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Journal articles on the topic 'Copper Electrochemical analysis'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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1

Martynov, L. Yu, O. A. Naumova, N. K. Zaytsev, and I. Yu Lovchinovsky. "THE USE OF COPPER INDICATOR ELECTRODES IN VOLTAMMETRIC ANALYSIS." Fine Chemical Technologies 11, no. 5 (October 28, 2016): 26–41. http://dx.doi.org/10.32362/2410-6593-2016-11-5-26-41.

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The review describes the application of solid electrodes based on copper for voltammetric analysis of major classes of organic and inorganic substances over the last fifty years. Despite the fact that there are many reviews of individual solid electrodes this review offers the first comprehensive report on all forms of copper electrodes. The advantages and disadvantages of copper electrodes in comparison with electrodes made of other metals are discussed. Varieties of copper electrodes, their basic physico-chemical properties and some specific characteristics of their surface are described. The electrochemical behavior of copper in aqueous solutions and electrocatalytic mechanisms of transformations of matter on its surface are reported. Examples of the use of electrochemical copper sensors for flow-injection analysis and liquid chromatography are given. Recent trends of the use of copper micro- and nanostructured electrodes in electrochemical analysis are reviewed. The prospects of using copper as a material for the creation of new electrochemical sensors are shown.

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2

Kowalik, R. "Analysis Of The Underpotential Deposition Of Cadmium On Copper." Archives of Metallurgy and Materials 60, no. 3 (September 1, 2015): 1629–32. http://dx.doi.org/10.1515/amm-2015-0284.

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Abstract In this study the process of deposition of cadmium on polycrystalline copper electrode in sulfate solution was investigated. The process of underpotential and bulk deposition was analyzed by classical electrochemical method: cyclic voltammetry(CV), anodic stripping voltammetry(ASV) and electrochemical quartz crystal microbalance(EQCM). The obtained results were compared with electrochemical impedance spectroscopy(EIS) measurements. CV, EQCM and EIS results suggest that the UPD of cadmium starts below potential −0.4 V vs Ag/AgCl. Additionally the stripping analysis indicates the formation of cadmium monolayer with different density of deposited atoms depending on the applied potential. The transition from UPD to bulk deposition occurs below potential −0,7 V.

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3

Diao, Shuzhi, Yiyong Wang, and Hui Jin. "Electronucleation mechanism of copper in wastewater by controlled electrodeposition analysis." RSC Advances 10, no. 63 (2020): 38683–94. http://dx.doi.org/10.1039/d0ra07380f.

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To improve the efficiency of copper deposition in wastewater containing polyvinylpyrrolidone surfactant and reveal the mechanism of copper crystals, a controlled electrodeposition process was developed using a low-cost stainless steel cathode and electrochemical methods.

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4

I. P. Tripathi, I. P. Tripathi, Aarti Kamal, Mahendra Kumar Mishra, Atul Dwivedi, Ruchita Tripathi, Chinmayi Mishra, and Laxmi Kant Shastri. "Synthesis, Spectral, Electrochemical Analysis and Screening for α-Glucosidase Inhibition of Some Complexes of Copper (II) with Amino acids." Indian Journal of Applied Research 4, no. 5 (October 1, 2011): 66–69. http://dx.doi.org/10.15373/2249555x/may2014/21.

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5

Nagiub, Adham Mohamed. "Electrochemical Noise Analysis and Electrochemical Impedance Spectroscopy for Pure Copper in Chloride Media." Chinese Journal of Chemistry 24, no. 2 (February 2006): 247–52. http://dx.doi.org/10.1002/cjoc.200690047.

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6

Huang, J. C., Yung Jin Weng, Yung Chun Weng, Y. F. Chan, Hsu Kang Liu, and H. S. Fang. "Effects of Electrolyte Formulas on Electrochemical Polish Planarization of Pure Copper." Key Engineering Materials 447-448 (September 2010): 159–63. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.159.

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Electrochemical polish technology could enhance the chemo-mechanical polishing efficiency of copper material. During the electrochemical polishing process, both the components and operation parameters of electrochemical polish solution are the key factors influencing planarization ability. This work measured the surface topography and roughness of copper material after mechanical polish by an atomic force microscope (AFM), and added glycerol in different ratios to the phosphoric acid (85 wt %), which was the main composition of experiment solution. Electrochemical polish was conducted within the potential action range in passivation area, and the surface topography and roughness of copper material after electrochemical polish was measured by AFM. The difference in surface topography of copper material after electrochemical polish was compared as well.The experiment indicated that after electrochemical polish in pure phosphoric acid for 50 sec, the surface roughness of copper material obviously decreased from 6.921nm (Ra) to 0.820nm (Ra), and the planarization was more obvious with the increase of electrochemical polish time. The above results could appear in different electrolyte formulas, indicating that electrochemical polish was a good processing method for copper material planarization. This work also proposed the effect of analyzing the electrochemical polish time on planarization through planarization efficiency. Based on the analysis, the planarization efficiency was decreased with the increase of electrochemical polish time, which indicated that longer electrochemical polish time did not yield better result. This work also found that the surface is not only flattened, but also glossed after electrochemical polish.

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7

Smilyk, Vitaliy, Sergii Fomaniyk, Gennady Kolbasov, Igor Rysetskiy, and Michael Danilov. "PHOTOELECTROCHEMICAL PROPERTIES OF FILMS BASED ON BISMUTH AND COPPER VANADATES." Ukrainian Chemistry Journal 87, no. 1 (February 19, 2021): 3–12. http://dx.doi.org/10.33609/2708-129x.87.01.2021.3-12.

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Films of bismuth and nickel tungstates were obtained by chemical and electrochemical synthesis. Bismuth tungstate was obtained by ionic layering and electrochemical deposition. Nickel tungstate (NiWO4) was obtained by combined synthesis methods: 1st - electrochemical synthesis and 2nd - combined electrochemical and thermochemical synthesis. The obtained materials have good adhesion with an optically transparent SnO2 substrate. It is shown that the mechanism of electrochemical formation of Bi2WO6 and NiWO4 films is similar to the processes of WO3 formation as a result of electroreduction of peroxide-complex compounds based on tungstate ions, which were studied in detail in. From the data of coloring kinetics the speed, efficiency and stability of electrochromic material depending on its cycling time are estimated. It is shown that tungstates can cycle for a long time with galvanostatic current change and different potentials. Comparison of electrochromic properties of nickel and bismuth tungstate films obtained by ionic stratification, electrodeposition and combined electrochemical and thermochemical methods showed that polycrystalline films have a lower color contrast compared to films obtained by electrodeposition. Using X-ray phase analysis, it was found that the structure of the obtained materials depended on the method of production. Comparison of X-ray diffraction data for chemically and electrochemically obtained Bi2WO6 showed that the films obtained by electrochemical deposition have more amorphous structure, possibly with inclusions of orthorhombic Bi2WO6 and hexagonal WO3 crystallites, while the films obtained by ionic layering have a layer of polycrystals, indicates the fine-grained obtained crystallites. The studied properties of Bi2WO6 and NiWO4 meet the requirements for electrochromic materials in terms of providing high color contrast in the visible part of the spectrum.

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8

Barba Pingarrón, Arturo, Miguel Ángel Hernández, Alba Covelo, and Raúl Valdez. "Corrosion Resistance of Hot Dip Aluminized Copper Alloys." Advanced Materials Research 976 (June 2014): 8–13. http://dx.doi.org/10.4028/www.scientific.net/amr.976.8.

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Copper and brass specimens were hot dipped aluminized using different times and temperatures conditions. Obtained coatings in a rich-aluminum matrix were characterized using microhardness test, metallographic analysis, electrochemical tests to evaluate corrosion resistance, and scanning electron microscopy/EDS analysis. Corrosion rate of hot dip aluminized copper varies according to processing parameters of molten aluminum. On the other hand, analysis and electrochemical results show that hot dipped aluminized brass increases its corrosion resistance at higher Al content within the coating.

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9

Wang, Chun-Tao, Shen-Hao Chen, Hou-Yi Ma, Lan Hua, and Nai-Xing Wang. "Study of the stability of self-assembled N-vinylcarbazole monolayers to protect copper against corrosion." Journal of the Serbian Chemical Society 67, no. 10 (2002): 685–96. http://dx.doi.org/10.2298/jsc0210685w.

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N-Vinylcarbazole (NVC) monolayers were self-assembled on copper surfaces. The electrochemical properties of the copper surfaces modified by NVC self-assembled monolayers (SAMs) were investigated using polarization and electrochemical impedance spectroscopic (EIS) methods. The polarization measurements indicated that the NVCSAMs could reduce the rates of the anodic and cathodic reaction on the surface of copper electrodes in 0.5 mol dm-3 NaCl solution. The EIS results showed the NVC formed a closely packed film that was able to inhibit copper corrosion. X-Ray photoelectron spectroscopy (XPS) analysis of the copper samples and atomic adsorption analysis of the solution showed that the copper surfaces were covered by NVCSAMs, and the adsorption of NVC on the copper surfaces was accompanied with dissolution of Cu into the solution.

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10

Kołczyk, Karolina, Remigiusz Kowalik, Krzysztof Mech, and Piotr Żabiński. "Electrochemical Deposition of Selenium on Copper." Key Engineering Materials 682 (February 2016): 189–96. http://dx.doi.org/10.4028/www.scientific.net/kem.682.189.

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The present work concerns studies aiming at determination of optimal parameters of obtaining selenium coatings on a copper substrate through the cathodic reduction from sulphate and citrate solutions. The voltammetric analysis was performed in selected solutions to define electrode reactions within the examined range of potentials as well as an influence of pH on their kinetics. The range of potentials in which selenium is reduced to Se0, and then to Se2- was determined. The next stage was performing several electrolysis, where the working electrode was copper. It was to define an influence of citric acid, sodium sulphate, electrolyte pH and the electrolysis potential on the quality of the obtained coatings. The coatings were analysed with the use of X-ray spectrofluorimetry, X-ray diffraction and scanning electron microscopy.

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11

Gashevskaya, Anna S., Elena V. Dorozhko, and Elena I. Korotkova. "COPPER-LABELED VOLTAMMETRIC IMMUNOSENSOR FOR CARBARYL DETECTION." IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA KHIMICHESKAYA TEKHNOLOGIYA 64, no. 2 (January 29, 2021): 26–33. http://dx.doi.org/10.6060/ivkkt.20216402.6258.

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A hapten-protein conjugate for determining carbaryl using copper nanoparticles was first synthesized in the present work. The copper nanoparticles were used as electrochemical labels in the direct solid-phase competitive analysis of carbaryl residues in flour from some crops. Copper nanoparticles stabilized by chitosan and a hapten-protein conjugate with copper nanoparticles stabilized by chitosan by UV/VIS - spectroscopy, transmission electron microscopy, and dynamic light scattering are characterized. To form a recognition receptor layer of monoclonal antibodies against the carbaryl on the surface of a gold-graphite electrode, 1-ethyl-3-(3-dimethylaminopropyl)carbodiimide hydrochloride, dicyclohexylcarbodiimide and 1-hydroxy-2,5-pyrrolidinedione were found to be the best covalent cross-linkers. When selection the electrochemical immunosensor conditions, working dilutions of the antibodies and the hapten-protein conjugate with copper nanoparticles copper nanoparticles stabilized by chitosan were selected to detect the carbaryl. The effect of ethyl alcohol on the performance of the electrochemical immunosensor for the determination of carbaryl was evaluated. The specificity of the developed electrochemical immunosensor was investigated by testing structurally related carbaryl compounds; the results did not exceed 7%. The electrochemical immunosensor can be used for highly sensitive determination of carbaryl residues in flour samples with a detection limit of 0.08 μg /kg within a range of detectable contents of 0.8-32.3 μg/kg.

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12

SHLEEV, Sergey, Andreas CHRISTENSON, Vladimir SEREZHENKOV, Dosymzhan BURBAEV, Alexander YAROPOLOV, Lo GORTON, and Tautgirdas RUZGAS. "Electrochemical redox transformations of T1 and T2 copper sites in native Trametes hirsuta laccase at gold electrode." Biochemical Journal 385, no. 3 (January 24, 2005): 745–54. http://dx.doi.org/10.1042/bj20041015.

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Mediatorless, electrochemically driven, redox transformations of T1 (type 1) and T2 copper sites in Trametes hirsuta laccase were studied by cyclic voltammetry and spectroelectrochemical redox titrations using bare gold electrode. DET (direct electron transfer) between the electrode and the enzyme was observed under anaerobic conditions. From analysis of experimental data it is concluded that the T2 copper site is in DET contact with gold. It was found that electron transfer between the gold surface and the T1 copper site progresses through the T2 copper site. From EPR measurements and electrochemical data it is proposed that the redox potential of the T2 site for high-potential ‘blue’ laccase is equal to about 400 mV versus NHE (normal hydrogen electrode) at pH 6.5. The hypothesis that the redox potentials of the T2 copper sites in low- and high-potential laccases/oxidases from totally different sources might be very similar, i.e. approx. 400 mV, is discussed.

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13

Norocel, Liliana, and Gheorghe Gutt. "Method and Electrochemical Biosensor for Detection of Copper in Wine." Revista de Chimie 69, no. 11 (December 15, 2018): 3010–12. http://dx.doi.org/10.37358/rc.18.11.6672.

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The developed biosensor is based on the electrochemical signal of the complex formed between the ligand used (glycine) and copper(II) ions. The developed electrochemical method is quick, inexpensive, easy to apply, and has shown good selectivity for copper ions. In this research, a linear response for copper ions was obtained in the concentration range of 0.2 mg to 1 mg/L, which largely covers the area of copper ion concentrations in wine. The achieved sensitivity was 11.05E-05 and the limit of detection (LOD) was 0.041 ppm. The biosensor with screen printed electrodes has been successfully used to detect copper ions in wine. A comparative study between the developed portable biosensor and ICP-MS analysis results of the same samples showed similar results.

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14

Berezhnaya, Alexandra G., Valentina V. Chernyavina, and Igor O. Lepeschkin. "Electrochemical Properties of the Composite Electrodes Containing Nanoparticles of Copper Salts." Electrochemical Energetics 20, no. 3 (2020): 132–45. http://dx.doi.org/10.18500/1608-4039-2020-20-3-132-145.

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The energetic properties of the new composite electrode materials suitable for electrochemical capacitors were investigated. Composite electrodes were made using Norit A activated carbon and synthesized sparingly soluble copper salts such as copper iodide(I) and hexacyanoferrates (II), etc. (III). The composition of the salts was confirmed by elemental analysis and the particle size was determined by the Scherrer equation using the data of X ray phase analysis. The electrochemical characteristics of the electrodes were determined with the help of cyclic voltammetry, charge discharge galvanostatic curves, and impedance spectroscopy. It was found that the composite materials containing 5–30 wt.% of copper iodide and copper hexacyanoferrate (II) had lower capacitive characteristics compared with the pure carbon electrode. The introduction of double hexacyanoferrates (II), copper (III) and potassium into the electrode material led to the increase in the specific capacitance by 30 and 20% respectively, compared with a carbon electrode.

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15

Chi-Ucán, Santos Lorenzo, Andrea Castillo-Atoche, Pedro Castro Borges, José Antonio Manzanilla-Cano, Gerardo González-García, Rodrigo Patiño, and Luis Díaz-Ballote. "Inhibition Effect of Glycerol on the Corrosion of Copper in NaCl Solutions at Different pH Values." Journal of Chemistry 2014 (2014): 1–10. http://dx.doi.org/10.1155/2014/396405.

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The inhibitory effect of glycerol on copper corrosion in aerated NaCl (0.5 M) solutions at three pH values (4, 7, and 10) was evaluated. Inhibition efficiency was assessed with conventional electrochemical techniques: open circuit potential, potentiodynamic polarization, and electrochemical impedance analysis. Glycerol reduced the corrosion rate of copper in NaCl solutions. The best inhibition effect (η≈83%) was produced in alkaline (pH 10) chloride media. This effect can be ascribed to increased viscosity and the presence of copper-glycerol complexes.

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16

Godfrey, D., J. H. Bannock, O. Kuzmina, T. Welton, and T. Albrecht. "A robotic platform for high-throughput electrochemical analysis of chalcopyrite leaching." Green Chemistry 18, no. 7 (2016): 1930–37. http://dx.doi.org/10.1039/c5gc02306h.

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17

Anand, Vikky, Harshavardhan, and Vimal Chandra Srivastava. "Synthesis and Characterization of Copper Nanoparticles by Electrochemical Method: Effect of pH." Journal of Nano Research 31 (April 2015): 81–92. http://dx.doi.org/10.4028/www.scientific.net/jnanor.31.81.

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Herein, copper nanoparticles were synthesized using electrochemical method at pH 5, 6.5, 9.5 and 12.5 (coded as Cu5, Cu6.5, Cu9.5 and Cu12.5, respectively). Copper was used as electrode whereas 0.15 M oxalic acid in aqueous solution was used as an electrolyte. Effect of pH of the electrolyte solution on the morphological, structural and textural properties of prepared copper nonoparticles was studied. Prepared nanoparticles were characterized by X-ray crystallography, Field emission scanning electron microscope, transmission electron microscopy, thermogravimetric analysis, differential thermal analysis and textural analysis. The morphology and sizes of the nanoparticles prepared varied with the initial pH of the solution. Sizes of synthesized Cu particles were found to be in the range of 20 nm to 7 μm. All the particles were mesoporous in nature. Cu5 was found to contain 67% copper hydroxide and 33% copper oxalate whereas Cu6.5, Cu9.5 and Cu12.5 essentially consisted of copper hydroxide.

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18

Cheng, Sha, Shou Gang Chen, Xue Ting Chang, Tao Liu, and Yan Sheng Yin. "Microbially Influenced Corrosion of Copper by Marine Bacterium Vibrio natriegens." Advanced Materials Research 79-82 (August 2009): 1111–14. http://dx.doi.org/10.4028/www.scientific.net/amr.79-82.1111.

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The microbially influenced corrosion of copper by marine bacterium Vibrio natriegens (V. natriegens) was investigated using surface analysis (atomic force microscopy (AFM) and electrochemical impedance spectroscopy (EIS). AFM images corroborated the results from the EIS models which show biofilm attachment over time. The electrochemical results showed that the corrosion of copper was accelerated in the presence of V. natriegens based on the decrease in the resistance of the charge transfer resistance (Rct) obtained from EIS.

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19

Pavlov, Michael, Danni Lin, and Eugene Shalyt. "Electrochemical Analysis of Aged Copper Plating Bath in Wafer Level Packaging (Part 1)." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000513–16. http://dx.doi.org/10.4071/isom-2017-tha16_067.

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Abstract Copper electroplating processes are widely used in semiconductor manufacturing, particularly during the packaging stage [1]. Copper deposition is used to build various structures including TSV, RDL, Pillars, and Micro and Mega Bumps. Those processes utilize plating solutions that contain inorganic components and organic additives [2]. During the electroplating process, the additives can partially transform into compounds that are so-called breakdown products. The presence of such breakdown products can interfere with the electrochemical analysis of organic additives. This article presents results of plating tests that show the influence of freshly produced breakdown products on analysis of organic additives. In addition, several options to eliminate this effect are presented.

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20

NISHITANI, Tomoko, Akihiro KAWAGUCHI, and Hideo HONMA. "Electrochemical Analysis of Additives in Copper Electroplating Bath Using Diamond Electrode." Journal of the Surface Finishing Society of Japan 61, no. 8 (2010): 597. http://dx.doi.org/10.4139/sfj.61.597.

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21

McDonald, Jason, Jennifer Hsieh, and Sikhanda Satapathy. "Numerical Analysis of Electrochemical Erosion for Functionally Graded Tungsten/Copper Materials." IEEE Transactions on Plasma Science 39, no. 1 (January 2011): 390–93. http://dx.doi.org/10.1109/tps.2010.2081383.

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22

Monroy, Alberto Vázquez, Antonio Romero Serrano, Jorge Araujo Osorio, Federico Chávez Alcalá, Elia Palacios Beas, and Simón López Ramírez. "Analysis of the Deoxidation Process of Copper using an Electrochemical Cell." steel research international 77, no. 2 (February 2006): 97–102. http://dx.doi.org/10.1002/srin.200606360.

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23

Stortini, Angela Maria, Sabrina Fabris, Gloria Saorin, Emanuele Verga Falzacappa, Ligia Maria Moretto, and Paolo Ugo. "Plasma Activation of Copper Nanowires Arrays for Electrocatalytic Sensing of Nitrate in Food and Water." Nanomaterials 9, no. 2 (January 25, 2019): 150. http://dx.doi.org/10.3390/nano9020150.

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Electrochemical methods for nitrate detection are very attractive since they are suitable for in-field and decentralized monitoring. Copper electrodes are often used to this aim as this metal presents interesting electrocatalytic properties towards nitrate reduction. In this research, we study improvements in the electrochemical analysis of nitrate in natural water and food by taking advantage of the detection capabilities of ensembles of copper nanowire electrodes (CuWNEEs). These electrodes are prepared via template electrodeposition of copper within the nanopores of track-etched polycarbonate (PC) membranes. A critical step in the preparation of these sensors is the removal of the template. Here, we applied the combination of chemical etching with atmospheric plasma cleaning which proved suitable for improving the performance of the nanostructured copper electrode. Analytical results obtained with the CuWNEE sensor for nitrate analyses in river water samples compare satisfactorily with those achieved by standard chromatographic or spectroscopic methods. Experimental results concerning the application of the CuWNEEs for nitrate analysis in food samples are also presented and discussed, with focus on nitrate detection in leafy vegetables.

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24

Li, Shaopei, Meissam Noroozifar, Jiayun Zhou, and Kagan Kerman. "Electrochemical flow injection analysis of the interaction between pyrroloquinoline quinone (PQQ) and α-synuclein peptides related to Parkinson's disease." Analyst 146, no. 14 (2021): 4545–56. http://dx.doi.org/10.1039/d1an00698c.

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25

Ritzdorf, Tom, Sam Lee, and Ian Drucker. "Material Analysis of Lead Free Solder Deposited by Electrochemical Deposition." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000136–42. http://dx.doi.org/10.4071/isom-2012-ta45.

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Lead-free solders have essentially replaced lead-tin solders for new microelectronic applications. At the same time, many products are continuing to go through miniaturization, so the behavior of the solder material is changing as a function of the connection size. As lead-tin solder has been replaced by lead-free alloys, electrodeposited SnAg has become the standard solder alloy used on wafers. Tin-based solders exhibit a complex material structure in the deposit, as recrystallization occurs in the deposit, and as intermetallic compounds form. Understanding the complex nature of these materials is becoming increasingly important to the performance of our electronic products. We have characterized ECD SnAg solder alloy deposits in terms of composition, grain size, phase, microstructure, and texture using EBSD analysis. We will discuss the effects of modifying the process parameters on the microstructure which could implications on the performance of the solder bump as a chip-level interconnect. We have seen that the metals deposit as β-tin with finely dispersed intermetallic grains. We have also seen evidence of recrystallization of the deposit subsequent to deposition, although the recrystallization behaviour is significantly different than the well-characterized copper recrystallization. Finally, the metal at the interface below the solder reacts with Sn to form intermetallic compounds, the compositions of which are dependent on the materials present. The effects of the process parameters on the deposit properties are becoming increasingly important to understand in order to control the properties of the interconnection, and how it changes over its lifetime. We have characterized the incorporation of trace organic materials in the deposit as a function of plating parameters. The deposition of SnAg from an MSA-based plating bath is very different from the deposition of copper from a copper sulfate plating bath. We have noticed that the incorporation of organic additive materials, as well as the grain size, increases as the deposition rate is increased in the deposition of SnAg.

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26

Alabi, A. B., T. Akomolafe, J. A. Ajao, N. Coppede, O. A. Babalola, and A. E. C. Ihekwaba. "Development of Vernonia Amygdalina Photosynthetic Membraneless Electrochemical Cell." Journal of New Materials for Electrochemical Systems 16, no. 1 (September 10, 2012): 33–40. http://dx.doi.org/10.14447/jnmes.v16i1.44.

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Experimental analyses of Vernonia amygdalina pigment from plant collected in Ilorin, Nigeria, have been carried out using spectrophotometer, 1H nuclear magnetic resonance (400Hz) and X-ray diffractometer. Biological membraneless electrochemical cells were fabricated using ground hydrated chlorophyll containing tissues. The cells were assembled by compaction of hydrated pigment housed in an air-tight 6.5 cm3 cylindrical container, with similar electrodes of copper material. Experimental results showed that the visible part of the electromagnetic spectrum is strongly absorbed at 412 nm and 662 nm by Vernonia amygdalina. The qualitative analysis of the powdered sample of the material showed that the constituents of the sample include Magnesium Carbide (Mg2C3), Nitrogen (N2) and Biuret Hydrate (C2H5N3O2H2O). In addition to this, chlorophyll a ( chl a) and triglyceride were also shown to be major constituents of the pigment. The particle size of the pigment was deduced using X-ray diffractometer to be 2.6 nm, and as such, the processed Vernonia amygdalina pigment is therefore a nano-material for energy conversion by photosynthetic processes. The copper-copper electrodes photosynthetic cells generated current of about 4 µA and open circuit voltage of about 5 mV. The current generated by copper-zinc electrodes Photosynthetic Electrochemical Cell (PEC) ranged between 0.2 mA and 1.5 mA, while the open circuit voltage ranged between 0.4 V and 0.9 V. The simple preparation technique adopted, using widely available and low cost natural material showed that a biological photosynthetic electrochemical cell is feasible and promising.

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27

Shcherbinina, Oksana N., Svetlana M. Zakirova, and Arman N. Murzagaliev. "CYCLIZATION OF MATRIX COPPER-BASED ELECTRODES IN NITRIC APROTIC SOLUTION OF CALCIUM SALT." IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENIY KHIMIYA KHIMICHESKAYA TEKHNOLOGIYA 59, no. 4 (July 12, 2018): 55. http://dx.doi.org/10.6060/tcct.20165904.5343.

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Influence of calcium compounds in the structure of copper matrix preliminary modified with transition metals on the cyclization of CuCa, CuBiCa, CuPbBiCa electrodes in nitric aprotic solution of calcium salt was studied. The composition of forming calcium compounds in the copper structure and electrochemical copper-based alloys was found by X-ray analysis.

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28

Rokosz, K., T. Hryniewicz, Ł. Dudek, and W. Malorny. "SEM And EDS Analysis Of Nitinol Surfaces Treated By Plasma Electrolytic Oxidation." Advances in Materials Science 15, no. 3 (September 1, 2015): 41–47. http://dx.doi.org/10.1515/adms-2015-0014.

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Abstract In the paper, the surface layers formed on nickel-titanium alloy during Plasma Electrolytic Oxidation (PEO), known also as Micro Arc Oxidation (MAO), are described. The mixture of phosphoric acid and copper nitrate as the electrolyte for all plasma electrochemical processes was used. Nitinol biomaterial was used for the studies. All the experiments were performed under the voltage of 450 V and current density of 0.3 A/dm2. The main purpose of the studies was to achieve the highest amount of copper in the surface layer versus amount of the copper nitrate in phosphoric acid. The highest copper concentration was found in the surface layer after the PEO treatment in the electrolyte consisting of 150g Cu(NO3)2 in 0.5 dm3 H3PO4. The worst results, in case of the amount of copper in the NiTi surface layer, were recorded after oxidizing in the solution with 5 g Cu(NO3)2.

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29

Al-Johani, Basma, Amna N. Khan, Zahra M. Alamshany, Munazza Gull, Elham S. Azam, Samia A. Kosa, and M. Tahir Soomro. "Synthesis, Electrochemical and Antimicrobial Activity of Colloidal Copper Nanoparticles." Biosciences, Biotechnology Research Asia 14, no. 4 (December 25, 2017): 1259–68. http://dx.doi.org/10.13005/bbra/2568.

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ABSTRACT: The colloidal dispersion of copper nanoparticles (CuNPs), prepared by reducing Cu2+ ions using ascorbic acid, was characterized and used for electrochemical and antimicrobial activity investigations. By depositing CuNPs onto the glassy carbon electrode (GCE) surface the CuNPs/GCE was constructed, which was used to study electrochemical behavior of CuNPs and to carry out direct electrochemical detection of trichloroacetic acid (TCA) and 2-chlorophenol (2-CP) in neutral medium. Excellent electrocatalytic ability of CuNPs, assessed by cyclic voltammetry (CV), for the reduction of TCA and 2-CP was detected. The electrochemical impedance analysis (EIS) of the GCE and CuNPs modified GCE evidenced higher charge transfer activity across the modified electrode surface. The antibacterial activity tests of as-synthesized CuNPs on the selected pathogenic strains of pathogenic strains of Salmonella group B (7.9±0.912), Klebsiella pneumonia (8.33±1.561), Escherichia Coli (15.65±1.612), Enterococcus faecalis (5.4±0.612), Staphylococcus aureus (12.6±1.531) and yeast Candida albicans (11.4.3±1.512), respectively, were performed. The results indicated that the use of CuNPs can be pursued as an alternative strategy (to antibiotics) for averting infections by controlling bacterial adhesion and bacterial bio-film formation against microbial infections.

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Sarma, Babita, and Diganta Kumar Das. "Synthesis, Spectroscopy, Thermal Analysis, Electrochemistry and Superoxide Scavenging Activity of a New Bimetallic Copper(II) Complex." Journal of Chemistry 2013 (2013): 1–5. http://dx.doi.org/10.1155/2013/349580.

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A new bimetallic copper(II) complex has been synthesized with ligand obtained by the condensation of salicylaldehyde and the amine derived from reduction of nitration product of benzil. The ligand was characterized by1H NMR and mass spectra, and the binuclear Copper(II) complex was characterized by vibrational and electronic spectra, EPR spectra, and magnetic moment measurement. Thermogravimetric analysis study and electrochemical study of the complex were also done. The complex was found to show superoxide dismutase activity.

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SAFIZADEH, F., and E. GHALI. "Electrochemical noise of copper anode behaviour in industrial electrolyte using wavelet analysis." Transactions of Nonferrous Metals Society of China 23, no. 6 (June 2013): 1854–62. http://dx.doi.org/10.1016/s1003-6326(13)62670-9.

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32

Gabrielli, Claude, Philippe Moçotéguy, Hubert Perrot, and Alan Zdunek. "Investigation of Copper Processing in the Damascene Process by Electrochemical Impedance Analysis." ECS Transactions 6, no. 8 (December 19, 2019): 33–50. http://dx.doi.org/10.1149/1.2794453.

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33

Prior, Chad, Claire E. Lenehan, and G. Stewart Walker. "Utilising gallium for enhanced electrochemical copper analysis at the bismuth film electrode." Analytica Chimica Acta 598, no. 1 (August 2007): 65–73. http://dx.doi.org/10.1016/j.aca.2007.07.020.

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CHEN, ZHENYU, HONGYU CEN, LISHA WEI, YAMIN CAO, and XINGPENG GUO. "INHIBITORY ACTION OF GARLIC EXTRACT IN THE CORROSION OF COPPER UNDER THIN ELECTROLYTE LAYERS." Surface Review and Letters 26, no. 01 (January 2019): 1850128. http://dx.doi.org/10.1142/s0218625x18501287.

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The inhibition effects of garlic extract on copper corrosion under a thin electrolyte layer (TEL) were investigated using weight-loss measurements, electrochemical methods and surface analysis. Results showed that the volatile organosulfur compounds of garlic extract, such as diallyl trisulfide and di-2-propenyl disulfide, among others, could adsorb on the surface of copper and have a significant inhibitory effect on copper corrosion. Garlic extract acted as a mixed-type inhibitor for copper under TEL. Surface analyses, such as scanning electron microscopy (SEM), energy-dispersive spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS), were conducted to illustrate the inhibitive mechanisms of this plant extract under a TEL.

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35

Cai, Xiaolan, Ziyang Wang, Changjiang Yang, Lei Zhou, Cui Hu, and Wei Zhu. "Fabrication of CNTs reinforced copper composite powders by electrochemical co-deposition." Integrated Ferroelectrics 201, no. 1 (September 2, 2019): 249–57. http://dx.doi.org/10.1080/10584587.2018.1454767.

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Carbon nanotubes (CNTs) reinforced copper composite powders were fabricated by electrochemical co-deposition. The purification and modification of MWCNTs and the effect of surfactants on deposition process were studied to improve uniform distribution of CNTs in copper matrix and the interfacial adhesion between them. The results indicate that MWCNTs treated by mixture concentrated acid generate many functional groups, such as hydroxyl group and carboxyl group, which greatly improve the hydrophily of CNTs and the co-deposition of CNTs and copper cation in the electrolyte. Further, a good adhesion of CNTs in copper matrix is obtained in the present study as revealed through the micrograph analysis of as-deposited Cu/CNTs composite powders by means of scanning electron microscope (SEM) and transmission electron microscope (TEM).

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36

Nakayama, Shigeyoshi. "An Approach to Achieving the Quantitative Analysis of Copper Oxides Formed on Copper Using an Electrochemical Technique." Zairyo-to-Kankyo 56, no. 12 (2007): 541. http://dx.doi.org/10.3323/jcorr.56.541.

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37

Iordache, Simona, Bogdan Tutunaru, Adriana Samide, and Alexandru Popescu. "Electrochemical and Thermal Stability of Nystatin Drug." Revista de Chimie 70, no. 2 (March 15, 2019): 503–5. http://dx.doi.org/10.37358/rc.19.2.6944.

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The analysis of synthetic / residual drugs is very important due to their systemic toxicity. Simple and rapid electrochemical degradation of nystatin drug was accomplished using constant current density electrolysis on platinum electrode. Electrochemical behavior of nystatin drug was investigated on different metallic electrodes by cyclic voltammetry. In saline solution, distinctive oxidation peak are observed on the lead and copper electrodes. The degree of electrochemical degradation reaches the maximum value of 100 % in 10 minutes on platinum electrodes. Thermal stability of nystatin drug was studied by simultaneous TG / DSC analysis. The thermogravimetric and heat flow curves indicated a relatively high stability up to 150 �C.

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38

Rahman, Gul, Mustifuz Ur Rahman, and Zainab Najaf. "In situ synthesis of PANI/CuO nanocomposites for non-enzymatic electrochemical glucose sensing." Applied Chemical Engineering 3, no. 2 (September 5, 2020): 9. http://dx.doi.org/10.24294/ace.v3i2.645.

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We report the in situ synthesis of polyaniline/copper oxide (PANI/CuO) nanocomposites and their characterization as electrocatalyst for non-enzymatic electrochemical glucose detection. Copper oxide (CuO) nanoparticles were prepared by wet chemical precipitation method followed by thermal treatment while the composites of PANI and CuO were synthesized by in situ chemical polymerization of aniline with definite amount of CuO. X-ray diffraction (XRD) results revealed that the composites are predominantly amorphous. The composite formation was confirmed by fourier transform infrared (FTIR) and UV-Vis spectroscopy analysis. The surface morphology was greatly altered with the amount of CuO in composite structure. PANI/CuO nanocomposites were coated on copper substrate to investigate their electrocatalytic activity for glucose sensing. PANI/CuO with 10 wt. % CuO exhibited good response towards electrochemical glucose oxidation.

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Sousa, Bryer C., Kristin L. Sundberg, Matthew A. Gleason, and Danielle L. Cote. "Understanding the Antipathogenic Performance of Nanostructured and Conventional Copper Cold Spray Material Consolidations and Coated Surfaces." Crystals 10, no. 6 (June 12, 2020): 504. http://dx.doi.org/10.3390/cryst10060504.

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The role of high strain rate and severe plastic deformation, microstructure, electrochemical behavior, surface chemistry and surface roughness were characterized for two copper cold spray material consolidations, which were produced from conventionally gas-atomized copper powder as well as spray-dried copper feedstock, during the course of this work. The motivation underpinning this work centers upon the development of a more robust understanding of the microstructural features and properties of the conventional copper and nanostructured copper coatings as they relate to antipathogenic contact killing and inactivation applications. Prior work has demonstrated greater antipathogenic efficacy with respect to the nanostructured coating versus the conventional coating. Thus, microstructural analysis was performed in order to establish differences between the two coatings that their respective pathogen kill rates could be attributed to. Results from advanced laser-induced projectile impact testing, X-ray diffraction, scanning electron microscopy, electron backscatter diffraction, scanning transmission microscopy, nanoindentation, energy-dispersive X-ray spectroscopy, nanoindentation, confocal microscopy, atomic force microscopy, linear polarization, X-ray photoelectron spectroscopy, electrochemical impedance spectroscopy and copper ion release assaying were performed during the course of this research.

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Chen, Qiang, Shan Li, Ying Luo, and Wen Long Lu. "Parameters Research of Precise Straightening Process in Roll Straightener." Advanced Materials Research 1095 (March 2015): 800–803. http://dx.doi.org/10.4028/www.scientific.net/amr.1095.800.

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Refined copper to obtain high quality can use the electrolytic method; the copper cathode plate is applied to the electrochemical machining. In order to make copper cathode plate has high flatness, assuring electrolytic cell cathode and anode plate spacing, so that the purity of copper electrolysis precipitation is higher, so change the straightening plate method has become the urgent task of the enterprise. Through the computer simulation, the ANSYS/LS-DYNA computer optimization, analysis precise straightening device parameters, in ensuring the copper starting sheet straightening can meet basic factories requirements, improve the machining precise straightening machine and copper starting sheet straightening efficiency.

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41

Kumar, Varun S., and Murali M. Sundaram. "Experimental study of binding copper powders by electrochemical deposition." Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 231, no. 8 (July 10, 2015): 1309–18. http://dx.doi.org/10.1177/0954405415592199.

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Binding of metal powders using electrochemically deposited binders provides a novel approach to achieve metal additive manufacturing at ambient temperature. In this study, using an in-house built experimental setup, a single layer of copper powders were electrochemically bound together with the help of nickel binder and the deposits were studied by scanning electron microscope and energy-dispersive X-ray spectroscopy. Mechanical characterization performed on the deposits reveals that the yield strength of the deposit is comparable to that of laser-sintered parts made from Cu/Ni powder. Furthermore, Taguchi studies have been conducted to investigate the optimal process parameters required for minimum diameter of electrochemically bound spot, layer thickness and yield strength. Analysis of variance and signal-to-noise ratio were used to determine the important levels of process parameters and the results were then experimentally verified.

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Shelkovnikov, Vladimir V., Mikhail V. Anishchenko, Yuliya V. Anishchenko, and Konstantin M. Minaev. "Metal-Polymer Sensors for Voltammetric Analysis." Key Engineering Materials 670 (October 2015): 264–69. http://dx.doi.org/10.4028/www.scientific.net/kem.670.264.

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The way of the graphite electrodes production, modified by polymeric composition, containing nanoparticles of gold or mercury, for determination of metals’ ions by the method of stripping voltammetry is offered. The influence of copolymer’s structure, nature of solvent, concentration of metal-modifier, viscosity of composition, film’s thickness and conditions of its formation on electrochemical and mechanical characteristics of sensor systems was studied. The approbation of electrodes was carried out using the certified techniques with help of the method of stripping voltammetry during determination of zinc, cadmium, lead, copper, mercury, arsenic, selenium.

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43

Krasilnikov, Boris A., and Svetlana I. Vasilevskaya. "Anode Dissolution Localization of Copper in Water Electrolytes." Applied Mechanics and Materials 788 (August 2015): 11–16. http://dx.doi.org/10.4028/www.scientific.net/amm.788.11.

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This article is devoted to investigating a possibility of using electrochemical machining (ECM) technology in manufacturing of printed circuits. Some investigations into the anodic dissolution of copper in aqueous electrolytes under stationary conditions were conducted. The analysis of potentiodynamic polarization curve character allowed revealing both areas of active and passive copper dissolution as well as areas of only active and only passive dissolution. Electrolytes were identified and the concentration of electrolyte solutions where the dissolution process occurs in the above areas was determined. It is shown how to assess a degree of the ECM process localization in electrolytes with surface activation in the treatment area. A simplified function of the localization degree L = i 0 /i without regard for current efficiency was used in the research. Electrolytes with a high degree of electrochemical dissolution localization were revealed. Potential ranges for each of the electrolytes providing a maximum degree of the localization copper dissolution process localization were determined.

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44

Das, Susmita, and Vimal Chandra Srivastava. "Synthesis and characterization of copper succinate and copper oxide nanoparticles by electrochemical treatment: Optimization by Taguchi robust analysis." Canadian Journal of Chemical Engineering 94, no. 7 (May 13, 2016): 1322–27. http://dx.doi.org/10.1002/cjce.22478.

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45

Finšgar, Matjaž, and Klodian Xhanari. "Electrochemical and Surface Analysis of 2-Phenylimidazole Adsorbed on Copper from Chloride Solution." Coatings 8, no. 7 (July 3, 2018): 234. http://dx.doi.org/10.3390/coatings8070234.

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46

Kumar, Sanjeev, Deepak Saini, Gurmeet Singh Lotey, and N. K. Verma. "Electrochemical synthesis of copper nanowires in anodic alumina membrane and their impedance analysis." Superlattices and Microstructures 50, no. 6 (December 2011): 698–702. http://dx.doi.org/10.1016/j.spmi.2011.09.011.

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47

Shiu, Kwok-Keung, and Yingzhou Zhang. "Electrochemical impedance study of polypyrrole modified electrodes bearing bathophenanthroline disulfonate in copper analysis." Electrochimica Acta 42, no. 3 (January 1997): 461–69. http://dx.doi.org/10.1016/s0013-4686(96)00241-1.

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48

Gomes, Jewel A., Kamrul Islam, Mohammad R. Islam, George Irwin, Paul Bernazzani, and David Cocke. "Utilization of Electrochemical Techniques for Copper Removal, Speciation, and Analysis in Aqueous Systems." ECS Transactions 28, no. 18 (December 17, 2019): 59–68. http://dx.doi.org/10.1149/1.3491278.

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49

Zhang, Chengxiao. "Determination of copper ions in waters by electrochemical stripping chemiluminescence analysis in situ." Analyst 123, no. 6 (1998): 1383–86. http://dx.doi.org/10.1039/a800016f.

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50

Maruo, Masahiro, and Kristin J. Orians. "Determination of copper complexation in freshwaters of west Canadian lakes by electrochemical analysis." SIL Proceedings, 1922-2010 29, no. 3 (March 2006): 1481–86. http://dx.doi.org/10.1080/03680770.2005.11902927.

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