Relevant bibliographies by topics / Components assembling

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Components assembling'

Author: Grafiati
Published: 4 June 2021
Last updated: 12 February 2022

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Journal articles on the topic "Components assembling"

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Mullineux, Glen. "Optimization scheme for assembling components." Computer-Aided Design 19, no. 1 (January 1987): 35–40. http://dx.doi.org/10.1016/0010-4485(87)90151-5.

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Carrez, Cyril, Alessandro Fantechi, and Elie Najm. "Assembling components with behavioural contracts." Annales Des Télécommunications 60, no. 7-8 (August 2005): 989–1022. http://dx.doi.org/10.1007/bf03219957.

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Yassine, Noura, and Silvana El-Rabih. "Assembling Components with Probabilistic Lead Times." IOP Conference Series: Materials Science and Engineering 521 (May 29, 2019): 012013. http://dx.doi.org/10.1088/1757-899x/521/1/012013.

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Kang, Yumei, Naiyuan Zhang, Tao Wang, and Yuhang Song. "Assembling Construction Technology of Prefabricated Box Culvert Components." IOP Conference Series: Materials Science and Engineering 735 (January 17, 2020): 012056. http://dx.doi.org/10.1088/1757-899x/735/1/012056.

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Chouali, Samir, Ahmed Hammad, and Hassan Mountassir. "Assembling Components using SysML with Non-Functional Requirements." Electronic Notes in Theoretical Computer Science 295 (May 2013): 31–47. http://dx.doi.org/10.1016/j.entcs.2013.04.003.

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Daneshjo, Naqib, Peter Korba, Renáta Vargová, and Baryalai Tahzib. "Application of 3D Modeling and Simulation Using Modular Components." Applied Mechanics and Materials 389 (August 2013): 957–62. http://dx.doi.org/10.4028/www.scientific.net/amm.389.957.

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This work resolves a real problem of assembling the hold-on component unit with the main product item by closing the riveting operation integrated in the manufacturing process. The finalized component will be used for assembling the newest model power switch in production of this corporation. In this diploma work some possible variants will be provided. The workable solution of the best one will be suggested as a final mechanical problem resolution with detailed description of construction description, component selection and skeleton program design to build a special purpose machinery.
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Shao, Dong Xiang, Bin Li, Guang Lin Wang, Hui Feng Wang, and Zhen Long Zhang. "Development of a New Pressing Machine for Assembling Armature Components of Electro-Hydraulic Servo Valve." Key Engineering Materials 522 (August 2012): 283–87. http://dx.doi.org/10.4028/www.scientific.net/kem.522.283.

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Armature components are the core component of the electro-hydraulic servo valve, and all the components of the armature components require high precision and assembly accuracy. Now, the armature components assembly uses an old-fashioned pressing machine, whose success rate and efficiency are low. This situation wastes a great deal of economic costs and time costs. To improve this situation, the authors develop a new type of automatic assembling machine to achieve automatic and high-precision assembly of the armature component.
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Srinivasan, Hari, and Rajit Gadh. "Efficient Geometric Disassembly of Multiple Components from an Assembly Using Wave Propagation." Journal of Mechanical Design 122, no. 2 (April 1, 2000): 179–84. http://dx.doi.org/10.1115/1.533567.

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This paper analyzes the problem of disassembling multiple selected components from an assembly, defined as selective disassembly, and presents algorithms for efficient disassembly analysis of geometric models. Applications for selective disassembly include assembling, maintenance and recycling. A new approach called ‘Disassembly Wave Propagation’ is proposed to determine a selective disassembly sequence with minimal component removals from an assembly. This approach defines: (i) disassembly waves to topologically arrange the components denoting the disassembly order and (ii) intersection events between the waves to determine the selective disassembly sequences. In order to evaluate a minimal removal sequence in a feasible computation time, algorithms are proposed that prioritize and process the intersection events based on the order in which they occurred. The proposed algorithms analyze selective disassembly from the geometric perspective and are applicable for both two-dimensional and three-dimensional product assemblies. [S1050-0472(00)01402-1]
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Chilom, Gabriela, Andrea Baglieri, Cyndey A. Johnson-Edler, and James A. Rice. "Hierarchical self-assembling properties of natural organic matter’s components." Organic Geochemistry 57 (April 2013): 119–26. http://dx.doi.org/10.1016/j.orggeochem.2013.02.008.

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Lan, Xiangqi, Xiangqian Jiang, Wenhan Zeng, and Liam Blunt. "Construct Surface Characterization System by Assembling Functional Components Dynamically." Procedia CIRP 27 (2015): 198–201. http://dx.doi.org/10.1016/j.procir.2015.04.066.

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Dissertations / Theses on the topic "Components assembling"

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Jaffer, Seema. "Development of modular system structures for assembling microfluidic components of disparate materials /." Burnaby B.C. : Simon Fraser University, 2007. http://ir.lib.sfu.ca/handle/1892/9292.

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Thesis (M.A.Sc.) - Simon Fraser University, 2007.
Theses (School of Engineering Science) / Simon Fraser University. Senior supervisor: Dr. Bonnie Gray -- School of Engineering Science. Also issued in digital format and available on the World Wide Web.
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Růžička, Lukáš. "Návrh racionalizace montážní linky sestav pro tepelné výměníky." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2015. http://www.nusl.cz/ntk/nusl-232020.

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The objective of the thesis is rationalization of current process of assembling of manifold assemblies from the reduction of operating costs point of view. The reason for rationalization is uncompetitiveness of actual solution due to high manufacturing cost of manifold assemblies coming from this process. After analysis of current operations, taking into account presumed production plan, the capacitive calculation of assembly line was done. Then alternative solutions were proposed based on above mentioned criterion, and from these the optimal variant was picked and developed. The assessment of resultant solution was done in the end.
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Kalsani, Venkateshwarlu. "Multi-component metallo supramolecular assemblies." [S.l.] : [s.n.], 2005. http://www.ub.uni-siegen.de/epub/diss/kalsani.htm.

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Alazragi, Reem Saeed. "Self-assembling peptides as biofunctional component in medical fabrics." Thesis, University of Leeds, 2014. http://etheses.whiterose.ac.uk/7739/.

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The importance of medical fabrics is reflected by increased clinical need and consumption over the past decade in the health and medical sectors. Medical fabric products, including wound dressings, are currently defined as ‘medical devices’ by European legislation. To ensure effectiveness as a wound dressing, these fabrics should assist the repair process by providing sufficient protection against bacterial spread in the wound bed. Chronic wounds are an increasingly urgent health problem, owing to the rising population of elderly, obese and diabetic patients. When treating such wounds with drug releasing dressings, the immediate release of the drug is a common limitation. Thus, the development of smart drug delivery dressings that release antibacterial agents into the wound bed when required would be a useful aid in medicine. The overall aim of this study was to develop a wound dressing that was able to release the antibacterial agents only in the presence of bacteria. Medical dressings were treated with pH-responsive, self-assembling peptides as antibacterial carriers that were able to release the loaded drug when stimulated by the bacterial pH. A methodology developed for potential future medical application is presented. The preliminary design consisted of three stages. First, the self-assembled peptide candidates were studied and selected as drug carriers. Second, fabrics were treated with the selected self-assembled peptides using two different methods: (1) coating with the peptides from the outer surface by impregnating in peptide solution and (2) incorporating the self-assembled peptides within the structure by electrospinning. The treatment success of the dressing was investigated using a series of complementary techniques such as FTIR, TEM, SEM and CLSM. Third, potential effectiveness of the dressings was assessed in vitro using two antibiotics model, vancomycin and levofloxacin separately, against a Staphylococcus epidermidis bacterial strain, a species commonly found in infected wounds. The study findings clearly demonstrated the in vitro potential of self-assembling peptide technology in improving the function of medical fabrics.
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Kim, Jay Jung. "Optimizing the location of components in mechanical assemblies." Thesis, Massachusetts Institute of Technology, 1989. http://hdl.handle.net/1721.1/14295.

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Beaven, Bradley John. "The growth and significance of the Coventry car component industry, 1895-1939." Thesis, De Montfort University, 1994. http://hdl.handle.net/2086/4096.

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Arzigian, J. S. "Cleaning of Printed Circuit Assemblies with Surface-Mounted Components." International Foundation for Telemetering, 1989. http://hdl.handle.net/10150/614697.

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International Telemetering Conference Proceedings / October 30-November 02, 1989 / Town & Country Hotel & Convention Center, San Diego, California
The need for ever-increasing miniaturization of airborne instrumentation through the use of surface mounted components closely placed on printed circuit boards highlights problems with traditional board cleaning methods. The reliability of assemblies which have been cleaned with vapor degreasing and spray cleaning can be seriously compromised by residual contaminants leading to solder joint failure, board corrosion, and even electrical failure of the mounted parts. In addition, recent government actions to eliminate fully halogenated chlorofluorocarbons (CFC) and chlorinated hydrocarbons from the industrial environment require the development of new cleaning materials and techniques. This paper will discuss alternative cleaning materials and techniques and results that can be expected with them. Particular emphasis will be placed on problems related to surface-mounted parts. These new techniques may lead to improved circuit reliability and, at the same time, be less expensive and less environmentally hazardous than the traditional systems.
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Malfavon-Ochoa, Mario, and Mario Malfavon-Ochoa. "Characterization of Semiconductor Nanocrystal Assemblies as Components of Optoelectronic Devices." Diss., The University of Arizona, 2017. http://hdl.handle.net/10150/625902.

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This dissertation presents new insight into the ability of small molecule passivated NCs to achieve intimate approach distances, despite being well passivated, while developing guiding principles in the area of ligand mediated microstructure control and the resulting macroscopic optical and electronic properties that close packing of high quality NCs enables. NC ligand coverage will be characterized quantitatively through thermogravimetric analysis (TGA), and qualitatively by photoluminescence and electroluminescence, in the case of functional devices; illustrating the importance of practitioner dependent control of ligand coverage through variations in the dispersion precipitation purification procedure. A unique examination of the relative contribution of energy and charge transfer in NC LEDs will demonstrate the ability to achieve charge transfer, at a level competitive with energy transfer, to well passivated NCs at various wt% loading in a polymer matrix. The observation of potential dependent recombination zones within an active layer further suggest novel, NC surface passivation mediated control of blend microstructure during solution processing towards the development of a bi-continuous network. Next, NC self-assembly and resulting microstructure dependent optical and electronic properties will be examined through electroluminescence and high-resolution transmission electron microscopy (TEM) micrographs of functional NC/polymer bulk heterojunction LEDs. The joint characterization of NC optical properties, and self-assembly microstructure provide a deeper understanding of the significant and inseparable effects of minimal changes in NC surface passivation on structure and function, and emphasize the potential to rely on strongly passivating ligands to control physical properties and processing parameters concurrently towards higher efficiency devices via low cost processing. Finally, micro-contact printing of blazed transmission gratings, using stable dispersions of core and core/shell NCs will be shown to produce close packed assemblies of NCs forming near-wavelength luminescent superstructures separated in space. We show the dominant contribution of a two-monolayer thick sharp interface CdS shell to the diffraction efficiency, and necessarily the refractive index, of the NCs, independent of core size. Utilization of these gratings as in-coupling elements at various positions within a device architecture are also examined. These new observations were achieved by unprecedented control of NC architecture during dispersion processing, while maintaining high luminescence, made possible by optimized NC surface passivation. These studies enable the formation of new LED architectures, and new optoelectronic devices based on angle resolved, monochromatic fluorescence from diffraction gratings prepared from simple solution processing approaches. Further, the novel observation of angle amplified interfering fluorescence from these features is argued to be a result of long range radiative coupling and superradiance enabled by the monodispersity and high-quality NC surface passivation described herein.
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Nirmal, Deepika. "Environmental and Cost impact Analysis of Materials and Assemblies in Building Construction." FIU Digital Commons, 2012. http://digitalcommons.fiu.edu/etd/643.

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One of the new trends in the building construction industry is designing for environmental-friendly buildings, a.k.a. Green Buildings. Planners and designers are therefore trying to accommodate these new environmental practices into existing design criteria. Selection of building materials is one of the key decisions need to be made by building designers. However, due to the strong influence of costs on the building industry, making material-selection decisions solely based on their environmental impacts could be both inadequate and impractical. These factors therefore complicate the building design process, especially pertaining to material selection. Accordingly, the present study is aimed at providing much needed support to the decision-making process of residential building design. To this end, the study evaluates and analyzes the environmental and cost impacts of several building assemblies and material alternatives for the building exterior walls. The Technique of Order Preference Similar to Ideal Solution (TOPSIS) is used to evaluate and rank different material alternatives used in walls based on their environmental impacts. In addition, the environmental data used in this study were extracted from commonly used databases that considered the lifecycle impacts of different residential building materials and assemblies. The environmental and cost impacts of several exterior wall assemblies are then aggregated for different building material alternatives to allow for an objective comparison of these assemblies and facilitate proper building design decision- making. The study results show that wood and exterior insulation finishing system (EIFS) provided the best environmental performance of wall structural and wall finishing materials, respectively. This research is expected to prove useful in supporting building design decision- making. In addition, this research can improve pre-construction estimation and support screening of building materials.
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Muncy, Jennifer V. "Predictive Failure Model for Flip Chip on Board Component Level Assemblies." Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/5131.

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Environmental stress tests, or accelerated life tests, apply stresses to electronic packages that exceed the stress levels experienced in the field. In theory, these elevated stress levels are used to generate the same failure mechanisms that are seen in the field, only at an accelerated rate. The methods of assessing reliability of electronic packages can be classified into two categories: a statistical failure based approach and a physics of failure based approach. This research uses a statistical based methodology to identify the critical factors in reliability performance of a flip chip on board component level assembly and a physics of failure based approach to develop a low cycle strain based fatigue equation for flip chip component level assemblies. The critical factors in determining reliability performance were established via experimental investigation and their influence quantified via regression analysis. This methodology differs from other strain based fatigue approaches because it is not an empirical fit to experimental data; it utilizes regression analysis and least squares to obtain correction factors, or correction functions, and constants for a strain based fatigue equation, where the total inelastic strain is determined analytically. The end product is a general flip chip on board equation rather than one that is specific to a certain test vehicle or material set.
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Books on the topic "Components assembling"

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Ellis, B. N. Cleaning and contamination of electronics components and assemblies. Ayr, Scotland: Electrochemical Publications, 1986.

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White, Nathan, and Michael Delichatsios. Fire Hazards of Exterior Wall Assemblies Containing Combustible Components. New York, NY: Springer New York, 2015. http://dx.doi.org/10.1007/978-1-4939-2898-9.

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Martin, Perry L. Electronic failure analysis handbook: Techiniques and applications for electronic and electrical packages, components and assemblies. New York: McGraw-Hill, 1999.

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Sherstnev, Nikolay. Maintenance and repair of marine pumps. ru: INFRA-M Academic Publishing LLC., 2021. http://dx.doi.org/10.12737/1085864.

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The tutorial shows the design features of marine pumps that affect their working conditions and methods of maintenance and repair. Recommendations for external inspection and control of their components and parts are given. The features of disassembly and assembly of various types of pumps are shown. With examples from ship practice, typical defects of pump assemblies and parts, methods of their determination and elimination are considered. It is intended for students of higher educational institutions (specialty in the specialty "Operation of marine power plants") and university teachers. It can also be used in the system of secondary vocational education in the specialty "Operation of marine power plants".
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Components and Sub-Assemblies. Elsevier, 1993. http://dx.doi.org/10.1016/c2009-0-11853-6.

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Britain, Great. Electronic Sub-Assemblies and Active Components. Stationery Office Books, 1991.

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Britain, Great. Electronic Sub-Assemblies and Active Components. Stationery Office Books, 1989.

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How to Buy Electronic Components & Assemblies. Chartered Institute of Purchasing & Supply, 2000.

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Britain, Great. Electronic Sub-Assemblies and Active Components. Stationery Office Books, 1990.

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Electronic Sub-Assemblies and Active Components. Stationery Office Books, 1991.

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Book chapters on the topic "Components assembling"

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Freeman, David M., Vrinda Bhandarkar, Edwin Shinn, John Wilkins-Wells, and Patricia Wilkins-Wells. "Assembling the Components of Middle-Level Organizations." In Local Organizations for Social Development, 36–59. New York: Routledge, 2021. http://dx.doi.org/10.4324/9780429043192-5.

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Janssen, Markus, and Rainer Müller. "Self-optimizing Handling System for Assembling Large Components." In Intelligent Robotics and Applications, 663–72. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-33509-9_66.

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Zhang, Yinan, Emily Whiting, and Devin Balkcom. "Assembling and Disassembling Planar Structures with Divisible and Atomic Components." In Springer Proceedings in Advanced Robotics, 816–30. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-43089-4_52.

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Saninsky, V. A., V. V. Korzin, and A. V. Petrukhin. "Automated Method for Modular Selection of Components for Multi-bearing Unit of Internal Combustion Engine Assembling." In Lecture Notes in Mechanical Engineering, 485–95. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-22041-9_52.

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Birolini, Alessandro. "Qualification Tests for Components and Assemblies." In Quality and Reliability of Technical Systems, 81–113. Berlin, Heidelberg: Springer Berlin Heidelberg, 1997. http://dx.doi.org/10.1007/978-3-642-97983-5_3.

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Birolini*, Alessandro. "Qualification Tests for Components and Assemblies." In Reliability Engineering, 81–111. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-14952-8_3.

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Birolini, Alessandro. "Qualification Tests for Components and Assemblies." In Reliability Engineering, 81–111. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013. http://dx.doi.org/10.1007/978-3-642-39535-2_3.

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Birolini, Alessandro. "Qualification Tests for Components and Assemblies." In Reliability Engineering, 81–111. Berlin, Heidelberg: Springer Berlin Heidelberg, 2017. http://dx.doi.org/10.1007/978-3-662-54209-5_3.

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Birolini, Alessandro. "Qualification Tests for Components and Assemblies." In Reliability Engineering, 81–113. Berlin, Heidelberg: Springer Berlin Heidelberg, 1999. http://dx.doi.org/10.1007/978-3-662-03792-8_3.

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Evtugyn, Gennady. "Biochemical Components Used in Biosensor Assemblies." In Lecture Notes in Chemistry, 21–97. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013. http://dx.doi.org/10.1007/978-3-642-40241-8_2.

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Conference papers on the topic "Components assembling"

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Tittelbach, Guenther, Ramona Eberhardt, and Volker Guyenot. "Assembling of micro-optical components." In Photonics West '97, edited by M. Edward Motamedi, Larry J. Hornbeck, and Kristofer S. J. Pister. SPIE, 1997. http://dx.doi.org/10.1117/12.271419.

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Rodrigues, Pedro, Jeff Kramer, and Emil Lupu. "On re-assembling self-managed components." In 2015 IFIP/IEEE International Symposium on Integrated Network Management (IM). IEEE, 2015. http://dx.doi.org/10.1109/inm.2015.7140362.

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AMAR, ABDELKADER, PIERRE BOULET, and JEAN-LUC DEKEYSER. "ASSEMBLING DYNAMIC COMPONENTS FOR METACOMPUTING USING CORBA." In Proceedings of the International Conference ParCo2001. PUBLISHED BY IMPERIAL COLLEGE PRESS AND DISTRIBUTED BY WORLD SCIENTIFIC PUBLISHING CO., 2002. http://dx.doi.org/10.1142/9781860949630_0048.

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Katayama, Shoko, Shingo Maeda, Yusuke Hara, and Shuji Hashimoto. "A self-assembling method for polymer gel components." In 2013 IEEE International Conference on Robotics and Biomimetics (ROBIO). IEEE, 2013. http://dx.doi.org/10.1109/robio.2013.6739439.

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Zhu, Lingbo, Dennis W. Hess, and C. P. Wong. "Assembling Carbon Nanotube Films as Thermal Interface Materials." In 2007 Proceedings 57th Electronic Components and Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/ectc.2007.374077.

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Muir, Michael J. "Assembling Small Components Using a Specialized Die Casting Technique." In SAE International Congress and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1997. http://dx.doi.org/10.4271/970377.

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Penna, S., A. Reale, G. M. Tosi Beleffi, P. S. Andre, A. L. J. Teixeira, M. Nakao, S. Shinada, and N. Wada. "Optoelectronics materials and components characterization for organic inorganic laser assembling." In 2009 14th OptoElectronics and Communications Conference (OECC). IEEE, 2009. http://dx.doi.org/10.1109/oecc.2009.5222647.

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Wei Lin, Yonghao Xiu, Lingbo Zhu, Kyoung-Sik Moon, and C. P. Wong. "Assembling of carbon nanotube structures by chemical anchoring for packaging applications." In 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4550005.

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Zhu, Lingbo, Kyoung-Sik Moon, Brian Bertram, Dennis W. Hess, and C. P. Wong. "Assembling Carbon Nanotube Bundles Using Transfer Process for Fine-Pitch Electrical Interconnect Applications." In 2007 Proceedings 57th Electronic Components and Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/ectc.2007.374073.

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Qi, Qifeng, and R. Du. "A vision based micro-assembly system for assembling components in mechanical watch movements." In 2010 International Symposium on Optomechatronic Technologies (ISOT 2010). IEEE, 2010. http://dx.doi.org/10.1109/isot.2010.5687332.

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Reports on the topic "Components assembling"

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Carney, David. Assembling Large Systems from COTS Components: Opportunities, Cautions, and Complexities. Fort Belvoir, VA: Defense Technical Information Center, May 1997. http://dx.doi.org/10.21236/ada634163.

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Montano, Gabriel A., Xiaoyin Xiao, Komandoor E. Achyuthan, Amy Allen, Susan Marie Brozik, Thayne L. Edwards, Amalie Lucile Frischknecht, and David Roger Wheeler. Bio-inspired nanocomposite assemblies as smart skin components. Office of Scientific and Technical Information (OSTI), September 2011. http://dx.doi.org/10.2172/1029762.

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Siuzdak, Gary. Ecosystems and Networks Integrated with Genes and Molecular Assemblies (ENIGMA): Component 5: Imaging Protein Conformations, Shapes & Assemblies in Solution & Administration project (Final Scientific/Technical Report, Subcontract No. 6974584). Office of Scientific and Technical Information (OSTI), June 2021. http://dx.doi.org/10.2172/1797991.

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Leduc, D. Design Guide for Packaging and Offsite Transportation of Nuclear Components, Special Assemblies, and Radioactive Materials Associated with Nuclear Explosives and Weapons Safety Program. Office of Scientific and Technical Information (OSTI), June 1994. http://dx.doi.org/10.2172/1183729.

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Roye, Thorsten. Unsettled Technology Areas in Deterministic Assembly Approaches for Industry 4.0. SAE International, August 2021. http://dx.doi.org/10.4271/epr2021018.

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Increased production rates and cost reduction are affecting manufacturing in all sectors of the mobility industry. One enabling methodology that could achieve these goals in the burgeoning “Industry 4.0” environment is the deterministic assembly (DA) approach. The DA approach is defined as an optimized assembly process; it always forms the same final structure and has a strong link to design-for-assembly and design-for-automation methodologies. It also looks at the whole supply chain, enabling drastic savings at the original equipment manufacturer (OEM) level by reducing recurring costs and lead time. Within Industry 4.0, DA will be required mainly for the aerospace and the space industry, but serves as an interesting approach for other industries assembling large and/or complex components. In its entirety, the DA approach connects an entire supply chain—from part manufacturing at an elementary level to an OEM’s final assembly line level. Addressing the whole process of aircraft design and manufacturing is necessary to develop further collaboration models between OEMs and the supply chain, including addressing the most pressing technology challenges. Since all parts aggregate at the OEM level, the OEM—as an integrator of all these single parts—needs special end-to-end methodologies to drastically decrease cost and lead time. This holistic approach can be considered in part design as well (in the design-for-automation and design-for-assembly philosophy). This allows for quicker assembly at the OEM level, such as “part-to-part” or “hole-to-hole” approaches, versus traditional, classical assembly methods like manual measurement or measurement-assisted assembly. In addition, it can increase flexibility regarding rate changes in production (such as those due to pandemic- or climate-related environmental challenges). The standardization and harmonization of these areas would help all industries and designers to have a deterministic approach with an end-to-end concept. Simulations can easily compare possible production and assembly steps with different impacts on local and global tolerances. Global measurement feedback needs high-accuracy turnkey solutions, which are very costly and inflexible. The goal of standardization would be to use Industry 4.0 feedback and features, as well as to define several building blocks of the DA approach as a one-way assembly (also known as one-up assembly, or “OUA”), false one-way assembly, “Jig-as-Master,” etc., up to the hole-to-hole assembly approach. The evolution of these assembly principles and the link to simulation approaches are undefined and unsolved domains; they are discussed in this report. They must be discussed in greater depth with aims of (first) clarifying the scope of the industry-wide alignment needs and (second) prioritizing the issues requiring standardization. NOTE: SAE EDGE™ Research Reports are intended to identify and illuminate key issues in emerging, but still unsettled, technologies of interest to the mobility industry. The goal of SAE EDGE™ Research Reports is to stimulate discussion and work in the hope of promoting and speeding resolution of identified issues. SAE EDGE™ Research Reports are not intended to resolve the challenges they identify or close any topic to further scrutiny.
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