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Journal articles on the topic 'Copper plates'

Author: Grafiati

Published: 3 June 2025

Last updated: 19 July 2025

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1

Leister, Wolfgang. "Computer Generated Copper Plates." Computer Graphics Forum 13, no. 1 (1994): 69–77. http://dx.doi.org/10.1111/1467-8659.1310069.

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2

Salomon, Richard. "The Copper Plates of Helagupta." Indo-Iranian Journal 63, no. 1 (2020): 3–69. http://dx.doi.org/10.1163/15728536-06301006.

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Abstract The article presents a new edition, translation, and interpretation of the inscription, which was previously published by H. Falk in 2014, of the otherwise unknown Buddhist patron Helagupta (helaüta). The inscription, datable to the latter half of the first century CE, is recorded on five copper plates and is the second longest one known in Kharoṣṭhī script/Gāndhārī language. This edition proposes several new readings and interpretations as well as discussing its cultural implications for issues such as the performance of ancestral rituals by Buddhists, and Buddhological ramifications

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3

Dai, Kaida, Han Liu, Pengwan Chen, Baoqiao Guo, Dalin Xiang, and Jili Rong. "Dynamic Response of Copper Plates Subjected to Underwater Impulsive Loading." Applied Sciences 9, no. 9 (2019): 1927. http://dx.doi.org/10.3390/app9091927.

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Understanding the mechanical response and failure behaviors of thin plates under impact loading is helpful for the design and improvement of thin plate structures in practical applications. The response of a copper plate subjected to underwater impulsive loading has been studied in fluid-structure interaction (FSI) experiments. Three typical copper plates, (a) without a pre-notch, (b) with a cross-shaped pre-notch (+), and (c) with a ring-shaped pre-notch (○) were selected. A high-speed photography system recorded the full-field shape and displacement profiles of the specimens in real time. Th

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Lee, S. I. "Copper-Plated Stainless Steel for Bipolar Plates in Direct-Oxidation SOFC." ECS Proceedings Volumes 2003-07, no. 1 (2003): 865–71. http://dx.doi.org/10.1149/200307.0865pv.

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5

Yan, J. C., G. M. Li, R. T. Han, et al. "Weld brazing of copper thick plates." Science and Technology of Welding and Joining 11, no. 4 (2006): 371–73. http://dx.doi.org/10.1179/174329306x128680.

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6

Hlinka, József, Miklós Berczeli, Gábor Buza, and Zoltán Weltsch. "Wetting properties of Nd:YAG laser treated copper by SAC solders." Soldering & Surface Mount Technology 29, no. 2 (2017): 69–74. http://dx.doi.org/10.1108/ssmt-01-2016-0003.

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Purpose This paper aims to discuss the effect of surface treatment on the wettability between copper and a lead-free solder paste. The industrial applications of laser technologies are increasing constantly. A specific laser treatment can modify the surface energy of copper and affect the wetting properties. Design/methodology/approach The surfaces of copper plates were treated using an Nd:YAG laser with varying laser powers. After laser surface treatment, wetting experiments were performed between the copper plates and SAC305 lead-free solder paste. The effect of laser treatment on copper sur

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7

Zhang, Jing, Jie Wang, Yong Gao, et al. "Influence of Film Coating Thickness on Secondary Electron Emission Characteristics of Non-Evaporable Getter Ti-Hf-V-Zr Coated Open-Cell Copper Foam Substrates." Materials 15, no. 6 (2022): 2185. http://dx.doi.org/10.3390/ma15062185.

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The application of vacuum materials with low secondary electron yield (SEY) is one of the effective methods to mitigate the electron cloud (EC). In this study, the Ti-Hf-V-Zr non-evaporable getter (NEG) film was deposited on open-cell copper foams with different pore sizes for the suppression of electron multipacting effects. Besides, the influence of the film thickness on the secondary electron emission (SEE) characteristics of Ti-Hf-V-Zr NEG film-coated open-cell copper foam substrates was investigated for the first time. The results highlighted that all uncoated and NEG-coated foamed porous

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8

Makarov, A. V., N. V. Lezhnin, A. B. Kotelnikov, et al. "Restoration of continuous casting machine mold copper plates made of Cr–Zr bronze using multi-pass friction stir lap welding." Izvestiya. Non-Ferrous Metallurgy, no. 6 (January 4, 2024): 66–83. http://dx.doi.org/10.17073/0021-3438-2023-6-66-83.

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An innovative technology has been developed and implemented for the restoration and manufacturing of new mold copper plates for continuous casting machines (CCMs) using wear-resistant composite coatings. These copper plates significantly surpass the service life of imported copper plates featuring galvanic coatings, sometimes by up to 20 times. However, the pressing challenge of restoring the copper plates of molds once they have reached the minimum permissible thickness remains unresolved. This study aimed to explore the feasibility of restoring a plate composed of precipitation-hardening Cr–

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9

Sohoni, Pushkar. "Paper documents and copper-plates: localization of hegemonic practices." Bulletin of the School of Oriental and African Studies 79, no. 1 (2015): 87–101. http://dx.doi.org/10.1017/s0041977x1500097x.

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AbstractThis paper examines the social currency of copper-plate charters on the basis of Persian copper-plates from the Deccan. Indic religious systems have a long tradition of conferring land grants using this medium, partially rooted in beliefs of metaphysical qualities attributed to metals. The objects from this region are highly unusual because there are no other recorded instances of a sultan issuing or authorizing land grants on copper-plates. The Persian-language copper-plates appear from the sixteenth century onwards, and seem to be later copies of (or extracts from) paper-based charte

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10

Bezrukov P. A., Nashchekin A. V., Nikonorov N. V., and Sidorov A. I. "Morphological features of micro- and nanoporous silver and copper films synthesized by the substitution reaction method." Physics of the Solid State 64, no. 8 (2022): 1106. http://dx.doi.org/10.21883/pss.2022.08.54634.342.

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The results of a study of the structural features of thin silver and copper films synthesized by the chemical substitution reaction are presented. Silver films were obtained by immersing copper substrates in a solution of silver nitrate. Copper films were synthesized by immersing iron and tin-plated iron substrates in a copper sulfate solution. The study of the morphology and composition of the synthesized layers was carried out using a scanning electron microscope. It has been shown that metal nanoporous layers up to 1 μm thick are formed on the substrates as early as 2-3 s after the start of

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11

Savu, Sorin Vasile, Cristian Daniel Ghelsingher, Iulian Stefan, et al. "Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects." Materials 16, no. 9 (2023): 3311. http://dx.doi.org/10.3390/ma16093311.

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Soldering processes are applied in the fabrication of electronic circuits used in most modern domestic and industrial technologies. This article aims to introduce a new soldering technology based on the microwave joining of copper materials used in electronic applications. The study was focused on microwave technology used as the thermal source for soldering. A simulation model of temperature distributions in copper plates with overall dimensions of 50 × 10 × 0.8 mm was developed in order to determine the necessary microwave power for soldering. For 270 °C simulated on the surface of copper pl

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12

Безруков, П. А., А. В. Нащекин, Н. В. Никоноров та А. И. Сидоров. "Морфологические особенности микро- и нанопористых пленок из серебра и меди, синтезированных методом реакции замещения". Физика твердого тела 64, № 8 (2022): 1096. http://dx.doi.org/10.21883/ftt.2022.08.52713.342.

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The results of a study of the structural features of thin silver and copper films synthesized by the chemical substitution reaction are presented. Silver films were obtained by immersing copper substrates in a solution of silver nitrate. Copper films were synthesized by immersing iron and tin-plated iron substrates in a copper sulfate solution. The study of the morphology and composition of the synthesized layers was carried out using a scanning electron microscope. It has been shown that metal nanoporous layers up to 1 μm thick are formed on the substrates as early as 2–3 s after the start of

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13

Amjadian, Mohsen, and Anil K. Agrawal. "Planar arrangement of permanent magnets in design of a magneto-solid damper by finite element method." Journal of Intelligent Material Systems and Structures 31, no. 7 (2020): 998–1014. http://dx.doi.org/10.1177/1045389x20905968.

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This article studies the energy dissipation mechanism of a proposed magneto-solid damper using a three-dimensional finite element model developed in COMSOL Multiphysics software. The energy dissipation mechanism of the magneto-solid damper dissipates energy through combined actions of friction and eddy current damping. The key components of the magneto-solid damper are a steel plate, two copper plates placed on two sides of the steel plate in parallel, and two planar arrays of permanent magnets each one placed between the steel plate and one of the copper plates. These arrays are kept away fro

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14

Djafar, Zuryati, Abdul Halim, Mustofa Mustofa, Lita Asyriati Latif, and Wahyu Haryadi Piarah. "Correlation of Sunlight Intensity and Output Voltage on Collector Plate-based Cascaded Thermoelectric Generator Modules." PROtek : Jurnal Ilmiah Teknik Elektro 10, no. 3 (2023): 179–83. http://dx.doi.org/10.33387/protk.v10i3.6375.

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The intensity of solar energy is an important factor in viewing the performance of the thermoelectric generator (TEG). Most studies only look at the effect of treatment on the TEG module in the form of cooling mode and its materials. Therefore this study examines the effect of the solar intensity value on the magnitude of the module voltage. On the hot side of the module are placed heat absorber plates of copper, Fe and aluminum plates as well as non collector plates. Modules are cascaded and connected in series as many as 14 modules per plate, so that a total of 56 TEG modules are used. Data

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15

Strobl, Susanne, Wolfgang Scheiblechner, and Roland Haubner. "Forging of Copper and Iron Plates by the Damascus Technique." Key Engineering Materials 809 (June 2019): 253–58. http://dx.doi.org/10.4028/www.scientific.net/kem.809.253.

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Forging of different steel grades is called Damascus technique and results in a layered composite material termed “Damascus steel”, but forging of different copper alloys is termed “mokume gane”. In this paper the joining of copper and iron plates by forging is described. Metallographic investigations showed well bonded interfaces of copper and iron. A very small diffusion zone was observed. To study the diffusion between copper and iron two heat treatments were performed in Ar atmosphere. After 30 minutes at 1000 °C a marginal Cu-Fe interaction took place. Above the melting point of Cu at 110

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16

Galvão, Ivan, Carlos Leitão, Altino Loureiro, and Dulce Rodrigues. "Friction Stir Welding of very thin plates." Soldagem & Inspeção 17, no. 1 (2012): 02–10. http://dx.doi.org/10.1590/s0104-92242012000100002.

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The results obtained in present research, relative to friction stir welding of 1 mm thick plates of aluminium, copper, copper-zinc and zinc alloys, prove that the application of the process in the joining of very thin plates is feasible and desirable. In fact, independently of the base material, the welds produced presented very good morphological characteristics and significant grain refinement in the nugget. Tensile and hardness tests proved that all the welds were at least in even-match relative to the base material properties. Based on the AA 5182 aluminium alloy results it was also possib

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17

Filipov, Emil, Liliya Angelova, and Albena Daskalova. "Superficial structuring of copper by femtosecond laser radiation for development of antibacterial surfaces." Journal of Physics: Conference Series 2994, no. 1 (2025): 012006. https://doi.org/10.1088/1742-6596/2994/1/012006.

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Abstract One of the most common ways of spreading infections is through surfaces that are under highly frequent contact such as handles or buttons in public places. An effective strategy to combat this problem is to develop durable surfaces modified at micro and nano level that can hinder the adhesion and dissemination of microbials. This paper presents a contactless and reproducible methodology for surface nano texturing of copper by means of femtosecond laser ablation. The surfaces of copper plates were irradiated by femtosecond laser (λ = 800 nm; τ = 70 fs) with varying range of working par

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18

Haubner, Roland, Susanne Strobl, Lorenz Pinkas Bichler, and Paul Linhardt. "Liquid Metal Embrittlement of Copper Brazed Plate Heat Exchangers." Key Engineering Materials 809 (June 2019): 535–40. http://dx.doi.org/10.4028/www.scientific.net/kem.809.535.

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Plate heat exchangers are widely used for heating and cooling activities in domestic and industrial applications. The plates of all these components were made of stainless steel (e.g. type X2 CrNiMo 17-12-2) and they were brazed with pure copper. After cutting and metallographic preparation, the samples were investigated by light optical microscopy (LOM) to measure the depth of copper penetration into the plates (liquid metal embrittlement (LME)). For seven heat exchangers the penetration depth was between 25 and 60 μm, but for one the depth was about 150 μm. At the steel-copper interfaces an

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19

Nair, P. Kesavan, and R. Vasudevan. "Studies on explosively cladded copper and aiuminium plates." Materials Testing 28, no. 3 (1986): 76–77. http://dx.doi.org/10.1515/mt-1986-280310.

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20

WATANABE, Mitsuhiro, Toshihiro OBUKI, Luke Yoshinari KAMIOKA, and Shinji KUMAI. "Magnetic pulse welding of aluminum and copper plates." Proceedings of Yamanashi District Conference 2017 (2017): 101. http://dx.doi.org/10.1299/jsmeyamanashi.2017.101.

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21

El‐Batouti, M. "Electropolishing of copper plates in water‐acetone mixtures." Anti-Corrosion Methods and Materials 43, no. 4 (1996): 27–33. http://dx.doi.org/10.1108/eb007398.

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22

ZAKHARENKO, I. D. "SMOOTH SPALLATION RESULTING FROM COLLISIONS OF COPPER PLATES." Le Journal de Physique Colloques 49, no. C3 (1988): C3–289—C3–294. http://dx.doi.org/10.1051/jphyscol:1988341.

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23

Livne, Z., and A. Munitz. "Characterization of explosively bonded iron and copper plates." Journal of Materials Science 22, no. 4 (1987): 1495–500. http://dx.doi.org/10.1007/bf01233153.

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24

Murr, L. E., E. P. Garcia, J. M. Rivas, W. Huang, F. I. Grace, and N. L. Rupert. "Ballistic penetration in thick copper plates: Microstructural characterization." Scripta Materialia 37, no. 9 (1997): 1329–35. http://dx.doi.org/10.1016/s1359-6462(97)00267-4.

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25

Okumoto, Yasuhisa, and Osamu Baba. "Improvements of Flux-Copper Backing Welding Quality." Journal of Ship Production 19, no. 04 (2003): 223–29. http://dx.doi.org/10.5957/jsp.2003.19.4.223.

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Flux-copper backing process welding is a high-speed, one-sided automatic welding process that is a type of submerged arc welding. Although it has been widely applied for the joining of flat skin plates in shipbuilding, a couple of problems with this process still exist: longitudinal cracks occur in the vicinity of the end point, and transverse cracks occur on the back surface. The data in this study were collected in the production site of Ishikawajima-Harima Heavy Industries Company Ltd, Kure Shipyard. The causes of failures were examined, and countermeasures were studied. Concerning the long

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26

Machniewicz, Tomasz, Przemysław Nosal, Adam Korbel, and Marek Hebda. "Effect of FSW Traverse Speed on Mechanical Properties of Copper Plate Joints." Materials 13, no. 8 (2020): 1937. http://dx.doi.org/10.3390/ma13081937.

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The paper describes the influence of the friction stir welding travel speed on the mechanical properties of the butt joints of copper plates. The results of static and fatigue tests of the base material (Cu-ETP R220) and welded specimens produced at various travel speeds were compared, considering a loading applied both parallel and perpendicularly to the rolling direction of the plates. The mechanical properties of the FSW joints were evaluated with respect to parameters of plates’ material in the delivery state and after recrystallisation annealing. The strength parameters of friction stir w

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Trismawati, Trismawati, Hendry Y. Nanlohy, Helen Riupassa, and Susi Marianingsih. "Computational Fluid Dynamics Analysis of Temperature Distribution in Solar Distillation Panel with Various Flat Plate Materials." Journal of Mechanical Engineering Science and Technology (JMEST) 8, no. 1 (2024): 108. http://dx.doi.org/10.17977/um0168i12024p108.

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As the world population continues to grow, the demand for clean water is increasing daily, making it a crucial resource to access. However, there are ways to harness abundant resources like solar energy and seawater to produce clean water. The present studies have conducted experimental investigations to convert seawater into freshwater using solar stills, where solar energy is utilized as the primary heat source for evaporation. The temperature distribution inside the solar stills was analyzed using a flat plate made of three different materials: copper, stainless steel, and aluminum. To exam

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28

F., K. A. Rahman, Saat S., Khafe A., Yusop Y., H. Husin S., and H. Jamaluddin M. "Efficiency comparison of capacitive wireless power transfer for different materials." International Journal of Power Electronics and Drive System (IJPEDS) 11, no. 1 (2020): 200–212. https://doi.org/10.11591/ijpeds.v11.i1.pp200-212.

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This paper describes the application of several types of materials to act as capacitive plates in a Capacitive Power Transfer (CPT) system. In general, the efficiency of CPT system is greatly influenced by the coupling capacitance which is varied by distances and permittivity values. Thus, this paper intended to compare the performance of CPT system in terms of the output efficiency for several types of capacitive plates. To be specific, copper plate, zinc, and aluminium are used in this work to act as coupling plates to the CPT system. The CPT system in this work applied class E inverter as i

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Aizawa, Tatsuhiko, Kenji Wasa, and Yoshiro Nogami. "Plasma Oxidation Printing into DLC and Graphite for Surface Functionalization." C 5, no. 1 (2019): 11. http://dx.doi.org/10.3390/c5010011.

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A diamond-like carbon (DLC) film, coated on a AISI420-J2 stainless steel substrate and vertically aligned graphite (VAG), was structured by high-density plasma oxidation to work as a DLC-punch for micro-stamping and DLC-nozzle array for micro-dispensing, in addition to acting as a copper-plated thermal spreader, respectively. Thick DLC films were micro-patterned by maskless lithography and directly plasma-etched to remove the unmasked regions. Thick VAG (Ca plates were micro-patterned by screen-printing and selectively etched to activate the surface. Raman spectroscopy as well as electric resi

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30

Li, Yi Nan, Z. L. Peng, and J. C. Yan. "GTA Welding of Copper Thick Plates by Using ERCuTi Welding Materials." Materials Science Forum 697-698 (September 2011): 409–13. http://dx.doi.org/10.4028/www.scientific.net/msf.697-698.409.

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The new welding material – ERCuTi alloys filler metals were developed specially for gas tungsten arc welding (GTAW) of copper. The hot cracking in welding copper is inhibited completely as the addition of de-oxidant element Ti in copper welding material. The degree of addition of Ti (2-4wt%) is critical when the susceptibility of cracking is to be suppressed. If the level is allowed to exceed 4wt%, more low-melting point eutectics (β-TiCu4and TiCu2) will be formed in the welds, and cracking susceptibility will be increased again. Results of mechanical properties tests show that although adding

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31

Choi, Sung Im, Mee Soo Chang, Taeeun Kim, et al. "Evaluation of copper alloys for reducing infection by methicillin resistant Staphylococcus aureus and vancomycin resistant Enterococcus faecium in intensive care unit and in vitro." Korean Journal of Internal Medicine 36, no. 5 (2021): 1204–10. http://dx.doi.org/10.3904/kjim.2020.643.

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Background/Aims: Multi-drug resistant pathogens are increasing among healthcare-associated infections. It is well known that copper and copper alloys have antimicrobial activity. We evaluated the activity of copper against bacteria in a hospital setting in Korea.Methods: This study was conducted in a laboratory and medical intensive care unit (ICU). Methicillin resistant Staphylococcus aureus (MRSA) and vancomycin resistant Enterococcus faecium (VRE) were inoculated onto copper, copper alloy and stainless steel plates. After 24 hours of incubation, colony-forming units (CFU) were counted in th

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32

Mohee, Faizul M., Adil Al-Mayah, and Alan Plumtree. "Friction Characteristics of CFRP Plates in Contact with Copper Plates under High Contact Pressure." Journal of Composites for Construction 20, no. 5 (2016): 04016022. http://dx.doi.org/10.1061/(asce)cc.1943-5614.0000673.

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33

Chen, Chen, Chu Cheng, Mengxin Wang, Haitao Liu, Xiaoheng Li, and Kexing Song. "Impact of 5-Amino-1H Tetrazole on Reducing Silver in Copper Cathodes during Electrorefining with High Silver Content Anode Plates." Metals 14, no. 7 (2024): 799. http://dx.doi.org/10.3390/met14070799.

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As the grade of the copper concentrate decreases and its composition becomes increasingly complex, the silver content in anode plates cast after fire refining increases, leading to a higher silver content in the copper cathode during electrorefining and a substantial loss of precious metals. This study investigates the impact of 5-amino-1H tetrazole (5-AT) on reducing silver in copper cathodes during electrorefining with high silver content anode plates. 5-AT forms an “adsorption layer” on the anode surface, reacting with Ag+ released by the anode to form a precipitate and prevent Ag+ from ent

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34

Kaya, Yakup. "Investigation of Copper-Aluminium Composite Materials Produced by Explosive Welding." Metals 8, no. 10 (2018): 780. http://dx.doi.org/10.3390/met8100780.

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Aluminium and copper are two metals frequently used in the automotive and aerospace industries due to their properties of lightness and high conductivity. In this study, copper and aluminium plates were joined using the explosive welding method. The effects of the explosive ratio on the properties of the bonding interface were investigated. Results of the experimental studies showed that the bonding interface changed from a slightly wavy structure to a completely wavy structure as the explosive ratio was increased. It was found that due to the cold deformation resulting from the collision of t

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35

Rahman, F. K. A., Shakir Saat, Y. Yusop, S. H. Husin, and M. H. Jamaluddin. "Efficiency comparison of capacitive wireless power transfer for different materials." International Journal of Power Electronics and Drive Systems (IJPEDS) 11, no. 1 (2020): 200. http://dx.doi.org/10.11591/ijpeds.v11.i1.pp200-212.

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<p>This paper describes the application of several types of materials to act as capacitive plates in a Capacitive Power Transfer (CPT) system. In general, the efficiency of CPT system is greatly influenced by the coupling capacitance which is varied by distances and permittivity values. Thus this paper intended to compare the performance of CPT system in terms of the output efficiency for several types of capacitive plates. To be specific, copper plate, zinc, and aluminium are used in this work to act as coupling plates to the CPT system. The CPT system in this work applied class E inver

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36

Yuan, Yuan, Peng Wan Chen, Er Feng An, and Jian Rui Feng. "Experimental Study on the Explosive Welding of Thin Al/Cu Composite Plates." Materials Science Forum 910 (January 2018): 52–57. http://dx.doi.org/10.4028/www.scientific.net/msf.910.52.

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In this investigation, thin Aluminum alloys 2A12 and Copper T2 composite plates which are both 1mm thick were obtained successfully by the method of explosive welding. The effect of annealing on the interface microstructures of the composite plates was investigated under different temperatures. Optical microscopy, scanning electron microscopy, micro-hardness test and bending test were performed. The results demonstrated that the Al/Cu composite plates were bonded well. The bonding interface of the Al/Cu composite plates had a wavy form. Micro-hardness measurements showed that the hardness of t

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Wei, Qiang, Li Xin Xu, Hui Juan Shi, Li Feng Shao, and Xiang Zhong Hao. "Study on Network Structure C-Cu Composites of Pantograph Slide Plates." Advanced Materials Research 150-151 (October 2010): 941–46. http://dx.doi.org/10.4028/www.scientific.net/amr.150-151.941.

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novel pantograph sliding plate, the network of carbon-copper composites, composed of carbon fiber cloth, copper powder, graphite powder, et al. The physical and mechanical properties of the new samples were tested. Compared with the commonly used pantograph sliding plate, the novel one has lower resistivity, higher bending strength, enhanced impact toughness and better mechanical properties. The new material is suitable for producing the pantograph sliding plate of the electric locomotive.

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Baganina, A. E., D. Y. Paleev, and Anton A. Kazantsev. "Attenuation of Acoustic Waves in Metal Barriers." Applied Mechanics and Materials 756 (April 2015): 482–85. http://dx.doi.org/10.4028/www.scientific.net/amm.756.482.

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The paper presents numerical solution of the problem of acoustic waves attenuation in metal barriers. We investigated separately the plates from steel, lead or copper as metal barriers. The acoustic wave attenuation was compared after passing the barrier, depending on the quantity of plates of the particular barrier and the distance between them.

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Datta, Madhav. "Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction Plates." Journal of Microelectronics and Electronic Packaging 12, no. 3 (2015): 146–52. http://dx.doi.org/10.4071/imaps.473.

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The work described in this article is part of an effort to build reliable and efficient liquid cooling modules for high-power laser diodes. The cooling system is designed to mount at least 12 laser diodes to a common microheat exchanger, thus requiring a large-size thermal conduction plate. Fabrication of the thermal conduction plate involved void-free bonding of copper layers on both sides of an aluminum nitride (AlN) plate. In the current study, ceramic-metal bonding methods using moly-manganese metallization and active metal brazing were investigated. Bonded AlN/copper plates were character

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40

Kotlarski, Georgi, Darina Kaisheva, Maria Ormanova, et al. "Electron Beam Welding of Dissimilar Ti6Al4V and Al6082-T6 Alloys Using Magnetron-Sputtered Cu Interlayers." Crystals 15, no. 4 (2025): 373. https://doi.org/10.3390/cryst15040373.

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In the present work, the influence of a magnetron-sputtered copper interlayer on the process of electron beam welding of Ti6Al4V and Al6082-T6 plates was investigated. A sample without a filler was also prepared as a control. The microstructure, microhardness, and tensile properties of both samples were determined. Applying a copper interlayer resulted in the formation of an additional CuAl2 intermetallic compound in the form of a eutectic structure along the boundary of the aluminum crystal grains. A noticeable shift in the preferred crystallographic orientation of the aluminum phase from the

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Carlone, Pierpaolo, and Gaetano S. Palazzo. "The Influence of Pre-Heating on the Weldability of Pure Copper by FSW." Open Mechanical Engineering Journal 8, no. 1 (2014): 177–84. http://dx.doi.org/10.2174/1874155x01408010177.

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This paper deals with an experimental investigation on the friction stir welding of pure copper. 4 mm thick copper plates have been welded in the butt joint configuration using a conical unthreaded tool, with and without preheating. An electrically heated backing plate has been employed to increase the initial temperature of the plates and to investigate the influence of pre-heating on the weld ability of the considered material. The welded joints have been analyzed by means of macroscopic and microscopic observations, microhardness measurements and tensile tests. Obtained outcomes suggest tha

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Kavitha, R., V. Durga, and A. Deepthi Sharma. "Mathematical Inscriptions on Copper Plates in Tamil Nadu: A Study of Numerical Notations, Calculation Methods, and Economic Implications." Shanlax International Journal of Arts, Science and Humanities 12, no. 1 (2024): 54–59. http://dx.doi.org/10.34293/sijash.v12i1.7621.

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Mathematical inscriptions on copper plates found in Tamil Nadu provide valuable insights into thenumerical notations, calculation methods, and economic activities of ancient South India. This researchpaper aims to analyze and interpret these inscriptions to understand the mathematical techniques employed by ancient Tamil societies for accounting, taxation, land measurement, and trade. By examining the content and context of mathematical inscriptions on copper plates, this study seeks to illuminate the mathematical literacy, computational skills, and economic sophistication of ancient Tamil Nad

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Gao, Bo, Jin Yong Xu, Wen Yao Luo, Yi Guang Wang, and Cheng Gao. "The Study about the Effect of Work-Piece Space on Copper-Cerium Alloy Case Thickness and Component." Advanced Materials Research 803 (September 2013): 285–88. http://dx.doi.org/10.4028/www.scientific.net/amr.803.285.

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In this paper, the author uses double glow plasma surface metallurgy technology, prepares antibacterial stainless steel with copper-cerium case on its surface, does some research on how work-piece space affects Copper-cerium case thickness and component in the case. According to experiment, we find in the range of 10 mm to 25 mm, copper-cerium case depth firstly increase and then decrease with the distance expands; copper-cerium component first rises and then falls with the work-piece space .When the distance is 15mm, hollow cathode effect forms between two plates, we can obtain ideal copper-c

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Chang, Qinghua, Jingpei Xie, Aixia Mao, and Wenyan Wang. "Study on Interface Structure of Cu/Al Clad Plates by Roll Casting." Metals 8, no. 10 (2018): 770. http://dx.doi.org/10.3390/met8100770.

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Large scale Atomic/Molecular dynamic Parallel Simulator (LAMMPS) molecular dynamics simulation software was used to simulate the copper and aluminum atom diffusion and changes of interface during heating and cooling process of copper and aluminum composite panels. The structures of the interface were characterized through scanning electron microscope (SEM), X-ray diffraction (XRD), and transmission electron microscope (TEM), and the mechanical properties were also tested. The simulation results show that the diffusion rate of copper atom is higher than that of aluminum atom, and that the CuAl2

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LÓPEZ-FUERTE, FRANCISCO OMAR, DAVID A. SIQUEIROS-BELTRONES, and LUCIEN VELEVA. "DIATOMS (BACILLARIOPHYTA) FROM ARTIFICIAL SUBSTRATES AND SEDIMENTS IN THE CARIBBEAN SEA OFF YUCATAN, MEXICO." Phytotaxa 406, no. 1 (2019): 1. http://dx.doi.org/10.11646/phytotaxa.406.1.1.

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We provide a floristic and iconographic reference of benthic marine diatom taxa growing on various artificial substrate plates: fiber-glass, stainless steel, aluminum and copper, afixed to a subtidal beach, as well as of diatoms from the adjacent sediments. The sampling site is located 10 km off the beach of Puerto de Telchac, Yucatan, Mexico. The floristic survey comprises 161 diatom taxa, species and varieties, with six new records for Mexican waters with taxonomic, nomenclatural, and updated bibliographic information for each taxon. Twenty-five taxa were identified solely to genus level. Th

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Winarto, W., M. Anis, and B. Eka Febryansyah. "Mechanical and Microstructural Properties of Friction Stir Welded Dissimilar Aluminum Alloys and Pure Copper Joints." MATEC Web of Conferences 269 (2019): 01001. http://dx.doi.org/10.1051/matecconf/201926901001.

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Joining dissimilar metal alloys such as aluminum and copper is very difficult to be done because of alterations in chemical, metallurgical and physical behavior. Friction Stir Welding (FSW) is a solid-state welding technique which is one of the new methods used for joining the dissimilar metal. The material used is aluminum alloy 5052 and pure copper plates. The welding parameters were carried out with variable geometry shape of pin tools: taper and threaded cylindrical pin tools. Also preheating were performed on the part of copper plates with temperatures at both 25°C and 200°C. The friction

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Sun, Li Gen, and Jia Quan Zhang. "Three Dimensional Thermo-Mechanical Model of Different Thermocouple Embedded Modes Analysis." Advanced Materials Research 291-294 (July 2011): 263–68. http://dx.doi.org/10.4028/www.scientific.net/amr.291-294.263.

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The embedded thermocouples have been analyzed with the consideration of their temperature effectiveness and the life of mould plates. Three dimensional FEM models have been adopted to study the effect of different installation of the thermocouples. The thermocouples installation methods, whatever from the back side of the plates or from the top or bottom, have been observed with little effect on the temperature field of the copper plates. But the effective Mises stress and strain are influenced obviously. The maximum stresses have been observed in the area of thermocouples channel with holes f

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Behr, Omri M. "An Improved Method for Steel-Facing Copper Etching Plates." Leonardo 30, no. 1 (1997): 47. http://dx.doi.org/10.2307/1576375.

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Mule, Samadhan Suresh. "An Experimental Study on Copper Plates Using Friction Drilling." International Journal for Research in Applied Science and Engineering Technology 9, no. 10 (2021): 767–70. http://dx.doi.org/10.22214/ijraset.2021.38513.

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Abstract: Friction drilling is a novel hole-making method that can be performed on thin-walled sheets. In recent years of study, the thrust force and torque under numerous process conditions were performed to demonstrate the benefits. In recent years of study, the thrust force and torque under various process conditions were performed to demonstrate the benefits. Our objective is to review the behavior of the material with the use of friction drilling by variation of thickness, Spindle speed, and feed rate. Our objective is to study the behavior of the material with the use of friction drillin

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Stead, J. E., and John Evans. "THE INFLUENCE OF COPPER ON STEEL RAILS AND PLATES." Journal of the American Society for Naval Engineers 13, no. 3 (2009): 678–89. http://dx.doi.org/10.1111/j.1559-3584.1901.tb04149.x.

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