Academic literature on the topic 'Cu-Ag liquid alloy'

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Journal articles on the topic "Cu-Ag liquid alloy"

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Zhang, W., and A. Inoue. "High glass-forming ability and good mechanical properties of new bulk glassy alloys in Cu–Zr–Ag ternary system." Journal of Materials Research 21, no. 1 (2006): 234–41. http://dx.doi.org/10.1557/jmr.2006.0020.

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The addition of Ag to Cu–Zr alloys is very effective for the increase in the stability of supercooled liquid as well as the glass-forming ability (GFA). The large supercooled liquid region (ΔTx) exceeding 60 K in Cu–Zr–Ag ternary system was obtained in a wide range of 25–55 at.% Cu, 40–65 at.% Zr, and 5–25 at.% Ag. The best GFA was obtained around Cu45Zr45Ag10, and glassy alloy rods with diameters up to 6.0 mm were formed by copper mold casting. The bulk glassy alloys exhibit good mechanical properties, i.e., compressive fracture strength of 1780–1940 MPa, Young's modulus of 106–112 GPa, compr
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Baryshev, Evgeny, Tatyana Kostina, Gennady Tyagunov, and Ksenya Shmakova. "Investigation of Copper-Silver Solders Properties in Liquid State before Amorphization." Key Engineering Materials 660 (August 2015): 93–96. http://dx.doi.org/10.4028/www.scientific.net/kem.660.93.

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The temperature and concentration dependences of kinematic viscosity of alloys of Cu-Ag system with Ag content to 99 mass % in liquid state have been studied. It has been found that heating above certain critical temperatures leads to transform the melt to equilibrium state. The kinematic viscosity of the Cu-Ag melts are extremely depend from silver content in the alloy. The new regime of amorphous ribbon production is selected. Proposed regime leads to increasing of microhardness and weld strength on 10 % and corrosion resistivity on 15 %.
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Li, Haifeng, Haofeng Xie, Yizhi Zhao, et al. "Microstructural Evolution and Mechanical Properties of Cu–Ag Alloy via Different Severe Plastic Deformation Processes." Materials 18, no. 3 (2025): 581. https://doi.org/10.3390/ma18030581.

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The field of artificial intelligence and integrated circuits is experiencing rapid development, particularly in the area of highly integrated and miniaturized components, in which Cu-Ag alloys, as a typical lead frame material, play a crucial role. However, current research is primarily focused on low Ag content alloys, and there are few studies on the regulation of the microstructure and mechanical properties of high Ag content Cu-Ag alloys. This limitation hindered the development and utilization of the high Ag content Cu-Ag alloys. In this study, the microstructure and mechanical properties
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Novakovic, R., Maria Luigia Muolo, E. Ricci, et al. "Surface Properties of Ag-Cu-Zr Liquid Alloys in Relation to the Wettability of Boride Ceramics." Materials Science Forum 512 (April 2006): 211–16. http://dx.doi.org/10.4028/www.scientific.net/msf.512.211.

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The wetting phenomena and adhesion between Ag-Cu-Zr molten alloys (where Zr is an active brazing element) and ZrB2-ceramic substrate have been investigated from theoretical and experimental point of view. The wetting phenomena of molten alloy/ceramic substrate depend on the bonding characteristics of liquid alloys and ceramics as well as the magnitude of interactive forces at the interface. Accordingly, the first step of this investigation is to determine the surface properties of Ag-Cu, Ag-Zr and Cu-Zr liquid alloys. The energetics of the bulk and the surface of liquid alloys have been analys
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Humud, Hammad R. "Synthesis of Au –Ag– Cu trimetallic alloy nanoparticles prepared by electrical exploding wire technique in distilled water." Iraqi Journal of Physics (IJP) 16, no. 39 (2019): 81–92. http://dx.doi.org/10.30723/ijp.v16i39.106.

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Formation of Au–Ag–Cu ternary alloy nanoparticles (NPs) is of particular interest because this trimetallic system have miscible (Au–Ag and Au–Cu) and immiscible (Ag– Cu) system. So there is a possibility of phase segregation in this ternary system. At this challenge it was present attempts synthetic technique to generate such trimetallic alloy nanoparticles by exploding wire technique. The importance of preparing nanoparticles alloys in distilled water and in this technique makes the possibility of obtaining nanoparticles free of any additional chemical substance and makes it possible to be us
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López-Cuevas, Jorge, Carlos A. Gutiérrez, Martin I. Pech-Canul, M. Castro-Román, and Juan Carlos Rendón-Angeles. "High Temperature Chemical Interaction Between SiO2 Substrates and Ag-Cu Based Liquid Alloys in Vacuo." Materials Science Forum 509 (March 2006): 117–22. http://dx.doi.org/10.4028/www.scientific.net/msf.509.117.

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The interfaces formed between vitreous or thermally devitrified fused quartz substrates and silver alloys after 90 min at 850 °C in vacuum have been characterized. Three silver alloys have been used: Cusil (Ag–28 wt % Cu), Cusil-ABA (Ag–35 wt % Cu–1.5 wt % Ti), and Incusil-ABA (Ag–27 wt % Cu–12 wt % In–2 wt % Ti). A non wetting condition is found for the Cusil alloy in both substrates. In contrast, the formation of Ti5Si3, Cu3Ti3O and Ti2O3, following the sequence SiO2 → Ti2O3 → Ti5Si3 → Cu3Ti3O, is observed at the metal/ceramic interface for the two titaniumcontaining alloys on both substrate
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Janovszky, Dóra, F. Tranta, J. Sólyom, and A. Roósz. "Glass Forming Ability of Bulk Amorphous Materials in Cu-Zr-Ag Ternary Alloy Systems." Materials Science Forum 729 (November 2012): 373–78. http://dx.doi.org/10.4028/www.scientific.net/msf.729.373.

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The glass forming ability (GFA) of the Cu-Zr-Ag alloy system was investigated on the basis of the thermal stability, and the structural, thermodynamic and kinetic properties of the material. We changed the concentration of the alloys, as we departed from the Cu58Zr42 composition and produced three different eutectic points in the Cu-Zr-Ag ternary system, in accordance with the results published in the respective literature. We produced various test pieces of Cu-Zr-Ag amorphous alloys with different Ag contents (0-70%), by casting the material into wedge-shaped copper moulds. In such ternary al
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Lee, Seung Jin, Joon Sik Park, Ki Tae Kim, and Jeong Min Kim. "Effect of Ag Addition on the Microstructure and Mechanical Properties of High Conductivity Cu-1Cr-Mg-P Alloy." Materials Science Forum 695 (July 2011): 389–92. http://dx.doi.org/10.4028/www.scientific.net/msf.695.389.

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High strength high conductivity Cu-1%Cr-Mg-P alloy was selected as a base composition and Ag was added to the alloy in order to further increase the strength without sacrificing the conductivity. SEM and TEM analyses indicated that very fine MgP and Ag(Mg) precipitates were formed in addition to relatively large Cr phase in the Cu matrix. Significantly high strength could be obtained through the special cold rolling at an extremely low temperature using liquid nitrogen. The electrical conductivity of alloy was slightly decreased by the Ag addition, but the tensile strength could be further enh
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Chen, Bin, Jie He, and Jiu Zhou Zhao. "Phase Separation of Fe-Cu-Pb Alloy and Recycling of Mixed Metals in Waste Printed Circuit Boards." Materials Science Forum 944 (January 2019): 1265–70. http://dx.doi.org/10.4028/www.scientific.net/msf.944.1265.

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The pyrolysis experiment was carried out on the waste printed circuit boards (WPCBs) of mobile phones to obtain the mixed metals which contains more than ten valuable metals. The main components in the mixed metals are elements Fe, Cu, Pb, Sn. The liquid-liquid phase separation behavior of (Fe0.4Cu0.6)100-xPbx ternary alloy has been studied. The introduction of Pb into the metastable immiscible Fe-Cu alloy can result in a stable liquid-liquid phase separation into L(Fe) and L(Cu,Pb) liquids. With the increasing of Pb content, the second phase separation in the residual L(Cu,Pb) liquid was dete
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Berdnikov, Nikolai, Victor Nevstruev, Pavel Kepezhinskas, Ivan Astapov, and Natalia Konovalova. "Gold in Mineralized Volcanic Systems from the Lesser Khingan Range (Russian Far East): Textural Types, Composition and Possible Origins." Geosciences 11, no. 2 (2021): 103. http://dx.doi.org/10.3390/geosciences11020103.

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While gold partitioning into hydrothermal fluids responsible for the formation of porphyry and epithermal deposits is currently well understood, its behavior during the differentiation of metal-rich silicate melts is still subject of an intense scientific debate. Typically, gold is scavenged into sulfides during crustal fractionation of sulfur-rich mafic to intermediate magmas and development of native forms and alloys of this important precious metal in igneous rocks and associated ores are still poorly documented. We present new data on gold (Cu-Ag-Au, Ni-Cu-Zn-Ag-Au, Ti-Cu-Ag-Au, Ag-Au) all
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Dissertations / Theses on the topic "Cu-Ag liquid alloy"

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Dumas, Olivier. "Étude de la croissance du grain équiaxe dans les alliages surfondus : application à l'alliage Ag-Cu." Grenoble INPG, 1996. http://www.theses.fr/1996INPG0196.

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Un bain liquide surfondu solidifie frequemment par l'intermediaire de grains equiaxes (petits solides apparus au sein du liquide, et non au niveau de ses surfaces limitantes). Hormis aux surfusions evanescentes, un grain equiaxe se presente sous la forme d'un milieu ramifie solide-liquide, dont le developpement est assure par l'avancee de pointes dendritiques. Leur vitesse s'estime a partir de la loi d'ivantsov et d'un critere de stabilite ; en se limitant a des pointes chimiques, il est necessaire de verifier que la presence de sources solutales (milieu ramifie, pointes voisines) ne viendra p
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Rado, Cyril. "Contribution à l'étude du mouillage et de l'adhésion thermodynamique des métaux et alliages liquides sur le carbure de silicium." Grenoble INPG, 1997. http://www.theses.fr/1997INPG0039.

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Dans ce travail nous avons realise une etude experimentale et theorique des proprietes de mouillage (angles de contact a l'equilibre et cinetiques d'etalement) et d'adhesion (travail d'adhesion) des metaux purs ni, cu et ag, et de leurs alliages formes avec le si sur des substrats de sic-. Les principaux parametres explores sont la temperature, la concentration des alliages en si, la polarite et la microstructure de sic et la nature de la phase vapeur. Les experiences de mouillage sont realisees par la methode de la goutte posee dans deux installations differentes (four metallique type ultravi
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Malviya, Kirtiman Deo. "Synthesis And Study Of Microstructure Evolution In Nanoparticles Of Immiscible Alloys By Laser Ablation Under Liquid Medium." Thesis, 2013. https://etd.iisc.ac.in/handle/2005/2614.

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The present thesis deals with synthesis of free alloy nanoparticles in immiscible alloy systems by the process of laser ablation under a liquid. In this process the alloy target is submerged in a liquid and the plume formed by the laser beam interaction with the target is confined in the liquid. The nanoparticles formed inside this plume and get quenched by the surrounding liquid yielding suspension of nanoparticles in the liquid. By the addition of suitable surfactants, these nanoparticles can be protected from other reactions and their size can be controlled by preventing further growth. W
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Malviya, Kirtiman Deo. "Synthesis And Study Of Microstructure Evolution In Nanoparticles Of Immiscible Alloys By Laser Ablation Under Liquid Medium." Thesis, 2013. http://etd.iisc.ernet.in/handle/2005/2614.

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The present thesis deals with synthesis of free alloy nanoparticles in immiscible alloy systems by the process of laser ablation under a liquid. In this process the alloy target is submerged in a liquid and the plume formed by the laser beam interaction with the target is confined in the liquid. The nanoparticles formed inside this plume and get quenched by the surrounding liquid yielding suspension of nanoparticles in the liquid. By the addition of suitable surfactants, these nanoparticles can be protected from other reactions and their size can be controlled by preventing further growth. We
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Sarder, Ujjal. "Modelling of thermotransport in engineering materials." Thesis, 2019. http://hdl.handle.net/1959.13/1401311.

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Research Doctorate - Doctor of Philosophy (PhD)<br>In this dissertation, the temperature and composition dependence of mass diffusion, thermal conductivity, thermotransport (thermodiffusion) properties are investigated numerically for liquid Cu-Ag binary alloys. The thermodynamic properties of the liquid Cu-Ag binary system are also studied over wide temperature and composition ranges. All studies were performed by making use of Molecular Dynamics (MD) simulations with a reliable classical embedded-atom method (EAM) potential [1].
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Book chapters on the topic "Cu-Ag liquid alloy"

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Muolo, M. L., A. Delsante, M. Bassoli, A. Passerone, and A. Bellosi. "Wettability of TiB2 Ceramics by Liquid Cu and Ag-Cu Eutectic Alloys." In Interfacial Science in Ceramic Joining. Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-017-1917-9_8.

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López-Cuevas, Jorge, Juan Carlos Rendón-Angeles, J. L. Rodríguez-Galicia, M. Herrera-Trejo, and J. Méndez-Nonell. "High Temperature Chemical Interaction Between SSiC Substrates and Ag-Cu Based Liquid Alloys in Vacuo." In Materials Science Forum. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-993-8.111.

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Novakovic, R., M. L. Muolo, E. Ricci, et al. "Surface Properties of Ag-Cu-Zr Liquid Alloys in Relation to the Wettability of Boride Ceramics." In Materials Science Forum. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-996-2.211.

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López-Cuevas, Jorge, Carlos A. Gutiérrez, Martin I. Pech-Canul, M. Castro-Román, and Juan Carlos Rendón-Angeles. "High Temperature Chemical Interaction Between SiO2 Substrates and Ag-Cu Based Liquid Alloys in Vacuo." In Materials Science Forum. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-993-8.117.

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Budai, I., Mária Z. Benkő, and George Kaptay. "Analysis of Literature Models on Viscosity of Binary Liquid Metallic Alloys on the Example of the Cu-Ag System." In Materials Science, Testing and Informatics II. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-957-1.309.

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Conference papers on the topic "Cu-Ag liquid alloy"

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Faizan, Mohammad, and Guo-Xiang Wang. "Modeling of Micro/Nano-Particle Dissolution During Reflow of Lead-Free Composite Solders." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33891.

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The ever increasing miniaturization of electronic devices has pressed the need to find the alternate solders that can deliver the necessary strength and reliability of the solder joints. In this view the development of composite solders has become the focus for many researchers in recent years. This paper presents a mathematical model to simulate the dissolution behavior of metal particles in composite solders during reflow process. The mathematical model is based on basic mass diffusion process and involves the actual physical properties of various species (particle, IMC, solder etc) of the s
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Faizan, Mohammad, and Guo-Xiang Wang. "Effect of Thermal Processing on the Dissolution of Micro/Nano-Size Metal Particles in Lead-Free Composite Solders." In ASME 2007 International Mechanical Engineering Congress and Exposition. ASMEDC, 2007. http://dx.doi.org/10.1115/imece2007-42102.

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The ever increasing miniaturization of electronic devices has pressed the need to find the alternate solders that can deliver the necessary strength and reliability of the solder joints. In this view the development of composite solders seems a promising option and has become the focus for many researchers in recent years. An assessment of terminal size of embedded metal particles in a composite solder after reflow process is critical to evaluate the quality and strength of the solder joint. During the actual reflow process the heating phase, holding time and cooling phase are parts of the nec
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Anson, Scott J., Jacob G. Slezak, and Krishnaswami Srihari. "Analysis of Solder Wetting in Sn-Ag-Cu.05 Lead Free Alloy." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-15759.

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Lead free electronics soldering is driven by a combination of health and environmental concerns, international legislation and marketing pressure by lead free electronics manufacturing competitors. Since July 1, 2006 companies that do not comply with the European Union legislation are not able to sell circuit assemblies with lead solder in the European Union. China has developed its own regulations, based on the European Union documents with a compliance date of March 1, 2007. Lead free soldering requires an increase in reflow peak temperatures which will further aggravate component moisture s
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Song, Jinlong, Shuai Huang, Xin Liu, and Wenji Xu. "Superoleophobic Surfaces on Al and Mg Alloy Substrates Through Rapid Surface Micro/Nanometer-Scale Structuring." In ASME 2014 International Manufacturing Science and Engineering Conference collocated with the JSME 2014 International Conference on Materials and Processing and the 42nd North American Manufacturing Research Conference. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/msec2014-3990.

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A facile and highly efficient electroless deposition method to rapidly fabricate superoleophobic surfaces on Al and Mg alloy substrates is described herein. Hierarchical micro/nanometer-scale rough Cu structures required by superoleophobic surfaces were fabricated on Al substrates via immersing Al plates in the mixed solution containing CuSO4 and NaCl. Hierarchical micro/nanometer-scale rough Ag structures were fabricated on Mg alloy substrates via immersing Mg alloy plates in the aqueous AgNO3 solution. After perfluorooctanoic acid modification, in-air superoleophobic Al and Mg alloy surfaces
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