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Relevant bibliographies by topics / Copper Copper alloys

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Academic literature on the topic 'Copper Copper alloys'

Author: Grafiati

Published: 4 June 2021

Last updated: 17 February 2022

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Journal articles on the topic "Copper Copper alloys"

1

Murphy, Michael. "Copper and copper alloys." Metal Finishing 95, no. 2 (1997): 24. http://dx.doi.org/10.1016/s0026-0576(97)94205-7.

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Honkanen, Mari, Minnamari Vippola, and Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens." Journal of Materials Research 23, no. 5 (2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.

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In this work, the oxide structures of three polycrystalline copper grades, unalloyed oxygen-free (OF) copper and alloyed CuAg and deoxidized high-phosphor (DHP) copper, were studied using cross-sectional analytical transmission electron microscopy (AEM) samples. The oxidation treatments were carried out in air at 200 and 350 °C for different exposure times. The detailed oxide layer structures were characterized by AEM. At 200 °C, a nano-sized Cu2O layer formed on the all copper grades. At 350 °C, a nano-sized Cu2O layer formed first on the all copper grades. After longer exposure time at 350 °C, a crystalline CuO layer grew on the Cu2O layer of the unalloyed OF-copper. In the case of the alloyed CuAg- and DHP-copper, a crystalline and columnar shaped layer, consisting of Cu2O and CuO grains, formed on the nanocrystalline Cu2O layer. At 350 °C, the unalloyed copper oxidized notably slower than the alloyed coppers, and its oxide structures were different than those of the alloyed coppers.

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Hashimoto, Kaoru, Takehiko Sato, and Koichi Niwa. "Laser Welding Copper and Copper Alloys." Journal of Laser Applications 3, no. 1 (1991): 21–25. http://dx.doi.org/10.2351/1.4745272.

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Raikov, Yu N., G. V. Ashikhmin, A. K. Nikolaev, N. I. Revina, and S. A. Kostin. "Nanotechnology for copper and copper alloys." Metallurgist 51, no. 7-8 (2007): 408–16. http://dx.doi.org/10.1007/s11015-007-0074-5.

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Ma, Shi De, Xia Zhao, Hong Ren Wang, and Ji Zhou Duan. "Research on the Antifouling Mechanisms of Copper and its Alloys." Advanced Materials Research 79-82 (August 2009): 2179–82. http://dx.doi.org/10.4028/www.scientific.net/amr.79-82.2179.

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In this paper, the in-situ exposure tests of 15 kinds of copper and its alloys were carried out in seawater at Zhanjiang Harbor for 12 months in order to study their anti-fouling abilities and anti-corrosion properties. In the same way, the in-situ anti-fouling tests of copper and bronze were performed in Qingdao for 8 years. Successively, the anti-fouling properties were analyzed combining with the electrochemical process of copper alloy corrosion and biology process of the adhesion. The chemical, physical and biological factors influencing the fouling properties of copper alloys were also investigated. The results showed that the coppers can equip themselves with antifouling performance by producing some toxic substances during the processes of chemical and electrochemical reaction. In addition, the antifouling ability was proved to relate to the exfoliation effect, which was the result of interaction between stain layer adhesion and spalling force of the attachments.

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MIURA, Hiromi. "Copper Alloys II." Journal of the Japan Society for Technology of Plasticity 54, no. 629 (2013): 466–68. http://dx.doi.org/10.9773/sosei.54.466.

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Tebyakin, A. V., A. N. Fokanov, and V. F. Podurazhnaya. "Multipurpose copper alloys." Proceedings of VIAM, no. 12 (December 2016): 5. http://dx.doi.org/10.18577/2307-6046-2016-0-12-5-5.

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Iijima, Yoshiaki, Yoshihiro Wakabayashi, Toshihiko Itoga, and Ken-ichi Hirano. "Diffusion in Copper-rich Copper-Silicon Alloys." Materials Transactions, JIM 32, no. 5 (1991): 457–64. http://dx.doi.org/10.2320/matertrans1989.32.457.

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KUROYANAGI, Takashi. "Copper and copper alloys in electronic materials." Journal of Japan Institute of Light Metals 37, no. 4 (1987): 313–26. http://dx.doi.org/10.2464/jilm.37.313.

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Boyle, K. P. "Latent Hardening in Copper and Copper Alloys." Materials Science Forum 495-497 (September 2005): 1043–48. http://dx.doi.org/10.4028/www.scientific.net/msf.495-497.1043.

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A new phenomenological latent hardening model is developed for rate-dependent single crystal plasticity. The model quantitatively predicts the latent hardening evolution and latent hardening material dependence for f.c.c. single crystals. Increased overshoot, typically observed in copper alloys as opposed to copper, is rationalized based on the history dependence of latent hardening.

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Dissertations / Theses on the topic "Copper Copper alloys"

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Wood, G. P. "Electrodeposition of copper-zinc alloys." Thesis, University of Nottingham, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.355428.

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Hamilton, M. A. "The optical properties of oxide films on copper and copper alloys." Thesis, London Metropolitan University, 1985. http://repository.londonmet.ac.uk/3378/.

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Suitable conditions were selected to allow thin, thermal oxide films consisting of cuprous oxide only to be grown on copper and dilute copper alloy substrates. The identity of the oxide was confirmed by x-ray diffraction and coulometry. Spectral measurements covering the wavelength range 350 - 750 nm were made using an automatic, self-nulling ellipsometer. From this data the optical constants and thickness of the oxide films were computed and compared to those of the bulk oxide. The optical constants of the oxide were found to depend on the thickness of the film and the identity of the alloying addition in the substrate. The effect of different substrates on the optical constants of cuprous oxide was tested by growing thin cuprous oxide films on gold and glass substrates. Optical property changes of the oxide are attributed to space-charge effects existing at the substrate/oxide interface.

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Vega-Garcia, Jean-Paul. "Microstructural Investigation of Precipitation Hardened CuNi2S+Zr Alloys for Rotor Applications." Master's thesis, University of Central Florida, 2010. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/2157.

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Industrial generator components experience high stresses and electrical fields during their service life. Material integrity is key in guaranteeing component performance. CuNi2SiZr, used as rotor wedges in generators, serve to maintain rotor slot content in place while experiencing high centrifugal stresses and low cycle fatigue during start and stop at elevated temperature. The quality and integrity of this material in service can be directly related to its microstructure, which is determined by the processing procedures of the wedges. In this study, the microstructure development in this material is evaluated to eliminate grain boundary defects by optimizing processing parameters, determining the best temperature/time combination for precipitation hardening, and determining cold work effect on aging parameters. Two chemistries containing Nickel-to-Silicon ratios of 3.2 and 3.8 were selected for analysis. Cast samples were hot extruded, cold worked, and precipitation hardened. Parameters were varied at each processing step. Five different levels of cold work (4, 5, 7, 10 and 13%) were evaluated using 5 different aging temperatures (450, 460, 470, 490 and 500°C). Each processing parameters' effect on microstructure and subsequently on hardness, conductivity, and tensile strength was recorded to assess material performance and identify grain boundary defects origination. Finding of this study identified observed grain boundary defects, using Transmission Electron Analysis, as voids/micro-tears. These defects on grain boundary are detrimental to low cycle fatigue, creep rupture and tensile strength properties and important aspects of the material performance. Grain boundary defects were observed at all levels of cold work, however, origination of defects was only observed in grain sizes larger than 50µm. The strengthening phases for the CuNi2Si+Zr alloy system were identified as Ni2Si and Cr3Si. The Nickel-to-Silicon ratio had an evident effect on the electrical conductivity of the material. However, aging benefits were not clearly established between the two Nickel-to-Silicon ratios.
M.S.M.S.E.
Department of Mechanical, Materials and Aerospace Engineering;
Engineering and Computer Science
Materials Science & Engr MSMSE

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Durandet, Y. C. "Rapidly solidified high-copper dental amalgam alloys /." Title page, contents and summary only, 1990. http://web4.library.adelaide.edu.au/theses/09PH/09phd949.pdf.

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Gao, Guilian. "Dealloying of copper alloys in aqueous solutions." Thesis, University of Cambridge, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.316771.

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Cottle, Rand Duprez. "Isotropic copper-invar alloys for microelectronics packaging /." Digital version accessible at:, 2000. http://wwwlib.umi.com/cr/utexas/main.

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Smith, Jacob A. "Electrical Performance of Copper-Graphene Nano-Alloys." Ohio University / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1550675878730599.

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Shepherd, Krupanand Solomon. "Diffusion Barriers/Adhesion Promoters. Surface and Interfacial Studies of Copper and Copper-Aluminum Alloys." Thesis, University of North Texas, 2000. https://digital.library.unt.edu/ark:/67531/metadc2603/.

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The focus of this research is to study the interaction between copper and the diffusion barrier/adhesion promoter. The behavior of copper sputter-deposited onto sputter-cleaned tantalum nitride is investigated. The data show that copper growth on tantalum nitride proceeds with the formation of 3-D islands, indicating poor adhesion characteristics between copper and Ta0.4N. Post-annealing experiments indicate that copper will diffuse into Ta0.4N at 800 K. Although the data suggests that Ta0.4N is effective in preventing copper diffusion, copper's inability to wet Ta0.4N will render this barrier ineffective. The interaction of copper with oxidized tantalum silicon nitride (O/TaSiN) is characterized. The data indicate that initial copper depositions result in the formation a conformal ionic layer followed by Cu(0) formation in subsequent depositions. Post-deposition annealing experiments performed indicate that although diffusion does not occur for temperatures less than 800 K, copper "de-wetting" occurs for temperatures above 500 K. These results indicate that in conditions where the substrate has been oxidized facile de-wetting of copper may occur. The behavior of a sputter-deposited Cu0.6Al0.4 film with SiO2 (Cu0.6Al0.4/SiO2) is investigated. The data indicate that aluminum segregates to the SiO2 interface and becomes oxidized. For copper coverages less than ~ 0.31 ML (based on a Cu/O atomic ratio), only Cu(I) formation is observed. At higher coverages, Cu(0) is observed. These data are in contrast with the observed behavior of copper metal deposited onto SiO2 (Cu/SiO2). The data for Cu/SiO2 show that copper does not wet SiO2 and forms 3-D nuclei. Furthermore, post-annealing experiments performed on Cu0.6Al0.4/SiO2 show that neither de-wetting nor diffusion of copper occurs for temperatures up to 800 K, while Cu diffusion into SiO2 occurs ~ 600 K. These data indicate that aluminum alloyed with copper at the SiO2 interface serves as an effective adhesion promoter and thermal diffusion barrier.

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Athavale, Saurabh. "Effect of Cu concentration and cooling rate on microstructure of Sn-3.9Ag-XCu." Diss., Online access via UMI:, 2006.

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Penegar, Ian. "Copper-nickel alloys in a marine environment : fouling and AFM studies of copper resistant bacteria." Thesis, University of Portsmouth, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.326980.

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Books on the topic "Copper Copper alloys"

1

Wang, Shuisheng. Electrodeposition of copper-cobalt alloys and copper-nickel alloys and pulse plating of copper-cobalt alloys. s.n.], 1989.

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2

Simon, N. J. Properties of copper and copper alloys at cryogenic temperatures. National Institute of Standards and Technology, 1992.

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Simon, N. J. Properties of copper and copper alloys at cryogenic temperatures. U.S. Dept. of Commerce, National Institute of Standards and Technology, 1992.

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4

Muster, T. H. Copper distributions in aluminum alloys. Nova Science Publishers, 2008.

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5

Osint︠s︡ev, O. E. Medʹ i mednye splavy: Otechestvennye i zarubezhnye marki : spravochnik. "Mashinostroenie", 2004.

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6

The corrosion of copper and its alloys: A practical guide for engineers. NACE International, 2010.

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Francis, Roger. The corrosion of copper and its alloys: A practical guide for engineers. NACE International, 2010.

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8

Alim, Khalaq Saiful. Electrodeposition of copper-cadmium and copper-indium alloys from aqueous solutions. s.n.], 1987.

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9

Samandi, Masoud. The machining of copper-based alloys. University of Birmingham, 1988.

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Naboka, Michael, and Jennifer Giordano. Copper alloys: Preparation, properties, and applications. Nova Science Publishers, 2011.

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Book chapters on the topic "Copper Copper alloys"

1

Sequeira, C. A. C. "Copper and Copper Alloys." In Uhlig's Corrosion Handbook. John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470872864.ch56.

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2

Kundig, Konrad J. A., and John G. Cowie. "Copper and Copper Alloys." In Mechanical Engineers' Handbook. John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/0471777447.ch4.

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3

Freudenberger, Jens, and Hans Warlimont. "Copper and Copper Alloys." In Springer Handbook of Materials Data. Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-69743-7_12.

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Watts, G. R. "Alloys with Copper." In Rh Rhodium. Springer Berlin Heidelberg, 1991. http://dx.doi.org/10.1007/978-3-662-06411-5_43.

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Boyle, K. P. "Latent Hardening in Copper and Copper Alloys." In Materials Science Forum. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-975-x.1043.

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6

Schaller, H. J., G. Fickel, and A. Maaz. "Thermodynamic Properties of Solid Copper-Aluminium and Copper-Germanium Alloys." In Thermochemistry of Alloys. Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-009-1027-0_21.

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7

Bolton, William, and R. A. Higgins. "Copper and its alloys." In Materials for Engineers and Technicians. Routledge, 2020. http://dx.doi.org/10.1201/9781003082446-16.

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8

Hummert, K., H. Müller, and C. Spiegelhauer. "Spray forming: Copper alloys." In Powder Metallurgy Data. Springer Berlin Heidelberg, 2003. http://dx.doi.org/10.1007/10689123_14.

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McDonald, D. T., F. John Humphreys, Pete S. Bate, and Ian Brough. "Dynamic Recrystallization in Copper and Copper-Tin Alloys." In Materials Science Forum. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-443-x.449.

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Müller, Hilmar R., and Igor Altenberger. "Spray Forming of Copper Alloys." In Metal Sprays and Spray Deposition. Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-52689-8_11.

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Conference papers on the topic "Copper Copper alloys"

1

Okamoto, S., K. Hashimoto, T. Sato, and K. Niwa. "Laser welding copper and copper alloys." In ICALEO® ‘89: Proceedings of the Materials Processing Conference. Laser Institute of America, 1989. http://dx.doi.org/10.2351/1.5058338.

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Schneider, M. S. "Laser-Induced Shock Compression of Copper and Copper Aluminum Alloys." In SHOCK COMPRESSION OF CONDENSED MATTER - 2003: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter. AIP, 2004. http://dx.doi.org/10.1063/1.1780312.

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Doiron, Theodore D., John R. Stoup, Patricia Snoots, and Grace Chaconas. "Measuring the stability of three copper alloys." In San Dieg - DL Tentative, edited by Roger A. Paquin. SPIE, 1990. http://dx.doi.org/10.1117/12.22862.

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Petring, Dirk, and Vahid Nazery Goneghany. "Learning more about laser beam welding by applying it to copper and copper alloys." In ICALEO® 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Laser Institute of America, 2010. http://dx.doi.org/10.2351/1.5062079.

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Lo, C. C. H. "Effects of copper precipitation on the magnetic properties of aged copper-containing ferrous alloys." In REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 31. AIP, 2012. http://dx.doi.org/10.1063/1.4716374.

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Miller, M. K., and K. F. Russell. "Clustering and precipitation in neutron irradiated low copper and copper-free steels and model alloys." In 2006 19th International Vacuum Nanoelectronics Conference and 50th International Field Emission Symposium. IEEE, 2006. http://dx.doi.org/10.1109/ivnc.2006.335299.

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El Abdi, Rochdi, and Erwann Carvou. "Damage Study of Copper Alloys Submitted to Vibration Tests." In ASME 2010 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/detc2010-28026.

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The main requirement for the connector materials used in electrical contacts and submitted to vibration mode is to maintain very low and stable electrical resistance. Wear and fretting corrosion are a major cause of connector failure and the main reasons influencing the reliability of the electrical system. If the use of coating materials in electrical contacts is widespread, the coatings disappear from the contact surfaces after a certain number of vibration cycles and the contact is carried out between the two basic substrates in contact at the interface. Our study relates to the contact resistance characterization under dynamic vibrations for a contact between a sphere and plane using high content copper alloys with no coatings. Only one contact part is subjected to a vibratory movement, the other part is fixed. The contact resistance is continuously measured during the test. An experimental study of contact resistance behaviour is undertaken in order to evaluate the influence of mechanical and electrical material properties on the degradation of conduction. The obtained results show that the hardness and the resistivity of the copper alloys used have a large influence on the component lifespan.

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"Copper-Zinc-Lead Alloys, Features And Applications (Technical Review)." In 3rd International Conference on Advances in Engineering Sciences and Applied Mathematics. International Institute of Engineers, 2015. http://dx.doi.org/10.15242/iie.e0315067.

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Ibrahim, Mohamed, Khaled Al-Athel, and Abul Fazal M. Arif. "Strength and Hardness Assessment of Copper and Copper Alloy Coatings on Stainless Steel Substrates." In ASME 2016 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/imece2016-66612.

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Coatings are extensively used in many areas including industrial and medical fields to serve various functions as corrosion resistance, wear resistance and antibacterial purposes. Copper and copper alloys are among the most widely applied coating materials for several industrial and medical applications. One of their widely used copper coating applications is in the antibacterial coating area. Most of the research done in this field focuses on the antibacterial behavior with no comprehensive assessment regarding their mechanical properties, such as hardness and adhesion strength. In this work, mechanical assessment of strength and hardness of pure copper and several copper alloys including Cu Sn5% P0.6%, Cu Ni18 Zn14 (German silver), and Cu Al9 Fe1 are studied experimentally and numerically. All coatings are deposited on stainless steel substrate disks of 25mm diameter by wire-arc thermal spraying at the center of advanced coating technologies, University of Toronto. All coatings are 150 microns in thickness, with two additional thicknesses up to 350 microns for Cu Ni18 Zn14 (German silver) and Cu Al9 Fe1. The effect of the coating thickness and composition on the mechanical properties is studied for all the copper and copper alloy samples with the varying thicknesses between 150 and 350 microns. Scanning Electron Microscope (SEM) is used to study the surface as well as the cross-sectional microstructure of the coatings. Vickers micro-indentation tests are used to evaluate hardness at various locations on the cross-section of the coating and the substrate. This is used to evaluate the effect of the deposition of the coating material, and the subsequent solidification, on the hardness of the coating layer as well as the substrate near the coating interface. Pull-off adhesion tests are performed to evaluate the effect of the coating composition and thickness on the strength of the coatings. Tests are carried out to compute the pull-off failure stress that causes the delamination between the coating and the substrate. Computational analysis will be used to calibrate the experimental data when available by means of finite element analysis. The preliminary pull-off tests show interesting results as the samples with lower coating thicknesses exhibit delamination at higher strengths. This is due to the increase in residual stresses in higher thicknesses building up during the deposition process. Some of the samples did not even fail at lower thicknesses of 150 microns. A comprehensive analysis between the adhesion strength and hardness will be very useful in understanding the effect of coating composition and thickness on the mechanical properties of the coating.

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Hu, Bo, Sydney Luk, and Peter Filip. "Friction and Wear Responses with Metallic Composite Materials to Replace Copper and Copper Alloys in Brake Pad Formulations." In SAE 2016 Brake Colloquium & Exhibition - 34th Annual. SAE International, 2016. http://dx.doi.org/10.4271/2016-01-1912.

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Reports on the topic "Copper Copper alloys"

1

Simon, N. J., E. S. Drexler, and R. P. Reed. Properties of copper and copper alloys at cryogenic temperatures. National Institute of Standards and Technology, 1992. http://dx.doi.org/10.6028/nist.mono.177.

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Leedy, K. D., J. F. Stubbins, B. N. Singh, and F. A. Garner. Fatigue behavior of copper and selected copper alloys for high heat flux applications. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/270446.

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Pawel, R. E., and R. K. Williams. Survey of physical property data for several alloys. [Nitronic 33; copper C10400; copper C17510]. Office of Scientific and Technical Information (OSTI), 1985. http://dx.doi.org/10.2172/5337885.

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Garner, F. A., and H. R. Brager. Neutron-induced changes in density of copper alloys. Office of Scientific and Technical Information (OSTI), 1991. http://dx.doi.org/10.2172/6224137.

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Fabritsiev, S. A., S. J. Zinkle, and A. F. Rowcliffe. Effect of fission neutron irradiation on the tensile and electrical properties of copper and copper alloys. Office of Scientific and Technical Information (OSTI), 1995. http://dx.doi.org/10.2172/114937.

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M.Sadayappan, J.P.Thomson, M.Elboujdaini, G.Ping Gu, and M. Sahoo. Grain Refinement of Permanent Mold Cast Copper Base Alloys. Office of Scientific and Technical Information (OSTI), 2005. http://dx.doi.org/10.2172/840819.

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Fabritsiev, S. A., A. S. Pokrovsky, V. A. Sandakov, et al. The effect of neutron spectrum on the mechanical and physical properties of pure copper and copper alloys. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/219451.

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Garner, F. A., and H. R. Brager. Swelling of copper-aluminum and copper-nickel alloys in FFTF-MOTA at approximately 450/sup 0/C. Office of Scientific and Technical Information (OSTI), 1986. http://dx.doi.org/10.2172/5349021.

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Zinkle, S. J., and W. S. Eatherly. Tensile and electrical properties of high-strength high-conductivity copper alloys. Office of Scientific and Technical Information (OSTI), 1998. http://dx.doi.org/10.2172/330628.

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Korinko, P., and M. Golyski. EFFECT OF THERMAL PROCESSES ON COPPER-TIN ALLOYS FOR ZINC GETTERING. Office of Scientific and Technical Information (OSTI), 2013. http://dx.doi.org/10.2172/1098218.

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