Dissertations / Theses on the topic 'Copper system'
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Sarson, Stuart C. "Investigations in the copper-lead system." Thesis, University of Cambridge, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.239160.
Full textMcClinton, Martin Andrew. "An investigation of the copper-difluorodihalomethane-amide trifluoromethylating system." Thesis, University of York, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.329701.
Full textJackson, A. R. W. "The imidazolethione/copper system : Coordination chemistry and corrosion inhibition." Thesis, University of Newcastle Upon Tyne, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.371068.
Full textPoole, Martin. "Progress towards the development and implementation of an unambiguous copper wire fingerprinting system." Thesis, Rhodes University, 2003. http://eprints.ru.ac.za/214/.
Full textPlana, Daniela. "An electrochemical investigation of electroless deposition : the copper-DMAB system." Thesis, University of Manchester, 2010. https://www.research.manchester.ac.uk/portal/en/theses/an-electrochemical-investigation-of-electroless-deposition-the-copperdmab-system(8478ea99-e05f-40c6-8260-2e8788f38efa).html.
Full textau, sblack@ccwa wa gov, and Silvia Beatriz Black. "The thermodynamic chemistry of the aqueous copper-ammonia thiosulfate system." Murdoch University, 2006. http://wwwlib.murdoch.edu.au/adt/browse/view/adt-MU20070508.154242.
Full textBlack, Silvia Beatriz. "The thermodynamic chemistry of the aqueous copper-ammonia thiosulfate system." Black, Silvia Beatriz (2006) The thermodynamic chemistry of the aqueous copper-ammonia thiosulfate system. PhD thesis, Murdoch University, 2006. http://researchrepository.murdoch.edu.au/336/.
Full textBarker, Simon William. "Diffusion induced liquid film migration in the aluminum-copper system /." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape11/PQDD_0001/NQ42721.pdf.
Full textBravo, de Nahui Flora. "Mass transfer behaviour for a packed bed copper cementation system." Thesis, University of Exeter, 1988. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.234559.
Full textBoston, Rebecca Helen. "Control of crystallisation in the yttrium barium copper oxide system." Thesis, University of Bristol, 2014. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.686173.
Full textGendall, Ian Richard. "The porphyry copper system and the precious metal-gold potential." Thesis, Rhodes University, 1994. http://hdl.handle.net/10962/d1005604.
Full textUr, Rehman Bilal. "Modelling a Mineral Froth Flotation Process : Case Study: Minerals process at Boliden AB." Thesis, Umeå universitet, Institutionen för tillämpad fysik och elektronik, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:umu:diva-51600.
Full textQuaranta, Davide. "Analysis and Molecular Characterization of an Unusual Copper Inducible Homeostasis Mechanism in Pseudomonas putida KT2440." Diss., The University of Arizona, 2009. http://hdl.handle.net/10150/194391.
Full textAndrade, Cassandra Jo. "Background and Research on Copper Alloys as an Antimicrobial Surface and the CusB protein of the Copper-Transporting Efflux System CusCFBA." Thesis, The University of Arizona, 2010. http://hdl.handle.net/10150/146238.
Full textHenline, Kylie Marie. "Amine- and Sulfide-Sensing Copper(I) Iodide Films and the Structure, Dynamics, and Photophysics in the Copper(I) Iodide-Tetrahydrothiophene System." W&M ScholarWorks, 2014. https://scholarworks.wm.edu/etd/1539626958.
Full textParmar, Paresh H. "An investigation into the possible neuroprotective role of melatonin in copper-loading." Thesis, Rhodes University, 2001. http://hdl.handle.net/10962/d1003261.
Full textMcCudden, Corey B. "Hydrothermal zoning in the copper-molybdenum system beneath Red Cone Peak, Colorado /." Connect to resource, 2006. http://hdl.handle.net/1811/24781.
Full textMiller, Owen David William. "Precious metal mineralization associated with the Coed-y-Brenin porphyry copper system, North Wales." Thesis, University of Aberdeen, 1993. http://digitool.abdn.ac.uk:80/webclient/DeliveryManager?pid=236945.
Full textGilmer, Amy K. "Petrogenesis of the Don Manuel igneous complex and porphyry copper system, central Chile." Thesis, University of Bristol, 2016. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.702924.
Full textPinto, Cecilia de Agrela. "The two-component system of a novel copper resistant operon of Marinobacter hydrocarbonoclasticus." Master's thesis, Faculdade de Ciências e Tecnologia, 2012. http://hdl.handle.net/10362/10062.
Full textThe majority of bacterial heavy metal resistance systems are regulated by twocomponent signal transduction systems. Stimuli from the environment interact with the histidine kinase, which in turn activates the response regulator by phosphorylation. The effector domain of the response regulator then binds to DNA, eliciting the specific response. Analysis of the Marinobacter hydrocarbonoclasticus genome revealed the presence of genes, copXAB, that code for proteins associated with copper response. The biochemical characterization of the two-component signal transduction system, copSR, is of interest due to the vital role it plays in the regulation of expression of the copXAB operon. The genes that encode for the CopR and CopS_C (cytosolic sensor domain of CopS) proteins were heterologously expressed in E.coli and expression was optimized for the production of soluble protein using LB medium. Due to solubility problems, the genes that code for these proteins were cloned as hexahistidine or glutathione S-transferase fusion proteins. CopR and its domains were optimally expressed at 16°C for 16 and 3 h after induction, respectively, whilst CopS_C was expressed at 37°C during 3 h after induction. Proteins were purified using different chromatographic strategies, most of them using affinity chromatography. The yields of pure protein per liter of growth culture obtained after complete purification from the soluble cellular extract were: 0.14 to 0.23 mg/L for CopR; 0.42 mg/L, CopR_NHis6; for the CopR_CHis6 it was 0.16 mg/L and 4.2 mg/L of CopS_C. The molecular mass of each protein was determined by gel filtration, 31 kDa for CopR, 17.5 kDa for CopR_NHis6, 15.1 kDa for CopR_CHis6 and 38.2 kDa for CopS_C. In the case of CopS_C there is the possibility that a dimer is formed, which should be evaluated. From the evaluation of disulfide bonds, using SDS PAGE and PAGE gels, all proteins or protein domains appeared to be monomers when in the presence of β-MEtOH. Circular dichroism evaluated the state of folding of the CopS_C and CopR proteins, which were shown to be folded in which the α-helix structures predominate. A model structure for CopR was also determined which agrees with this analysis. However, in the case of the CopR domains, the data obtained merely indicate folding, due to the low concentrations of the proteins. Phosphorylation and electrophoresis mobility shift assays of the CopR protein were, for the most part, inconclusive. However, in the absence of BSA, formation of the CopR:DNA complex in a gel filtration column is observed, though requires additional evaluation.
Kim, Seong-Jin. "Directional crystallization in the bismuth-strontium-calcium-copper-oxygen system: Effect of phase separation." Diss., The University of Arizona, 1992. http://hdl.handle.net/10150/186040.
Full textJensen, Paul William 1967. "A structural and geochemical study of the Sierrita porphyry copper system, Pima County, Arizona." Thesis, The University of Arizona, 1998. http://hdl.handle.net/10150/291456.
Full textRushing, Jason Clark. "Advancing the Understanding of Water Distribution System Corrosion: Effects of Chlorine and Aluminum on Copper Pitting, Temperature Gradients on Copper Corrosion, and Silica on Iron Release." Thesis, Virginia Tech, 2002. http://hdl.handle.net/10919/34235.
Full textFactors identified included the presence of relatively high levels of free chlorine and aluminum in the distribution system. Experiments were conducted to examine the effect of these constituents on copper pitting under stagnant and flow conditions. That led to discovery of a synergistic redox reaction between chlorine, aluminum solids, and copper metal as evidenced by increased chlorine decay rates, non-uniform corrosion, and rising corrosion potentials.
Temperature changes had been suspected to increase copper pitting frequency and copper release to drinking water. Experiments examined the effect of temperature gradients on copper pipe corrosion during stagnant conditions. The pipe orientation in relation to the temperature gradient determined whether convective mixing would occur, which influenced temperature gradients within the pipe. This work is the first to demonstrate that temperature gradients lead to thermogalvanic currents, influences copper leaching and scale type.
Iron release from corroding water mains is another concern of many water utilities, but little is known about chemistry factors that influence the problem. In laboratory experiments, higher levels of silica caused more iron release to the water and decreased the size of suspended iron particles. Silica levels also changed during the experiment: it decreased through incorporation into a dense scale, and increased by release from cast iron during corrosion. Silica slightly decreased iron corrosion rates near the end of this 6-month test.
Master of Science
Davis, William. "The Effects of Hydrilla Infestation on Selected Wintering Waterfowl: Santee Copper Lake System, South Carolina." TopSCHOLAR®, 1997. http://digitalcommons.wku.edu/theses/773.
Full textFarquharson, Colin. "Studies of connective tissue abnormalities in the skeleton and cardiovascular system of copper deficient rats." Thesis, University of Strathclyde, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.278277.
Full textMäki, J. (Joni). "Lysyl oxidases:cloning and characterization of the fourth and the fifth human lysyl oxidase isoenzymes, and the consequences of a targeted inactivation of the first described lysyl oxidase isoenzyme in mice." Doctoral thesis, University of Oulu, 2002. http://urn.fi/urn:isbn:9514267397.
Full textXiao, Weizhong. "EFFECT OF SOURCE WATER BLENDING ON COPPER RELEASE IN PIPE DISTRIBUTION SYSTEM: THERMODYNAMIC AND EMPIRICAL MODELS." Doctoral diss., University of Central Florida, 2004. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/4409.
Full textPh.D.
Department of Civil and Environmental Engineering
Engineering and Computer Science
Civil and Environmental Engineering
Mathur, Aditi. "Optimization of Polymer Enhanced Diafiltration system by studying copper removal from aqueous solutions using Lambda-carrageenan." Digital WPI, 2008. https://digitalcommons.wpi.edu/etd-theses/993.
Full textBeamguard, Miles B. "Mathematical model of arsenic adsorption in a modified zeolite / Microfiltration System." [Tampa, Fla] : University of South Florida, 2006. http://purl.fcla.edu/usf/dc/et/SFE0001804.
Full textAffandi, Trisiani, and Trisiani Affandi. "Structural and Functional Characterization of the Histidine Kinase CusS in Escherichia coli." Diss., The University of Arizona, 2016. http://hdl.handle.net/10150/622937.
Full textRusk, Brian Geoffrey. "Cathodoluminescent quartz textures and fluid inclusions in veins of the porphyry copper-molybdenum deposit in Butte, Montana : constraints on physical and chemical evolution of the hydrothermal system /." view abstract or download file of text, 2003. http://wwwlib.umi.com/cr/uoregon/fullcit?p3080595.
Full textTypescript. Includes vita and abstract. Includes bibliographical references (leaves 211-235). Also available for download via the World Wide Web; free to University of Oregon users.
El, Mallah Nadine Hassan. "Dispersion of the carbon nonotubes in a vacuum arc system and synthesis of copper-carbon nanotubes composites." Thesis, McGill University, 2006. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=99408.
Full textSadagopan, Rishi S. "Effect of copper and nickel on the performance of an activated sludge system treating cellulose acetate wastewater." Thesis, This resource online, 1992. http://scholar.lib.vt.edu/theses/available/etd-09292009-020122/.
Full textHeinrich, Glen Sean. "An investigation into the use of froth colour as sensor for metallurgical grade in a copper system." Master's thesis, University of Cape Town, 2003. http://hdl.handle.net/11427/15427.
Full textIn recent years the development of Machine Vision systems has opened up new possibilities for non-intrusive process performance sensors and process control. There are currently various Machine Vision systems on notation plants worldwide (Metso at Kennecott, Frothcam at Escondida). Extensive research has been done on using froth image analysis in closed loop control (Hyotyniemi et aI, 2000; Kittel et aI, 2001; Holtham and Nguyen, 2002; Cipriano et aI, 1998) and recently plants have been using these systems to control the air or level of a flotation cell as a means of controlling mass pull using the froth velocity output. As yet no flotation plants have reported the use of froth colour in their control strategies, however it is well accepted that an experienced operator can judge the metallurgical state of a flotation cell by the appearance of the froth, using colour as a key descriptor of grade, particularly in the case of copper froths. For this reason an investigation was undertaken to evaluate whether a relationship existed between concentrate grade and the froth colour obtained using a Machine Vision system. This relationship could be used to control reagent addition or for system diagnostics. Both would be invaluable tools for the flotation industry. A Machine Vision system called SmartFroth has been developed at University of Cape Town (VCT) as a research tool to investigate the relationships between froth surface indicators and metallurgical parameters. The relationship between froth colour and % solids was also investigated as it was believed that solids loading could be reflected by froth colour. This work was aimed at evaluating the empirical relationship between froth colour and copper grade in the laboratory and then investigating whether a similar relationship existed on plant. Various colour spaces were examined to find one appropriate for the copper flotation froths in order to allow for accurate colour analysis. It also evaluated the use of calibration objects in the colour analysis of flotation froths. This work also evaluated relating froth colour to % solids on plant. Two batch flotation campaigns were done using different ores as well as a preliminary plant trial.
Morard, Adrien. "Miniaturisation et fiabilité des interconnexions copper pillar sur desassemblages de type « System In Package » (sip) pour le domaine aéronautique." Thesis, Université Grenoble Alpes (ComUE), 2019. http://www.theses.fr/2019GREAT068.
Full textThe thesis is opening towards new technical solutions. The aim of this study is twofold, the first is tominiaturize the electronics to achieve a factor of 10 in integration compared to a conventional CMStechnology, the second is to improve the system in package reliability for aeronautics, defense and space.The first step concerns the manufacture of an assembly composed by a silicon chip and an organicsubstrate. These two entities will allow the study of the report by flip chip. To do so, micro-pillar type copperand tin-silver solder connections, otherwise known as copper pillar, will be used. The impact of differentdesign and assembly parameters on thermal cycles reliability will be studied.In a second step, finite element simulations are carried out on the assemblies in order to obtainpredictions on the reliability during thermal cycles using as a criterion the viscoplastic energy. Thesimulations and the experimental results will eventually be compared, and the gaps will be discussed.Failures analysis during thermal cycles will be based on the analysis of copper pillar interconnectionsby micro-sections and SEM and EBSD imaging. Thickness changing in intermetallic, cracking in the solder aswell as grain size and recrystallization phenomena will be presented and commented.The final objectives of this work are, from an academic point of view, to highlight first of all, theC2 - Restrictedbehaviors involved in the reliability of such interconnections in a binding thermo-mechanical environment,and moreover, the failure mechanisms. Then, it is to establish a predict life model that is representative ofthe experimental results obtained. Finally, it will define design rules that can then be used at Safran for therealization of SIP
Muraco, Cory E. "Isolation and Characterization of Oxidized Lysozyme Variants Produced by a Copper(II)/Hydrogen Peroxide Metal-Catalyzed Oxidation System." Youngstown State University / OhioLINK, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=ysu1369228839.
Full textEdwards, Sion Charles. "The behaviour of mercury and copper contamination in a lowland river system and their accumulation by some biota." Thesis, Imperial College London, 1995. http://hdl.handle.net/10044/1/7457.
Full textSunyer, i. Borrell Alba. "Arsenic inertization through alunite-type phases: Application to copper pyrometallurgy." Doctoral thesis, Universitat de Barcelona, 2013. http://hdl.handle.net/10803/128666.
Full textAvui en dia l’arsènic és un problema de contaminació de les aigües important. Una de les fonts de generació de residus amb arsènic són les indústries metal•lúrgiques no ferroses. En la metal•lúrgia del coure, la important demanda d’aquest metall està obligant a obtenir el coure de menes que cada cop contenen més arsènic. Així doncs, cada cop es generen més residus amb arsènic que han de ser abocats a llocs controlats. En alguns països, aquests residus estan provocant problemes de contaminació a les aigües freàtiques. Per tal d’evitar aquests problemes, s’han fet nombrosos estudis per a la precipitació i estabilització de l’arsènic. Malgrat tot, totes les fases estudiades contenen ferro, que és pot reduir fàcilment en sòls reductors. A més a més, molts estudis indiquen que totes aquestes fases, a llarg termini s’acaben descomponent permetent la dissolució de l’arsènic que contenen. Amb la intenció de trobar una solució a aquest problema, en aquesta tesi es proposa la inertització d’arsènic a través de fases del supergrup de l’alunita, concretament les que porten alumini i no ferro en l’estructura. Aquestes fases presenten la característica de poder substituir part del sulfat de l’estructura per arseniat. Aquesta substitució és la que s’ha estudiat en natroalunites, alunites i hidroni alunites, així com en d’altres membres anàlegs. La incorporació d’arseniat ha estat possible en natroalunites i alunites, seguint la mateixa partició: (AsO4/(SO4+AsO4))S ≅ 0.5(AsO4/(SO4+AsO4))L. Amb la incorporació d’arseniat el paràmetre de cel•la c s’incrementava amb una pendent de ~0.58 Å. No obstant, un paràmetre de cel•la c inicial de l’alunita més gran, no té efecte en la incorporació d’arseniat a l’estructura. Finalment, l’estabilitat a curt, a mig i a llarg termini de les natroalunites i les alunites ha resultat sé molt bona. A curt termini aquesta era de 0.01-0.03 mg As/L a pH’s entre 5 i 8. A llarg termini (6 mesos) la natroalunita es va estabilitzar a 0.1 mg/L. En tests a mig termini (5 setmanes) l’alunita es va estabilitzar a 0.3 mg As/L. Aquests valors de dissolució són molt més bons que en d’altres fases utilitzades, com per exemple les escorodites, les quals presenten un valors a curt termini un ordre de magnitud més elevats. A mig termini es va veure que l’escorodita natural presenta un valor similar al de l’alunita (0.4 mg/L), mentre que l’escorodita sintètica presenta un valor de 1.3 mg/L, molt més elevat que els obtinguts per alunites i per natroalunites.
MacNevin, David. "THE EFFECTS OF PHOSPHATE AND SILICATE INHIBITORS ON SURFACE ROUGHNESS AND COPPER RELEASE IN WATER DISTRIBUTION SYSTEMS." Doctoral diss., University of Central Florida, 2008. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/3713.
Full textPh.D.
Department of Civil and Environmental Engineering
Engineering and Computer Science
Environmental Engineering PhD
Bashir, Muhammad Muqarrab. "Modeling reliability in copper/low-k interconnects and variability in cmos." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/41092.
Full textThompson, Denis Alan. "Removal of copper and nickel from solution by the non-viable biomass of the water fern Azolla filiculoides in an upscaled fixed-bed column system." Thesis, Rhodes University, 2001. http://hdl.handle.net/10962/d1003973.
Full textFarooqi, Owais Ehtisham. "An Assessment and Modeling of Copper Plumbing pipe Failures due to Pinhole Leaks." Thesis, Virginia Tech, 2006. http://hdl.handle.net/10919/33918.
Full textMaster of Science
Xiao, Zhifeng 1966. "Experimental and theoretical studies of the solubility of copper in liquid and vapor in the system NaC1-HC1-HO." Thesis, McGill University, 1999. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=36733.
Full textThe solubility of copper in liquid was measured in vapor-saturated aqueous HCl/NaCl solutions at temperatures ranging from 40 to 300°C, total chloride concentrations from 0.01 to 1 m, and pH from 0 to 3.5. Copper was found to dissolve primarily as CuCl(aq), CuCl2- and CuCl32-. Data collected from the experiments were regressed to determine the equilibrium constants as functions of temperature (K): Cu(s) + 1/4O2(g) + H+ + xCl- = CuClx1-x +1/2 H2O(l), where x varied from 1 to 3.
Data obtained on the solubility of copper in the liquid phase were used to model gold-copper and gold-zinc mineralization in VMS deposits. Equilibrium path calculations, employing EQ3/6, predict temperatures of precipitation, the paragenetic sequence of minerals, and the chemical composition of chimneys associated with vents on the seafloor at 21°N, East Pacific Rise. The modeling results suggest that the co-precipitation of gold with copper and zinc at different temperatures is determined by the behavior of their complexes in the solution. However, among the models simulated, only the conductive cooling model and combined mixing and cooling model predict the co-precipitation of gold and copper at high temperature (>300°C) and gold-zinc at low temperature (<250°C), which is common in VMS deposits.
The solubility of CuCl(s) in the vapor was measured in a vapor-saturated H2O(I)-H2O(v)-NaCl-HCl (NaCl/HCl; 9:1) system at temperatures ranging from 360 to 400°C, and total chloride concentration from 0.01 to 5 m. At 360°C, the copper solubility can be described by the reaction: CuCl(s) + H2O(v) = CuCl⁺H2O(v), and the equilibrium relationship for this reaction by KC = mCuCl⁺H2Ov /rH2Ov , where mCuCl⁺H2Ov is the molality of copper in the vapor phase and rH2Ov is the density of water vapor; the log KC value is ~-2.01. At 380°C and 400°C, copper solubility is controlled by the reaction: CuCl(s) + 4 H2O(v) = CuCl ⁺ 4H 2O(v). The equilibrium relationship for this reaction is KC = mCuCl⁺4H2O v/r4 H2Ov , and the values of log KC values are 0.22 and 1.17 at 380 and 400°C, respectively.
Partition coefficients for copper between vapor and liquid were calculated for the CuCl-NaCl-HCl-H2O(l)-H2O(v) system at the following conditions, where T = 400°C, P = water vapor saturated pressure, mNaCl = 0.5--2.3m, and mHCl = 0.001 m. The close similiarity of the partition coefficients for copper to those of sodium under the same conditions suggests that partitioning data for NaCl can be used to estimate copper (I) chloride partition coefficients at conditions for which no data are available.
張曉筑. "Add Thiourea for Acidic Copper System." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/18954122324851127846.
Full text明新科技大學
化學工程與材料科技研究所
100
There were different kinds of additives used in the process of electroplating copper. The experiment focused on the effect of the electroplating procedure of copper by changing the thiourea concentration, observing the structure of the surface, rate of metal deposition, analysis of crystal structure and the change of resistivity with the equipments of SEM, EDS, XRD and four-point prove. The reason to use additives was to improve the roughness, smoothness and sameness of the coating. The acid sulfuric acid copper was the main electroplating solution due to it’s simple composition, stability, high current rate and high efficiency. The results showed that when the additive of sulfur urea was at 10 ppm, the structure of the specimen was denser, the coating smoother, the deposition faster, resistivity higher and so on.
CHENG, CHUNG-HAO, and 鄭中豪. "Development of Automatic Copper Wire Elongation System." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/br2syh.
Full text國立勤益科技大學
電子工程系
107
Copper wire is currently a most widely used conductive material for transmitting various signals. Its size can be produced as small as 0.01mm, particularly in medical health equipment. Although most of the wire elongation process has been atomized, it still requires human to thread the wire through tens of die molds in advance, usually taking tens of minutes. To resolve this problem, this paper develops an automatic mechanical control system for wire elongation. The proposed hardware system mainly contain three pneumatic claws that can replace the human hands operation are designed in the proposed system. The first claw is used to clamp the wire. The second claw fixed in the rotating mechanism is to draw the heated wire. The third claw is used to move the wire going through the die molds. The wire drawing power is generated from the gear connection controlled by the serer motor. The control software is developed by PLC programming. The experimental results confirm that the proposed can work efficiently in terms of robust and rapid performance.
Bolcavage, Ann. "A study of the copper-indium binary system." 1991. http://catalog.hathitrust.org/api/volumes/oclc/24334235.html.
Full textTypescript. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 67-68).
Tsai, Wen-Ching, and 蔡文慶. "High Frequency Pulse Plating in Acid Copper System." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/94402318544442499309.
Full text國立清華大學
化學工程學系
91
In this dissertation, the effects of high frequency pulse plating on copper deposition in acid copper system were theoretically and experimentally studied. In the part of theoretical analysis, numerical simulations were employed to predict the influence of additive with various inclusion rates and capacities on potential response and mass transfer. The analyses of potential responses at various pulse periods were employed to account for the variation of current efficiency by pulse current. In the experimental analysis, copper electrodeposition in plated-through-hole (PTH) process and onto copper seed layer over silicon wafer by high frequency pulse current (PC) and pulse-reverse current (PR) were characterized by linear sweep voltammetry (LSV), cyclic voltammogram (CV), impedance, scanning electron microscopy (SEM) and x-ray diffraction (XRD). 80 ppm chloride ions (Cl-), 100 ppm polyethylene glycol (PEG) with 4000 average molecular weight and 40 ppm 3-mercapto-1-propanesulfonate (MPS) were used as additives and compared with the baths without additives. In the absence of additives, capacitive current density can be neglected owing to the smaller overpotential. However, the double layer effect can not be neglected in the millisecond range pulse plating in the presence of additives. Overpotential response is strongly affected by the presence of additives. Capacitive current density not only increases in the presence of additives due to increase in overpotential but also increases with increasing capacity of double layer. Then, the variation of surface concentrations of additives and metal ions diminishes as a result of the fast charging and discharging of the double layer. This prediction is consistent with the experimental overpotential response on a copper rotating disk electrode in a bath with and without 100 ppm PEG. The current efficiency of copper deposition decreases with shortening pulses in the millisecond range but increases with shortening pulses in the microsecond range. Shortening the pulse period could change the rate-determining step from the first-step charge transfer and surface diffusion to the first-step charge transfer. Only in the millisecond range, the current efficiency decreases with shortening pulse period due to the disproportionation of cuprous ions and the dissolution of copper adatom. However, in the microsecond range, the current efficiency was found to increase with decreasing pulse period because the adatoms are directly incorporated into steps and kink sites, and the disproportionation of cuprous ions or the dissolution of copper adatoms has less chance to occur. High frequency PC and PR can improve the deposition uniformity in PTH. In an additive-free electrolyte, the deposition uniformity in PTH with high frequency PC and PR at 20 mA/cm2 average current density is better than that with low frequency PC and PR. Based on impedance analysis, plating at low frequency is controlled by the diffusion of cuprous or cupric ion while plating at high frequency is controlled by charge transfer. Changing the rate-determining step from diffusion control to charge transfer control results in an improved metal distribution. In the presence of additives (PEG+MPS+Cl), the uniformity improves with DC at 20 or 10mA/cm2. The trend in the baths with additives using PC and PR at high and low frequency is similar to that in the bath without additives. However, the improvement by high frequency PC and PR is not significant since the plating is under adsorption control. The resistivity of copper deposit decreases with increasing PC and PR frequency in the baths with and without additives. The deposit becomes smoother with larger grain size as the frequency increases. Since overpotential decreases with increasing pulse frequency, it results in lower resistivity. In addition, the increase in the fraction of (200) at high frequency also reduces the resistivity. In the presence of additives, the copper resistivity of a bath with additives is generally lower than that without additives. A larger grain size can be obtained in the presence of additives because the additives tend to decrease overpotential, which naturally lead to lower resistivity.
楊世權. "Research of Fabrication Copper Nanofluid by Plasma Arc System." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/13634383109450458847.
Full text國立臺灣師範大學
機電科技研究所
99
The purpose of experiment is aim to a methods of nanofluid produce by arc plasma. Refer to previous research data and correction. Consist with several stages: preparation, modification, system installation, tested; use “Evaporation synthesi- zed condensation system” to implement copper/water nanofluid by selected high energy plasma arc that can vaporize any kind of metal as a heating source, collect vaporized nanoparticle into nanofluid collector. To avoid condensed bigger size of particle due to high temperature or cluster, take paramenter in consideration during the period of experiment; such as working current, collector function, trying to obtain process minimum and average nanoparticle. By mean of two stage experiment, base on different current parameter (50A, 60A, 70A, 80A) collector to gain the proper nanoparticle by target meterial melting situation. Preliminary analyze to determine what type of current maybe optimum parameter. Marcoscopic results show current 60A and 70A are optimum parameter for particle collect on stage one. In the second stage, base on fixed current used three different working current plasma arc torch pulse. Then stimulate with ultrasonic after that, analyze by SEM, EDS, particle size analyzer to define which process can produce perfect nanoparticle. As a result, working current 60A/25Hz average particle is 548nm, 70A/25Hz average particle is 3500nm, process copper/water nanofluid heating resistance test, found that heating resistance reach to -30% under water temperature 50℃, paramenter 70A/25Hz.
CHEN, HAUAN-CHU, and 陳宣竹. "System software development for automatic Copper Wire Elongation process." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/k9cu6t.
Full text國立勤益科技大學
電子工程系
107
Before the industry conducts automatic wire drawing operations, the wires have been manually thinned and passed through the eye molds. However, increasing labor cost is becoming a big challenge in industry. For this reason, design an automation system software, with the wire through the eye mold mechanism, the software design proposed in this paper includes wire extension system, eye mold crossing system, man-machine interface. PLC is used as a core controller that controls pneumatic cylinder and server motor. Human machine interface is also designed for friendly operation. The simulation performance results confirm that the proposed is capable of carrying out an automatic Copper Wire Elongation process effectively.
Lin, Ming-Yuan, and 林明源. "Electrochemical Analyses of Leveler Additives in Copper Electrodeposition System." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/13804705372999412483.
Full text國立聯合大學
能源工程學系碩士班
103
High aspect ratio (HAR) though-Si via and though hole filling by copper plating is an important technology for 3D IC package to vertically connect chip-to-chip as interposers. In order to achieve a conformal copper metallization in high aspect ratio vias and holes filling, organic additives such as bis(3-sulfopropyl)disulfide (SPS), polyethylene glycol (PEG), and (Janus Green B, JGB) are commonly used in the Cu plating bath. In this work, a study of concentration effect of additives, the competition adsorption of the leveler additives on the copper electrodeposition, and forced convection behavior are performed by cyclic voltammetry (CV) and the galvanostatic measurements (GM) with rotating disk electrode under a well control of forced convection strength. According to the electrochemical analyses, the acceleration performance of SPS is better than that of MPS. The inhibition behavior of PEG did not increase isometrically with concentration of PEG if the amount of Cl- ion maintained at the same concentration. The electrochemical behavior of JGB is depended on bias current density and potential. The interaction studies between additives is according to the GM results with different injection sequence. By controlling the selected additives adsorbed on the surface of electrode, the antagonistic adsorption or synergistic behavior was discussed. Furthermore, we introduce a novel lever, Indione Blue (IB), in the plating bath to study the electrochemical behavior. Compare to the traditional lever, JGB, a better inhibit behavior was shown in the CV and GM results. An obvious increase of the cathodic potential was revealed by subsequently inject 1 ppm IB at a current density of 10 mA/cm2 indicating a good inhibit behavior. At the last part, electrolyte containing 0.88 M CuSO4‧5H2O、0.54 M H2SO4, 40 ppm Cl-, 200 ppm PEG, 1 ppm SPS, 1 ppm JGB or 1 ppm IB was used to fill blind holes on Si wafers. The blind holes with diameter of 50 μm and depth of 100 μm were successfully filled with copper electrodeposited at constant current density to achieve a void-free filling of TSV.