chapters on the topic "Circuit board"

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Weik, Martin H. "printed-circuit board." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_14620.

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Chilton, Neil. "Printed Circuit Board Fabrication." In Inkjet Technology for Digital Fabrication. John Wiley & Sons, Ltd, 2014. http://dx.doi.org/10.1002/9781118452943.ch8.

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Foitzik, Andreas. "Printed Circuit Board Technologies." In The Electronic Design Automation Handbook. Springer US, 2003. http://dx.doi.org/10.1007/978-0-387-73543-6_24.

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Kohlhammer, Bernd. "Printed Circuit Board Design." In The Electronic Design Automation Handbook. Springer US, 2003. http://dx.doi.org/10.1007/978-0-387-73543-6_25.

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Archambeault, Bruce R. "Printed Circuit Board Layout." In PCB Design for Real-World EMI Control. Springer US, 2002. http://dx.doi.org/10.1007/978-1-4757-3640-3_11.

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Seraphim, Donald P., Donald E. Barr, William T. Chen, George P. Schmitt, and Rao R. Tummala. "Printed-Circuit Board Packaging." In Microelectronics Packaging Handbook. Springer US, 1989. http://dx.doi.org/10.1007/978-1-4613-1069-3_12.

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Mardiguian, Michel. "Printed Circuit Board Design." In Controlling Radiated Emissions by Design. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3102-9_6.

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Edwards, Phillip R. "Printed circuit board manufacture." In Manufacturing Technology in the Electronics Industry. Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3130-8_5.

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Edwards, Phillip R. "Printed circuit board assembly." In Manufacturing Technology in the Electronics Industry. Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3130-8_6.

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Harrold, Christopher. "Your First Circuit Board." In Practical Smart Device Design and Construction. Apress, 2020. http://dx.doi.org/10.1007/978-1-4842-5614-5_11.

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Conference papers on the topic "Circuit board"

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van de Kraats, Berto, Marc van Kreveld, and Mark Overmars. "Printed circuit board simplification." In the eleventh annual symposium. ACM Press, 1995. http://dx.doi.org/10.1145/220279.220336.

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Paul, Clayton R., and Woodrow W. Everett. "Printed Circuit Board Crosstalk." In 1985 IEEE International Symposium on Electromagnetic Compatibility. IEEE, 1985. http://dx.doi.org/10.1109/isemc.1985.7566982.

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Ota, Masayuki, Takashi Sakusabe, Takehiro Takahashi, and Noboru Schibuya. "Electromagnetic interference from printed circuit boards connected by flexible printed circuit board." In 2008 1st Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) & 19th International Zurich Symposium on Electromagnetic Compatibility. IEEE, 2008. http://dx.doi.org/10.1109/apemc.2008.4559960.

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Vujosevic, M., P. Raghavan, G. Ramanathan, W. Hezeltine, and K. Blue. "Nonlinear Response of a Printed Circuit Board in Shock." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89094.

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This work focuses on deformation mechanisms taking place in a Printed Circuit Board (PCB) exposed to high impact shock. A combined experimental, theoretical, and numerical approach has been applied to address both the nature of the observed deformation and its modeling and test metrology implications. Experimental evidence overwhelmingly indicates that a PCB in both test and system applications undergoes nonlinear deformations. Geometric nonlinearity of board response is attributed to the elevated in-plane (membrane) stresses that develop when a drop height and/or inertia forces are significan
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Dion, J. "Fast printed circuit board routing." In 24th ACM/IEEE conference proceedings. ACM Press, 1987. http://dx.doi.org/10.1145/37888.38004.

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Norman, Richard, Olivier Valorge, Yves Blaquiere, et al. "An active reconfigurable circuit board." In 2008 Joint International IEEE Northeast Workshop on Circuits and Systems (NEWCAS) and TAISA Conference (NEWCAS-TAISA). IEEE, 2008. http://dx.doi.org/10.1109/newcas.2008.4606393.

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Benedikt, Michael, Thomas Stenger, Klein Andreas, and Frank Kruger. "SCB - Stamped Circuit Board technology." In 2010 3rd Electronic System-Integration Technology Conference (ESTC). IEEE, 2010. http://dx.doi.org/10.1109/estc.2010.5642995.

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Slee, Daren T. "Printed Circuit Board Propagating Faults." In ISTFA 2004. ASM International, 2004. http://dx.doi.org/10.31399/asm.cp.istfa2004p0436.

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Abstract This paper is a review of propagating faults in printed circuit boards (PCBs) from the perspective of using the resulting burn and melted copper patterns to identify likely locations of fault initiation. Visual examination and x-ray imaging are the main techniques for examining PCB propagating faults. Once the likely fault initiation location has been identified, fault tree analysis can be used to determine the root cause for fault initiation. The paper discusses the mechanisms by which PCB propagating faults occur. The method of determining the likely area of initiation of the fault
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Mozar, Stefan, and Erik van Voorthuysen. "Are printed circuit board assemblies overtested?" In 2012 IEEE Global High Tech Congress on Electronics (GHTCE). IEEE, 2012. http://dx.doi.org/10.1109/ghtce.2012.6490154.

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Vieroth, Rene, Thomas Loher, Manuel Seckel, et al. "Stretchable Circuit Board Technology and Application." In 2009 International Symposium on Wearable Computers (ISWC). IEEE, 2009. http://dx.doi.org/10.1109/iswc.2009.13.

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Reports on the topic "Circuit board"

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Anderson, J. T. Document Template for Printed Circuit Board Layout. Office of Scientific and Technical Information (OSTI), 1998. http://dx.doi.org/10.2172/1032099.

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Holder, Darryl. Prototype and Short-Run Printed Circuit Board Creation. Defense Technical Information Center, 1993. http://dx.doi.org/10.21236/ada263245.

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Bacon, L. D., and R. P. Toth. LineCAP (Line/Circuit Analysis Program): Cross-coupling on PC (printed circuit) board traces including discontinuities and circuit elements. Office of Scientific and Technical Information (OSTI), 1989. http://dx.doi.org/10.2172/6038898.

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Edwards, H. W., M. F. Kostrzewa, and G. P. Looby. Pollution prevention assessment for a printed circuit board plant. Office of Scientific and Technical Information (OSTI), 1995. http://dx.doi.org/10.2172/125058.

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Booth, Janice C., Tracy Hudson, Brian A. English, Michael R. Whitley, and Michael S. Kranz. Integrated Printed Circuit Board (PCB) Active Cooling With Piezoelectric Actuator. Defense Technical Information Center, 2012. http://dx.doi.org/10.21236/ada567661.

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Jablonski, Gregory A., Paul H. Kydd, and David L. Richard. Waste Minimization in Circuit Board Manufacturing by PARMOD(TM) Technology. Defense Technical Information Center, 1998. http://dx.doi.org/10.21236/ada350771.

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Aniti, Ronen. Predicting Deformation and Strain Behavior in Circuit Board Bend Testing. Defense Technical Information Center, 2012. http://dx.doi.org/10.21236/ada590805.

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Thaler, B. J., A. N. Sreeram, E. S. Tormey, P. Palanisamy, and M. Liberatore. Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs). Defense Technical Information Center, 1996. http://dx.doi.org/10.21236/ada320234.

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Thaler, B. J., and W. A. Vitriol. Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs). Defense Technical Information Center, 1997. http://dx.doi.org/10.21236/ada329435.

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Neilsen, Michael K., Kevin N. Austin, Douglas Brian Adolf, Scott W. Spangler, Matthew Aaron Neidigk, and Robert S. Chambers. Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses. Office of Scientific and Technical Information (OSTI), 2011. http://dx.doi.org/10.2172/1022184.

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