Relevant bibliographies by topics / Conductive Metal Inks

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers
  5. Reports

Academic literature on the topic 'Conductive Metal Inks'

Author: Grafiati
Published: 4 June 2021
Last updated: 14 February 2022

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Journal articles on the topic "Conductive Metal Inks"

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Tomotoshi, Daisuke, and Hideya Kawasaki. "Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics." Nanomaterials 10, no. 9 (August 27, 2020): 1689. http://dx.doi.org/10.3390/nano10091689.

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.
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Aguilar-Banegas, Alejandro David, Fredy David Reyes-Cruz, Jesús Antonio Vargas-Pineda, and Cesar Humberto Ortega-Jimenez. "Literature Review of Gallium: Conductive Ink Alternative?" Materials Science Forum 975 (January 2020): 139–44. http://dx.doi.org/10.4028/www.scientific.net/msf.975.139.

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Although there are currently different applications for gallium in microelectronics, literature is sparse about its applications in the area of conductive inks. The important characteristics to consider from the ink are viscosity, corrosion and surface tension. The importance of viscosity is a critical parameter in the printing ink mixture, which requires a metal to fulfill the function of conductor, such as gold, copper, and silver. Gallium as a conductor replacement is proposed due to the high cost of such metals currently used. The valence electrons are discussed in this paper due to the direct relation that has with metal conductivity, to provide a justified analysis about gallium application in conductive ink. The application of gallium could mean a significant change in conductive ink elaboration process. Thus, the aim of this research is to analyze the application of gallium as conductive ink, which is done by a literature review on gallium as a semi-conductor because of his valence electrons. Results about gallium as a potential conductive ink show that there is evidence that gallium shares similar properties as the current of materials conductive inks being adopted. This first literature review has some implications on the potential use of gallium as a conductive ink, requiring further experimental research to better test for conducting efficiency.
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Renn, Michael J., Matthew Schrandt, Jaxon Renn, and James Q. Feng. "Localized Laser Sintering of Metal Nanoparticle Inks Printed with Aerosol Jet® Technology for Flexible Electronics." Journal of Microelectronics and Electronic Packaging 14, no. 4 (October 1, 2017): 132–39. http://dx.doi.org/10.4071/imaps.521797.

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Direct-write methods, such as the Aerosol Jet® technology, have enabled fabrication of flexible multifunctional 3-D devices by printing electronic circuits on thermoplastic and thermoset polymer materials. Conductive traces printed by additive manufacturing typically start in the form of liquid metal nanoparticle inks. To produce functional circuits, the printed metal nanoparticle ink material must be postprocessed to form conductive metal by sintering at elevated temperature. Metal nanoparticles are widely used in conductive inks because they can be sintered at relatively low temperatures compared with the melting temperature of bulk metal. This is desirable for fabricating circuits on low-cost plastic substrates. To minimize thermal damage to the plastics, while effectively sintering the metal nanoparticle inks, we describe a laser sintering process that generates a localized heat-affected zone (HAZ) when scanning over a printed feature. For sintering metal nanoparticles that are reactive to oxygen, an inert or reducing gas shroud is applied around the laser spot to shield the HAZ from ambient oxygen. With the shroud gas-shielded laser, oxygen-sensitive nanoparticles, such as those made of copper and nickel, can be successfully sintered in open air. With very short heating time and small HAZ, the localized peak sintering temperature can be substantially higher than that of damage threshold for the underlying substrate, for effective metallization of nanoparticle inks. Here, we demonstrate capabilities for producing conductive tracks of silver, copper, and copper–nickel alloys on flexible films as well as fabricating functional thermocouples and strain gauge sensors, with printed metal nanoparticle inks sintered by shroud-gas-shielded laser.
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Tam, Sze Kee, Ka Yip Fung, Grace Sum Hang Poon, and Ka Ming Ng. "Product design: Metal nanoparticle-based conductive inkjet inks." AIChE Journal 62, no. 8 (May 16, 2016): 2740–53. http://dx.doi.org/10.1002/aic.15271.

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Mendez-Rossal, Hector R., and Gernot M. Wallner. "Printability and Properties of Conductive Inks on Primer-Coated Surfaces." International Journal of Polymer Science 2019 (March 7, 2019): 1–8. http://dx.doi.org/10.1155/2019/3874181.

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Conductive inks’ performance is affected by the printing conditions and the substrate’s properties. In this study, one graphite-, one polymer-, and two silver-based conductive inks were printed on four primer-coated metal substrates by screen printing. The compatibility and wettability between the inks and the primers were evaluated by infrared spectroscopy and surface energy measurements. The printed structures were characterized by laser confocal microscopy, peel-off tape testing, and four-point probe electrical resistivity testing. In general, silver inks exhibited the best performance in terms of printability and electrical conductivity. The graphite ink presented the worst printing, adhesion, and functional properties. The polymer-based ink revealed poor wettability but good adhesion and functionality. The surface roughness, energy, and polarity of the primer coating had no significant influence on the electrical conductivity of the printed inks.
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Reiser, B., L. González-García, I. Kanelidis, J. H. M. Maurer, and T. Kraus. "Gold nanorods with conjugated polymer ligands: sintering-free conductive inks for printed electronics." Chemical Science 7, no. 7 (2016): 4190–96. http://dx.doi.org/10.1039/c6sc00142d.

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Kamyshny, Alexander, and Shlomo Magdassi. "Conductive nanomaterials for 2D and 3D printed flexible electronics." Chemical Society Reviews 48, no. 6 (2019): 1712–40. http://dx.doi.org/10.1039/c8cs00738a.

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This review describes recent developments in the field of conductive nanomaterials and their application in 2D and 3D printed flexible electronics, with particular emphasis on inks based on metal nanoparticles and nanowires, carbon nanotubes, and graphene sheets.
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Lee, Seungae, Jahyun Koo, Seung-Kyun Kang, Gayoung Park, Yung Jong Lee, Yu-Yu Chen, Seon Ah Lim, Kyung-Mi Lee, and John A. Rogers. "Metal microparticle – Polymer composites as printable, bio/ecoresorbable conductive inks." Materials Today 21, no. 3 (April 2018): 207–15. http://dx.doi.org/10.1016/j.mattod.2017.12.005.

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González-Domínguez, Jose M., Alejandro Baigorri, Miguel Á. Álvarez-Sánchez, Eduardo Colom, Belén Villacampa, Alejandro Ansón-Casaos, Enrique García-Bordejé, Ana M. Benito, and Wolfgang K. Maser. "Waterborne Graphene- and Nanocellulose-Based Inks for Functional Conductive Films and 3D Structures." Nanomaterials 11, no. 6 (May 29, 2021): 1435. http://dx.doi.org/10.3390/nano11061435.

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In the vast field of conductive inks, graphene-based nanomaterials, including chemical derivatives such as graphene oxide as well as carbon nanotubes, offer important advantages as per their excellent physical properties. However, inks filled with carbon nanostructures are usually based on toxic and contaminating organic solvents or surfactants, posing serious health and environmental risks. Water is the most desirable medium for any envisioned application, thus, in this context, nanocellulose, an emerging nanomaterial, enables the dispersion of carbon nanomaterials in aqueous media within a sustainable and environmentally friendly scenario. In this work, we present the development of water-based inks made of a ternary system (graphene oxide, carbon nanotubes and nanocellulose) employing an autoclave method. Upon controlling the experimental variables, low-viscosity inks, high-viscosity pastes or self-standing hydrogels can be obtained in a tailored way. The resulting inks and pastes are further processed by spray- or rod-coating technologies into conductive films, and the hydrogels can be turned into aerogels by freeze-drying. The film properties, with respect to electrical surface resistance, surface morphology and robustness, present favorable opportunities as metal-free conductive layers in liquid-phase processed electronic device structures.
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Li, Wei Wei, Lu Hai Li, Li Xin Mo, Xu Wei Hu, Xian Leng, Hua Fang, Wen Bo Li, and Shu Kun Li. "Progress of Printing RFID Antenna Using Water-Based Conductive Ink." Advanced Materials Research 380 (November 2011): 137–40. http://dx.doi.org/10.4028/www.scientific.net/amr.380.137.

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The RFID antenna is mainly fabricated by metal coil winding, copper or aluminum etching, plating, printing and so on. In this paper, the comparison of above methods is conducted and the progress of the printing method and water-based conductive ink are emphasized. Water-based conductive inks are environmental-friendly, economic, high applicability, and are widely used in screen printing, gravure, flexible printing, inkjet printing, etc. Although starts late and the technology is not very mature, the RFID antenna prepared by printing method has many advantages, such as low cost, high precision, easy operation, variety of substrates, etc. Thus the printing has great potential applications on the fabrication of RFID antenna. Furthermore, water-based conductive inks used in ink-jet printing RFID antenna will be the first choice of printed RFID antenna.
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Dissertations / Theses on the topic "Conductive Metal Inks"

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Qi, Siyuan. "Microwave assisted processing of metal loaded inks and pastes for electronic interconnect applications." Thesis, Loughborough University, 2014. https://dspace.lboro.ac.uk/2134/16118.

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Isotropically conductive adhesives (ICAs) and inks are potential candidates for low cost interconnect materials and widely used in electrical/electronic packaging applications. Silver (Ag)filled ICAs and inks are the most popular due to their high conductivity and good reliability. However, the price of Ag is a significant issue for the wider exploitation of these materials in low cost, high volume applications such as printed electronics. In addition, there is a need to develop systems compatible with temperature sensitive substrates through the use of alternative materials and heating methods. Copper (Cu) is considered as a more cost-effective filler for ICAs and in this work, Cu powders were treated to remove the oxide layer and then protected with a self-assembled monolayer (SAM). The coating was found to be able to limit the re-oxidation of the Cumicron particles. The treated Cu powderswerecombined with one of two different adhesive resins to form ICAs that were stencil printed onto glass substrates before curing. The use of conventional and microwave assisted heating methods under an inert atmosphere for the curing of the Cu loaded ICAs was investigated in detail. The samples were characterised for electrical performance, microstructure and shrinkage as a function of curing temperature (80-150°C) and time. Tracks with electrical conductivity comparable to Ag filled adhesives were obtained for both curing methods and with both resins. It was found that curing could be accelerated and/or carried out at lower temperature with the addition of microwave radiation for one adhesive resin, but the other showed almost no absorption indicating a difference in curing mechanism for the two formulations.
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Sui, Yongkun. "A Low-Temperature Printing Technology for Fabricating Electrically Conductive Structures and Devices Using Plasma-Activated Stabilizer-Free Inks." Case Western Reserve University School of Graduate Studies / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=case1562589709669126.

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Öhlund, Thomas. "Metal Films for Printed Electronics : Ink-substrate Interactions and Sintering." Doctoral thesis, Mittuniversitetet, Avdelningen för naturvetenskap, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-23420.

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A new manufacturing paradigm may lower the cost and environmental impact of existing products, as well as enable completely new products. Large scale, roll-to-roll manufacturing of flexible electronics and other functionality has great potential. However, a commercial breakthrough depends on a lower consumption of materials and energy compared with competing alternatives, and that sufficiently high performance and reliability of the products can be maintained. The substrate constitutes a large part of the product, and therefore its cost and environmental sustainability are important. Electrically conducting thin films are required in many functional devices and applications. In demanding applications, metal films offer the highest conductivity.   In this thesis, paper substrates of various type and construction were characterized, and the characteristics were related to the performance of inkjet-printed metal patterns. Fast absorption of the ink carrier was beneficial for well-defined pattern geometry, as well as high conductivity. Surface roughness with topography variations of sufficiently large amplitude and frequency, was detrimental to the pattern definition and conductivity. Porosity was another important factor, where the characteristic pore size was much more important than the total pore volume. Apparent surface energy was important for non-absorbing substrates, but of limited importance for coatings with a high absorption rate. Applying thin polymer–based coatings on flexible non-porous films to provide a mechanism for ink solvent removal, improved the pattern definition significantly. Inkjet-printing of a ZnO-dispersion on uncoated paper provided a thin spot-coating, allowing conductivity of silver nanoparticle films. Conductive nanoparticle films could not form directly on the uncoated paper.   The resulting performance of printed metal patterns was highly dependent on a well adapted sintering methodology. Several sintering methods were examined in this thesis, including conventional oven sintering, electrical sintering, microwave sintering, chemical sintering and intense pulsed light sintering. Specially designed coated papers with modified chemical and physical properties, were utilized for chemical low-temperature sintering of silver nanoparticle inks. For intense pulsed light sintering and material conversion of patterns, custom equipment was designed and built. Using the equipment, inkjet-printed copper oxide patterns were processed into highly conducting copper patterns. Custom-designed papers with mesoporous coatings and porous precoatings improved the reliablility and performance of the reduction and sintering process.         The thesis aims to clarify how ink-substrate interactions and sintering methodology affect the performance and reliability of inkjet-printed nanoparticle patterns on flexible substrates. This improves the selection, adaptation, design and manufacturing of suitable substrates for inkjet-printed high conductivity patterns, such as circuit boards or RFID antennas.
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"Formulating a Particle-Free and Low Temperature Nickel Reactive Ink for Inkjet Printing Conductive Features." Master's thesis, 2019. http://hdl.handle.net/2286/R.I.53708.

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abstract: Reactive inkjet printing (RIJP) is a direct-write deposition technique that synthesizes and patterns functional materials simultaneously. It is a route to cheap fabrication of highly conductive features on a versatile range of substrates. Silver reactive inks have become a staple of conductive inkjet printing for application in printed and flexible electronics, photovoltaic metallization, and more. However, the high cost of silver makes these less effective for disposable and low-cost applications. This work aimed to develop a particle-free formulation for a nickel reactive ink capable of metallizing highly pure nickel at temperatures under 100 °C to facilitate printing on substrates like paper or plastic. Nickel offers a significantly cheaper alternative to silver at slightly reduced bulk conductivity. To meet these aims, three archetypes of inks were formulated. First were a set of glycerol-based inks temperature ink containing nickel acetate, hydrazine, and ammonia in a mixture of water and glycerol. This ink reduced between 115 – 200 °C to produce slightly oxidized deposits of nickel with carbon content around 10 wt %. The high temperature was addressed in a second series, which replaced glycerol with lower boiling glycols and added sodium hydroxide as a strong base to enhance thermodynamics and kinetics of reduction. These inks reduced between 60 and 100 °C but sodium salts contaminated the final deposits. In a third set of inks, sodium hydroxide was replaced with tetramethylammonium hydroxide (TMAH), a strong organic base, to address contamination. These inks also reduced between 60 and 100 °C. Pipetting or printing onto gold coated substrates produce metallic flakes coated in a clear, thick residue. EDS measured carbon and oxygen content up to 70 wt % of deposits. The residue was hypothesized to be a non-volatile byproduct of TMAH and acetate. Recommendations are provided to address the residue. Ultimately the formulated reactive inks did not meet design targets. However, this thesis sets the framework to design an optimal nickel reactive ink in future work.
Dissertation/Thesis
Masters Thesis Chemical Engineering 2019
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WANG, LING-HSUAN, and 王翎軒. "Fabrication of Metal Conductive Circuits on Polyimide Substrate by Laser-Assisted Ion Catalyst Ink." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/42cux9.

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Paisana, Hugo José Antunes. "Hydrographics Electronics: Functionalize any 3D Surface." Master's thesis, 2017. http://hdl.handle.net/10316/83313.

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Dissertação de Mestrado Integrado em Engenharia Electrotécnica e de Computadores apresentada à Faculdade de Ciências e Tecnologia
Um novo método de fabricação e transferência de circuitos impressos é introduzido. Este método permite a impressão digital de caminhos condutores sobre vários tipos de superfícies, incluindo papel de tatuagem e papel de transferência de água. Além disso, são introduzidos novos tipos de materiais e processos para a fabricação de tais circuitos (patente nos EUA preenchida).Para além disso, e inspirado em tatuagens temporárias para crianças, conseguimos produzir circuitos que podem ser transferidos para o corpo humano com o objectivo de bio-monitorização através de bio-substâncias encontradas na pele humana. Como estudo de caso, mostramos eléctrodos eletromiográficos (EMG) transferidos sobre pele humana e que permitem o reconhecimento do gesto das mãos humanas através da monitorização dos músculos do antebraço.Também inspirados na técnica de impressão hidro-gráfica, mostramos que circuitos podem ser transferidos para objectos com formas tridimensionais. A impressão hidro-gráfica está a tornar-se um método popular para transferir gráficos em várias partes e superfícies, especialmente para melhorar a estética de automóveis. Mostramos como circuitos eléctricos podem ser transferidos para essas mesmas partes e superfícies. No estudo de caso, dois circuitos foram apresentados, uma parte de um headphone que é activada ao pressionar botões impressos para controlar o volume da música, e uma peça para uma mão robótica foi actualizada com botões impressos e um LED RGB como interface para o controlo da mesma.O processo, a composição do material e os resultados são apresentados nesta dissertação.
A novel method for fabrication and transfer of printed circuits is introduced. This method allows digital printing of conductive traces over various surfaces, including tattoo paper and water transfer paper. In addition, a novel material composition and process is introduced for fabrication of such circuits (pro-visionary US Patent filed). Moreover, and inspired from children temporary tattoos, we produced circuits that can be transferred over the human body for bio-monitoring through measurement of bio-potentials over the epidermis layer of the human skin. As a case study, we show an electromyography (EMG) electrodes transferred over a volunteer skin which allows human hand gesture recognition through monitoring of the forearm muscles.Also inspired from the hydro-graphics printing technique, we showed circuits that can be transferred on three dimensional shapes. Hydro-graphics printing is recently becoming a popular method for transferring graphics over various parts, specially for car aesthetics. Here, we showed how electronics circuits can be transferred to such parts. As case study two circuits were presented, a headphone part was activated with touch buttons to control music volume and a 3D printed back-shell of a prosthetic hand was also updated with tactile buttons as human input and a RGB LED as the human interface.The process, material composition and results are presented in this dissertation.
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Book chapters on the topic "Conductive Metal Inks"

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Saito, Hiroshi, and Haruyuki Nakajo. "Metal Nanoparticle Conductive Inks for Industrial Inkjet Printing Applications." In Handbook of Industrial Inkjet Printing, 215–24. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2017. http://dx.doi.org/10.1002/9783527687169.ch11.

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Dzisah, Patrick, and Nuggehalli M. Ravindra. "Modeling of Rheological Properties of Metal Nanoparticle Conductive Inks for Printed Electronics." In TMS 2021 150th Annual Meeting & Exhibition Supplemental Proceedings, 964–79. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-65261-6_86.

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Conference papers on the topic "Conductive Metal Inks"

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Wang, Lei, and Jing Liu. "Liquid Metal Inks for Flexible Electronics and 3D Printing: A Review." In ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-37993.

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Flexible electronics and 3D printing are quickly reshaping the world in many aspects spanning from science, technology to industry and social society. However, there still exist many barriers to impede further progress of the areas. One of the biggest bottlenecks lies in the strong shortage of appropriate functional inks. Among the many printable materials ever tried such as conductive polymers, powdered plastic, metal particles or other adhesive materials, the liquid metal or its alloy is quickly emerging as a powerful electronic ink with diverse capabilities from which direct printing of flexible electronics and room temperature 3D printing for manufacturing metal structures are enabled. All these fabrication capabilities are attributed to the unique properties of such metal’s low melting point (generally less than 100 °C), flowable feature and high electrical conductivity etc. To better push forward the research and application of the liquid metal printed electronics and 3D manufacture, this article is dedicated to present an overview on the fundamental research advancements in processing and developing the liquid metal inks. Particularly, the flow, thermal, phase change and electrical properties of a group of typical liquid metals and their alloy inks will be systematically summarized and comparatively evaluated. Some of the practical applications of these materials in a wide variety of flexible electronics fabrication, 3D printing and medical sensors etc. will be briefly illustrated. Further, we also explained the basic categories of the liquid metal material genome towards discovering new functional alloy ink materials as initiated in the authors’ lab and interpret the important scientific and technical challenges lying behind. Perspective and future potentials of the liquid metal inks in more areas were also suggested.
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Sanghyuk Kim and Inkyu Park. "Direct metal patterning by two-step transfer printing of conductive metal nano-inks." In 2010 IEEE 10th Conference on Nanotechnology (IEEE-NANO). IEEE, 2010. http://dx.doi.org/10.1109/nano.2010.5697766.

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Selwood, Ronald K., Albert A. Zelinski, and Gregory R. Rosenberger. "The replacement of precious metal thick film inks using new conductive polymer technology." In 1985 EIC 17th Electrical/Electronics Insulation Conference. IEEE, 1985. http://dx.doi.org/10.1109/eic.1985.7458628.

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Watanabe, Akira, and Jinguang Cai. "Laser direct writing of conductive 3D micropatterns using metal nanoparticle ink." In 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO). IEEE, 2016. http://dx.doi.org/10.1109/nano.2016.7751432.

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Zheng, Yi, Zhi-Zhu He, Jun Yang, and Jing Liu. "Liquid Metal Printing for Manufacturing Large-Scale Flexible Electronic Circuits." In ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-37763.

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The advancement of printed electronics technology has significantly facilitated the development of electronic engineering. However, so far there still remain big barriers to impede the currently available printing technologies from being extensively used. Many of the difficulties came from the factors like: complicated ink-configurations, high post-treatment temperature, poor conductivity in room temperature and extremely high cost and time consuming fabrication process. From an alternative strategy, our recently invented desktop liquid metal printer offered a flexible way to better address the above deficiencies. Through modifying the system developed in the authors’ lab, here we demonstrated the feasibility of the method in quickly and reliably printing out various large area electronic circuits. Particularly, the liquid metal ink made of GaIn24.5 alloy, with a high electrical resistivity of 2.98×10−7 Ω·m, can be rapidly printed on polyvinyl chloride (PVC) substrate with maximum sizes spanning from centimeter size to meter large. Most important of all, all these manufactures were achieved at an extremely low cost level which clearly shows the ubiquitous value of the liquid metal printer. To evaluate the working performance of the present electronics fabrication method, the electrical resistance and wire width of the printed circuits were investigated under multiple overprinting cycles. For practical illustration purpose, LED lighting conductive patterns which can serve as a functional electronic decoration art were fabricated on the flexible plastic substrate. The present work sets up an example for directly making large-scale ending consumer electronics via a high-efficiency and low-cost way.
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Kim, J. H., M. Y. Lee, Y. J. Park, and C. K. Song. "Roll-type Micro-contact printing process with PDMS stamp for patterning conductive Metal Line with Ag ink." In 2010 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2010. http://dx.doi.org/10.7567/ssdm.2010.p-10-2.

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Saito, Daiki, Kazuhiko Sasagawa, Takeshi Moriwaki, and Kazuhiro Fujisaki. "Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density." In ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/ipack2019-6408.

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Abstract Flexible printed circuits (FPCs) are widely used in electronic devices such as movable part line or wearable sensor. Photolithography is one of the most popular processes for fabricating electric interconnect lines. However, inkjet printing has attracted attention because the method can draw an arbitrary-shape electric lines without any mask. Therefore, nanoparticle metal ink is widely used for printing of conductive electric lines with lowering cost and small-lot production. The physical characteristics such as flexibility or durability of metal nanoparticle ink lines have been evaluated by bending or tensile tests. By contrast, the evaluation method has not been sufficiently established for the electrical characteristics of these lines, and the failure mechanism under high-current density has not been clarified. According to scaling down of electric devices, current density and Joule heating in device lines increase and electromigration (EM) damage becomes a serious problem. EM is a transportation phenomenon of metallic atoms caused by electron wind under high-current density. Reducing EM damage is extremely important to enhance device reliability. In this study, current loading tests of metal nanoparticle ink line were performed to discuss damage mechanism and evaluate electrical reliability under high-current density condition. As the results of current loading tests, the thickness of cathode part of straight-test line was decreased. It is considered that atomic transport from the cathode to the anode occurred by EM phenomenon. The line surface became rough and aggregates of particles generated at middle or anode parts of straight-test line by high-current loading. Both of atomic transport and aggregate generation were closely related the changes of potential drop, their dominances were varied depending the current density value.
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Lee, Jung Shin, Jung Woo Cho, Sun Woo Park, Seungdon Lee, Hyunjin Lee, and Daniel Min Woo Rhee. "Numerical Study of Metal Ink Behavior on the Wettability Pattern for Conductive Line Inkjet-Printing with Lattice Boltzmann Approach." In 2021 IEEE 71st Electronic Components and Technology Conference (ECTC). IEEE, 2021. http://dx.doi.org/10.1109/ectc32696.2021.00252.

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Zhang, Qin, and Jing Liu. "Additive Manufacturing of Conformable Electronics on Complex Objects Through Combined Use of Liquid Metal Ink and Packaging Material." In ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-66607.

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Conventional electronics manufacturing strategies are generally complicated, time, water, material and energy consuming. Besides, building an electronic device on a complex object generally requests a series of different connecting wires which would make the machine in a mess. Here from an alternative approach, we proposed an innovative method of realizing conformable electronic connection by the low melting point metal ink and the related flexible packaging material for quickly manufacturing electronics. The liquid metal ink could easily and directly be written on a series of complex surfaces and then coated with the packaging material which is to offer mechanical strength and prevent it from air oxygenization. For illustrating purpose, an electrical connection of LED circuit on cylindrical surface, concave, inclined structure, planes of right angle and sphere was demonstrated. Such optoelectronic device appears rather compact without any evident connecting wires exposing out. Further, a thermal cycle experiment (−40°C∼120°C) was designed to test the variation of the electrical properties of the working sample. It is disclosed that the conductive line covered by the packaging material has a temperature coefficient of 0.255 mΩ/°C (T0 = −16°C) and finally an increasing rate of only 4.24% in resistance after all thermal aging cycles. This electrical connection method is expected to have a significant impact in surface mount technology. Its applications will not only in industry but also can change the way we interact with each other and our everyday life.
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10

Bieri, N. R., S. E. Haferl, D. Poulikakos, and C. P. Grigoropoulos. "Manufacturing of Electrically Conductive Microstructures by Dropwise Printing and Laser Curing of Nanoparticle-Suspensions." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-33859.

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A novel method for the manufacturing of electric microconductors for semiconductor and other devices is presented. The method brings together three technologies: controlled (on demand) printing, laser curing, and the employment of nanoparticles of matter, possessing markedly different properties (here, melting point) than their bulk counterparts. A suspension of gold particles in toluene solvent is employed to print electrically conducting line patterns utilizing a modified on demand ink jet printing process. To this end, microdroplets of 80–100 μm diameters are deposited on a moving substrate such that the droplets form continuous lines. Focused laser irradiation is utilized in order to evaporate the solvent, melt the metal nanoparticles in the suspension, and sinter the suspended particles to form continuous, electrically conducting gold microlines on a substrate. The ultra fine particles in the suspension have a diameter size range of 2 – 5 nm. Due to curvature effects of such small particles, the melting point is markedly lower (400°C) than that of bulk gold (1063°C). Thermodynamic aspects of the effect of particle size on the melting and evaporation temperatures of gold and toluene, respectively, are discussed in the paper. The structure and line width of the cured line as a function of the laser irradiation power and stage velocity are reported in detail. Preliminary measurements of the electrical conductivity are represented.
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Reports on the topic "Conductive Metal Inks"

1

Selwood, R. K., G. Rosenberger, and A. Zelinski. The Replacement of Precious Metal Thick Film Inks Using Conductive Polymer Technology. Fort Belvoir, VA: Defense Technical Information Center, February 1985. http://dx.doi.org/10.21236/ada152002.

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