Academic literature on the topic 'Cml pfd'
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Journal articles on the topic "Cml pfd"
Abbas, Waseem, Zubair Mehmood, and Munkyo Seo. "A V-Band Phase-Locked Loop with a Novel Phase-Frequency Detector in 65 nm CMOS." Electronics 9, no. 9 (September 13, 2020): 1502. http://dx.doi.org/10.3390/electronics9091502.
Full textGunes, Adalet Meral, Frédéric Millot, Krzysztof Kalwak, Birgitte Lausen, Petr Sedlacek, Birgitte Versluijs, Michael Dworzak, Barbara De Moerloose, and Meinolf Suttorp. "Features and Outcome of Chronic Myeloid Leukemia (CML) at Very Young Age: Data from the International Pediatric CML Registry (I-CML-Ped Study)." Blood 132, Supplement 1 (November 29, 2018): 1748. http://dx.doi.org/10.1182/blood-2018-99-112905.
Full textMillot, Frédéric, Meinolf Suttorp, Joelle Guilhot, Pietr Sedlacek, Evelina S. De Bont, Chi Kong Li, Krzysztof Kalwak, et al. "The International Registry for Chronic Myeloid Leukemia (CML) in Children and Adolescents (I-CML-Ped-Study): Objectives and Preliminary Results." Blood 120, no. 21 (November 16, 2012): 3741. http://dx.doi.org/10.1182/blood.v120.21.3741.3741.
Full textPark, Boumyoung, Hyunseop Lee, Kihyun Park, Heondeok Seo, Haedo Jeong, Hoyoun Kim, and Hyoungjae Kim. "Fixed Abrasive Pad with Self-conditioning in CMP Process." Journal of the Korean Institute of Electrical and Electronic Material Engineers 18, no. 4 (April 1, 2005): 321–26. http://dx.doi.org/10.4313/jkem.2005.18.4.321.
Full textMillot, Frédéric, Joelle Guilhot, Meinolf Suttorp, Petr Sedlacek, Eveline S. J. M. de Bont, Chi Kong Li, Krzysztof Kalwak, et al. "The Experience of the International Registry for Chronic Myeloid Leukemia (CML) in Children and Adolescents (I-CML-Ped Study): Pronostic Consideration." Blood 124, no. 21 (December 6, 2014): 521. http://dx.doi.org/10.1182/blood.v124.21.521.521.
Full textPak, Byeongjun, Dasol Lee, Seonho Jeong, Hyunjin Kim, and Haedo Jeong. "Finite Element Analysis on Dynamic Viscoelasticity of CMP Polishing Pad." Journal of the Korean Society for Precision Engineering 36, no. 2 (February 1, 2019): 177–81. http://dx.doi.org/10.7736/kspe.2019.36.2.177.
Full textPark, Ki-Hyun, Hyoung-Jae Kim, Jae-young Choi, Heon-deok Seo, and Hae-do Jeong. "The Effects of Groove Dimensions of Pad on CMP Characteristics." Transactions of the Korean Society of Mechanical Engineers A 29, no. 3 (March 1, 2005): 432–38. http://dx.doi.org/10.3795/ksme-a.2005.29.3.432.
Full textChoi, Gwon-Woo, Nam-Hoon Kim, Yong-Jin Seo, and Woo-Sun Lee. "CMP Properties of Oxide Film with Various Pad Conditioning Temperatures." Journal of the Korean Institute of Electrical and Electronic Material Engineers 18, no. 4 (April 1, 2005): 297–302. http://dx.doi.org/10.4313/jkem.2005.18.4.297.
Full textEGAMI, Kazutaka, Syuhei KUROKAWA, Toshiro DOI, Osamu OHMSHI, Midhio UNEDA, and Kazunori KADOMURA. "907 Condition of Grain on CMP Conditioner and Pad Surface Analysis." Proceedings of Conference of Kyushu Branch 2012.65 (2012): 319–20. http://dx.doi.org/10.1299/jsmekyushu.2012.65.319.
Full textde Cortazar, Victor Garcia, and Gabino Reginato. "Yield, PFD Interception, and Crop Load Relationships in `Royal Gala' Apples." HortScience 41, no. 4 (July 2006): 1010A—1010. http://dx.doi.org/10.21273/hortsci.41.4.1010a.
Full textDissertations / Theses on the topic "Cml pfd"
SUN, TING. "Pad-Wafer and Brush-Wafer Contact Characterization in Planarization and Post-Planarization Processes." Diss., The University of Arizona, 2009. http://hdl.handle.net/10150/194898.
Full textMu, Yan, and Yan Mu. "Slurry Mean Residence Time Analysis and Pad-Wafer Contact Characterization in Chemical Mechanical Planarization." Diss., The University of Arizona, 2016. http://hdl.handle.net/10150/621459.
Full textMohamed, Mohamed Ali. "Les facteurs explicatifs du rendement scolaire dans l'enseignement primaire aux îles Comores, la contribution des enseignants des classes de CM1 et de CM2." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 2000. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape3/PQDD_0021/NQ55822.pdf.
Full textGuay, Daniel. "Étude thermodynamique des systèmes monomoléculaires mixtes CHL a/a-TQ, CHL a/PQ 2, CHL a/PQ 3 et CHL a/PQ 9 à l'interface air-eau." Thèse, Université du Québec à Trois-Rivières, 1986. http://depot-e.uqtr.ca/6047/1/000556260.pdf.
Full textKusznir, James. "CLM as a smart home middleware." Pullman, Wash. : Washington State University, 2010. http://www.dissertations.wsu.edu/Thesis/Spring2010/j_kusznir_042110.pdf.
Full textTitle from PDF title page (viewed on July 9, 2010). "School of Electrical Engineering and Computer Science." Includes bibliographical references (p. 46-48).
Broutin, Clémentine. "Electron Measurements and Search for Higgs Bosons in Multi-Lepton Channels with the CMS Experiment at LHC." Palaiseau, Ecole polytechnique, 2011. http://pastel.archives-ouvertes.fr/docs/00/61/75/14/PDF/these_cbroutin2.pdf.
Full textThis thesis presents three years of work with the CMS experiment, in the context of the first LHC collisions. Electron objects were studied in particular, as major tools for multi-lepton analyses, in particular the H → ZZ(∗) → 4ℓ analysis. During the first months of collisions, we took part in the validation of data registered by the electromagnetic calorimeter. We also measured the efficiency of the level-1 electron and photon trigger during the whole 2010 year. The plateau efficiency is of 99. 6 % (resp. 98. 5 %) on electrons in the barrel part (resp. In the endcap part) of the calorimeter. In order to optimize the discovery potential, we built a new electron charge measurement algorithm. In CMS, this measurement is affected by the large amount of material present in the inner tracker. The performance of this algorithm was measured on 2010 data, for electrons from Z boson decay passing a standard selection. The probability of charge mis-identification is of 1. 06 % (0. 19 % with a specific selection), in agreement with the simulation. The physics analysis that was built during this PhD searches doubly charged Higgs bosons decaying into lepton pairs. For the amount of data registered in 2010, one background event is expected to pass the selection, while the amount of signal events depends on the mass hypothesis and on the model. One event was found on data, in agreement with the background expectation, hence the signal was excluded on larger mass ranges than previous experiments: a mass limit was set between 122 GeV and 176 GeV, depending on the model
Cook, Kathryn. "Learner control and user-interface interactions in CMC courses." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 2001. http://www.collectionscanada.ca/obj/s4/f2/dsk3/ftp04/NQ63620.pdf.
Full textSun, Yan. "Business-oriented Software Process Improvement based on CMM and CMMI using QFD." Diss., Rolla, Mo. : University of Missouri-Rolla [sic] [Missouri University of Science and Technology], 2008. http://scholarsmine.mst.edu/thesis/pdf/Sun_09007dcc8047a90b.pdf.
Full textDegree granted by Missouri University of Science and Technology, formerly known as the University of Missouri-Rolla. Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed April 29, 2008) Includes bibliographical references (p. 108-111).
Jean, David. "CDL+CWS, un langage de prototype et son environnement." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape11/PQDD_0002/MQ40593.pdf.
Full textSegui, Jacob A. "Propriétés photovoltaïques des cellules en sandwich ITO/CdS/Chl ® /Ag." Thèse, Université du Québec à Trois-Rivières, 1992. http://depot-e.uqtr.ca/5365/1/000597808.pdf.
Full textBooks on the topic "Cml pfd"
Firth, Helen V., Jane A. Hurst, and Judith G. Hall. Pregnancy and fertility. Oxford University Press, 2011. http://dx.doi.org/10.1093/med/9780192628961.003.0203.
Full textSchwingungen von Windenergieanlagen 2019. VDI Verlag, 2019. http://dx.doi.org/10.51202/9783181023464.
Full textStrayer, Robert W. Ways of the World : A Brief Global History with Sources, 2e CMB & Launch Pad HistoryClass for Ways of the World: A Brief Global History with Sources, 2e CMB. Bedford/St. Martin's, 2013.
Find full textBook chapters on the topic "Cml pfd"
Liao, Yunn Shiuan, M. Y. Tsai, James C. Sung, and Y. L. Pai. "Single Diamond Dressing Characteristics of CMP Polyurethane Pad." In Advances in Abrasive Technology IX, 151–56. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-416-2.151.
Full textTso, Pei Lum, and Y. L. Pai. "Amorphous Diamond Dresser for CMP Fixed Abrasives Pad." In Advances in Abrasive Technology IX, 157–62. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-416-2.157.
Full textZhou, Zhao Zhong, Ju Long Yuan, Bing Hai Lv, and Jia Jin Zheng. "Study on Pad Conditioning Parameters in Silicon Wafer CMP Process." In Advances in Grinding and Abrasive Technology XIV, 309–13. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-459-6.309.
Full textSung, James C., and Ming Chi Kan. "The In-Situ Dressing of CMP Pad Conditioners with Novel Coating Protection." In Progress in Powder Metallurgy, 1133–36. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-419-7.1133.
Full textLuo, Jianfeng, and David A. Dornfeld. "Material Removal Mechanism in CMP: A Comprehensive Model of Abrasive Particle, Pad Asperity and Wafer Interactions." In Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication, 53–95. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-07928-7_3.
Full textLuo, Jianfeng, and David A. Dornfeld. "Material Removal Regions in CMP: Coupling Effects of Slurry Chemicals, Abrasive Particle Size Distribution and Wafer-Pad Contact Area." In Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication, 115–45. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-07928-7_5.
Full textCook, Lee M. "Chapter 6 CMP Consumables II: Pad." In Semiconductors and Semimetals, 155–81. Elsevier, 1999. http://dx.doi.org/10.1016/s0080-8784(08)62570-3.
Full textSeo, Jihoon. "Chemical Mechanical Planarization-Related to Contaminants: Their Sources and Characteristics." In Emerging Contaminants [Working Title]. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.94292.
Full textLi, Z. C., E. A. Baisie, X. H. Zhang, and Q. Zhang. "Diamond disc pad conditioning in chemical mechanical polishing." In Advances in Chemical Mechanical Planarization (CMP), 327–57. Elsevier, 2016. http://dx.doi.org/10.1016/b978-0-08-100165-3.00013-9.
Full textLi, Z. C., E. A. Baisie, X. H. Zhang, and Q. Zhang. "Diamond disc pad conditioning in chemical mechanical polishing." In Advances in Chemical Mechanical Planarization (CMP), 383–412. Elsevier, 2022. http://dx.doi.org/10.1016/b978-0-12-821791-7.00014-9.
Full textConference papers on the topic "Cml pfd"
Lim, Donghyun, Hojoong Kim, Bongyoung Jang, Honglae Cho, Junyong Kim, and Hasub Hwang. "A novel pad conditioner and pad roughness effects on tungsten CMP." In 2014 International Conference on Planarization/CMP Technology (ICPT). IEEE, 2014. http://dx.doi.org/10.1109/icpt.2014.7017318.
Full textTano, Hiroyuki, Katsutaka Yokoi, Hideki Nishimura, Ayako Maekawa, Takami Hirao, and Satoshi Kamo. "Advanced Cu CMP pad for reducing scratches." In 2014 International Conference on Planarization/CMP Technology (ICPT). IEEE, 2014. http://dx.doi.org/10.1109/icpt.2014.7017274.
Full textLiu, Yi-Liang, Wu-Sian Sie, Chun-Lin Chen, P. C. Huang, Yu-Ting Li, Renn Guey Lin, Yu Min Lin, et al. "Defect reduction with CMP pad dressing optimization." In 2014 International Conference on Planarization/CMP Technology (ICPT). IEEE, 2014. http://dx.doi.org/10.1109/icpt.2014.7017312.
Full textNg, Dedy, Milind Kulkarni, and Hong Liang. "Roles of Surfactant Molecules in Post-CMP Cleaning." In World Tribology Congress III. ASMEDC, 2005. http://dx.doi.org/10.1115/wtc2005-64358.
Full textBaisie, Emmanuel A., Z. C. Li, and X. H. Zhang. "Finite Element Modeling of Pad Deformation due to Diamond Disc Conditioning in Chemical Mechanical Polishing (CMP)." In ASME 2012 International Manufacturing Science and Engineering Conference collocated with the 40th North American Manufacturing Research Conference and in participation with the International Conference on Tribology Materials and Processing. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/msec2012-7364.
Full textShin, Cheolmin, Sunjae Jang, Hongyi Qin, Jichul Yang, and Taesung Kim. "Characteristic of pad cut rate as conditioner structure." In 2014 International Conference on Planarization/CMP Technology (ICPT). IEEE, 2014. http://dx.doi.org/10.1109/icpt.2014.7017308.
Full textTeodosescu, Petre-Dorel, Mircea Bojan, Denes Fodor, and Richard Marschalko. "Research concerning appropriate PFC methods for classic CFL lighting devices." In 2012 EPE-ECCE Europe Congress. IEEE, 2012. http://dx.doi.org/10.1109/epepemc.2012.6397251.
Full textBaisie, Emmanuel A., Z. C. Li, and X. H. Zhang. "Diamond Disc Pad Conditioning in Chemical Mechanical Polishing: A Literature Review of Process Modeling." In ASME 2009 International Manufacturing Science and Engineering Conference. ASMEDC, 2009. http://dx.doi.org/10.1115/msec2009-84033.
Full textFukuda, Akira, and Masahito Mitarai. "Visualization of slurry flow in polishing pad asperity area." In 2014 International Conference on Planarization/CMP Technology (ICPT). IEEE, 2014. http://dx.doi.org/10.1109/icpt.2014.7017288.
Full textLi, Z. C., Emmanuel A. Baisie, and X. H. Zhang. "Diamond Disc Pad Conditioning in Chemical Mechanical Planarization (CMP): A Mathematical Model to Predict Pad Surface Shape." In ASME 2011 International Manufacturing Science and Engineering Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/msec2011-50149.
Full textReports on the topic "Cml pfd"
Chapman, Ray, Phu Luong, Sung-Chan Kim, and Earl Hayter. Development of three-dimensional wetting and drying algorithm for the Geophysical Scale Transport Multi-Block Hydrodynamic Sediment and Water Quality Transport Modeling System (GSMB). Engineer Research and Development Center (U.S.), July 2021. http://dx.doi.org/10.21079/11681/41085.
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