Academic literature on the topic 'Cu-Ag liquid alloy'
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Journal articles on the topic "Cu-Ag liquid alloy"
Zhang, W., and A. Inoue. "High glass-forming ability and good mechanical properties of new bulk glassy alloys in Cu–Zr–Ag ternary system." Journal of Materials Research 21, no. 1 (2006): 234–41. http://dx.doi.org/10.1557/jmr.2006.0020.
Full textBaryshev, Evgeny, Tatyana Kostina, Gennady Tyagunov, and Ksenya Shmakova. "Investigation of Copper-Silver Solders Properties in Liquid State before Amorphization." Key Engineering Materials 660 (August 2015): 93–96. http://dx.doi.org/10.4028/www.scientific.net/kem.660.93.
Full textLi, Haifeng, Haofeng Xie, Yizhi Zhao, et al. "Microstructural Evolution and Mechanical Properties of Cu–Ag Alloy via Different Severe Plastic Deformation Processes." Materials 18, no. 3 (2025): 581. https://doi.org/10.3390/ma18030581.
Full textNovakovic, R., Maria Luigia Muolo, E. Ricci, et al. "Surface Properties of Ag-Cu-Zr Liquid Alloys in Relation to the Wettability of Boride Ceramics." Materials Science Forum 512 (April 2006): 211–16. http://dx.doi.org/10.4028/www.scientific.net/msf.512.211.
Full textHumud, Hammad R. "Synthesis of Au –Ag– Cu trimetallic alloy nanoparticles prepared by electrical exploding wire technique in distilled water." Iraqi Journal of Physics (IJP) 16, no. 39 (2019): 81–92. http://dx.doi.org/10.30723/ijp.v16i39.106.
Full textLópez-Cuevas, Jorge, Carlos A. Gutiérrez, Martin I. Pech-Canul, M. Castro-Román, and Juan Carlos Rendón-Angeles. "High Temperature Chemical Interaction Between SiO2 Substrates and Ag-Cu Based Liquid Alloys in Vacuo." Materials Science Forum 509 (March 2006): 117–22. http://dx.doi.org/10.4028/www.scientific.net/msf.509.117.
Full textJanovszky, Dóra, F. Tranta, J. Sólyom, and A. Roósz. "Glass Forming Ability of Bulk Amorphous Materials in Cu-Zr-Ag Ternary Alloy Systems." Materials Science Forum 729 (November 2012): 373–78. http://dx.doi.org/10.4028/www.scientific.net/msf.729.373.
Full textLee, Seung Jin, Joon Sik Park, Ki Tae Kim, and Jeong Min Kim. "Effect of Ag Addition on the Microstructure and Mechanical Properties of High Conductivity Cu-1Cr-Mg-P Alloy." Materials Science Forum 695 (July 2011): 389–92. http://dx.doi.org/10.4028/www.scientific.net/msf.695.389.
Full textChen, Bin, Jie He, and Jiu Zhou Zhao. "Phase Separation of Fe-Cu-Pb Alloy and Recycling of Mixed Metals in Waste Printed Circuit Boards." Materials Science Forum 944 (January 2019): 1265–70. http://dx.doi.org/10.4028/www.scientific.net/msf.944.1265.
Full textBerdnikov, Nikolai, Victor Nevstruev, Pavel Kepezhinskas, Ivan Astapov, and Natalia Konovalova. "Gold in Mineralized Volcanic Systems from the Lesser Khingan Range (Russian Far East): Textural Types, Composition and Possible Origins." Geosciences 11, no. 2 (2021): 103. http://dx.doi.org/10.3390/geosciences11020103.
Full textDissertations / Theses on the topic "Cu-Ag liquid alloy"
Dumas, Olivier. "Étude de la croissance du grain équiaxe dans les alliages surfondus : application à l'alliage Ag-Cu." Grenoble INPG, 1996. http://www.theses.fr/1996INPG0196.
Full textRado, Cyril. "Contribution à l'étude du mouillage et de l'adhésion thermodynamique des métaux et alliages liquides sur le carbure de silicium." Grenoble INPG, 1997. http://www.theses.fr/1997INPG0039.
Full textMalviya, Kirtiman Deo. "Synthesis And Study Of Microstructure Evolution In Nanoparticles Of Immiscible Alloys By Laser Ablation Under Liquid Medium." Thesis, 2013. https://etd.iisc.ac.in/handle/2005/2614.
Full textMalviya, Kirtiman Deo. "Synthesis And Study Of Microstructure Evolution In Nanoparticles Of Immiscible Alloys By Laser Ablation Under Liquid Medium." Thesis, 2013. http://etd.iisc.ernet.in/handle/2005/2614.
Full textSarder, Ujjal. "Modelling of thermotransport in engineering materials." Thesis, 2019. http://hdl.handle.net/1959.13/1401311.
Full textBook chapters on the topic "Cu-Ag liquid alloy"
Muolo, M. L., A. Delsante, M. Bassoli, A. Passerone, and A. Bellosi. "Wettability of TiB2 Ceramics by Liquid Cu and Ag-Cu Eutectic Alloys." In Interfacial Science in Ceramic Joining. Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-017-1917-9_8.
Full textLópez-Cuevas, Jorge, Juan Carlos Rendón-Angeles, J. L. Rodríguez-Galicia, M. Herrera-Trejo, and J. Méndez-Nonell. "High Temperature Chemical Interaction Between SSiC Substrates and Ag-Cu Based Liquid Alloys in Vacuo." In Materials Science Forum. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-993-8.111.
Full textNovakovic, R., M. L. Muolo, E. Ricci, et al. "Surface Properties of Ag-Cu-Zr Liquid Alloys in Relation to the Wettability of Boride Ceramics." In Materials Science Forum. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-996-2.211.
Full textLópez-Cuevas, Jorge, Carlos A. Gutiérrez, Martin I. Pech-Canul, M. Castro-Román, and Juan Carlos Rendón-Angeles. "High Temperature Chemical Interaction Between SiO2 Substrates and Ag-Cu Based Liquid Alloys in Vacuo." In Materials Science Forum. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-993-8.117.
Full textBudai, I., Mária Z. Benkő, and George Kaptay. "Analysis of Literature Models on Viscosity of Binary Liquid Metallic Alloys on the Example of the Cu-Ag System." In Materials Science, Testing and Informatics II. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-957-1.309.
Full textConference papers on the topic "Cu-Ag liquid alloy"
Faizan, Mohammad, and Guo-Xiang Wang. "Modeling of Micro/Nano-Particle Dissolution During Reflow of Lead-Free Composite Solders." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33891.
Full textFaizan, Mohammad, and Guo-Xiang Wang. "Effect of Thermal Processing on the Dissolution of Micro/Nano-Size Metal Particles in Lead-Free Composite Solders." In ASME 2007 International Mechanical Engineering Congress and Exposition. ASMEDC, 2007. http://dx.doi.org/10.1115/imece2007-42102.
Full textAnson, Scott J., Jacob G. Slezak, and Krishnaswami Srihari. "Analysis of Solder Wetting in Sn-Ag-Cu.05 Lead Free Alloy." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-15759.
Full textSong, Jinlong, Shuai Huang, Xin Liu, and Wenji Xu. "Superoleophobic Surfaces on Al and Mg Alloy Substrates Through Rapid Surface Micro/Nanometer-Scale Structuring." In ASME 2014 International Manufacturing Science and Engineering Conference collocated with the JSME 2014 International Conference on Materials and Processing and the 42nd North American Manufacturing Research Conference. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/msec2014-3990.
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