Relevant bibliographies by topics / Co-bonding

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Co-bonding'

Author: Grafiati
Published: 4 June 2021
Last updated: 17 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Co-bonding.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Co-bonding"

1

Bu, Yuxiang, and Zhaohua Cao. "Structures and Bonding Character of Ge···CO Weakly Bonding Complexes." Journal of Physical Chemistry B 106, no. 7 (2002): 1613–21. http://dx.doi.org/10.1021/jp014095i.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Boyanov, B. I., P. T. Goeller, D. E. Sayers, and R. J. Newmanich. "Preferential Co–Si bonding at the Co/SiGe(100) interface." Applied Physics Letters 71, no. 21 (1997): 3060–62. http://dx.doi.org/10.1063/1.119436.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Yoo, Soo-Yoen, Seong-Kyun Kim, Seong-Joo Heo, Jai-Young Koak, and Joung-Gyu Kim. "Effects of Bonding Agents on Metal-Ceramic Bond Strength of Co-Cr Alloys Fabricated by Selective Laser Melting." Materials 13, no. 19 (2020): 4322. http://dx.doi.org/10.3390/ma13194322.

Full text
Abstract:
Bonding agents have been developed to improve bond strength between ceramic and Co-Cr metal. The aim of this study was to investigate the influence of two bonding agents on bond strength of Co-Cr metal fabricated by selective laser melting (SLM). Bond strength was determined by a three-point bending test, and the interfaces of the metal and ceramic, before and after the bending test, were observed by optical microscopy and scanning electron microscopy (SEM) to determine the thickness of the oxide layer and amount of ceramic remaining. To analyze the elemental composition of the bonding agents
APA, Harvard, Vancouver, ISO, and other styles
4

Bagus, Paul S., Klaus Hermann, Wolfgang Müller, and Constance J. Nelin. "Nature of the Bonding for Chemisorbed CO." Physical Review Letters 57, no. 12 (1986): 1496. http://dx.doi.org/10.1103/physrevlett.57.1496.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Szuromi, P. "Probing bonding profiles with a CO tip." Science 344, no. 6186 (2014): 868. http://dx.doi.org/10.1126/science.344.6186.868-j.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Bauschlicher, Charles W. "On the bonding in Fe2(CO)9." Journal of Chemical Physics 84, no. 2 (1986): 872–75. http://dx.doi.org/10.1063/1.450532.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Föhlisch, A., M. Nyberg, P. Bennich, et al. "The bonding of CO to metal surfaces." Journal of Chemical Physics 112, no. 4 (2000): 1946–58. http://dx.doi.org/10.1063/1.480773.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Jeung, G. H., and J. Koutecký. "Molecular bonding involving scandium: interaction with CO." Chemical Physics Letters 129, no. 6 (1986): 569–76. http://dx.doi.org/10.1016/0009-2614(86)80402-x.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Cappus, D., J. Klinkmann, H. Kuhlenbeck, and H. J. Freund. "CO on NiO(100): orientation and bonding." Surface Science 325, no. 3 (1995): L421—L427. http://dx.doi.org/10.1016/0039-6028(95)80003-4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Barnes, C. J., and M. Valden. "Bonding and thermal stability of CO on potassium-doped Co(1010)." Journal of Physics: Condensed Matter 1, SB (1989): SB185—SB186. http://dx.doi.org/10.1088/0953-8984/1/sb/034.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Dissertations / Theses on the topic "Co-bonding"

1

Gladh, Jörgen. "Bonding and Desorption Mechanismsof CO on Metal Surfaces." Licentiate thesis, Stockholms universitet, Fysikum, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:su:diva-77218.

Full text
Abstract:
I have investigated two different systems CO/Fe(100) and CO/Ru(0001), toobtain new information on the binding and desorption processes. The twodifferent systems have served as a model system, one for a static examination,CO on iron, and for the dynamic case, CO on ruthenium. To perform theseinvestigations, several types of techniques have been used such as, X-rayabsorption spectroscopy, X-ray emission spectroscopy, and femtosecond laserinduced desorption techniques such as two-pulse correlation. For the CO/Fe(100) system, we found that the on-top CO “<img src="http://www.diva-portal.org/cgi-bi
APA, Harvard, Vancouver, ISO, and other styles
2

Perera, Manomi Dharshika. "Hydrogen and halogen bonding in co-crystallization: from fundamentals to applications." Diss., Kansas State University, 2017. http://hdl.handle.net/2097/36209.

Full text
Abstract:
Doctor of Philosophy<br>Department of Chemistry<br>Christer B. Aakeroy<br>The impact of the molecular electrostatic potential values (MEPs) in halogen and hydrogen bond interactions were explored using two acceptors with multiple acceptor sites with twelve hydrogen-bond donors, five halogen bond donors and four mixed halogen and hydrogen bond donors. The results suggested if the difference between the two acceptor sites is above 38 kJ/mol both hydrogen and halogen bond donors prefer the acceptor site with the highest MEP value and this selectivity was lost if the difference is below 26 kJ/mol.
APA, Harvard, Vancouver, ISO, and other styles
3

Askar, Raid. "The role of tin in surface bonding of CO to Pt(111)." Thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-50842.

Full text
Abstract:
We have used synchrotron radiation based photoelectron spectroscopy to study tin induced modifications in surface bonding of CO to Pt(111). Tin can form both so-called surface alloys, where tin replaces surface platinum atoms and ordered adatom structures where tin stays on top of the surface. The alloy is formed after annealing to 600 °C. The results from Pt(111) are in excellent agreement with previous literature, with CO binding in top site and in bridge site. On Pt(111)-Sn alloys we observe the same species, but with a reduced bridge site emission. Tin does not take direct part in the chem
APA, Harvard, Vancouver, ISO, and other styles
4

Oswald, Iain D. H. "Rationalisation and design of hydrogen bonding patterns in co-crystals and polymorphs." Thesis, University of Edinburgh, 2004. http://hdl.handle.net/1842/15564.

Full text
Abstract:
The crystal structures of five hemiadducts of paracetamol with 1,4-dioxane, N-methylmorpholine, morpholine, N,N-dimethylpiperazine and piperazine, and a related 1:1 adduct of paracetamol with 4,4’-bipyridine are described. All structures are characterised by the formation of chains of paracetamol molecules, linked either via OH…O=C interactions [C(9) chains in graph set notation] or NH..O=C interactions [C(4) chains], depending on the presence or absence of substituent groups on the guest molecule. In all cases except for the morpholine and bipyridine adduct these chains are connected by H-bon
APA, Harvard, Vancouver, ISO, and other styles
5

Jasieczek, Christina Bozena. "Investigation of hydrogen bonding and SHG activity of organic salts and co-crystals." Thesis, University of Sussex, 1996. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.318504.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Moretti, Laure. "Simulation des distorsions de cuisson de pièces composites élaborées par co-bonding en autoclave." Thesis, Ecole nationale des Mines d'Albi-Carmaux, 2019. http://www.theses.fr/2019EMAC0009.

Full text
Abstract:
Les composites stratifiés en fibres de carbone et à matrices thermodurcissables sont, grâce à leurs propriétés spécifiques, des matériaux très performants pour les pièces de structure primaire en aéronautique. Cependant, durant leur élaboration, de nombreux phénomènes multi-physiques conduisent à l’apparition de contraintes et de déformations résiduelles qui impactent la géométrie finale de la pièce. Ces écarts de géométrie sont critiques pour les pièces de grandes dimensions et les assemblages. Il est donc primordial de prédire ces déformations par la simulation. Le travail effectué au cours
APA, Harvard, Vancouver, ISO, and other styles
7

Peng, Xuan. "Co-deformation and bonding of multi-component billets with application to Nb-Sn based superconductor processing." Connect to resource, 2005. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1127096847.

Full text
Abstract:
Thesis (Ph. D.)--Ohio State University, 2005.<br>Title from first page of PDF file. Document formatted into pages; contains xix, 182 p.; also includes graphics (some col.). Includes bibliographical references (p. 177-182). Available online via OhioLINK's ETD Center
APA, Harvard, Vancouver, ISO, and other styles
8

Brown, Suzanne. "THE IMPACT OF BONDING HISTORY AND SOCIAL NETWORKS ON PARENTING COMPETENCE AMONG MOTHERS WITH SUBSTANCE DEPENDENCE OR CO-OCCURRING DISORDERS." Case Western Reserve University School of Graduate Studies / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=case1332866711.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

McMahon, Jennifer Anne. "Crystal engineering of novel pharmaceutical forms." [Tampa, Fla] : University of South Florida, 2006. http://purl.fcla.edu/usf/dc/et/SFE0001792.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Ellis, Jeffrey LeClair. "Dense Carbon Dioxide Assisted Polymer Processing at the Nanoscale." The Ohio State University, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=osu1244033142.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Books on the topic "Co-bonding"

1

Us Supreme Court Transcript Of Record American Bonding Co Of Baltimore. Gale, U.S. Supreme Court Records, 2011.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

Berardo, Ramiro, Isabella Alcañiz, Jennifer Hadden, and Lorien Jasny. Networks and the Politics of the Environment. Edited by Jennifer Nicoll Victor, Alexander H. Montgomery, and Mark Lubell. Oxford University Press, 2016. http://dx.doi.org/10.1093/oxfordhb/9780190228217.013.26.

Full text
Abstract:
This chapter surveys recent research that utilizes the measures and techniques of social network analysis (SNA) to explain socioecological outcomes. The chapter focuses on the role of key characteristics of networks—including density and fragmentation, bonding and bridging social capital, brokerage and leadership—in promoting adaptive governance and co-management, and in turn, successful environmental management outcomes. It argues that network structures affect the ability of actors to coordinate their behavior, cooperate with one another, share information, and adapt their behavior to new ci
APA, Harvard, Vancouver, ISO, and other styles
3

Advanced thermal barrier system bond coatings for use on Ni, Co-, and Fe-base alloy substrates. National Aeronautics and Space Administration, Lewis Research Center, 1985.

Find full text
APA, Harvard, Vancouver, ISO, and other styles

Book chapters on the topic "Co-bonding"

1

Michael, D., P. Mingos, and Lin Zhenyang. "Non-bonding orbitals in co-ordination, hydrocarbon and cluster compounds." In Structure and Bonding. Springer Berlin Heidelberg, 1989. http://dx.doi.org/10.1007/3-540-50775-2_1.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Pacchioni, G., and P. S. Bagas. "CO Chemisorption on Oxide Surfaces: Bonding and Vibrations." In Cluster Models for Surface and Bulk Phenomena. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4684-6021-6_24.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Striewe, Barbara, Martin Hunkel, Axel von Hehl, and Norbert Grittner. "The Bonding Behavior of co-extruded Aluminum-Titanium-Compounds." In ICAA13 Pittsburgh. Springer International Publishing, 2012. http://dx.doi.org/10.1007/978-3-319-48761-8_254.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Striewe, Barbara, Martin Hunkel, Axel von Hehl, and Norbert Grittner. "The Bonding Behavior of Co-Extruded Aluminum-Titanium-Compounds." In ICAA13: 13th International Conference on Aluminum Alloys. John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118495292.ch254.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Baerends, E. J., and A. Rozendaal. "Analysis of σ-Bonding, π-(Foack)Bonding and the Synergic Effect in Cr(CO)6. Comparison of Hartree-Fock and Xα Results for Metal-CO Bonding." In Quantum Chemistry: The Challenge of Transition Metals and Coordination Chemistry. Springer Netherlands, 1986. http://dx.doi.org/10.1007/978-94-009-4656-9_12.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Bhattacharya, Suman, Krishna S. Peraka, and Michael J. Zaworotko. "Chapter 2. The Role of Hydrogen Bonding in Co-crystals." In Monographs in Supramolecular Chemistry. Royal Society of Chemistry, 2018. http://dx.doi.org/10.1039/9781788012874-00033.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Shinn, N. D., and T. E. Madey. "Stimulated Desorption from CO Chemisorbed on Cr(110): Sensitivity to Bonding Changes." In Desorption Induced by Electronic Transitions DIET III. Springer Berlin Heidelberg, 1988. http://dx.doi.org/10.1007/978-3-642-73728-2_30.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Frenking, G., S. Dapprich, T. Meisterknecht, and J. Uddin. "Structure and Bonding of M(CO)3(H2O), M(CO)5(NH3), and M(CO)5(PH3) (M = Cr, Mo, W)1." In Metal-Ligand Interactions in Chemistry, Physics and Biology. Springer Netherlands, 2000. http://dx.doi.org/10.1007/978-94-011-4245-8_4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Nichols, Bridget Satinover, and Daniel J. Flint. "Creating Memories and Bonding through Competitive Shopping: Evidence of Co-creating Experiential Retail Value." In The Customer is NOT Always Right? Marketing Orientationsin a Dynamic Business World. Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-50008-9_52.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Asaji, T., D. Amino, N. Tago, and M. Mizuno. "Proton dynamics in one-dimensional hydrogen-bonding system in molecular co-crystals TMP-D2ca and DMP-H2ca." In HFI / NQI 2010. Springer Netherlands, 2010. http://dx.doi.org/10.1007/978-94-007-1269-0_46.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Co-bonding"

1

Dederich, Douglas N., Kenneth W. Hinkelman, Andrew Albert, and John Tulip. "Effect of CO 2 laser on dentinal bonding." In OE/LASE '90, 14-19 Jan., Los Angeles, CA, edited by Stephen N. Joffe and Kazuhiko Atsumi. SPIE, 1990. http://dx.doi.org/10.1117/12.17488.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Kim, S. H., and Jin Yu. "Wafer to wafer bonding using electroplated Co-Sn solder layer." In 2008 International Conference on Electronic Materials and Packaging (EMAP). IEEE, 2008. http://dx.doi.org/10.1109/emap.2008.4784291.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Aoki, Mayu, Kazuyuki Hozawa, and Kenichi Takeda. "Wafer-level hybrid bonding technology with copper/polymer co-planarization." In 2010 IEEE International 3D Systems Integration Conference (3DIC). IEEE, 2010. http://dx.doi.org/10.1109/3dic.2010.5751471.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. "Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization." In 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2020. http://dx.doi.org/10.1109/eurosime48426.2020.9152679.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Lewis, Steven P., and Andrew M. Rappe. "Quantum-mechanical investigation of bonding and vibrational properties of CO-adsorbed copper." In SPIE's 1995 International Symposium on Optical Science, Engineering, and Instrumentation, edited by Janice M. Hicks, Wilson Ho, and Hai-Lung Dai. SPIE, 1995. http://dx.doi.org/10.1117/12.221502.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Al-Ibadi, Muhsen Abood Muhsen, Duraid Tawfeeq Oraibi та Ahlam Hussein Hasan. "The ruthenium–ruthenium bonding in bridged ligand system: QTAIM study of [Ru3(μ3-κ2-MeImCH) (μ-CO) (CO)9] complex". У THE 7TH INTERNATIONAL CONFERENCE ON APPLIED SCIENCE AND TECHNOLOGY (ICAST 2019). AIP Publishing, 2019. http://dx.doi.org/10.1063/1.5123065.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Dory, Thomas S., Bill Read, Leonel R. Arana, and John M. Heck. "Wafer Level Bonding of MEMS Devices Using Ceramic Lids." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73377.

Full text
Abstract:
Wafer level bonding of MEMS devices is becoming an important packaging technique for small die. Wafer lid bonding simplifies and provides an economical assembly process. One requirement for RF MEMS devices is a hermetic lid, seal material, and sealing process for device reliability. A challenge of this packaging technique is the difference between the lid material CTE, coefficient of thermal expansion, and the silicon device wafer. We selected low temperature co-fired ceramics, LTCC, to evaluate as a potential MEMS lid material for wafer level bonding. This report covers the use of LTCC cerami
APA, Harvard, Vancouver, ISO, and other styles
8

OLIVIER, PHILIPPE, LAURE MORETTI, BRUNO CASTANIE, LEONARD SERRANO, and GÉRARD BERNHART. "Implementation of a Simulation Tool of Strains Induced During the Co-bonding of Autoclave-cured Parts." In American Society for Composites 2019. DEStech Publications, Inc., 2019. http://dx.doi.org/10.12783/asc34/31293.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Eschen, Henrik, and Thorsten Schüppstuhl. "Local Weakening of Honeycomb Core for Improved Surface Quality and Bonding in Co-Cured Sandwich Panels." In AeroTech Europe. SAE International, 2019. http://dx.doi.org/10.4271/2019-01-1859.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Chen, Sihai, Sheng Liu, Mingxiang Chen, et al. "Wafer-Level MEMS Package by Gold-Tin Bonding Method." In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-43467.

Full text
Abstract:
This paper reports some results for an on-going program in wafer-level MEMS package Institute of Microsystems at Huazhong University of Science and Technology. The final goal was to come up with a method usable for various types of MEMS devices in wafer level so that the low cost and high reliability can be achieved at the same time. In this particular paper, three closed-loop microheaters of 5μm, 7μm and 9μm width were designed. By reactive ion sputtering technique, two classes of samples are presented. The first one was first co-sputtered with Ni/Cr and then sputtered with Au metal as heatin
APA, Harvard, Vancouver, ISO, and other styles
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography