Academic literature on the topic 'Critical Dimension Measurement'

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Journal articles on the topic "Critical Dimension Measurement"

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OTAKA, Tadashi, Hiroki KAWADA, Chie SHISHIDO, and Mayuka OSAKI. "Critical Dimension Measurement Technology Using CD-SEM." Hyomen Kagaku 27, no. 11 (2006): 636–41. http://dx.doi.org/10.1380/jsssj.27.636.

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Mizuno, Fumio. "Evaluation of total uncertainty in the dimension measurements using critical-dimension measurement scanning electron microscopes." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 16, no. 6 (1998): 3661. http://dx.doi.org/10.1116/1.590387.

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Sartore, R. "Linewidth measurements of metallization coated with insulator on microelectronic circuits using Energy-Dispersive Xray Analysis (EDXA)." Proceedings, annual meeting, Electron Microscopy Society of America 50, no. 2 (1992): 1690–91. http://dx.doi.org/10.1017/s0424820100133084.

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Evaluation of quality and conformance to target production specifications for microelectronic devices frequently require measurements of the feature sizes of the critical conductive elements for the circuits. Further, failure analysis dictates critical dimension measurements to trace cause of failure for device. To date, the commercial critical dimension (CD) measurement systems are based on the secondary electron (SE) imaging techniques and analysis. In a failure analysis or quality evaluation laboaratory the microelectronic circuits received are mostly already fully fabricated, with passivat
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Abe, Hideaki, Motoki Kadowaki, Akira Hamaguchi, Takahiro Ikeda, and Yuichiro Yamazaki. "Systematic Measurement Uncertainty of Critical Dimension Scanning Electron Microscope." Japanese Journal of Applied Physics 49, no. 6 (2010): 06GD03. http://dx.doi.org/10.1143/jjap.49.06gd03.

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Lee, Wonsuk. "Measurement of critical dimension in scanning electron microscope mask images." Journal of Micro/Nanolithography, MEMS, and MOEMS 10, no. 2 (2011): 023003. http://dx.doi.org/10.1117/1.3574771.

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Kwon, Soonyang, Namyoon Kim, Taeyong Jo, and Heui Jae Pahk. "Critical dimension measurement of transparent film layers by multispectral imaging." Optics Express 22, no. 14 (2014): 17370. http://dx.doi.org/10.1364/oe.22.017370.

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Lorusso, G. F., and D. C. Joy. "Experimental resolution measurement in critical dimension scanning electron microscope metrology." Scanning 25, no. 4 (2003): 175–80. http://dx.doi.org/10.1002/sca.4950250403.

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Yamashita, Hiroshi. "Highly accurate critical dimension measurement for sub-0.5-μm devices". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 12, № 6 (1994): 3591. http://dx.doi.org/10.1116/1.587477.

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Hitomi, Keiichiro, Yoshinori Nakayama, Hiromasa Yamanashi, Yasunari Sohda, and Hiroki Kawada. "Study of Measurement Condition Optimization in Critical Dimension-Scanning Electron Microscope." Japanese Journal of Applied Physics 47, no. 8 (2008): 6554–57. http://dx.doi.org/10.1143/jjap.47.6554.

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Nagase, Masao, Hideo Namatsu, Kenji Kurihara, and Takahiro Makino. "Critical Dimension Measurement in Nanometer Scale by Using Scanning Probe Microscopy." Japanese Journal of Applied Physics 35, Part 1, No. 7 (1996): 4166–74. http://dx.doi.org/10.1143/jjap.35.4166.

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Dissertations / Theses on the topic "Critical Dimension Measurement"

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Binnie, Iona B. "Critical dimension control : influencing factors and measurement." Thesis, University of Edinburgh, 1991. http://hdl.handle.net/1842/10815.

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Advanced Lithography continues to be the limiting factor in the drive for higher levels of microcircuit integration. The key to the successful management of a lithography process is the integration of full measurement and instrumentation functions with the process, and the adoption of effective process control strategies. The aim of this research is to improve the understanding of critical dimension (CD) control by an investigation of the sources of variations in linewidth dimensions. Having identified the key factors, it should be possible to characterize and control their influence. Experime
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Davies, Guy Scott. "Critical dimension measurement and sidewall slope evaluation using a coherence probe microscope." Thesis, University of Edinburgh, 1994. http://hdl.handle.net/1842/13587.

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The drive by the manufacturers and designers of integrated circuits towards smaller dimensions has led to ever increasing demands being placed on the vendors of semiconductor equipment. In the photolithography arena this has meant producing optical projection systems with improved resolution approaching 0.2μm and layer to layer registration to better than 50nm. In order to monitor these processes, metrology equipment must be capable of tracking changes in the above areas. Traditionally, optical techniques have been utilised for several reasons, namely their cost, high throughput and ease of us
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Chapman, Erin L. "Periodic analysis of critical dimension measurements in the photolithography manufacturing process." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape8/PQDD_0023/MQ52290.pdf.

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Cortesi, Elisabetta 1966. "Analysis and reduction of variability in scanning electron microscopy measurements of critical dimensions." Thesis, Massachusetts Institute of Technology, 1998. http://hdl.handle.net/1721.1/9579.

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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering; and, (S.M.)--Massachusetts Institute of Technology, Sloan School of Management, 1998.<br>Includes bibliographical references (p. 79).<br>This thesis describes work done during a Leaders for Manufacturing internship at Intel. At the broadest level, this work relates to the importance of controlling and monitoring measurement processes just as one controls the "fundamental" processes being measured. Without such control there can be no confidence in the integrity of the data describing the fundament
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Lindqvist, Richard. "Geometrical and dimensional Measurement Planning : - a systematic and holistic approach." Licentiate thesis, KTH, Mätteknik och optik, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-42163.

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För att försäkra sig om den slutliga kvaliteten på maskinbearbetade komponenter måste tillverkande företag mäta och verifiera de geometriska och dimensionella egenskaperna på komponenter innan dem skickas vidare nedströms till den mer värdeskapande monteringen. Det är idag vanligt att den geometriska och dimensionella mätningen och verifieringen uppstår varje gång då en maskin ställs om, när man startar om eller startar upp en ny produktionslina eller då en produktionsprocess ändras. Produktionsteknisk mätteknik och resultat från utförda mätningar används sedan som indata för statistisk proces
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Li, Meiyan. "Transient Stability Prediction based on Synchronized Phasor Measurements and Controlled Islanding." Diss., Virginia Tech, 2013. http://hdl.handle.net/10919/52623.

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Traditional methods for predicting transient stability of power systems such as the direct method, the time domain approach, and the energy function methods do not work well for online transient stability predictions problems. With the advent of Phasor Measurement Units (PMUs) in power systems, it is now possible to monitor the behavior of the system in real time and provide important information for transient stability assessment and enhancement. Techniques such as the rotor oscillation prediction method based on time series have made the prediction of system stability possible for real-time
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Su, Rong. "Improved inspection and micrometrology of embedded structures in multi-layered ceramics : Development of optical coherence tomographic methods and tools." Doctoral thesis, KTH, Mätteknik och optik, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-144595.

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Roll-to-roll manufacturing of micro components based on advanced printing, structuring and lamination of ceramic tapes is rapidly progressing. This large-scale and cost-effective manufacturing process of ceramic micro devices is however prone to hide defects within the visually opaque tape stacks. To achieve a sustainable manufacturing with zero defects in the future, there is an urgent need for reliable inspection systems. The systems to be developed have to perform high-resolution in-process quality control at high speed. Optical coherence tomography (OCT) is a promising technology for detai
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Shyu, Deh-Ming, and 徐得銘. "High Resolution Optical Metrology for Critical Dimension Measurement." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/33502758311896154885.

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博士<br>國立交通大學<br>光電工程系所<br>95<br>Critical dimension (CD) is the smallest size which must be resolved in specific measurement. The CD becomes smaller and smaller due to developments of technology and innovations of products. In the fabrication of integrated circuit, reliable CD measurement is the key procedure to improve the yields. The CD measurements include line-width, overlay, thickness, material, and roughness, etc. In this thesis we focus on the high resolution optical metrology for CD measurement. For the measurement of line-width, we use the through-focus focus-metric method to measure t
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Books on the topic "Critical Dimension Measurement"

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M, Monahan Kevin, and Society of Photo-optical Instrumentation Engineers., eds. Handbook of critical dimension metrology and process control. SPIE Optical Engineering Press, 1994.

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Magee, Patrick, and Mark Tooley. Physics in anaesthesia. Edited by Antony R. Wilkes and Jonathan G. Hardman. Oxford University Press, 2017. http://dx.doi.org/10.1093/med/9780199642045.003.0023.

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This chapter covers the basic science of physics relevant to anaesthetic practice. Equipment and measurement devices are covered elsewhere. Starting with fundamentals, atomic structure is introduced, followed by dimensions and units as used in science. Basic mechanics are then discussed, focusing on mass and density, force, pressure, energy, and power. The concept of linearity, hysteresis, and frequency response in physical systems is then introduced, using relevant examples, which are easy to understand. Laminar and turbulent fluid flow is then described, using flow measurement devices as app
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Fazekas, Mihály, Luciana Cingolani, and Bence Tóth. Innovations in Objectively Measuring Corruption in Public Procurement. Oxford University Press, 2018. http://dx.doi.org/10.1093/oso/9780198817062.003.0007.

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While there is continued interest in measuring governance, disagreement on how best to do so has only grown over time. To provide pointers at innovative and rigorous indicator building, this chapter documents innovations in measuring a particularly challenging governance dimension: corruption in public procurement. In hopes of inspiring future research, the chapter critically reviews objective corruption proxies using administrative data on government purchases falling in four broad categories: tendering risk indicators, political connections indicators, supplier risk indicators, and contracti
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Brazier, John, Julie Ratcliffe, Joshua A. Salomon, and Aki Tsuchiya. Alternatives to generic preference-based measures: mapping, condition-specific measures, bolt-ons, vignettes, direct utility assessment, and well-being. Oxford University Press, 2016. http://dx.doi.org/10.1093/med/9780198725923.003.0008.

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This chapter describes the methods and critically reviews the alternatives to generic preference-based measures (GPBMs) of health. Although there is considerable evidence for the validity and responsiveness of GPBMs in many conditions, but despite this, in these conditions they are often not used in clinical trials. Furthermore, GPBMs have been shown to be insensitive for some conditions. One alternative is to map from other health or clinical measures on to one of the GPBMs. Another is to devise a more relevant condition-specific preference-based measure, or use a bespoke vignette (scenario)
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Book chapters on the topic "Critical Dimension Measurement"

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Cheng, Junyu, Joshua Matthews, and John Mitchell O’Toole. "Fluency: A Critically Important Yet Undervalued Dimension of L2 Vocabulary Knowledge." In Pacific Rim Objective Measurement Symposium (PROMS) 2014 Conference Proceedings. Springer Berlin Heidelberg, 2015. http://dx.doi.org/10.1007/978-3-662-47490-7_8.

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Lee, Sang Hyun, and Abrar Haider. "Information Quality Assessment for Asset Management Systems." In Information Quality and Governance for Business Intelligence. IGI Global, 2014. http://dx.doi.org/10.4018/978-1-4666-4892-0.ch007.

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Information quality is critical for any business. It is particularly important for mission critical information systems that manage the lifecycle of an engineering asset. Quality of information or lack thereof in these systems can be traced to technical, organisation, as well as human sources. It is, therefore, extremely important to ascertain the causes that contribute to lack of information quality in asset lifecycle management systems. Depending upon the business area, organisations take proactive or reactive approach to establishing, maintaining, and enhancing their information quality. Among proactive approaches, the ability of the organisation to measure information quality dimensions forms the foundation of a solid information quality management initiative. Such a measurement, however, is an intricate task because these dimensions are subjective, can be context dependent as well as independent, and are interdependent, since each dimension impacts other dimensions. This research employs productive perspective to information and applies Six-Sigma methodology to assess its quality in information systems utilised to manage engineering asset lifecycle. It utilises analytical hierarchy process and quality function deployment to convert subjective information quality dimension into objective metrics, assesses the relationship between various information quality dimensions, and ascertains critical to quality factors. The results thus obtained form the basis for monitoring of information quality aimed at its continuous improvement. This study contributes to literature and practice by providing a method for assessing correlation of information quality dimensions, applying six sigma to information, and controlling quality of information.
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Daniel, Ben Kei. "Approaches for Measuring Social Capital." In Social Capital Modeling in Virtual Communities. IGI Global, 2009. http://dx.doi.org/10.4018/978-1-60566-663-1.ch004.

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While it is possible to measure how much an economic capital is worth, at least in terms of monetary value, through the use of sophisticated econometric tools, while conditioning other factors, in comparison, measuring social capital is significantly more challenging and complex business. The complexity in measuring social capital relates to the fact it is an intangible concept, multidimensional and multivariate in nature. Further as discussed earlier, social capital lacks a unified definition and dimension. To make matters more problematic, social capital is not a static construct that can be easily captured and conditioned during measurement, but rather it is a moving target, difficult to capture, without resorting to some assumptions and conditioning during measurement. An exploration of the various ways in which researchers have measured social capital is critical to our understanding of the range of approaches and techniques available, to guide us when thinking about measuring social capital. This will also enable us to make informed decisions on the most relevant and appropriate approaches and level of measurement as per a variable or component of social capital. This Chapter presents some of the major approaches currently employed to measure social capital and the approaches used to achieve this endeavour. The Chapter describes with illustration, the dimensions taken by each approach.
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Akhtar, Imtisal, Malik Abdul Rehman, and Yongho Seo. "Measuring the Blind Holes: Three-Dimensional Imaging of through Silicon via Using High Aspect Ratio AFM Probe." In 21st Century Surface Science - a Handbook. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.92739.

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Three-dimensional integration and stacking of semiconductor devices with high density, its compactness, miniaturization and vertical 3D stacking of nanoscale devices highlighted many challenging problems in the 3D parameter’s such as CD (critical dimension) measurement, depth measurement of via holes, internal morphology of through silicon via (TSV), etc. Current challenge in the high-density 3D semiconductor devices is to measure the depth of through silicon via (TSV) without destructing the sample; TSVs are used in 3D stacking devices to connect the wafers stacked vertically to reduce the wiring delay, power dissipation, and of course, the form factor in the integration system. Special probes and algorithms have been designed to measure 3D parameters like wall roughness, sidewall angle, but these are only limited to deep trench-like structures and cannot be applied to structures like via holes and protrusions. To address these problems, we have proposed an algorithm based nondestructive 3D Atomic Force Microscopy (AFM). Using the high aspect ratio (5, 10, 20, 25) multiwall carbon nanotubes (MWCNTs) AFM probe, the depth of holes up to 1 micron is faithfully obtained. In addition to this, internal topography, side walls, and location of via holes are obtained faithfully. This atomic force microscopy technique enables to 3D scan the features (of any shape) present above and below the surface.
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Horning, Ned, Julie A. Robinson, Eleanor J. Sterling, Woody Turner, and Sacha Spector. "Terrain and soils." In Remote Sensing for Ecology and Conservation. Oxford University Press, 2010. http://dx.doi.org/10.1093/oso/9780199219940.003.0012.

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Building on the foundations of working with images and measuring land cover and vegetation in the previous two chapters, we now add the discussion of elevation and geology. Terrain attributes (such as elevation, slope, and aspect) and soil characteristics affect the distribution of most taxa and are therefore critical for effective biodiversity monitoring and conservation. Remote sensing is the primary tool for collecting terrain information from local to global scales. This chapter will provide an overview of different types of terrain data that you can collect using remote sensing methods as well as how you can visualize and analyze these data. We will also highlight applications using terrain data to illustrate how they and their derived products can aid the conservation biologist or ecologist. In addition to landforms, this section will look at how remote sensing technology can provide information about geology and soils. Box 5.1 provides an example of how elevation data and satellite imagery helped in selecting field sites. The fundamental measurement used to create terrain data is elevation. In this section we discuss elevation measurements in detail. First, we define elevation and then describe common data formats. Next we present an overview of you can acquire elevation values and then we will present examples of how elevation data are useful in biodiversity conservation and how you can use these data to improve the geometric and radiometric qualities of remote sensing imagery. This section concludes with a discussion of some of the methods used to analyze and visualize terrain data. Before discussing the use of elevation data it is useful to define what is meant by “elevation” and other related terms. A general definition for elevation is that it is the vertical distance measured from a point to a reference surface. This may seem pretty straightforward, but accurately defining the location of a point or a reference surface in the vertical dimension can be quite difficult. When measuring an elevation you need to define a reference surface. This reference surface is called a vertical datum. A common reference (or datum) for elevation measurements is sea level. Many maps, for instance, label elevation as meters or feet above sea level.
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Huang, Stephen. "Basic Doppler principles." In Oxford Textbook of Advanced Critical Care Echocardiography, edited by Anthony McLean, Stephen Huang, and Andrew Hilton. Oxford University Press, 2020. http://dx.doi.org/10.1093/med/9780198749288.003.0001.

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Basic two-dimensional echocardiography alone is inadequate for advanced diagnosis and treatment monitoring in critically ill patients because of haemodynamic complexities. To cope with such demands, a critical care physician will also need to be competent in Doppler echocardiography, which provides accurate measurements of blood flows. Experienced echocardiographers are able to draw inference about the cardiac function, intracardiac and intravascular pressures, and other abnormalities from the Doppler flow spectra. Doppler echocardiography also provides objective measurements that can be used for bedside diagnosis or for longitudinal monitoring. Learning Doppler echocardiography has a steep learning curve and has several hurdles to overcome. First, one needs to develop high-level transducer navigation skills to make sure a proper insonation angle is obtained for all Doppler measurements. Second, an understanding of medical ultrasound physics is required not only for knobology purposes, but also for appreciation of the pros and cons of various Doppler modalities. Third, recognition of the limitations of Doppler echocardiography is necessary to avoid misapplications and misinterpretations. Fourth, the operator needs to be able to identify Doppler artefacts so as not to mistake artefacts for real findings. Finally, an understanding of haemodynamic principles is important to execute proper interpretations of Doppler measurements. This chapter will cover mainly the second and third aspects of these. Doppler artefacts will be covered in Chapter 2 and haemodynamic principles in Chapter 3.
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Greve, Goetz. "Social Media Performance Measurement." In Trends and Innovations in Marketing Information Systems. IGI Global, 2015. http://dx.doi.org/10.4018/978-1-4666-8459-1.ch011.

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Today, companies are turning to social media as a source of marketing information. Comments posted on social network sites, tweets, and blogs provide a wealth of data for the improvement of marketing decision making. Thus, marketers are greatly interested in how marketing activities can affect certain social media metrics and to what extent each drives business performance. The purpose of the chapter is to elaborate on the performance outcomes of social media activities and the possibility to use data from these networks for marketing information systems. Thus, the chapter discusses the theoretical foundations of social media and develops dimensions for social media performance measurement. In addition, the integration of social media performance measurement into a marketing information system is discussed and implementation issues are critically evaluated. The chapter closes with an outline of further research directions and a conclusion.
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Quinones, Myriam, Mónica Gómez-Suárez, and Maria Jesús Yagüe. "Conceptualization and Measurement of Smart Shopping." In Advances in Marketing, Customer Relationship Management, and E-Services. IGI Global, 2019. http://dx.doi.org/10.4018/978-1-5225-7856-7.ch011.

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The purpose of this chapter is to critically review current studies on “smart shopping” with the aim of improving the understanding of this phenomenon and suggesting future lines of research. The authors present a pioneering classification of international research on smart shopping published in the last 30 years that provides a comprehensive overview of existing knowledge. They categorize smart shoppers' traits and develop a thorough analysis of existing measurement scales, data collection methods, product categories and countries that have been objects of prior studies. Their findings highlight the need to develop cross-cultural models that consider the affective and behavioral dimensions of smart shoppers from different countries to help academics and practitioners better identify and target this customer segment.
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Van den Berg, H. "Measurement Models in the Intellectual Capital Theory." In Strategies for Information Technology and Intellectual Capital. IGI Global, 2007. http://dx.doi.org/10.4018/978-1-59904-081-3.ch005.

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Intellectual capital in the form of intangible assets is now variously estimated to constitute 60-75 percent of corporate value, on average. Current debates about intellectual capital are part of the search for a methodology to measure the knowledge base of a firm. This is critical since a failure to properly conceptualize the nature and value of knowledge assets condemns firms and whole economies to fight competitive battles with outdated weapons and tactics. The purpose of this chapter is to present a comparative evaluation of some of the most commonly known intellectual capital (IC) measurement models. These models include Skandia’s IC Navigator, Intellectual Capital Services’ ICIndex™, The Technology Broker’s IC Audit, Sveiby’s intangible asset monitor (IAM), citation-weighted patents, and real option theory. Each model is classified along dimensions of temporal orientation, system dynamics, and causal direction.
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Choi, Gordon YS, and Yu-Yeung Yip. "Valvular regurgitation." In Oxford Textbook of Advanced Critical Care Echocardiography, edited by Anthony McLean, Stephen Huang, and Andrew Hilton. Oxford University Press, 2020. http://dx.doi.org/10.1093/med/9780198749288.003.0015.

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Valvular regurgitation can be classified according to the involvement of the specific valve and the rate of development of the disease process. Two-dimensional (2D) transthoracic echocardiography (TTE) is recommended as first-line imaging in valvular regurgitation and is often sufficient for diagnosis. A transoesophageal echocardiography (TOE) is indicated when TTE is inadequate or when further diagnostic refinement is required. The aetiology and mechanism of the regurgitant lesion should be determined with the use of 2D, M-mode, and colour-flow imaging. Specific quantification techniques include vena contracta (VC), proximal isovelocity surface area (PISA), pulsed-wave (PW) and continuous-wave (CW) Doppler measurements. Haemodynamic consequences may vary, depending on the valve affected and the rate of development of the regurgitation. It is vital for the clinician to accurately determine the degree of valvular regurgitation and its contribution to the overall clinical presentation of the patient.
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Conference papers on the topic "Critical Dimension Measurement"

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Larrabee, Robert D., and Michael T. Postek. "Parameters characterizing the measurement of a critical dimension." In Critical Review Collection. SPIE, 1994. http://dx.doi.org/10.1117/12.187452.

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Cheng, Shiqiu, Yankun Zhan, Qingyun Zuo, et al. "Optical critical dimension measurement for 16/14 nm FinFET." In 2016 China Semiconductor Technology International Conference (CSTIC). IEEE, 2016. http://dx.doi.org/10.1109/cstic.2016.7464083.

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Griffith, Joseph E., Gabriel L. Miller, Leslie C. Hopkins, et al. "Stability of glass probe tips for critical dimension measurement." In Microlithography '97. SPIE, 1997. http://dx.doi.org/10.1117/12.275932.

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Divens, William G., and William B. Cole, Jr. "Laser Based Critical Dimension Measurement System For Semiconductor Production." In 1985 Microlithography Conferences, edited by Harry L. Stover. SPIE, 1985. http://dx.doi.org/10.1117/12.947765.

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Muckenhirn, Sylvain, and A. Meyyappan. "Critical-dimension atomic force microscope (CD-AFM) measurement of masks." In 23rd Annual International Symposium on Microlithography, edited by Bhanwar Singh. SPIE, 1998. http://dx.doi.org/10.1117/12.308778.

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Xiao, Hong, Wei Fang, Yan Zhao, et al. "High-throughput contact critical dimension and gray level value measurement." In SPIE 31st International Symposium on Advanced Lithography, edited by Chas N. Archie. SPIE, 2006. http://dx.doi.org/10.1117/12.656978.

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Seo, Kangjoon, MunSik Kim, Sang Chul Kim, et al. "New critical dimension uniformity measurement concept based reticle inspection tool." In Photomask and NGL Mask Technology XVII, edited by Kunihiro Hosono. SPIE, 2010. http://dx.doi.org/10.1117/12.864109.

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Yasutake, M. "Tungsten Deposited Scanning Probe Microscope Tips for Critical Dimension Measurement." In SCANNING TUNNELING MICROSCOPY/SPECTROSCOPY AND RELATED TECHNIQUES: 12th International Conference STM'03. AIP, 2003. http://dx.doi.org/10.1063/1.1639704.

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Zhang, Zhensheng, Yi Huang, Yi-Shih Lin, et al. "Optical critical dimension measurement for source/drain structures at advanced node." In 2016 China Semiconductor Technology International Conference (CSTIC). IEEE, 2016. http://dx.doi.org/10.1109/cstic.2016.7464084.

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Park, Byong Chon, Ki Y. Jung, Won Young Song, Beomhoan O, and TaeBong Eom. "Atomic force microscopy with carbon nanotube tip for critical dimension measurement." In SPIE's 27th Annual International Symposium on Microlithography, edited by Daniel J. C. Herr. SPIE, 2002. http://dx.doi.org/10.1117/12.473510.

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Reports on the topic "Critical Dimension Measurement"

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Stallard, B. R., and S. Kaushik. Novel near-field optical probe for 100-nm critical dimension measurements. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/486169.

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Yan, Yujie, and Jerome F. Hajjar. Automated Damage Assessment and Structural Modeling of Bridges with Visual Sensing Technology. Northeastern University, 2021. http://dx.doi.org/10.17760/d20410114.

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Recent advances in visual sensing technology have gained much attention in the field of bridge inspection and management. Coupled with advanced robotic systems, state-of-the-art visual sensors can be used to obtain accurate documentation of bridges without the need for any special equipment or traffic closure. The captured visual sensor data can be post-processed to gather meaningful information for the bridge structures and hence to support bridge inspection and management. However, state-of-the-practice data postprocessing approaches require substantial manual operations, which can be time-c
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