Relevant bibliographies by topics / Circuits passifs

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Circuits passifs'

Author: Grafiati
Published: 4 June 2021
Last updated: 18 February 2022

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Journal articles on the topic "Circuits passifs"

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Fouad Hanna, Victor, Joseph Achkar, Odile Picon, Jacques Citerne, M’hamed Drissi, and Chakir Amrani. "Analyse de Circuits Passifs en Technologie Microruban Suspendu." Annales Des Télécommunications 47, no. 11-12 (1992): 515–29. http://dx.doi.org/10.1007/bf02998314.

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Omran, H., M. Madec, B. Bayle, and V. Schuh. "Carte électronique générique à base de compensateurs avance-retard pour les travaux pratiques d’automatique continue." J3eA 18 (2019): 1012. http://dx.doi.org/10.1051/j3ea/20191012.

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Dans le cadre des travaux pratiques d’automatique en première année à Télécom Physique Strasbourg, nous avons conçu une carte électronique unique permettant la réalisation d’une large gamme de correcteurs pour l’asservissement continu sur des systèmes divers : moteur, système de chauffage, lévitation magnétique. La carte est constituée de trois circuits d’entrée permettant l’implémentation d’un filtre du premier ordre, de quatre modules correcteurs constitués chacun d’un compensateur à avance-retard de phase, d’un additionneur et d’un soustracteur, ainsi que de trois sorties. Cette maquette pe
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Wilson, P. R. "Modeling the Non Linear Behavior of a Magnetic Fault Current Limiter." Advanced Electromagnetics 4, no. 3 (2015): 1. http://dx.doi.org/10.7716/aem.v4i3.265.

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Fault Current Limiters are used in a wide array of applications from small circuit protection at low power levels to large scale high power applications which require superconductors and complex control circuitry. One advantage of passive fault current limiters (FCL) is the automatic behavior that is dependent on the intrinsic properties of the circuit elements rather than on a complex feedback control scheme making this approach attractive for low cost applications and also where reliability is critical. This paper describes the behavioral modeling of a passive Magnetic FCL and its potential
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Shen, Yun De, Guang Ma, Il Kwon Oh, and Tai Hong Cheng. "Electromagnetic Material Based Semi-Passive Switching Shunt Damper." Advanced Materials Research 143-144 (October 2010): 424–27. http://dx.doi.org/10.4028/www.scientific.net/amr.143-144.424.

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This paper describes the implementation of semi-passive switching shunt control for electro-magneto-mechanically coupled flexible structures. This simple system consists of a permanent magnet attached to an aluminum beam and a coil placed below the magnet with a switching circuit connected to the end of the coil. The MATLAB Simulink program and dSPACE hardware were employed for realizing the switching mechanism. Switching is done between open-circuit and short-circuits states. When the structure moves away from equilibrium, the circuit is short circuited, thereby dissipating energy, subsequent
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Kondo, Yusuke, Yasushi Shimada, Yoshitaka Hirata, Kazunori Yamamoto, Etsuo Watanabe, and Akira Kuriyama. "High-Frequency Properties of Embedded Passives and Thermal Resistance in Organic Substrates for RF Module." International Journal of Microwave Science and Technology 2010 (April 20, 2010): 1–5. http://dx.doi.org/10.1155/2010/871027.

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Radio Frequency (RF) modules have been miniaturized to meet the demand for smaller and more enhanced handsets for wireless applications such as cellular phones. However, area for passive devices used in RF modules has made further miniaturization difficult. Passives embedded in substrates are now being studied intensively. In addition, circuit simulation technology has been developed that enables efficient designing of RF module circuits. Circuit designers, however, have limited database of organic substrates and embedded passives. Further, optimized thermal designs are required to prevent the
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Chandra Shaker, Pittala, and Avireni Srinivasulu. "Electronic Tuning Square-Wave Generators with Improved Linearity Using Operational Transresistance Amplifier." Journal of Low Power Electronics and Applications 10, no. 2 (2020): 12. http://dx.doi.org/10.3390/jlpea10020012.

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Two new electronic tuning current-mode square-wave generators are introduced in the ensuing paper. In the first proposed square-wave generator circuit, one Operational Trans-resistance Amplifier (OTRA) and two passive components are involved, along with two NMOS depletion mode transistors. This circuit generates a square-wave with almost equal and fixed duty cycles. The second proposed circuit is able to control both on-duty and off-duty cycles independently with the help of two passive components, two NMOS depletion mode transistors, and two diodes connected to the circuit. The frequency of t
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Jiménez, Alejandro Dueñas, and Francisco Jiménez Hernández. "Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams." JOURNAL OF ADVANCES IN PHYSICS 5, no. 1 (2014): 737–41. http://dx.doi.org/10.24297/jap.v5i1.1972.

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Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were
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Tairidis, Georgios K. "Vibration control of smart composite structures using shunted piezoelectric systems and neuro-fuzzy techniques." Journal of Vibration and Control 25, no. 18 (2019): 2397–408. http://dx.doi.org/10.1177/1077546319854588.

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Shunt piezoelectric circuits can be used in several combinations for passive control of smart structures. Resonant shunt circuits with resistors and inductors can control resonant frequencies, by consuming the energy produced from vibrations by passing it to electric components. Such systems are very efficient for single-mode problems; however, when it comes to multi-mode control, their performance drastically deteriorates. The purpose of the present study is the development of optimized resonant shunt piezoelectric circuits, along with an intelligent control system based on adaptive neuro-fuz
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SOLIMAN, AHMED M. "HISTORY AND PROGRESS OF THE TOW THOMAS BI-QUADRATIC FILTER PART III: GENERATION USING NAM EXPANSION." Journal of Circuits, Systems and Computers 19, no. 03 (2010): 529–48. http://dx.doi.org/10.1142/s021812661000627x.

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A new generation method of the Tow-Thomas (TT) circuit based on the nodal admittance matrix (NAM) expansion is given. The family of TT circuits defined includes four different types of generated circuits. All the advantages of the classical TT circuit namely, independent control on the frequency, selectivity factor Q and gain, besides having very low passive sensitivities are maintained. Besides, each of the family members of the generated circuits use grounded passive elements and has very high input impedance. It is found that there are eight circuits in each type implying a total of 32 TT c
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Hruboš, Zdeněk, and Tomáš Gotthans. "Analysis and Synthesis of Chaotic Circuits using Memristor Properties." Journal of Electrical Engineering 65, no. 3 (2014): 129–36. http://dx.doi.org/10.2478/jee-2014-0020.

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Abstract This paper provides an innovative practical realization of a memristor based chaotic circuit. The first part discusses the mathematical analysis of the proposed system, including calculation of an eigenvalues, bifurcation diagram and largest Lyapunov exponents. Another parts deal with circuitry realization and the influence of parasitic properties of active elements. The circuit simulations obtained by PSpice environment and the practical measurement results on a breadboard are presented in the last part of this paper. The main aim of this work is an innovative realization of the memr
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Dissertations / Theses on the topic "Circuits passifs"

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Saadaoui, Mohamed. "Optimisation des circuits passifs micro-ondes suspendus sur membrane diélectrique." Phd thesis, Université Paul Sabatier - Toulouse III, 2005. http://tel.archives-ouvertes.fr/tel-00011358.

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Les travaux présentés dans ce mémoire traite du développement et de l'optimisation de nouvelles filières technologiques d'élaboration de circuits micro-ondes suspendus sur membrane diélectrique. Cette élaboration passe par l'étude physique, mécanique et électrique de nouveaux matériaux susceptibles de répondre aux cahiers des charges. Nous proposons la filière technologique basée sur la fabrication de membranes épaisses à partir des dépôts par plasma. L'intérêt majeur de cette technologie est d'améliorer la fiabilité mécanique du composant. Les résultats en terme de caractérisation fréquentiel
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Richard, Mikaël. "Développement des composants passifs pour les circuits MMICs en GaN." Paris 6, 2009. http://www.theses.fr/2009PA066677.

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Le développement des matériaux à grand gap comme le nitrure de gallium (GaN) ces dernières années a permis d’augmenter de manière spectaculaire les densités de puissance disponible. Ce mémoire traite du développement de composants passifs pour les circuits MMIC en GaN. Ces composants ont été simulés, fabriqués, modélisés et implémentés dans un kit de conception pour la réalisation de nombreux circuits MMIC dans le cadre du projet européen Korrigan. Un second aspect de ce travail est l’utilisation de matériaux diélectriques à forte permittivité qui permettent d’augmenter les densités surfacique
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Crespin, Marie. "Contribution à l'étude de la miniaturisation des circuits passifs radiofréquences : application aux circuits d'accès aux antennes." Nantes, 2006. http://www.theses.fr/2006NANT2089.

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Le développement des systèmes de communication mobiles et le nombre toujours croissant de services accessibles depuis un même terminal imposent le développement de technologies multistandards reconfigurables toujours plus performantes. Cela implique l’optimisation des structures aussi bien en terme de performances que d’encombrement. Si les technologies d’intégration monolithique ont permis la réalisation compacte des principales fonctions du frontal radio, son volume est maintenant limité par les circuits d’interconnexion entre ces fonctions et les circuits d’accès aux antennes. Ces travaux o
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Guilloton, Laurent. "Contribution au développement d'une CAO pour les circuits optiques : Mise en œuvre et application aux circuits passifs." Grenoble INPG, 2005. http://www.theses.fr/2005INPG0076.

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Apres avoir introduit les specificites des differents outils de cao optiques existants, on contribue au developpement d'une approche orientee "circuit" basee sur l'utilisation de matrices-s apres sa generalisation pour les composants optiques grace a l'utilisation du formalisme de la matrice de jones. Plusieurs composants passifs tels que guide, miroir, isolateur ou encore coupleur optique ont ete modelises tout d'abord de maniere descriptive, puis de maniere plus technologique en inserant dans chacun des modeles les specificites liees a la technologie de fabrication. On genere ainsi une bibli
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Piquet, Jérôme. "Caractérisation et modélisation HF de composants passifs MIM intégrés pour circuits avancés." Chambéry, 2007. http://www.theses.fr/2007CHAMS012.

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Les travaux présentés ici portent sur l'étude des, composants passifs fortement intégrés et plus particulièrement sur les capacités MIM (Métal-Isolant-Métal) de type damascène. Leur compatibilité avec les technologies microélectroniques, fiCUS a conduit a étudier cette nouvelle architecture de capacité intégrant du Si3N4 afin de préparer les prochaines générations de circuits intégrés. Nous avons développé plusieurs méthodes de caractérisation de la capacité MIM sur une large bande de fréquence (40MHz- 400Hz). C'est ainsi que plusieurs approches permettant de définir différents modèles équival
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Emonin, Stéphanie. "Analyse de circuits optiques passifs et actifs en microscopie a sonde locale." Dijon, 1998. http://www.theses.fr/1998DIJOS038.

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Le principal objectif de cette étude est de montrer que les microscopes à sonde locale sont tout-à-fait adaptés à la caractérisation de circuits optiques passifs et actifs de l'optique intégrée, que ce soit par une utilisation individuelle des microscopes AFM (atomic force microscope) et PSTM (photon scanning tunneling microscope) ou par le couplage de deux techniques AFM/LFM (lateral force microscope) et AFM/PSTM. Dans un premier chapitre, nous déterminons les longueurs d'onde de coupure de guides d'ondes planaires à gradient d'indice grâce a un PSTM. A l'aide d'une méthode numérique adaptée,
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Takacs, Alexandru. "Contribution à la conception de circuits passifs à faibles pertes d'insertion en ondes millimétriques." Toulouse, INPT, 2004. http://www.theses.fr/2004INPT013H.

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Ce travail présente notre contribution à la conception de circuits passifs à faibles pertes en ondes millimétriques en utilisant un substrat à membrane de silicium. Premièrement nous proposons une topologie originale à iris résonants pour des filtres diplexeurs à très faibles pertes utilisables dans les télécommunications spatiales. Nous proposons également deux méthodes d'optimisation (par approximation successive et une méthode évolutive basée sur les algorithmes génétiques) pour ces filtres. Puis en utilisant une structure combinant deux transitions progressives (guide rectangulaire-guide n
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Nongaillard, Matthieu. "Contribution à des règles de dessin pour la fabrication de circuits intégrés passifs PICS." Lyon, INSA, 2010. http://theses.insa-lyon.fr/publication/2010ISAL0047/these.pdf.

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Depuis l'avènement des premiers circuits intégrés, l'industrie du semiconducteur s'efforce constamment de miniaturiser la taille des composants électroniques. Les sociétés NXP et IPDiA conçoivent depuis plusieurs années des systèmes "sb-SiP" (silicon-based System in Package) qui permettent d'assembler dans un même boîtier des puces actives sur une puce passive. Ce concept repose principalement sur la technologie PICS (Passive Integration Connective Substrate) qui est dédiée à l'intégration de composants passifs et plus particulièrement des capacités de fortes valeurs. La problématique de la fi
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Lorthioir, Alain. "Méthode de simulation de circuits hautes fréquences et microondes à partir d'une pile "LIFO" : application à l'étude de filtres passifs." Lille 1, 1993. http://www.theses.fr/1993LIL10032.

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Parment, Frédéric. "Guides d’onde Intégrés au Substrat (SIW) multicouches à haute performance pour des circuits millimétriques à faible coût." Thesis, Université Grenoble Alpes (ComUE), 2016. http://www.theses.fr/2016GREAT077/document.

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La technologie SIW, introduite dans les années 2000, suscite aujourd’hui un très vif intérêt pour la conception de circuits micro-ondes compacts, intégrés, faible coût et blindés par nature. Cependant, les guides d’onde métalliques, qui offrent de bien meilleures performances en termes de pertes d’insertion et de tenue en puissance, malgré un coût bien plus important, sont encore incontournables pour de nombreuses applications millimétriques. Afin de proposer une alternative intégrée et faible coût au guide d’onde rectangulaire, et de permettre une large exploitation du spectre millimétrique,
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Books on the topic "Circuits passifs"

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Rizzi, Peter A. Microwave engineering: Passive circuits. Prentice Hall, 1988.

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Microwave engineering: Passive circuits. Prentice-Hall, 1988.

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Besser, Les. Practical RF circuit design for modern wireless systems: Passive circuits and systems ; volume 1. Artech House, 2004.

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Passive RF & microwave integrated circuits. Newnes, 2003.

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S, Raghuvanshi G., ed. Microwave circuits and passive devices. Wiley, 1987.

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Marston, R. M. Newnes passive and discrete circuits. 2nd ed. Newnes, 2000.

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CMOS circuits for passive wireless microsystems. Springer, 2011.

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Helszajn, J. Microwave planar passive circuits and filters. J. Wiley, 1994.

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Yuan, Fei. CMOS Circuits for Passive Wireless Microsystems. Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-7680-2.

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Ahn, Hee-Ran. Asymmetric passive components in microwave integrated circuits. Wiley-Interscience, 2006.

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Book chapters on the topic "Circuits passifs"

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Barker, Derek C. "Passive circuits." In MINNIE and HSpice for Analogue Circuit Simulation. Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3122-3_2.

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Karmakar, Ayan, and Kamaljeet Singh. "Passive Circuits." In Si-RF Technology. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-8051-8_3.

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Brand, John R. "Passive Circuits." In Handbook of Electronics Formulas, Symbols, and Definitions. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4684-6491-7_1.

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Tietze, Ulrich, Christoph Schenk, and Eberhard Gamm. "Passive Components." In Electronic Circuits. Springer Berlin Heidelberg, 2008. http://dx.doi.org/10.1007/978-3-540-78655-9_26.

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May, Colin. "DC Circuits." In Passive Circuit Analysis with LTspice®. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-38304-6_2.

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May, Colin. "RC Circuits." In Passive Circuit Analysis with LTspice®. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-38304-6_8.

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Chen, Wenhua, Karun Rawat, and Fadhel M. Ghannouchi. "Multiband RF Passive Circuits." In Multiband RF Circuits and Techniques for Wireless Transmitters. Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-662-50440-6_4.

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Penin, A. "Passive Multi-port Circuits." In Power Systems. Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-28451-4_8.

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Penin, A. "Passive Multi-port Circuits." In Power Systems. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-35366-7_8.

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Hrníčko, F., and M. Pavel. "Analysis of Passive Circuit Elements." In Microwave Integrated Circuits. Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1224-6_2.

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Conference papers on the topic "Circuits passifs"

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Sorkin, Alexander, Chris Pawlowicz, Alex Krechmer, and Michael W. Phaneuf. "Circuit Tracing on Integrated Circuit Using FIB Passive Voltage Contrast Effect." In ISTFA 2015. ASM International, 2015. http://dx.doi.org/10.31399/asm.cp.istfa2015p0092.

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Abstract Competitive circuit analysis of Integrated Circuits (ICs) is one of the most challenging types of analysis. It involves multiple complex IC die de-processing/de-layering steps while keeping precise planarity from metal layer to metal layer. Each step is followed by Scanning Electron Microscope (SEM) imaging together with mosaicking that subsequently passes through an image recognition and Graphic Database System (GDS) conversion process. This conventional procedure is quite time and resource consuming. The current paper discusses and demonstrates a new inventive methodology of circuit
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Henderson, Rashaunda M., and Michael F. Petras. "Integrated Passives for Commercial Wireless Applications (Invited Paper)." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73499.

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This paper discusses the modeling, design and performance of inductors and capacitors fabricated in high density interconnect (HDI), low temperature co-fired ceramic (LTCC) and silicon (Si) integrated circuit technologies. Scalable models demonstrate the capability of designing LC-based resonators and filters for use in cellular front-end modules. The performance of the circuits is presented along with size comparisons.
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Sunappan, Vasudivan, Chee Wai Lu, Lai Lai Wai, Wei Fan, and Boon Keng Lok. "A Novel Discrete Passives Integration on Organic Substrate." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73102.

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A novel process has been developed to embed discrete (surface mountable) passive components like capacitors, resistors and inductors using printed circuit board fabrication technology. The process comprises of mounting passive components on top surface of a core PCB (printed circuit board) material using surface mount technology. The passive components mounting were designed in multiple clusters within the PCB. Dielectric sheets are sandwiched between top surface of core PCB and second PCB material for lamination process. A direct interconnection of the passive components to one or more integr
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Mulder, Randal. "A Case Study—Improving FIB Passive Voltage Contrast Imaging for Deep N-Well Circuits." In ISTFA 2015. ASM International, 2015. http://dx.doi.org/10.31399/asm.cp.istfa2015p0364.

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Abstract This paper presents a case study of a customer return that failed functional testing on the production tester. Investigation by applications and design engineering identified several analog circuit blocks where a possible failure mechanism could be located causing the functional failure mode seen at test. The identified circuit blocks all resided in deep n-well structures preventing traditional passive voltage contrast imaging (PVC) from being used to isolate the fault location. Neither functional probing nor active voltage contrast imaging were viable options to isolate the failure m
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Chincholkar, Mandar M., and Jeffrey W. Herrmann. "Modeling the Impact of Embedding Passives on Manufacturing System Performance." In ASME 2002 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. ASMEDC, 2002. http://dx.doi.org/10.1115/detc2002/dfm-34174.

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With the miniaturization of electronic products, reducing the size of the printed circuit board that forms the backbone of the product is paramount. Embedding passive components, which otherwise occupy valuable “real estate” atop the printed circuit board, into the printed circuit board substrate itself is one way of achieving this objective. This first part of this paper examines the techniques and advantages of embedding passives. Embedding passives also affects manufacturing system performance, due to a change in the processing sequence and changes to the processing times at resources. The
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Khalkhali, H., S. Mohammadi, L. P. B. Katehi, and K. Kurabayashi. "Design and Analysis of Micromachined Thermosyphon for Cooling of High-Power InP HBT Circuits." In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-41108.

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Integrated InP heterojunction bipolar transistors (HBTs) are used as a high-speed switch in high-power radio frequency (RF) circuits for microwave wireless communications. The power dissipation of each of these devices often reaches as high as 1 W, raising concerns for their thermal reliability. The relatively poor thermal conductivity of InP prohibits effective spreading of heat within the device substrate. To address this problem, this work proposes a novel microfluidic device called the “micro thermosyphon” for cooling the InP-based microwave circuits. This paper describes the concept of th
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Scarborough, Lloyd H., Christopher D. Rahn, Edward C. Smith, and Kevin L. Koudela. "Coupled Pitch Links for Multi-Harmonic Isolation Using Fluidic Circuits." In ASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/detc2012-70334.

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Replacing rigid pitch links on rotorcraft with coupled fluidic devices has the potential to reduce the aerodynamic blade loads transmitted through the pitch links. Analytical models of two fluidic devices coupled with three different fluidic circuits are derived. These passive fluidlastic systems are tuned, by varying the fluid inertances and capacitances of each fluidic circuit, to reduce the transmitted pitch-link loads for up to three main-rotor harmonics. The simulation results show loads reduction at the targeted odd and even harmonics of at least 95% and 72%, respectively.
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Tsai, Meng-Shiun, Tai-Yen Hwang, and Hao-Wei Nien. "Optimal and Robust Control of Enhanced Active Constrained Layer Treatment With Passive Shunt Circuit Under Consideration of Temperature Effect." In ASME 2007 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/detc2007-34683.

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The optimal and robust H∞ control designs for the enhanced active constrained layer treatment (EACL) and the EACL system with passive shunt circuits (EACL-Shunt) are analyzed in this paper. The GHM method is adopted to model the dynamic behavior of the viscoleastic layer in EACL which is highly dependent on temperature. The system variations due to temperature changes are modeled as system uncertainties. Root locus technique is applied to analyze the stability problem when temperature changes. It is shown that the added shunt circuit on the EACL can indeed improve system robustness (reduced un
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Onete, Cristian E., and Maria Cristina C. Onete. "Reconfiguring Passive Linear Circuits." In 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD). IEEE, 2018. http://dx.doi.org/10.1109/smacd.2018.8434870.

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"Session C7: Passive Circuits." In 15th International Conference on Microwaves, Radar and Wireless Communications. IEEE, 2004. http://dx.doi.org/10.1109/mikon.2004.1358481.

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You might also be interested in the extended bibliographies on the topic 'Circuits passifs' for particular source types:
Journal articles Dissertations / Theses Books
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