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Journal articles on the topic 'Circuit board'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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1

Yang, Jun, and Jing Liu. "Direct printing and assembly of FM radio at the user end via liquid metal printer." Circuit World 40, no. 4 (2014): 134–40. http://dx.doi.org/10.1108/cw-07-2014-0029.

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Purpose – This paper aims to demonstrate the practicability of the liquid metal printer, developed in the authors’ laboratory, in the direct manufacture and assembly of circuit boards at the end customer side using GaIn24.5 alloy as printing ink at room temperature. Design/methodology/approach – A practical procedure for printing a real designed frequency modulation (FM) radio circuit on flexible and transparent substrate using liquid metal printer was established. Necessary electronic components are then assembled on this circuit board. To enhance the mechanical stability of the FM radio circ

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2

Vanfleteren, J., M. Gonzalez, F. Bossuyt, et al. "Printed circuit board technology inspired stretchable circuits." MRS Bulletin 37, no. 3 (2012): 254–60. http://dx.doi.org/10.1557/mrs.2012.48.

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3

Kumagai, Masaaki, and Takashi Emura. "Development of a Universal Interface Board and its Application to Robot Controllers and Signal Processors." Journal of Robotics and Mechatronics 16, no. 2 (2004): 200–207. http://dx.doi.org/10.20965/jrm.2004.p0200.

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Multipurpose digital interface boards for the PCI bus were designed for robot controllers. They used a programmable logic device reconfigured for internal circuits. The user plugs the board in, then downloads circuit data to obtain various interfaces. Optional modules such as analog front ends and support software also were developed. The board enables rapid prototyping and flexible use of high-speed digital circuits. Three applications of the board — robot interfaces of DC servomotors for a walking robot, high-speed digital signal processing for a motion capture system, and pipelined image pr

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4

Craven, Jeffery D., Ariel R. Oldag, and Robert N. Dean. "A Technique for Detecting Moisture Absorption in Printed Circuit Boards." Journal of Microelectronics and Electronic Packaging 17, no. 1 (2020): 28–33. http://dx.doi.org/10.4071/imaps.1014123.

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Abstract Most circuit boards operate in environments that have the potential to be exposed to moisture, either in vapor or liquid form. Because low-cost circuit boards can readily absorb moisture, this can lead to performance issues, reliability issues, and even catastrophic failure. However, it is difficult to detect if moisture absorption has occurred before the circuit board suffers a complete failure. To alleviate this issue, a fringing field capacitor was implemented in printed circuit board (PCB) technology and used to detect the absorption of moisture in the circuit board through the ac

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5

Shao, Xian Tao, Wei Lv, and Deng Xin Li. "Electronic Computer Circuit Board Waste Leaching Toxicity Study." Applied Mechanics and Materials 448-453 (October 2013): 625–29. http://dx.doi.org/10.4028/www.scientific.net/amm.448-453.625.

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Select the e-waste in the PC board as the research object, and through microwave-assisted digestion and flip Preparation leaching solution, respectively, using inductively coupled plasma atomic emission spectrometry (ICP-AES) and gas chromatography - mass spectrometry (GC-MS) analysis of the circuit board test results with HJ/T299 set forth in the various elements and organic matter concentration limits comparison shows that a computer circuit board has a leaching toxicity, is hazardous waste for the computer circuit boards harmless and resource provide a reliable theoretical basis.

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6

Kim, Ernest M., and Thomas F. Schubert. "A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice." International Journal of Electrical Engineering & Education 54, no. 3 (2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.

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Over a 2-year period, printed circuit board layout design and test were included in the laboratory portion of the second of two junior-level electronic circuits courses. Printed circuit board design using industry-accepted board specifications and standard industry Gerber file export experience was developed. The students’ printed circuit board design experience emulated real-world situations and cost criteria. The instructor served as the fabricator in this model of the industrial design situation. Students individually used industry standard schematic capture and layout software to develop a

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7

Myers, Sharon A., Troy D. Cognata, and Hugh Gotts. "FTIR analysis of printed-circuit board residue." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 264–65. http://dx.doi.org/10.1017/s0424820100163782.

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Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. The failure to boot was originally traced to a suspected bad microcontroller chip. Replacing this chip, or an oscillator tied to the microcontroller circuit, did not consistently solve the boot problem. With further testing, it was found the microcontroller circuit was very sensitive to resistance and was essentially shorted.A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resist

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8

Das, Rajesha K., Omdeo K. Gohatre, Manoranjan Biswal, Smita Mohanty, and SK Nayak. "Influence of non-metallic parts of waste printed circuit boards on the properties of plasticised polyvinyl chloride recycled from the waste wire." Waste Management & Research: The Journal for a Sustainable Circular Economy 37, no. 6 (2019): 569–77. http://dx.doi.org/10.1177/0734242x19836725.

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Extreme complexity in the range of metallic and non-metallic parts present in waste printed circuit boards leads to incineration for collecting valuable metals. The non-metallic parts of the printed circuit board can be used effectively without affecting the environment. In this study, the non-metallic parts of the printed circuit board, which is made up by cross-linked resin and fibre, was used as a filler in recycled plasticised polyvinyl chloride collected from waste wires and cables. The properties of the plasticised polyvinyl chloride matrix and plasticised polyvinyl chloride–non-metallic

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9

Lepla, Keith C., and Gary Horlick. "Photodiode Array Systems for Inductively Coupled Plasma-Atomic Emission Spectrometry." Applied Spectroscopy 43, no. 7 (1989): 1187–95. http://dx.doi.org/10.1366/0003702894203462.

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Details are presented for the construction of photodiode array (PDA) measurement systems from commercial components. The PDA systems described include the Hamamatsu S2304–1024Q, a Reticon 1024S using the RC1000 and RC1001 circuit boards, and a Reticon 1024S using the RC1024S circuit board. Detals are presented for computer-controlled clocking and timing circuits, ADC sub-systems, and Peltier cooling subsystems. The measurement characteristics (sensitivity and detection limits) for all arrays are intercompared with the use of analyte emission signals from an inductively coupled plasma.

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10

OKADA, Yoshio, Takashi ANDOH, and Shingo NISHIKI. "Special issue/Three-dimensional molded circuit boards. Flat patterned circuit board." Journal of the Surface Finishing Society of Japan 41, no. 7 (1990): 728–32. http://dx.doi.org/10.4139/sfj.41.728.

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11

Stadterman, Thomas, and Donald Barker. "Practical Assessment of Electronic Circuit Cards Under Mechanical Shock Loading." Journal of the IEST 48, no. 1 (2005): 62–74. http://dx.doi.org/10.17764/jiet.48.1.b32w158u336414q0.

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This paper presents a practical approach for assessing electronic circuit cards for mechanical shock loading. The approach is comprised of three areas: determining board response, assessing damage to the printed wiring boards, and assessing damage to the components. Determining the board response to the shock loading provides the basis for the damage assessments. To determine board response, the approach recommends specific structures to model and finite element analysis (FEA) methods to use. Failure models for circuit board and component failures are provided in terms of failure risk. To demo

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12

Chen, Sheng Yi, Gui Tang Wang, and Ying Ge Li. "Based on the Sensor Network and Virtual Instrument Circuit Board Reliability Test System." Key Engineering Materials 522 (August 2012): 731–35. http://dx.doi.org/10.4028/www.scientific.net/kem.522.731.

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Aiming at the problem that the quality of fans control circuit board is not stable, this paper designs and develops of multiparameter networked reliability testing system of eclectic fans circuit board based on the virtual instrument Labview. This system adopts distributed structure, which consists of three parts: the measurement and control node, virtual instrument PC, interference sources. The sensing nets measurement and control node with embedded processor, controls test model,process,jamming signals voltage and frequency of circuit interference source, and real-time online collects parame

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13

Lin, Hai, Ying Bo Dong, and Xin Wang. "Research Progress on Recovering Valuable Metals from Wasted Circuit Board by Bio-Hydrometallurgy Technology." Advanced Materials Research 1130 (November 2015): 677–80. http://dx.doi.org/10.4028/www.scientific.net/amr.1130.677.

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The quantity of circuit boards produced and abandoned has increased with the development of electronics industry. The wasted circuit board has the characters of large amounts, high metal content and harmful to environment, which is known as “urban mines”. The effective recycling of the valuable metals in wasted circuit boards had always been the focus. The characteristics of pyrometallurgical recovery, mechanical recovery and wet recovery, such as low recovery ratio, high cost and environmental pollution fails to recover the precious metals from wasted circuit board. This paper outlines the re

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14

Hsia, Kuo-Hsien, and Jr-Hung Guo. "Estimation of the PCB Production Process Using a Neural Network." Proceedings of Engineering and Technology Innovation 15 (April 27, 2020): 01–07. http://dx.doi.org/10.46604/peti.2020.4265.

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Printed Circuit Boards (PCB) are an integral part of all electronic products, and the production process for printed circuit boards is quite complex. As the life cycle of electronic products becomes shorter and shorter, and the precision and signal bandwidth of electronic products become higher and higher, the manufacturing process of printed circuit boards is further complicated. Therefore, how to pre-evaluate the production difficulty before starting the production will effectively increase the efficiency and quality of printed circuit board production. Gerber file is the most commonly

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15

LO, C. L., and L. R. TUNG. "Printed Circuit Board Industry in Asia. Printing Circuit Boards Industry in Taiwan." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11, no. 3 (1996): 169–74. http://dx.doi.org/10.5104/jiep1995.11.169.

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16

IDA, Kiyoshi, Shizuo SAKURAI, and Hiroshi NAGATSU. "Printed resistor circuit board." Circuit Technology 2, no. 4 (1987): 232–39. http://dx.doi.org/10.5104/jiep1986.2.232.

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17

Emery, Chris. "Printed circuit board capacitors." Physics Teacher 31, no. 4 (1993): 234–35. http://dx.doi.org/10.1119/1.2343735.

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18

LaDou, Joseph. "Printed circuit board industry." International Journal of Hygiene and Environmental Health 209, no. 3 (2006): 211–19. http://dx.doi.org/10.1016/j.ijheh.2006.02.001.

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19

McCall, Jed. "Advanced printed circuit board." Microelectronics Journal 23, no. 2 (1992): 147–52. http://dx.doi.org/10.1016/0026-2692(92)90051-2.

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20

Sullivan, Kelly D., Corrie L. Gallant-Behm, Ryan E. Henry, Jean-Luc Fraikin, and Joaquín M. Espinosa. "The p53 circuit board." Biochimica et Biophysica Acta (BBA) - Reviews on Cancer 1825, no. 2 (2012): 229–44. http://dx.doi.org/10.1016/j.bbcan.2012.01.004.

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21

Wang, Dai-Hua, Lian-Kai Tang, Yun-Hao Peng, and Huai-Qiang Yu. "Principle and structure of a printed circuit board process–based piezoelectric microfluidic pump integrated into printed circuit board." Journal of Intelligent Material Systems and Structures 30, no. 17 (2019): 2595–604. http://dx.doi.org/10.1177/1045389x19869519.

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Considering mature printed circuit board processes, researches on microfluidic pumps that can be integrated into printed circuit board will provide a solution for further miniaturization and integration of microfluidic systems with low costs. The principle and structure of a printed circuit board process–based piezoelectric microfluidic pump integrated into printed circuit board are proposed and realized in this article. The printed circuit board process–based design and manufacturing technology of a piezoelectric microfluidic pump integrated into printed circuit board is researched utilizing

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22

Plovie, Bart, Sheila Dunphy, Kristof Dhaenens, et al. "2.5D Smart Objects Using Thermoplastic Stretchable Interconnects." International Symposium on Microelectronics 2015, no. 1 (2015): 000868–73. http://dx.doi.org/10.4071/isom-2015-thp51.

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This contribution describes the technology used to produce thermoplastically deformable electronics, based on flexible circuit board technology, to achieve low-cost 2.5D free-form rigid smart objects. These one-time deformable circuits employ a modified version of the previously developed meander-based “polymer-last” technology for dynamically stretchable elastic circuits. This is readily achieved by substituting the dynamically stretchable elastomeric materials (e.g. silicone) with thermoplastic polymers (e.g. polycarbonate). Afterwards the circuit is given its final form using widely availab

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23

Sisoev, Oleg Yu, Sergey S. Sokolov, and Victor A. Tupik. "CHOOSING RATIONAL TRACING PROCEDURE BY CONSTRUCTIVE CRITERION." Journal of the Russian Universities. Radioelectronics, no. 6 (January 18, 2019): 5–12. http://dx.doi.org/10.32603/1993-8985-2018-21-6-5-12.

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The analysis of autorouter efficiency in the known CAD systems under structural and technological constraints is carried out. The revealed significant constraints are related to the thermal strength of the wires and possible mutual influence through the electromagnetic field. When manually designing the designer guided by his own experience, can ignore these and other constraints. Unlike a person, the autorouter strictly fulfills all the specified constraints, which, given the topology of the printed circuit board, does not allow tracing to complete. On the other hand, giving greater freedom t

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24

Atasever, Şule, Pınar A. Bozkurt, and Muammer Canel. "Pyrolysis of Waste Printed Circuit Board Particles." International Journal of Energy Optimization and Engineering 4, no. 2 (2015): 70–75. http://dx.doi.org/10.4018/ijeoe.2015040105.

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Electrical and electronic apparatus and instruments which are obsolete value in use or completion of the life can be defined as e-waste. E-waste is one of the fastest growing types of hazardous waste. Printed circuit boards a major component of this waste. In this study, printed circuit board particles of mobile phone (MPCB) were used as electronic waste. MPCB waste was obtained from a local electronic waste factory. The elemental analysis and ICP-MS analysis were performed on these electronic wastes and thereafter pyrolysis runs were carried out between 500 and 900°C in a horizontal furnace.

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25

Borovikov, Sergei M., and Vladislav N. Bondarev. "MODEL FOR PREDICTION OF PERFORMANCE RELIABILITY OF PRINTED CIRCUIT BOARDS TAKING INTO ACCOUNT CYCLES OF OPERATING TIME AND TEMPERATURE REGIMES OF USING." Globus: technical sciences 7, no. 4(40) (2021): 18–24. http://dx.doi.org/10.52013/2713-3079-40-4-4.

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A model is proposed for predicting the operational reliability of printed circuit boards, which include mounting holes for installing output elements and contact pads for mounting SMD elements on the surface of a printed circuit board. A distinctive feature of the model is taking into account the cyclical nature of the operation of the electronic module and taking into account the thermo mechanical stresses that arise in the printed circuit board and connections when the temperature changes (during operation, during storage). An example of the application of the model is given.

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26

Lim, Hansang, Do-Hwan Jung, Geono Kwon, Young Jong Lee, and Jun Seo Park. "Downsizing an automotive junction box based on large current-carrying printed-circuit board optimization." Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering 231, no. 2 (2016): 267–78. http://dx.doi.org/10.1177/0954407016657498.

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An automotive junction box distributes electric power to electric systems installed in a vehicle with overcurrent protection. As a larger number of electric systems are installed, the junction box is equipped with more components, functionalities and connections. However, owing to the fuse accessibility, its installation space is so restricted that a downsized design is required for the junction box. The junction box is composed of small signal circuitry for control and monitoring, and large current-carrying circuitry for power distribution which includes many parallel traces. Because of these

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27

Zhou, Nian Xin, Ya Qun He, Chen Long Duan, and Shu Ai Wang. "Experimental Study on Impact Mechanical Properties of Waste Printed Circuit Boards." Advanced Materials Research 113-116 (June 2010): 1123–27. http://dx.doi.org/10.4028/www.scientific.net/amr.113-116.1123.

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Comminution is a key part of the reutilization of discarded circuit board. In order to find out the most appropriate method of crushing, the characteristics of the materials and the mechanical properties of resistance impact of discarded circuit boards were studied. The substrate of circuit boards, slots of ISA and PCI were adopted as the specimen. The scanning electron microscope (SEM) and energy disperse X-ray spectroscopy (EDX) were used to characterize and analyze the combined state of the fracturing materials on the specimen surfaces after comminution. Results showed that the metals and n

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28

Yu, Guangwei, Yuan Yao, and Zhuoyuan Song. "A multi-dimensional matrix keyboard interfacing circuit design." Circuit World 46, no. 3 (2020): 175–82. http://dx.doi.org/10.1108/cw-10-2019-0142.

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Purpose This paper presents a novel design method for keyboard circuits. The purpose of this study is to enable a single-board computer with fewer pins to recognize a keyboard system consisting of a large number of switches. Through the study of different kinds of keyboard circuits, a general circuit schematic design method is abstracted. Several experiments are conducted to prove the feasibility of the proposed circuit design method. Design/methodology/approach Conventional circuit schematic diagrams are often limited to two-dimensional planes. Through investigating higher dimensional alterna

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29

Kannan Megalingam, Rajesh, Shree Rajesh Raagul Vadivel, Sreekumar S, Swathi Sekhar, Thejus R Nair, and Midhun RR. "Design and Implementation of CNC Milling Bot for Milled Circuit Board Fabrication." International Journal of Engineering & Technology 7, no. 3.12 (2018): 1205. http://dx.doi.org/10.14419/ijet.v7i3.12.17838.

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This research paper presents an alternative way to fabricate a Milled Circuit Board (MCB) with the help of a Computer Numerical Controlled (CNC) milling robot. Printed Circuit Boards (PCB) are one of the most widely used control modules in electrical and electronic industries. In this research paper we propose a computer controlled milling machine which can be used for quick fabrication of double layered PCBs called MCB where a user wants to test the circuit without the need to wait for the conventional PCB fabrication. The end effector of the CNC milling machine has the provision to move in 3

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30

Korotky, O. A., A. A. Korneev, and A. Yu Galkin. "PROCESS IMPACTS ON RELIABILITY OF PRINTED CIRCUIT BOARDS." Issues of radio electronics, no. 11 (November 20, 2018): 6–9. http://dx.doi.org/10.21778/2218-5453-2018-11-6-9.

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The paper considers defects that directly affect the quality of the finished product, which includes printed circuit boards and wiring connections. Current problems lead to failures of electronic equipment, which can lead to the failure of complex technical systems with subsequent downtime. Also methods for increasing the reliability of electronic equipment products are proposed, which exclude premature failures of the equipment as a whole. Such failures include breakage of the metallization column during extreme heating of the printed circuit board, poor connection quality of components on th

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31

Žemva, Andrej, Andrej Trost, and Baldomir Zajc. "Educational Programmable System for Prototyping Digital Circuits." International Journal of Electrical Engineering & Education 35, no. 3 (1998): 236–44. http://dx.doi.org/10.1177/002072099803500306.

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In this paper, we present an educational programmable system for prototyping digital circuits. The system is composed of the PC and the prototyping board composed of 3 FPGAs. PC is used for designing a digital circuit, programming the FPGAs, automatic generation of the interface logic and hardware verification of the designed circuit.

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32

Frear, D. R., and F. G. Yost. "Reliability of Solder Joints." MRS Bulletin 18, no. 12 (1993): 49–54. http://dx.doi.org/10.1557/s0883769400039087.

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In early electronic technologies, circuit components were attached to circuit boards by mechanical means. The electrical leads were either twisted together or mechanically interlocked to a board prior to soldering. The possibility of an unreliable solder joint causing any kind of circuit failure was remote. Interconnections were made intrinsic to the board by applying solder to increase electrical and thermal conductance. Technological advances and the need for high-density electronics have since eliminated the luxury of mechanical interlocks. Soldering in advanced applications, like surface m

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33

JimÃ©nez, Alejandro DueÃ±as, and Francisco JimÃ©nez HernÃ¡ndez. "Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams." JOURNAL OF ADVANCES IN PHYSICS 5, no. 1 (2014): 737–41. http://dx.doi.org/10.24297/jap.v5i1.1972.

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Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the â€œspeedsâ€ on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were

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34

TRAGOUDAS, SPYROS. "BOARD LEVEL PARTITIONING FOR IMPROVED PARTIAL SCAN." International Journal of High Speed Electronics and Systems 06, no. 04 (1995): 573–94. http://dx.doi.org/10.1142/s0129156495000201.

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We present a two phase board level partitioning scheme for improved partial scan on the resulting Integrated Circuits (ICs). The first phase clusters the nodes of the synchronous sequential PCB system into sets of bounded capacity. Each set represents an IC. The main objective function is to minimize the maximum number of inputs to a set. This considerably affects the test generation and response verification phases while testing the ICs. The second phase repositions the flip-flops so that we minimize the partial scan related hardware overhead for each IC, maintain a small sequential depth for

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35

Andrade, Lidiane Maria, Mariana Alves de Carvalho, Marcos Paulo Kohler Caldas, Denise Espinosa, and Jorge Tenòrio. "RECOVERY OF COPPER AND SILVER OF PRINTED CIRCUIT BOARDS FROM OBSOLETE COMPUTERS BY ONE-STEP ACID LEACHING." Detritus, no. 14 (February 26, 2021): 86–91. http://dx.doi.org/10.31025/2611-4135/2021.14056.

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Over the years, the generation of Waste Electric and Electronic Equipment has been significantly increased, which leads to environmental and economic concerns. Thus, it is fundamental to develop treatment methods for these residues. Printed Circuit Boards are essential components of electronic equipments. In this sense, printed circuit boards are composed of remarkable metals, in particular, copper and silver at high and low concentrations, respectively. These metals can be recovered by the hydrometallurgical process followed by a chemical purification step. Therefore, the aim of this study wa

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Han, Tae Uk, Seungdo Kim, Young-min Kim, Byeonga Hwang, U. Bayasgalan, and Jeong-Yeon Lee. "Pyrolysis Reaction Characteristics of Waste Paper Laminated Phenolic-Printed Circuit Board (p-PCB)." Journal of Korea Society of Waste Management 32, no. 2 (2015): 161–69. http://dx.doi.org/10.9786/kswm.2015.32.2.161.

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Johansson, Susie, and John Dzarnoski. "Evaluation of Epoxy Flux for Use in Hearing Aid SMD Assemblies." International Symposium on Microelectronics 2013, no. 1 (2013): 000152–57. http://dx.doi.org/10.4071/isom-2013-ta53.

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Miniaturization of everyday products has been driving sales for some time and continues to fuel the consumer market. Everyone expects size reduction with each new product generation [1], [2]. Almost everything has electronics inside that must get smaller. There is no market demanding smaller devices that are faster, more capable, more feature-rich than that of the hearing aid industry. While radios, Bluetooth wireless systems and other accessories are added to hearing instruments feature lists, the consumer nonetheless continues to wish for them to be even smaller. Advancements in circuit fabr

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38

IMOTO, Akira, and Kazumasa FURUHASHI. "Ceramic Printed Circuit Board Material." Circuit Technology 9, no. 7 (1994): 531–40. http://dx.doi.org/10.5104/jiep1986.9.531.

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39

Weinhold, M. "Quo Vadis Printed (Circuit) Board?" Circuit World 16, no. 1 (1989): 13–18. http://dx.doi.org/10.1108/eb046064.

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40

Taylor, John. "ELCID (Electronic Circuit Board Discriminator)." Electronics Education 1996, no. 3 (1996): 35–37. http://dx.doi.org/10.1049/ee.1996.0079.

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41

Chevalier, Phillipe B., and Lawrence M. Wein. "Inspection for Circuit Board Assembly." Management Science 43, no. 9 (1997): 1198–213. http://dx.doi.org/10.1287/mnsc.43.9.1198.

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42

Lee, Junseok, and Youngsu Cha. "Flexible printed circuit board actuators." Smart Materials and Structures 26, no. 12 (2017): 125019. http://dx.doi.org/10.1088/1361-665x/aa9557.

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43

Oyebola, Blessed Olalekan, and E. Eze Blessing. "Simulation and Implementation of Microcontroller Based Printed Circuit Board Ready Circuits for Technical Training and Demonstration." Asian Journal of Engineering and Applied Technology 7, no. 1 (2018): 29–36. http://dx.doi.org/10.51983/ajeat-2018.7.1.981.

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The paper presents designed and constructed microcontroller based PCB ready on five automation circuits as an attempt to aid technical education on microcontroller circuits’ simulation in Computer Engineering Technology. The designs were of three stages that include circuit design and simulation by using Proteus software, printed circuit board (PCB) production using manual techniques and construction of five selected circuits (Seven Segment to Display Number 0-9, seven Segment Counter to Count 0-99, Matrix Led to Display A-Z, Digital Thermometer and Motion Sensor to Switch 10 Points of Loads)

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Bernstein, Kerry. "Circuit Responses to Radiation-Induced Upsets." MRS Bulletin 28, no. 2 (2003): 126–30. http://dx.doi.org/10.1557/mrs2003.40.

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AbstractHistorically, radiation-induced corruption of data in high-speed complementary metal oxide semiconductor designs has been limited to on-board static random-access memory in various memory caches. Successive generations of scaling, however, have resulted in capacitance reductions in key logic circuits, increasing their vulnerability to these “soft errors.” Charge delivered by radiation events now carries a substantial probability of inducing upsets, not only in bistable elements, but in logic evaluation circuits as well. This article introduces the reader to common logic-circuit topolog

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Glowka, David A., and Randy A. Normann. "Optimization of a Ceramic Circuit Board Clamp." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (2012): 000394–401. http://dx.doi.org/10.4071/hitec-thp21.

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This paper documents the design optimization of a board-mounting system for securing a ceramic or other heavy circuit board to the electronics chassis in a wireline logging tool. A clamp fixes the extreme lower end of the circuit board to the chassis while allowing the board and chassis to undergo differential thermal expansion above that fixed point, through the use of sliding board mounts. After developing equations that describe the stress, deflection, and thermal expansion of the clamp/board assembly, they are used to select the geometry and material options available in the design. Result

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Yudachev, S. S., S. S. Sitnikov, and F. M. Bosy. "Digitalization of production in Altium Designer software." Glavnyj mekhanik (Chief Mechanic), no. 6 (May 25, 2021): 34–42. http://dx.doi.org/10.33920/pro-2-2106-03.

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A method for modeling and printed circuit board layout in the form of a 3D model in one of the digital solutions designed for this task, Altium Designer, is proposed. The practical significance of the work is the study of the basic software libraries in terms of their creation, filling and application when working with the project, as well as of the algorithm for constructing an electrical circuit in the Altium Designer program, layout and design of the simplest circuit on the board. In the course of the work, the algorithm and rules for creating a library of three-dimensional models of compon

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Ravim and Suma K. V. "Low Noise EEG Amplifier Board for Low Cost Wearable BCI Devices." International Journal of Biomedical and Clinical Engineering 5, no. 2 (2016): 17–28. http://dx.doi.org/10.4018/ijbce.2016070102.

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Designing a real-time BCI device requires an Electroencephalogram (EEG) acquisition system and a signal processing system to process that acquired data. EEG acquisition boards available in market are expensive and they are required to be connected to computer for any processing work. Various low cost Digital Signal Processor (DSP) boards available in market come with internal Analog to Digital converters and peripheral interfaces. The idea is to design a low cost EEG amplifier board that can be used with these commercially available DSP boards. The analog data from EEG amplifier can be convert

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Nevliudov, Igor, Evgeny Razumov-Fryzyuk, Dmytro Nikitin, Danila Bliznyuk, and Roman Strelets. "TECHNOLOGY FOR CREATING THE TOPOLOGY OF PRINTED CIRCUIT BOARDS USING POLYMER 3D MASKS." Innovative Technologies and Scientific Solutions for Industries, no. 1 (15) (March 31, 2021): 120–31. http://dx.doi.org/10.30837/itssi.2021.15.120.

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The subject of research is the influence of factors of exposure of two-dimensional images on the topology of conductors in the manufacture of printed circuit boards by the method of three-dimensional polymer photomasks. The purpose of the work is ensuring the accuracy and preservation of the geometric dimensions of the conductors of printed circuit boards during LCD exposure of masks on the work piece. To achieve this goal, it is necessary to solve the following tasks: to analyze photolithography technology and types of polymer 3D printing; to develop a technological process for exposing photo

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Wallace, D. B. "Automated Electronic Circuit Manufacturing Using Ink-Jet Technology." Journal of Electronic Packaging 111, no. 2 (1989): 108–11. http://dx.doi.org/10.1115/1.3226514.

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The feasibility of using ink-jet technology to write circuits on PC board material and TAB substrate has been demonstrated. Several systems were evaluated and the most successful system used paraffin as a resist material on a copper substrate. The copper was etched and the paraffin subsequently removed to form the conductive paths of the circuit. Line widths down to 100μm were achieved, and line widths of 50μm were shown feasible. The generation of the print pattern from a computer file illustrated the potential of coupling a circuit writing system to an electrical CAD system to provide rapid

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Okude, Satoshi, Kazushisa Itoi, Masahiro Okamoto, Nobuki Ueta, and Osamu Nakao. "Active and Passive Devices Embedded in Laminate-Based Multilayer Board." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 001253–83. http://dx.doi.org/10.4071/2012dpc-tp44.

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We have developed active and passive devices embedded multilayer board utilizing our laminate-based WLCSP embedding technology. The proposed embedded board is realized by laminating plural circuit formed polyimide films together by adhesive with thin devices being arranged in between those polyimide layers. The electrical connection via has a filled via structure composed of the alloy forming conductive paste which ensures high reliable connection. The embedded active device is WLCSP which has no solder bump on its pads therefore the thickness of the die is reduced to 80 microns. The embedded

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