Relevant bibliographies by topics / Copper wires

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Academic literature on the topic 'Copper wires'

Author: Grafiati
Published: 4 June 2025
Last updated: 23 June 2025

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Journal articles on the topic "Copper wires"

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Crockett, William G. "Critical Barriers Associated with Copper Wire." International Symposium on Microelectronics 2015, no. 1 (2015): 000394–98. http://dx.doi.org/10.4071/isom-2015-wp31.

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Since around 2008, the shift from Gold (Au) bonding wire to Copper (Cu) bonding wire has been taking place, full scale, with the aim of reducing costs. When compared with Au, Cu wire presents challenges in reliability and repeatable bonding characteristics in terms of chemical stability, which is required in high reliability applications. Therefore Cu wire adoption in automotive and industrial semiconductors has been limited. Conventionally the market for Cu bonding wires has been divided into two types: bare Cu wires (high purity) and Palladium coated copper (PCC) bonding wires. These wires have yet to satisfy the required characteristics for high reliability products such as industrial and automotive electronics. A new breed of alternative bonding wires has been developed to offer performance advantages for high reliability applications compared to bare copper wire and PCC wire. Cu alloy wire and Ag alloy wires continue their market introduction for advanced bonding applications, where bare Cu and PCC wires have known limitations.
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Demian, Mihai, Gabriela Demian, Stefan Radu, and Alexandru Becheru. "Studies to Determine Optimal Parameters for the Ultrasonic Bonding of Copper Wires." Applied Mechanics and Materials 880 (March 2018): 285–90. http://dx.doi.org/10.4028/www.scientific.net/amm.880.285.

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In the paper is investigated a method of ultrasonic connection of copper wires so that its joining has a higher mechanical strength. Copper wires connection analysis was carried out by destructive methods such as breaking strength of wire testing or metallographic testing. The purpose of the paper is to identify optimal parameters for ultrasonic welding of copper wires.
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Li, Zhe, Qingwen Lin, Yang Li, Huifei Lyu, Huaibin Wang, and Junli Sun. "Effect of the Current on the Fire Characteristics of Overloaded Polyvinyl Chloride Copper Wires." Polymers 14, no. 21 (2022): 4766. http://dx.doi.org/10.3390/polym14214766.

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In this study, the fire behavior variation of unenergized polyvinyl chloride (PVC) copper wires subjected to overload with different currents was investigated by a cone calorimeter. Overload currents were selected from 1 times safe-rated current (Ie) to 3.5 times Ie to obtain tested sample wires. The mass fraction, time to ignition (TTI), heat release rate (HRR), gas emission, and residue were measured. If the current flowing through the wire increased up to 3.5 times Ie, the TTI of this unenergized wire increased drastically and the peak HRR (pHRR) decreased notably so that the flame growing index (FGI) reduced considerably. When the wire carried less than three times Ie, the FGI remained stable. For all overloaded PVC copper wires, the increase in the heat flux resulted in a higher pHRR and a lower burning duration. However, regardless of the external heat flux exposure, the FGI of copper wires overloaded at 3.5 times Ie was lower than that of copper wires carrying less than other times Ie. Moreover, the consumption of O2 and generation of CO2 as the heat flux varied were consistent with that of the HRR. Opposed to expectation, the flame propagation of unenergized PVC copper wires would decline in a fire, if the wire has been damaged by overload with some currents.
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Zhu, Jianjun, Guangkai Yu, Ting Liu, et al. "Application of Copper Cladding Aluminum Composites in UHV Portable Earthing and Short-circuiting Wires." MATEC Web of Conferences 160 (2018): 01004. http://dx.doi.org/10.1051/matecconf/201816001004.

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Aiming at the heavy weight and inconvenience when carrying and installing copper earthing wires on the UHV transmission lines, in this paper, we present the use of copper clad aluminum(CCA) composite materials as a lightweight method for UHV earthing wire conductor. Theoretical calculations and tests of the fusing current in a short time for copper and CCA material are conducted. The results show that the theoretical value of the earthing wire conductor's fusing current corresponds with the test value on condition of the conductor cross section greater than 4mm2 as well as fusing time less than 1.5s. The CCA-10 earthing wires get 36.2% weight reduction compared with copper wires.
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Bolya, Piyush, Nibha Yadav, Vikas Goyal, Shuchi Singh, and Neha Ajmera. "Impact of recycling on efficiency and efficacy of copper nickel titanium wire and heat activated nickel titanium wire – An invitro study." Journal of Contemporary Orthodontics 8, no. 3 (2024): 294–300. http://dx.doi.org/10.18231/j.jco.2024.044.

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The aim of the study is to assess the feasibility of reusing copper nickel titanium wire and heat activated nickel titanium wires by evaluating the changes in efficiency and efficacy of wire after different sterilization techniques. 120 total samples were taken. 60 samples of Damon copper nickel titanium (ORMCOTM) and 60 samples of heat activated nickel titanium wires (ORMCOTM). Damon CuNiTi and HANT were divided in 4 different sub groups of 15 samples each. 15 as received wires served as controlled group. The remaining wires were placed intraorally for a period of 4 weeks in patients undergoing orthodontic treatment. After 4 weeks, these wires were taken out. Remaining 45 wires were divided on the basis of sterilization method to be used. (autoclave, 70% isopropyl alcohol, 2% glutaraldehyde solution). Maximum load and tensile strength were tested using universal testing machine. No significant difference in mechanical properties of wires after various sterilization process (p value > 0.05). There no such difference in mechanical properties of controlled group wires and wires those are placed intraorally for 4 weeks. Results suggested that there was no statistically significant difference in the Ultimate Tensile Strength and Maximum Load of Damon Copper Nickel-Titanium wire and Heat Activated Nickel Titanium wire following various sterilization procedures. These wires can be reused after sterilization.
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Yang, Fei, Xiaodan Zhang, and Feng Fang. "Microstructure and properties of cold-drawn Cu and Cu-Fe alloy wires." IOP Conference Series: Materials Science and Engineering 1249, no. 1 (2022): 012057. http://dx.doi.org/10.1088/1757-899x/1249/1/012057.

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Abstract Copper and Cu-Fe alloy wires were cold drawn at room temperature, and the microstructure and properties were characterized and analyzed. The results show that, at the same drawing strain, the strength and ductility of Cu-Fe wires are higher than those of copper wires. At a drawing strain of 4, the tensile elongation of Cu-Fe alloy wires is about 5%, much higher than 2% for pure copper wires. For Cu-Fe wires, with increasing drawing strain, the Fe phase is elongated along the drawing direction and forms a fiber structure with a <110> texture. In addition to the <111> and <100> fiber textures in the copper wire, a high-intensity of texture with a <112> orientation forms in Cu-Fe alloy wires. The ductility of the Cu-Fe alloy wires is greatly preserved due to dynamic recrystallization. Moreover, with the additional refining effect of nano-copper fibers in the Fe phase, the strength of the material is greatly improved.
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Appelt, Bernd K., William T. Chen, Andy Tseng, and Yi-Shao Lai. "Fine Pitch Cu Wire Bonding – As Good As Gold." International Symposium on Microelectronics 2010, no. 1 (2010): 000650–55. http://dx.doi.org/10.4071/isom-2010-wp4-paper1.

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Fine pitch wire bonding has traditionally been the domain of gold wires. The significant increase in gold commodity prices has driven a continuous reduction in wire diameters to minimize the impact of the raw materials cost of the wire. This has reached a point now where copper wires are beginning to displace gold wires despite the technical challenges associated with copper wires. The basic challenges like propensity for oxidation, hardness and propensity for corrosion can be managed with the appropriate investment in tooling and infrastructure. Doubts are persisting about yield and reliability. With a very methodical approach to developing the process controls, it can be demonstrated that yields are as good as those for gold despite the fact that copper bonds are not reworkable. Likewise, the typical JEDEC reliability tests can be full filled. Here, an extensive effort has been placed on extended JEDEC testing to demonstrate that with good process control and proper materials choices, test durations of more than 2x can be passed. This excellent performance demonstrates that copper wire bonding can be as good as or better than gold wire bonding.
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Banda, Floyd, Levy Siaminwe, and Henry M. Mwenda. "Aspects of Die Geometry Influencing Drawability of Metals During Wire Drawing: A Literature Review." Journal for Manufacturing Science and Production 14, no. 3 (2014): 141–49. http://dx.doi.org/10.1515/jmsp-2013-0023.

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AbstractDrawn metal wires such as copper cables, aluminium wires and steel wires have found several applications which have an impact on the domestic and commercial economic uses, namely power cables, welding cables, wire ropes, wire meshes, electrode and filler wire, etc. All these applications require the use of good quality wires. However, this is not easily achieved since wire production faces many challenges. The influence of the drawing die on drawability and the need to maintain the required quality characteristics of the wire stand out among these challenges. This paper gives a background to wire drawing by highlighting the challenges of attaining the required drawability and quality characteristics during wire drawing. It was found from the literature that the draw die geometry has the greatest influence on the quality of copper, aluminium and steel wire products.
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Chelladurai, Samson Jerold Samuel, Ramesh Arthanari, Rohith Selvarajan, Sujeevan Athanarsamy, Satheshkumar Arumugam, and Gajendhiran Veerakumar. "Investigation on Mechanical Properties and Wear Behaviour of Squeeze Cast LM13 Aluminium Alloy Reinforced with Copper Coated Steel Wires." Zeitschrift für Physikalische Chemie 232, no. 12 (2018): 1787–806. http://dx.doi.org/10.1515/zpch-2017-1093.

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Abstract Copper coated steel wires (1–5 numbers) reinforced in LM13 aluminium alloy composites have been prepared using squeeze casting process. Microstructure of composites has been investigated and mechanical properties viz., hardness, tensile strength and ductility have been examined and reported. Dry sliding wear behaviour of composites has been investigated by varying sliding distance and load. Fracture surface of broken tensile specimens and worn surface of wear samples have been investigated using field emission scanning electron microscope (FESEM). The results reveal that copper coated steel wires reinforcement in LM13 aluminium alloy improves the mechanical properties and wear resistance. Average hardness values of 136 BHN and 96 BHN have been observed in steel wire and at the interface of steel wire and aluminium alloy, respectively. Tensile strength of composites increased up to 28% by reinforcing three copper coated steel wires in LM13 aluminium alloy. Dry sliding wear test results reveal that weight loss, wear rate and coefficient of friction decreased with increasing number of copper coated steel wires reinforcement in LM13 matrix. However, weight loss of samples increased with increasing sliding distance and load. LM13 aluminium alloy reinforced with five numbers of copper coated steel wires decreased the weight loss up to 69% as compared to LM13 aluminium alloy tested at 40 N load and a sliding distance of 2500 m. Fracture surface of composites shows broken steel wires and dimples are observed in LM13 matrix. Worn surface of composites shows fine and shallow grooves; whereas delamination is observed in LM13 aluminium alloy. In general, copper coated steel wire reinforcement in LM13 aluminium alloy exhibited better mechanical properties and wear resistance compared to matrix.
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Mokryak, Andrei Yu, Anna V. Mokryak, Soslan V. Skodtaev, and Tatiana V. Safonova. "Determination of the Causes of Copper Wires Beads after Fire in Vehicles." Materials Science Forum 1049 (January 11, 2022): 311–16. http://dx.doi.org/10.4028/www.scientific.net/msf.1049.311.

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An electrical installation that simulates an automobile DC power supply system with a voltage of 12 V has been created. An experimental simulation of a short circuit at currents up to 400 A on copper multi-wire and single-wire conductors under normal environmental conditions is carried out. The copper wires beads were annealed in a furnace at temperatures from 700 to 1000 °C for 20, 40 and 60 minutes. Metallographic analysis of copper wires beads was carried out. The temperatures and times that of at which the signs of short circuit and overcurrent are destroyed has been revealed. Obtained results contribute to improvement evidence’s researching in the fire investigation of motor vehicles electrical wiring after a fire. Keywords: Arc beads, Copper, Metallographic analysis, Electrical Short Circuit, Wires.
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Dissertations / Theses on the topic "Copper wires"

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Khader, Iyas [Verfasser]. "Damage mechanisms in silicon nitride rolling tools applied in caliber rolling copper and steel wires / Iyas Khader." Aachen : Shaker, 2010. http://d-nb.info/1081885637/34.

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FERNANDES, MARCOS G. "Obtanção de fios em ligas cobre-magnésio para utilização em linhas de transmissão de energia elétrica." reponame:Repositório Institucional do IPEN, 2010. http://repositorio.ipen.br:8080/xmlui/handle/123456789/10030.

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Made available in DSpace on 2014-10-09T12:33:59Z (GMT). No. of bitstreams: 0<br>Made available in DSpace on 2014-10-09T14:01:16Z (GMT). No. of bitstreams: 0<br>Dissertação (Mestrado)<br>IPEN/D<br>Instituto de Pesquisas Energéticas e Nucleares - IPEN-CNEN/SP
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Johnston, Martin David. "Current and field distribution in high temperature superconductors." Thesis, Imperial College London, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.298870.

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Araújo, Mishene Christie Pinheiro Bezerra de. "Reciclagem de fios e cabos elétricos." Universidade de São Paulo, 2006. http://www.teses.usp.br/teses/disponiveis/3/3133/tde-05092006-135800/.

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A indústria eletro-eletrônica vem aumentando a quantidade de sucatas geradas anualmente. Por este motivo necessita-se de reciclagem, para que se evite o desperdício de matérias-primas e de recursos naturais não-renováveis. A maioria dos produtos eletro-eletrônicos não recebe tratamento pós-consumo sendo depositada em aterros sanitários junto com o resíduo doméstico.Os resíduos eletro-eletrônicos são caracterizados pela presença de metais distribuídos em placas de circuito impresso, fios e cabos elétricos e componentes eletrônicos em geral. No caso da reciclagem de fios e cabos ainda persistem práticas incorretas, como a queima do plástico para aproveitamento do metal, que elimina o polímero em vez de aproveitá-lo. A solução para este problema está no reaproveitamento destes metais e polímeros contidos nos resíduos eletro-eletrônicos. Assim, deixarão de ser perdidas quantidades de alumínio, cobre, e polímeros presentes nos cabos, os quais poderão gerar receitas para o processo, já que estes são indispensáveis ao processo de fabricação. O objetivo deste trabalho é estudar a reciclagem dos cabos tipo cordão paralelo e flexível através de operações unitárias de Tratamento de Minérios. O tratamento da sucata iniciou-se com a seguinte seqüência: moagem, separação granulométrica, separação em meio denso, separação eletrostática, atrição, bateamento e elutriação. Ao final destes processos observou-se que as operações unitárias utilizadas na pesquisa obtiveram concentrados de cobre com baixo grau de contaminação, porém com exceção da elutriação, todas precisam de uma outra técnica para complementá-las. Com os resultados obtidos, concluiu-se que a moagem em moinho de facas com grelha de 3mm seguida de elutriação possibilita a separação do material polimérico, assim como, a obtenção de um concentrado de cobre.<br>The electro-electronics industry follows increasing the amount of scraps annually generated. For this reason it is necessary to recycle, so that it prevents the waste of raw materials and not renovable natural resources. The majority of the electro-electronic products do not receive any treatment after use and is disposed in municipal landfills together with solid wastes (MSW). The electro-electronic wastes are characterized by metal presence distributed in printed circuits, wires and cables and electronic components in general. In the case of the recycling of wires and cables incorrect practices still persist, as the burning of the plastic for recovery of the metal, thus eliminating the polymer instead of using it to advantage. The solution for this problem is in the recovery of the metals and polymers contained in the electro-electronic wastes. Thus, amounts of aluminum, copper, and polymers contained in the cables will not be lost, that way they will be able to generate resources for the process, since these substances are indispensable to the manufacture process. The objective of this work is to study the recycling of the parallel and flexible cables through Mineral Processing unit operations. The treatment of the scrap was initiated with the following sequence: grinding, size classification, density separation, electrostatic separation, attrition, panning and elutrition. To the end of this process concentrate conductor of copper with low degree of contamination were achieved. However, with exception of elutrition, all they need another technique to complement them. With the gotten results, it can be concluded that the milling in knives mill with 3mm grate followed of elutrition makes possible the separation of the polymeric material, as well as, the attainment of a copper concentrate.
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Sarvari, Reza. "Impact of size effects and anomalous skin effect on metallic wires as GSI interconnects." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/31636.

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Thesis (Ph.D)--Electrical and Computer Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Meindl, James D.; Committee Member: Davis, Jeffrey A.; Committee Member: Gaylord, Thomas K.; Committee Member: Hess, Dennis W.; Committee Member: Peterson, Andrew F. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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Sathler-Zanda, Renata. "Avaliação da deflexão elástica de fios ortodônticos de níquel-titânio, calibre 0,014." Universidade de São Paulo, 2012. http://www.teses.usp.br/teses/disponiveis/25/25144/tde-05112012-215337/.

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PROPOSIÇÃO: O objetivo desta pesquisa foi apresentar a magnitude e a constância das forças liberadas por fios ortodônticos de níquel-titânio, usados para a correção dos apinhamentos dentários. Outro objetivo foi comparar os dois meios mais utilizados de avaliação da deflexão elástica destes fios: o teste de 3 pontos e o dispositivo de simulação clínica. MATERIAL E MÉTODOS: Foram avaliados 11 grupos de fios de liga predominantemente de níquel-titânio, calibre 0,014, de 6 marcas diferentes (Abzil convencional e termoativado; GAC convencional e termoativado; Morelli convencional e termoativado; Ormco CuNiTi; Orthometric convencional e termoativado e Orthosource convencional e termoativado), em teste de deflexão elástica, nas deflexões de 0,5; 1; 2 e 3mm. Uma máquina de ensaio universal INSTRON 3342, com célula de carga de 10N foi utilizada e, como protocolo, foi seguida a norma ISO 15.841. Para a análise estatística dos resultados foram utilizados os testes: Kolmogorov-Smirnov, para conferir se havia normalidade; teste t independente, para comparação dos resultados do teste de 3 pontos e dos resultados do dispositivo; e o teste ANOVA seguido do teste de Tukey, para comparações entre grupos. RESULTADOS: Houve diferença estatística entre os resultados gerados pelo teste de 3 pontos e os gerados pelo dispositivo. Por ser o teste indicado pela norma ISO citada, somente os resultados do teste de 3 pontos foram considerados. Todos os fios estudados apresentaram pseudoelasticidade em uma faixa de variação de força de até 40cN. Os grupos Abzil convencional, GAC convencional, Morelli termoativado, Ormco CuNiTi e Orthometric convencional apresentaram força dentro de uma faixa considerada ótima para a indução da movimentação dentária (50cN-100cN). Os fios termoativados liberaram forças mais leves que seus pares convencionais. CONCLUSÕES: Dentre os grupos estudados, aqueles que apresentaram pseudoelasticidade, forças dentro de uma faixa considerada ótima e homogeneidade de amostra, foram os grupos Morelli termoativado e Ormco CuNiTi.<br>OBJECTIVE: The purpose of this study was to present the magnitude and the constancy of the forces released by nickel-titanium orthodontic wires, used to treat dental crowding. Another purpose was to compare the most usual types of bending tests used to evaluate these wires: 3-point test and clinical simulation device. MATERIAL AND METHODS: Eleven groups of orthodontic nickel-titanium wires, caliber 0.014, of 6 different brands (Abzil conventional and heat-activated; GAC conventional and heat-activated; Morelli conventional and heat-activated; Ormco CuNiTi; Orthometric conventional and heat-activated and Orthosource conventional and heat-activated) were tested by bending test, at deflections of 0.5; 1; 2 and 3mm. A universal testing machine INSTRON 3342 with a 10N load cell was used and, in order to standardize the tests, the ISO 15.841 regulation was followed. Statistical analysis was performed using the subsequent tests: Kolmogorov-Smirnov to verify normality; independent t test to compare the results of the 3-point test and the results derived from the device, and ANOVA followed by the Tukey test for intergroup comparisons. RESULTS: There were significant differences between the results of the 3-point test and the device. As indicated by the ISO regulation, only the results from the 3-point bending test were considered. All groups were classified as pseudoelastic, within a load range of 40cN, at maximum. The groups Abzil conventional, GAC conventional, Morelli heat-activated, Ormco CuNiTi and Orthometric conventional released load within optimum range (50cN-100cN). Heatactivated wires released lower load compared to conventional wire of the same brand. CONCLUSIONS: Among the groups evaluated those that presented pseudoelasticity, load within a range considered optimal, in a homogeneous manner, were Morelli heat-activated and Ormco CuNiTi.
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Tardieu, Simon. "Fils conducteurs composites (microfils d'argent - cuivre) pour application en champs magnétiques intenses." Thesis, Toulouse 3, 2020. http://www.theses.fr/2020TOU30186.

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Le LNCMI-Toulouse produit les champs magnétiques non-destructifs pulsés parmi les plus puissants du monde (98,8 T). Les fils conducteurs utilisés dans les bobines qui génèrent ces champs magnétiques nécessitent une contrainte à la rupture élevée afin de résister aux forces de Lorentz. De plus, pour obtenir une durée d'impulsion la plus longue possible, ces conducteurs doivent avoir une résistivité électrique la plus proche possible de celle du Cu pur. Le LNCMI et le CIRIMAT explorent la conception et la préparation de fils nano-composites à matrice Cu par une combinaison de métallurgie des poudres, de frittage SPS et de tréfilage. Les poudres composites à faibles teneurs en Ag (&lt; 10 % vol. Ag) sont préparées en dispersant des microfils d'Ag (diamètre 200 nm, longueur 30 µm) synthétisés au CIRIMAT dans une poudre commerciale de Cu sphérique (diamètre 0,5-1 µm). Les poudres ainsi obtenues sont consolidées par SPS sous forme de barreaux. Ceux-ci sont étirés sans rupture, jusqu'à l'obtention de fils fins (diamètre 1 - 0,2 mm) dont la microstructure est sous la forme de grains ultrafins de Cu (200 - 400 nm) allongés sur plusieurs micromètres dans le sens de l'étirage. Les microfils d'Ag sont dispersés le long des joints de grains du Cu. La mesure de la résistivité électrique et de la contrainte à la rupture des fils (à 293 K et 77 K) a permis de déterminer que les fils contenants seulement 1 % vol. Ag présentent le meilleur compromis contrainte à la rupture / résistivité (1100 MPa / 0,49 µÔmega.cm à 77 K). La formation d'un alliage Cu/Ag lors du frittage SPS a pour conséquence une augmentation notable de la résistivité électrique des fils et doit donc être évitée. Une matrice de Cu avec une distribution bimodale de la taille des grains permet de réduire la résistivité électrique tout en conservant une haute contrainte à la rupture (1080 MPa / 0,45 µÔmega.cm à 77 K). Les fils nano-composites Ag-Cu présentent une contrainte à la rupture équivalente à celle des fils d'alliage Cu/Ag contenant environ 20 fois plus d'Ag élaborés par fusion et solidification, mais présentent une résistivité électrique environ 1,5 fois plus faible<br>LNCMI-Toulouse produces some of the most intense non-destructive pulsed magnetic fields in the world (98.8 T). The wires used in coils which generate these magnetic fields require high ultimate tensile strength (UTS) in order to resist the Lorentz forces. Moreover, to obtain the longest possible pulse duration, these wires must have an electrical resistivity closest to that of pure Cu. LNCMI and CIRIMAT explore the design and preparation of Cu-based nanocomposite wires obtained by a combination of powder metallurgy, Spark Plasma Sintering (SPS) and wire-drawing. Composite powders with low Ag contents (&lt; 10 % vol. Ag) are prepared by dispersing Ag microwires (diameter 200 nm, length 30 µm) synthesized at CIRIMAT in a commercial spherical Cu powder (diameter 0.5-1 µm). The so-obtained composite powders are consolidated by SPS in the form of cylinders. These cylinders are drawn, without breaking, in the form of fine wires (1 - 0.2 mm). The microstructure of the wires is made up of Cu ultrafine grains (200 - 400 nm) elongated over several micrometers in the drawing direction. Ag microwires are dispersed along the grain boundaries of Cu. The measurement of the electrical resistivity and the UTS of the wires (at 293 K and 77 K) shows that the wires containing only 1 vol. % Ag present the best compromise between high UTS and low electrical resistivity (1100 MPa / 0.49 µÔmega.cm at 77 K). The formation of Cu/Ag alloys during the SPS cycle significantly increases the resistivity of the wires and thus must be avoided. A Cu matrix with a bimodal grain size distribution makes it possible to reduce the electrical resistivity of the wires while keeping high UTS (1080 MPa / 0.45 µÔmega.cm at 77 K). Ag-Cu nanocomposite wires present high UTS, equivalent to that of Cu/Ag alloy wires containing about 20 times more Ag produced by melting and solidification, but their electrical resistivity is about 1.5 times lower
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Arnaud, Claire. "Fils conducteurs nanostructurés (cuivre et composites nanotube de carbone - cuivre) pour application en champs magnétiques intenses." Thesis, Toulouse 3, 2015. http://www.theses.fr/2015TOU30216/document.

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Afin de produire des champs magnétiques intenses (100 T), les fils conducteurs utilisés dans les bobines pulsées doivent présenter une contrainte à la rupture élevée et une très faible résistivité électrique. Le LNCMI et l'équipe NNC du CIRIMAT explorent des solutions originales basées sur l'élaboration de fils de cuivre nanostructuré et de fils nanocomposites nanotube de carbone - cuivre (NTC-Cu) par la combinaison originale du spark plasma sintering (SPS) et de l'étirage à température ambiante. Des barreaux de cuivre ont été élaborés par SPS à partir de poudres commerciales micrométriques. La croissance cristalline est très faible et la taille des grains de cuivre est 10 fois plus petite que celle des précurseurs de fils classiques. Les barreaux ont été étirés, sans rupture, sous forme de fils de diamètre décroissant (jusqu'à 0,198 mm) et de plusieurs mètres de long. Les grains ultrafins de Cu sont fortement allongés dans la direction de l'étirage. Aucune macle n'a été observée. Tous nos fils de cuivre présentent une résistance à la rupture en traction (à 293K et 77K) supérieure à celle des fils préparés à partir d'un précurseur de cuivre OFHC classique, ce qui pourrait résulter de la combinaison de l'écrouissage et des mécanismes d'Orowan. La résistivité électrique des fils est environ 12% plus élevée que celle des fils de cuivre OFHC. Pour les composites NTC-Cu, une adaptation de la méthode de mélange (fonctionnalisation des NTC biparois et à huit parois, mélange, cryogénisation, lyophilisation, réduction sous H2) a permis de produire des lots de poudre de 14 g en ayant une dispersion homogène des NTC. Du fait de la très faible teneur en carbone (= 1%), la préparation des barreaux puis des fils par les méthodes employées pour le cuivre pur est possible sans modification. La contrainte maximale à la rupture des fils NTC-Cu est supérieure (10-25%) à celle des fils de cuivre correspondants. Les NTC ont peu d'influence sur la microstructure du cuivre et leur probable alignement permet de bénéficier de leur grande résistance en traction. La résistivité est légèrement supérieure à celle des fils de cuivre correspondants (environ 12% à 77K). Le dernier chapitre est consacré à la préparation d'éprouvettes " os-de-chien " (Cu et NTC-Cu) directement par SPS " near-net-shape ". Nous avons mis en évidence l'influence de la nature du matériau dans lequel est usinée la matrice (graphite ou WC-Co) sur la microstructure, la microdureté et la contrainte à la rupture, pour un même cycle de frittage<br>In order to produce high magnetic fields (100 T), the conducting wires used in pulsed coils must show both a high tensile strength and very low electrical resistivity. The LNCMI and NNC team of CIRIMAT explore creative solutions based on the development of nanostructured copper wires and carbon nanotube - copper (CNT-Cu) nanocomposite wires by the original combination of spark plasma sintering (SPS) and room-temperature wire-drawing (WD). Copper cylinders were prepared by SPS of micrometric commercial powders. Crystal growth is very low and the copper grains size is 10 times lower than for conventional wire precursors. The cylinders were wire-drawn, without breaking, into wires of decreasing diameter (down to 0.198 mm) and several meters long. The ultrafine Cu grains are highly elongated in the WD direction. No twinning was observed. Our copper wires show an ultimate tensile strength (UTS) at 293K and 77K higher than those for wires prepared from conventional OFHC copper, which could result from the combination of strain hardening and Orowan mechanisms. The electrical resistivity is about 12% higher than those for the OFHC wires. For the CNT-Cu nanocomposites, an adaptation of preparation route (functionalization of double-walled and eight-walled CNTs, mixing, freeze-drying, H2 reduction) resulted in the production of 14 g powder batches with a homogeneous dispersion of the CNTs. Due to the very low carbon content (= 1%), the preparation of the cylinders and wires by the methods used for pure copper is possible without modification. The UTS of the CNT-Cu wirers is 10-25% higher than for the corresponding copper wires. The CNTs have little influence on the Cu microstructure and their probable alignment allows one to benefit from their high tensile strength. The electrical resistivity is only moderately higher than for the corresponding copper wires (about 12% at 77K). The last chapter was devoted to the preparation of "dog-bone" Cu and CNT-Cu test samples by "near-net-shape" SPS. We have brought to the fore the influence of the nature of the die (graphite or WC-Co) on the microstructure, microhardness and tensile strength, for the same sintering cycle
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Gross, David [Verfasser]. "Copper Metallization on Silicon Power Devices for Heavy Copper Wire-Bonding / David Gross." Aachen : Shaker, 2016. http://d-nb.info/1122546432/34.

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Zhang, Xiaodong. "Characterization of copper diffusion in advanced packaging /." View abstract or full-text, 2007. http://library.ust.hk/cgi/db/thesis.pl?MECH%202007%20ZHANG.

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Books on the topic "Copper wires"

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Chauhan, Preeti S., Anupam Choubey, ZhaoWei Zhong, and Michael G. Pecht. Copper Wire Bonding. Springer New York, 2014. http://dx.doi.org/10.1007/978-1-4614-5761-9.

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Latham, George. Copper wire George. Yamaji Language Centre, 2001.

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Commission, United States International Trade. Low-fuming brazing copper wire and rod from France, New Zealand, and South Africa: Determination of the Commission in investigation no. 701-TA-237 (preliminary) under the Tariff Act of 1930, together with the information obtained in the investigation. U.S. International Trade Commission, 1985.

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Commission, United States International Trade. Low-fuming brazing copper wire and rod from New Zealand: Determination of the Commission in investigation no. 731-TA-246 (final) under the Tariff Act of 1930, together with the information obtained in the investigation. U.S. International Trade Commission, 1985.

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United States International Trade Commission. Low-fuming brazing copper wire and rod from South Africa: Determination of the Commission in investigation no. 731-TA-247 (final) under the Tariff Act of 1930, together with the information obtained in the investigation. U.S. International Trade Commission, 1986.

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United States International Trade Commission. Low-fuming brazing copper wire and rod from South Africa: Determination of the Commission in investigation no. 731-TA-247 (final) under the Tariff Act of 1930, together with the information obtained in the investigation. U.S. International Trade Commission, 1986.

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United States International Trade Commission. Low-fuming brazing copper wire and rod from New Zealand: Determination of the Commission in investigation no. 731-TA-246 (final) under the Tariff Act of 1930, together with the information obtained in the investigation. U.S. International Trade Commission, 1985.

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United States International Trade Commission. Low-fuming brazing copper wire and rod from New Zealand: Determination of the Commission in investigation no. 731-TA-246 (final) under the Tariff Act of 1930, together with the information obtained in the investigation. U.S. International Trade Commission, 1985.

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United States International Trade Commission. Low-fuming brazing copper wire and rod from South Africa: Determination of the Commission in investigation no. 731-TA-247 (final) under the Tariff Act of 1930, together with the information obtained in the investigation. U.S. International Trade Commission, 1986.

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Blake-Coleman, B. C. Copper wire and electrical conductors: The shaping of a technology. Harwood Academic, 1992.

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Book chapters on the topic "Copper wires"

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Thilly, Ludovic, Vanessa Vidal, and Florence Lecouturier. "Plasticity Mechanisms in Multi-Scale Copper-Based Nanocomposite Wires." In THERMEC 2006. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-428-6.814.

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Tan, Sheldon, Mehdi Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, and Saman Kiamehr. "Fast EM Immortality Analysis for Multi-Segment Copper Interconnect Wires." In Long-Term Reliability of Nanometer VLSI Systems. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-26172-6_4.

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Funk, Felix, Huong Giang Nguyen, and Jörg Franke. "Scenario-Based Life Cycle Assessment of an Automotive Wire Harness." In Lecture Notes in Mechanical Engineering. Springer Nature Switzerland, 2025. https://doi.org/10.1007/978-3-031-77429-4_26.

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AbstractWire harnesses are one of the the largest purchased part for many automotive Original Equipment Manufacturers (OEMs). They are highly complex assembly products, consisting of hundreds of wires, electrical connectors, electronic parts, and ancillary materials such as tape. Assembly still is a largely manual process, as the complexity of the wire handling and low level of standardization and digitization pose a challenge to automation efforts. Wire harnesses are expected to increase in complexity and size due to current developments in the automotive sector, namely electromobility, autonomous driving, and digitalization. As a result, the importance of these products to the overall environmental impact of vehicles is likely to increase, with copper playing a significant role. In this study, the environmental impacts of a rear door wire harness are quantified by performing a Life Cycle Assessment (LCA), considering the life cycle from cradle to gate and based on different supply chain scenarios. The impact of sourcing and transport is shown and potential for improvement is derived, especially with regard to reshoring and automation.
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Cho, Jae Hyung, Anthony D. Rollett, and Kyu Hwan Oh. "The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing." In Materials Science Forum. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-434-0.399.

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Yoshida, Kazunari, and Hiroshi Tanaka. "Cup-shaped Defect in Copper Wires Drawn from Rods of Continuous Casting and Rolling." In Advanced Technology of Plasticity 1987. Springer Berlin Heidelberg, 1987. http://dx.doi.org/10.1007/978-3-662-11046-1_24.

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Reddy, Dukka Sai Sarath, K. V. Varalakshmi, and D. Srinivasa Rao. "An Experimental Study on the Tensile Behaviors of Ultrasonic-Welded Joints for Copper Wires." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2024. https://doi.org/10.1007/978-981-97-6016-9_30.

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Cież, Michał. "Bonding of Al Wires to Copper Contacts on PCBs and Alumina Substrates - a Comparative Study." In Microelectronic Interconnections and Assembly. Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5135-1_19.

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Dusi, Durga Prasad, B. V. Manu, Kambam Naresh Meetei, and Amit Kumar. "Numerical Investigation of Opposed Flame Spread Over Cellulose-Insulated Copper Wires in Normal Gravity Environment." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2025. https://doi.org/10.1007/978-981-97-6783-0_32.

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Zhang, Yuan-wang, Shu-sen Wang, and Da-wei Yao. "Microstructure Evolution and Physics Properties of Low Silver Copper Alloy Wires During In Situ Composite Preparation." In TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-05861-6_130.

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Chauhan, Preeti S., Anupam Choubey, ZhaoWei Zhong, and Michael G. Pecht. "Copper Wire Bonding." In Copper Wire Bonding. Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-5761-9_1.

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Conference papers on the topic "Copper wires"

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Zelinka, Samuel L., and Stan Lebow. "Corrosion of Wires on Wooden Wire-Bound Packaging Crates." In CORROSION 2015. NACE International, 2015. https://doi.org/10.5006/c2015-05617.

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Abstract Wire-bound packaging crates are used by the US Army to transport materials. Because these crates may be exposed to harsh environments, they are dip-treated with a wood preservative (biocide treatment). For many years, zinc-naphthenate was the most commonly used preservative for these packaging crates and few corrosion problems with the wires were observed. Recently, copper based alternatives to zinc naphthenate have been used, and corrosion problems have been observed. Here, we present the results of laboratory corrosion testing of 10 different wood treatments to see which preservatives have the potential to cause corrosion problems. The laboratory test was designed to mimic the production process; wires from packaging crates were attached to wood and dipped in the wood preservative and stored in a polyethylene bag for either 2 or 8 weeks to simulate how the crates are stored in the warehouse. The amount of corrosion was examined both visually and gravimetrically. Zinc naphthenate and Preservative A were the least corrosive preservatives, and there were no statistical differences between these two preservatives. The remaining treatments had at least 5 times more corrosion than these two preservatives. Three of the 10 treatments showed a linear increase in the amount of corrosion with time, suggesting that they were still corroding as rapidly at week 8 as they were at week 2 and present a high risk of corrosion. From these results, Preservative A (a copper ethanolamine complex containing citric acid) appears to be the least corrosive alternative to zinc naphthenate.
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Dean, Sheldon W., and David B. Reiser. "Comparison of the Atmospheric Corrosion Rates of Wires and Flat Panels." In CORROSION 2000. NACE International, 2000. https://doi.org/10.5006/c2000-00455.

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Abstract A series of regression analyses were made on the one-year corrosion measurements of flat panel and wire helix specimens. There was a very strong relationship between the wire and panel results with the wire specimens yielding higher rates than the panels, but approaching the panel rates at the highest rates for all four metals. A second series of regression analyses between the residuals from the panel-helix regression was run against environmental variables. The residuals showed a significant positive relationship with sulfur dioxide for zinc, chloride for copper, and both chloride and sulfur dioxide for aluminum. This indicates that increases in the environmental variable increased the corrosion rate of the wires more than flat panels. An estimate of the gas phase convective mass transfer rate of sulfur dioxide to wires as compared to flat surfaces showed that sulfur dioxide would diffuse to wire surfaces about three times the rate to a flat panel. The collection efficiency of chlorides to wire surfaces would likewise be greater than flat surfaces, but the actual rates would depend on the particle size and wind velocity. These results show that wire helix specimens are not equivalent to flat panels in estimating atmospheric corrosivity.
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Xue, C., C. Mao, G. Wang, X. Wang, and D. Xiao. "Energy Balance Analysis of The Electrical Explosion of Copper Wires in Air and Water." In 2024 IEEE International Conference on Plasma Science (ICOPS). IEEE, 2024. http://dx.doi.org/10.1109/icops58192.2024.10626899.

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Crook, P. "Development of a New Ni-Cr-Mo Alloy." In CORROSION 1996. NACE International, 1996. https://doi.org/10.5006/c1996-96412.

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Abstract This paper describes the design concepts, experimental studies, and production activities associated with the development of a new, wrought Ni-Cr-Mo alloy. The objective of the project was to provide a material with very high resistance to both oxidizing and non-oxidizing (reducing) acids. For oxidizing acids, a base composition with a high chromium content was selected. The critical step in the development of this new alloy was the gathering of experimental evidence that copper, at certain levels, can be used to enhance significantly the resistance of the base composition to sulfuric acid, in the concentration range 10 to 60 wt.%, and dilute hydrochloric acid, without detriment to its general characteristics. Copper also appears to be of benefit in hydrofluoric and phosphoric acids. A large scale heat of the most promising composition was melted and processed into plates, sheets, bars, and wires (for welding), without problems. The corrosion behavior and mechanical properties of some of these production materials are given in this paper.
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Shukla, Pavan K., Andrew Nordquist, and James Kulczyk. "Cathodic Protection Design Considerations in Congested Area Facilities." In CORROSION 2018. NACE International, 2018. https://doi.org/10.5006/c2018-10900.

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Abstract Various facilities such as gas compressor stations, storage tank stations, and gathering and distribution stations have buried metallic structure that are both coated and uncoated and of different metal types. These facilities are identified as congested area facilities. For example, facility such as a gas compressor station may have coated pipelines, uncoated screw piles, copper grounding wires, and copper groundrods. Each of these structures has different structure-to-earth resistance and current demand for protection. Increasingly, these structures are electrically interconnected to mitigate the lightning hazard, and to achieve optimal lightning protection throughout the facilities. However, this has an adverse effect on the cathodic protection (CP) system of the facilities because a large fraction of the CP current could be diverted to uncoated carbon steel and copper groundwires and groundrods. In fact, in some congested area facilities, less than one percent of CP current is delivered to the active buried structures such as buried pipelines transmitting oil or natural gas. Further, the approaches available to estimate the CP current distribution for the transmission pipelines are not directly applicable for the facilities with congested buried metallic structures with different structure-to-soil resistances. An analysis was conducted to develop guidelines to design and install and optimal CP system for such facilities, and to remediate insufficient CP to the below grade pipelines at the existing facilities. The analysis included developing a three-dimensional computer model to estimate CP current distribution in congested areas with coated and uncoated buried pipelines, screwpiles, groundwires and copper groundrods. The model was exercised to determine the optimal anode bed structure to deliver sufficient CP current to active buried structures such as transmission pipelines within the facility. The model was used to develop recommendations for optimal CP systems for newer facilities, and remediating insufficient CP at the existing facilities, and anode bed structure that will result in optimal CP system for a given facility.
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Staller, Kristopher D. "Low Temperature Plasma Decapsulation of Copper-Wire-Bonded and Exposed Copper Metallization Devices." In ISTFA 2010. ASM International, 2010. http://dx.doi.org/10.31399/asm.cp.istfa2010p0127.

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Abstract One method of reducing costs in the packaging sector is to switch from gold bond wires to copper. Thicker copper wires (over 2 mils) can be safely decapsulated using a ratio mixture of fuming acids. Some surface etching of the copper will occur, but the wire will remain electrically viable. Microwave Plasma can provide a safer alternative for decapsulating packages with copper bondwires and exposed copper metallization. In this paper, experimental deprocessing of copper bond wire and copper metallization using laser ablation and downstream microwave plasma has found that 1 mil stressed wires can be safely exposed and examined, showing slip plane fractures in the corner wires. Topside copper metallization remains intact, even the thin protective nickel plating. Sensitive copper metal structures on top of the passivation (such as antennas) will remain electrically viable following decapsulation with plasma, but are often lost and defective following acid decapsulation.
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Karlsen, Stian. "Fatigue of Copper Conductors for Dynamic Subsea Power Cables." In ASME 2010 29th International Conference on Ocean, Offshore and Arctic Engineering. ASMEDC, 2010. http://dx.doi.org/10.1115/omae2010-21017.

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Dynamic subsea power cables are used for distribution of electric power to subsea units for oil and gas production and for power distribution from offshore wind mills. As the cables are suspended from the sea level to sea floor, a dynamic analysis is normally required to ensure that the cables are able to withstand the dynamic tension and bending caused by waves and vessel movements. The fatigue property of a conductor is determined by the mechanical properties of the individual wires and stress concentration caused by wire interaction. Previous publications on steel wires and ropes have brought light on the effect of R-ratio and wire interaction such as fretting and inter wire slippage. For copper conductors the complexity of fatigue is multiplied by the fact that the individual wires have a nonlinear stress-strain behavior well below the defined yield stress limit and poor creep properties below maximum cable operation temperatures. Moreover, the interaction between the wires is determined not only by the contact between copper surfaces but also by the water blocking compound in between the wires normally required for subsea cables. A test method, simulating the fatigue mechanism in a dynamic power cable, including the effect from friction, fretting, creep properties of copper and high tension at deep waters is presented together with test results for a representative conductor.
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Brown, L. E. "Liquid Metal Embrittlement of Copper Wires." In ISTFA 2000. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.istfa2000p0449.

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Abstract Intermittent opens in hand-assembled electronic components have a number of expected causes. In this case the failure mechanism that was identified is of concern in certain industries, but is unexpected in the electronics business. Solder in solder pots and in flow solder systems is expected to become contaminated with the various metals and other materials that the solder contacts during use. In the analysis presented here, the solder was determined to be contaminated with mercury. This contaminated solder caused wires tinned in the solder to fracture due to liquid-metal embrittlement. Liquid-metal embrittlement (LME) is the reduction in metal ductility caused by contact with liquid metal.
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Hang, C. J., I. Lum, J. Lee, et al. "On-Line Hardness Characterization of Novel 2-mil Copper Bonding Wires." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33046.

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In order to eliminate the chip cratering for copper wire applications in IC packaging, it is worthwhile to develop new Cu wire chemistries to obtain a soft copper wire with a soft free-air ball (FAB). The conventional hardness characterization of a new bonding wire is a labour intensive, time-consuming work. Therefore an on-line hardness characterization method is presented that enables the hardness comparison of a larger number of different wires within a shorter time. The influences of capillary change, bonding substrate metallization and temperature on this method is quantified. It is found these influences need to be held constant during a hardness comparison study. With this method, the wire and FAB hardness comparison of nine novel 2-mil copper bonding wires, Cu 1 to Cu 9, and one 2-mil Au wire are performed. The wire hardness (wireside) and FAB hardness are characterized. It is found that the Cu 4 and Cu 5 have the softest wireside hardness and FAB hardness.
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Gerlach, David W., and Yogendra K. Joshi. "Boiling Performance of Flourinert PF 5060 on Confined and Unconfined Wire Meshes Soldered to the Substrate." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-82595.

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The boiling performance of the dielectric fluorocarbon liquid PF 5060 was measured on submerged 0.9 cm square tin-plated copper and bronze wire meshes soldered to a copper block. Three mesh sizes were tested: 8 wires/cm (20 wires/inch) with 406 micron diameter, 20 wires/cm (50 wires/inch) with 229 micron diameter, and 59 wires/cm (150 × 150 wires/inch) with 66 micron diameter. The curves were measured with top of the mesh open in a pool boiling arrangement and with the mesh covered with a plate so that bubbles must exit sideways.
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Reports on the topic "Copper wires"

1

Ruschau. L51961 Coating Compatibility at Thermite Welds and Keyhole Excavations. Pipeline Research Council International, Inc. (PRCI), 2002. http://dx.doi.org/10.55274/r0010247.

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Patching and repairing high performance pipeline coatings requires a high performance repair material to ensure the integrity of the coating system. The application conditions are not optimized as they are during plant applications, so it is imperative that repair coatings applied to mainline coatings will adhere to all coated surfaces so that resources can be focused on optimizing application methods. Compatibility of repair coatings applied to thermite weld components may be inadequate for optimum field performance. When combined with the limiting factors of keyhole excavations it is important to use coatings which are not only compatible with the thermite welds but also are suitable for the keyhole application procedure. A series of 14 pipeline repair coatings were evaluated for their compatibility with the components of a thermite weld. Chemical compatibility was determined in terms of adhesion with the thermite weld individual components: polyethylene wire insulation, polyvinylchloride wire insulation, copper wire, steel, and copper/aluminum thermite alloy. The same coatings were evaluated for their suitability for application by keyhole excavation procedures. A keyhole excavation was simulated using a scaffold over filled soil boxes (dry soil) containing buried pipe sections, and each of the repair coatings was applied by a commercial keyhole excavation company. The ease of application and general suitability was rated. After backfilling and aging for six months, the samples were removed from the soil boxes and the coatings evaluated.
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Gray. L51567 Influence of Filler Wire Carbon and Residual Element Content on the Mechanical Properties. Pipeline Research Council International, Inc. (PRCI), 1998. http://dx.doi.org/10.55274/r0010565.

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This study was conducted to determine the interactive roles of carbon, oxygen, and nitrogen and residual elements such as titanium, chromium, copper, sulfur, phosphorous, aluminum, tin, antimony, and arsenic on weld metal mechanical properties in pipeline steels. Eleven seamless, flux-core electrodes were fabricated with varying compositions and deposited in girth welds in a 24-inch diameter, API 5LX-65 pipe using the gas-metal-arc-weld (GMAW) process. The results of Charpy V-notch and crack-tip opening displacement tests indicate that desirable toughness properties may require the addition of alloying elements (e.g., nickel) that promote the formation of acicular-ferrite microstructures. In addition, small variations in sulfur content were shown to cause significant variability in notch toughness.
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Collins, GW. A multi-institution collaboration to study copper wire hybrid and laser-cut foil X-pinches. Office of Scientific and Technical Information (OSTI), 2021. http://dx.doi.org/10.2172/1786282.

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Schofield, Ian S., Paul L. Brown, Mark J. Logsdon, and Matthew P. Wickham. Waste Rock Dump Characterization Studies at the Bingham Canyon Mine. Utah Geological Survey, 2024. http://dx.doi.org/10.34191/mp-179.

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The Bingham Canyon Mine, located near Salt Lake City, Utah, is surrounded by more than 6 billion tons of waste rock developed over the open cut mining history from 1903 to present; the surface area of the waste rock is approximately 5000 acres. Waste rock dumps have a thickness of more than 1 200 feet from crest to toe. From 1930 to 2000, selected portions of the waste rock dumps were commercially leached using a ferric-sulfate-based lixiviant to extract copper, whereas other portions have only received meteoric leaching. From 2011 to present, Rio Tinto Kennecott has studied the evolution and geochemical controls on water chemistry associated with the waste rock dumps at the Bingham Canyon Mine. In this program, the waste rock dumps have been characterized in detail from the field logging of, and data collected from instrumentation installed within, 13 paired borings. At 12 of the 13 locations, the borings penetrated the full depth of the dumps, through the pre-mine soil contact, and into bedrock. Borings were installed to depths approaching 900 feet below ground surface using roto-sonic drilling methods to enable (1) core recovery and (2) measurement of near in situ properties. Field logging of the borings included Unified Soil Classification System descriptions, clast lithology, relative oxidation, paste pH, and geophysical methods (gyroscopic, temperature, neutron, and gamma). Core from the borings was analyzed for geotechnical properties (density, grain size distribution, moisture content, plasticity index and limit, and direct and block shear), quantitative evaluation of minerals by scanning electron microscopy (QEMSCAN), modified acid-base accounting (ABA), modified synthetic precipitation leaching procedure (SPLP), and hyperspectral analysis by CoreScan. If water was encountered during the drilling process at sufficient volumes for collection from the core barrel, samples were collected for chemical analysis. Instrumentation installed within the borings included lysimeters, thermistor nodes, direct temperature sensing (DTS) fiber optic cables, time domain reflectometry (TDR), shear cables, gas (oxygen, carbon dioxide) measurement tubes, and vibrating wire piezometers (VWPs). Additionally, each drill site had multiple measurements of oxygen consumption in the surface layer of the local waste rock. Data acquired from the borings were linked with historical information (covering a period of greater than 50 years) from extensive drilling, mineralogical and litho-geochemical evaluations, hydraulic and tracer testing, and 20 years of seepage f low and water chemistry data to develop a conceptual model that describes the hydraulic, geochemical, and physical behavior of the waste rock dumps. Pyrite and other sulfide minerals in the waste rock dumps are oxidized by both diffusive and convective ingress of air, producing acidic, high-total dissolved solids effluents, and jarosite that has formed within the waste rock as a secondary phase that stores additional acidity. The dominant air ingress mechanism is convection, which accounts for greater than 90% of the sulfide oxidation within the waste rock dumps. Based on temperature profiles and water balance for the dumps, moisture loss to geochemical reactions is a significant part of the water budget.
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