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Journal articles on the topic 'Cu-Ag liquid alloy'

Author: Grafiati
Published: 11 December 2022
Last updated: 31 July 2025

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1

Zhang, W., and A. Inoue. "High glass-forming ability and good mechanical properties of new bulk glassy alloys in Cu–Zr–Ag ternary system." Journal of Materials Research 21, no. 1 (2006): 234–41. http://dx.doi.org/10.1557/jmr.2006.0020.

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The addition of Ag to Cu–Zr alloys is very effective for the increase in the stability of supercooled liquid as well as the glass-forming ability (GFA). The large supercooled liquid region (ΔTx) exceeding 60 K in Cu–Zr–Ag ternary system was obtained in a wide range of 25–55 at.% Cu, 40–65 at.% Zr, and 5–25 at.% Ag. The best GFA was obtained around Cu45Zr45Ag10, and glassy alloy rods with diameters up to 6.0 mm were formed by copper mold casting. The bulk glassy alloys exhibit good mechanical properties, i.e., compressive fracture strength of 1780–1940 MPa, Young's modulus of 106–112 GPa, compr
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2

Baryshev, Evgeny, Tatyana Kostina, Gennady Tyagunov, and Ksenya Shmakova. "Investigation of Copper-Silver Solders Properties in Liquid State before Amorphization." Key Engineering Materials 660 (August 2015): 93–96. http://dx.doi.org/10.4028/www.scientific.net/kem.660.93.

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The temperature and concentration dependences of kinematic viscosity of alloys of Cu-Ag system with Ag content to 99 mass % in liquid state have been studied. It has been found that heating above certain critical temperatures leads to transform the melt to equilibrium state. The kinematic viscosity of the Cu-Ag melts are extremely depend from silver content in the alloy. The new regime of amorphous ribbon production is selected. Proposed regime leads to increasing of microhardness and weld strength on 10 % and corrosion resistivity on 15 %.
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3

Li, Haifeng, Haofeng Xie, Yizhi Zhao, et al. "Microstructural Evolution and Mechanical Properties of Cu–Ag Alloy via Different Severe Plastic Deformation Processes." Materials 18, no. 3 (2025): 581. https://doi.org/10.3390/ma18030581.

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The field of artificial intelligence and integrated circuits is experiencing rapid development, particularly in the area of highly integrated and miniaturized components, in which Cu-Ag alloys, as a typical lead frame material, play a crucial role. However, current research is primarily focused on low Ag content alloys, and there are few studies on the regulation of the microstructure and mechanical properties of high Ag content Cu-Ag alloys. This limitation hindered the development and utilization of the high Ag content Cu-Ag alloys. In this study, the microstructure and mechanical properties
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4

Novakovic, R., Maria Luigia Muolo, E. Ricci, et al. "Surface Properties of Ag-Cu-Zr Liquid Alloys in Relation to the Wettability of Boride Ceramics." Materials Science Forum 512 (April 2006): 211–16. http://dx.doi.org/10.4028/www.scientific.net/msf.512.211.

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The wetting phenomena and adhesion between Ag-Cu-Zr molten alloys (where Zr is an active brazing element) and ZrB2-ceramic substrate have been investigated from theoretical and experimental point of view. The wetting phenomena of molten alloy/ceramic substrate depend on the bonding characteristics of liquid alloys and ceramics as well as the magnitude of interactive forces at the interface. Accordingly, the first step of this investigation is to determine the surface properties of Ag-Cu, Ag-Zr and Cu-Zr liquid alloys. The energetics of the bulk and the surface of liquid alloys have been analys
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5

Humud, Hammad R. "Synthesis of Au –Ag– Cu trimetallic alloy nanoparticles prepared by electrical exploding wire technique in distilled water." Iraqi Journal of Physics (IJP) 16, no. 39 (2019): 81–92. http://dx.doi.org/10.30723/ijp.v16i39.106.

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Formation of Au–Ag–Cu ternary alloy nanoparticles (NPs) is of particular interest because this trimetallic system have miscible (Au–Ag and Au–Cu) and immiscible (Ag– Cu) system. So there is a possibility of phase segregation in this ternary system. At this challenge it was present attempts synthetic technique to generate such trimetallic alloy nanoparticles by exploding wire technique. The importance of preparing nanoparticles alloys in distilled water and in this technique makes the possibility of obtaining nanoparticles free of any additional chemical substance and makes it possible to be us
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6

López-Cuevas, Jorge, Carlos A. Gutiérrez, Martin I. Pech-Canul, M. Castro-Román, and Juan Carlos Rendón-Angeles. "High Temperature Chemical Interaction Between SiO2 Substrates and Ag-Cu Based Liquid Alloys in Vacuo." Materials Science Forum 509 (March 2006): 117–22. http://dx.doi.org/10.4028/www.scientific.net/msf.509.117.

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The interfaces formed between vitreous or thermally devitrified fused quartz substrates and silver alloys after 90 min at 850 °C in vacuum have been characterized. Three silver alloys have been used: Cusil (Ag–28 wt % Cu), Cusil-ABA (Ag–35 wt % Cu–1.5 wt % Ti), and Incusil-ABA (Ag–27 wt % Cu–12 wt % In–2 wt % Ti). A non wetting condition is found for the Cusil alloy in both substrates. In contrast, the formation of Ti5Si3, Cu3Ti3O and Ti2O3, following the sequence SiO2 → Ti2O3 → Ti5Si3 → Cu3Ti3O, is observed at the metal/ceramic interface for the two titaniumcontaining alloys on both substrate
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7

Janovszky, Dóra, F. Tranta, J. Sólyom, and A. Roósz. "Glass Forming Ability of Bulk Amorphous Materials in Cu-Zr-Ag Ternary Alloy Systems." Materials Science Forum 729 (November 2012): 373–78. http://dx.doi.org/10.4028/www.scientific.net/msf.729.373.

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The glass forming ability (GFA) of the Cu-Zr-Ag alloy system was investigated on the basis of the thermal stability, and the structural, thermodynamic and kinetic properties of the material. We changed the concentration of the alloys, as we departed from the Cu58Zr42 composition and produced three different eutectic points in the Cu-Zr-Ag ternary system, in accordance with the results published in the respective literature. We produced various test pieces of Cu-Zr-Ag amorphous alloys with different Ag contents (0-70%), by casting the material into wedge-shaped copper moulds. In such ternary al
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8

Lee, Seung Jin, Joon Sik Park, Ki Tae Kim, and Jeong Min Kim. "Effect of Ag Addition on the Microstructure and Mechanical Properties of High Conductivity Cu-1Cr-Mg-P Alloy." Materials Science Forum 695 (July 2011): 389–92. http://dx.doi.org/10.4028/www.scientific.net/msf.695.389.

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High strength high conductivity Cu-1%Cr-Mg-P alloy was selected as a base composition and Ag was added to the alloy in order to further increase the strength without sacrificing the conductivity. SEM and TEM analyses indicated that very fine MgP and Ag(Mg) precipitates were formed in addition to relatively large Cr phase in the Cu matrix. Significantly high strength could be obtained through the special cold rolling at an extremely low temperature using liquid nitrogen. The electrical conductivity of alloy was slightly decreased by the Ag addition, but the tensile strength could be further enh
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9

Chen, Bin, Jie He, and Jiu Zhou Zhao. "Phase Separation of Fe-Cu-Pb Alloy and Recycling of Mixed Metals in Waste Printed Circuit Boards." Materials Science Forum 944 (January 2019): 1265–70. http://dx.doi.org/10.4028/www.scientific.net/msf.944.1265.

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The pyrolysis experiment was carried out on the waste printed circuit boards (WPCBs) of mobile phones to obtain the mixed metals which contains more than ten valuable metals. The main components in the mixed metals are elements Fe, Cu, Pb, Sn. The liquid-liquid phase separation behavior of (Fe0.4Cu0.6)100-xPbx ternary alloy has been studied. The introduction of Pb into the metastable immiscible Fe-Cu alloy can result in a stable liquid-liquid phase separation into L(Fe) and L(Cu,Pb) liquids. With the increasing of Pb content, the second phase separation in the residual L(Cu,Pb) liquid was dete
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10

Berdnikov, Nikolai, Victor Nevstruev, Pavel Kepezhinskas, Ivan Astapov, and Natalia Konovalova. "Gold in Mineralized Volcanic Systems from the Lesser Khingan Range (Russian Far East): Textural Types, Composition and Possible Origins." Geosciences 11, no. 2 (2021): 103. http://dx.doi.org/10.3390/geosciences11020103.

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While gold partitioning into hydrothermal fluids responsible for the formation of porphyry and epithermal deposits is currently well understood, its behavior during the differentiation of metal-rich silicate melts is still subject of an intense scientific debate. Typically, gold is scavenged into sulfides during crustal fractionation of sulfur-rich mafic to intermediate magmas and development of native forms and alloys of this important precious metal in igneous rocks and associated ores are still poorly documented. We present new data on gold (Cu-Ag-Au, Ni-Cu-Zn-Ag-Au, Ti-Cu-Ag-Au, Ag-Au) all
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11

Krishna, S. Chenna, K. Thomas Tharian, Bhanu Pant, and Ravi S. Kottada. "Age-Hardening Characteristics of Cu-3Ag-0.5Zr Alloy." Materials Science Forum 710 (January 2012): 563–68. http://dx.doi.org/10.4028/www.scientific.net/msf.710.563.

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Among the copper alloys, the Cu-3Ag-0.5Zr alloy is one of the potential candidates for combustion chamber of liquid rocket engine because of its optimum combination of high strength with thermal conductivity. The present study is a detailed characterization of microstructure, strength, and electrical conductivity during the aging treatment. The aging cycle for Cu-3Ag-0.5Zr alloy after the solution treatment (ST) was optimized to obtain higher hardness without compromising on electrical conductivity. The precipitates responsible for strengthening in aged samples are identified as nanocrystallin
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12

Wang, Zi Run, Xin Liu, Gui Qi Xie, et al. "Convenient Route to Cu-Ag Bimetallic Nanoleaflets with High Content of Cu and their Electrochemical Properties." Key Engineering Materials 727 (January 2017): 395–402. http://dx.doi.org/10.4028/www.scientific.net/kem.727.395.

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Cu-Ag alloy nanoparticles were synthesized by a liquid phase reduction method. Using sodium formaldehyde sulfoxylate (SFS) as reducing agents, copper-silver bimetallic nanoleaflets with high content of Cu were prepared. The obtained Cu-Ag bimetallic nanocrystal were characterized by powder X-ray diffraction (XRD), energy dispersive X-ray spectroscopy (EDX), field emission scanning electron microscope (FESEM), high resolution transmission electron microscopy (HRTEM) and transmission electron microscopy (TEM). Different molar ratio of Cu-Ag bimetallic nanomaterials could produce different morpho
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13

Fan, Yixuan, Menghan Li, Xiangzheng Jia, et al. "Self-Assembly Graphene Arrays on a Liquid Cu–Ag Alloy." Chemistry of Materials 33, no. 22 (2021): 8649–55. http://dx.doi.org/10.1021/acs.chemmater.1c02390.

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14

Janovszky, D., K. Tomolya, A. Sycheva, and G. Kaptay. "Stable miscibility gap in liquid Cu–Zr–Ag ternary alloy." Journal of Alloys and Compounds 541 (November 2012): 353–58. http://dx.doi.org/10.1016/j.jallcom.2012.07.015.

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15

Drewienkiewicz, Aleksandra, Arkadiusz Żydek, Marcela E. Trybula, and Janusz Pstruś. "Atomic Level Insight into Wetting and Structure of Ag Droplet on Graphene Coated Copper Substrate—Molecular Dynamics versus Experiment." Nanomaterials 11, no. 6 (2021): 1465. http://dx.doi.org/10.3390/nano11061465.

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Understanding the atomic-level phenomena occurring upon the wetting of graphene-coated Cu with liquid Ag is pivotal for the description of the wetting phenomenon and the role of graphene as a diffusion barrier. We have performed molecular dynamics (MD) simulations and confronted with our present experimental results to characterize wetting behavior of graphene coated Cu surfaces. Perfect and defected graphene layers covering Cu surface were wetted with liquid Ag droplet at 1273 K. Structural and topological aspects are discussed to characterize structure of the liquid Ag droplet and a product
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16

Zhu, Sheng Li, Guo Qiang Xie, Akihisa Inoue, Zhen Duo Cui, Xian Jin Yang, and Wei Zhang. "Effects of Minor Additions on Ni- and Be-Free Ti-Based Bulk Glassy Alloys." Materials Science Forum 833 (November 2015): 79–84. http://dx.doi.org/10.4028/www.scientific.net/msf.833.79.

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We investigated the effects of addition elements (Sn, Al, Si, Ag, Fe, Cr) with a small amount on the glass-forming ability, thermal stability and mechanical properties of the Ti-Zr-Cu-Pd glassy alloy system. The results revealed that minor Sn addition improved the glass-forming ability, thermal stability and plasticity, Si addition enlarged the supercooled liquid region, and Fe addition improved the plasticity, while minor additions of Si, Ag, Fe, and Cr lowered the glass-forming ability, and Al and Cr additions were harmful to the plasticity of the Ti-Zr-Cu-Pd glassy alloy system.
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17

Yue, Li Jie, Jin Sheng Han, and Kun Xie. "The Microalloying Effects in Cu-Based Bulk Metallic Glasses." Materials Science Forum 688 (June 2011): 407–12. http://dx.doi.org/10.4028/www.scientific.net/msf.688.407.

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The glassy alloy rods of Cu50Zr43Al7, (Cu50Zr43Al7)100-xYx(x=2,5) and (Cu50Zr43Al7)100-xAgx(x=6,7) with diameters of 3.0 mm were prepared by copper mold suction casting method. The influence of adding Ag and Y to Cu50Zr43Al7 metallic glass on glass formation ability (GFA) and thermal stability was studied by means of X-ray diffraction analysis (XRD) and differential scanning calorimetry (DSC). The results show that Ag and Y appropriate micro-addition enhance the glass formation ability and thermal stability of the Cu-Zr-Al metallic glass. The effect of Ag is better than that of Y. The addition
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18

Wu, Yu Cai, and Ming Yan. "The Application of Rare-Earth Element." Advanced Materials Research 233-235 (May 2011): 3005–9. http://dx.doi.org/10.4028/www.scientific.net/amr.233-235.3005.

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In this paper, the process of Cu-Ag contact wire with adding rare-earth elements was presented. The additive process of the rare-earth elements and the function of the rare earth were chiefly analyzed. Adding the rare-earth elements into melt alloy, the oxide and sulfur can be removed from the liquid, so we can get the purified alloy. At the same time, adding rare-earth can reduce the external crack flaws which produced during the casting and makes the grain refined, as the result, the properties of the Cu-Ag alloy contact wire can be greatly improved and meliorated. Such as the conductivity,
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19

Chen, Linghao, Hong Zhang, Xianyi Kuang, and Shiqing Zhu. "Composition Distribution Simulation of Al-Cu-Mg-Ag Alloy based on Phase-Field Method during Solidification." Journal of Physics: Conference Series 2956, no. 1 (2025): 012048. https://doi.org/10.1088/1742-6596/2956/1/012048.

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Abstract Al-Cu-Mg-Ag alloys are widely used in aerospace due to their excellent heat resistance, high specific strength, and good machinability. In solidification, the compositional distribution and segregation of the alloy play an important role in its properties. Therefore, in this paper, the solidification phase field model was established by using the phase field method to simulate the compositional distribution of the alloy after solidification. The experiments show that the solutes are expelled during the advancement of the interface to the liquid phase, and that the content of each elem
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20

Tan, Xin F., Flora Somidin, Stuart D. McDonald, et al. "In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy." Materials 15, no. 2 (2022): 510. http://dx.doi.org/10.3390/ma15020510.

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The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due to the lack of direct observation at micro- and nano-meter resolutions. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur in Cu6Sn5 between a Sn-3.0 wt%Ag-0.5 wt%Cu (SAC305) solder alloy and a Cu substrate in situ at temp
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21

Dezso, Andras, Gergely Vasko, Peter Baumli, and George Kaptay. "[P36] On the equilibrium Cu-content of the Sn-Ag-Cu liquid alloy with solid Cu." Calphad 51 (December 2015): 383–84. http://dx.doi.org/10.1016/j.calphad.2015.01.125.

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22

Zhao, Su, Dong Lai Wei, and Qing Miao. "Structures and Undercooling Technology of Ag-28.1 wt.% Cu Eutectic Alloy." Advanced Materials Research 750-752 (August 2013): 734–38. http://dx.doi.org/10.4028/www.scientific.net/amr.750-752.734.

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Effects of the technological parameters (superheat, cycle times and holding time) on undercooling and structure of Ag-28.1 wt.% Cu eutectic alloy were discussed by orthogonal experiment. It shows that the influence of the superheat on undercooling is biggest, followed by cycle times, and finally holding time. Then the optimum process parameters of getting different undercooling are given in this paper. In the Ag-28.1 wt.% Cu eutectic alloy melt, cellular growth of lamellar eutectics takes place because of the large difference in composition between the two eutectic phases and the very large th
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23

Kim, M. J., C. S. Lee, M. Catalano, and K. S. Shin. "Microstructure and properties of Al-Cu-Li-Ag-Mg-Zr alloy." Proceedings, annual meeting, Electron Microscopy Society of America 50, no. 1 (1992): 184–85. http://dx.doi.org/10.1017/s0424820100121326.

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Weldalite™ 049 is an ultrahigh strength weldable Al-Cu-Li based alloy containing minor amounts of Ag, Mg and Zr, developed at Martin Marietta. Additions of Ag and Mg seem to stimulate precipitation in this alloy, but the exact role of these elements in promoting the precipitation of strengthening phases is as yet unclear. In this paper, we report the characteristic microstructure of the Weldalite™ 049 alloy in the near peak aged T8 temper condition and its effect on the measured tensile properties of this alloy.The alloy used in this study was prepared by the Reynolds Metals Company. Measured
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24

Taute, Carlien, and Heinrich Möller. "Segregation Characteristics of Rheo-High Pressure Die Cast Al-Alloy 2139 Plates." Materials Science Forum 828-829 (August 2015): 100–105. http://dx.doi.org/10.4028/www.scientific.net/msf.828-829.100.

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Al-Cu-Mg-Ag alloy 2139 is a wrought alloy that is heat-treatable and used in aerospace constructions. This is mainly due to the addition of silver in the alloy. Hot-tearing is a problem for casting wrought alloys with conventional liquid casting techniques. The risk is reduced by using rheo-high pressure die casting (R-HPDC) to allow the alloy to be used for near-net shape forming of components. This study investigates the segregation characteristics of R-HPDC alloy 2139. The effects of segregation on the age-hardening response as well as the tensile properties are studied. The chemical compos
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25

Drienovsky, Marian, Marián Palcut, Pavol Priputen, et al. "Properties of Sn-Ag-Cu Solder Joints Prepared by Induction Heating." Advances in Materials Science and Engineering 2020 (March 12, 2020): 1–9. http://dx.doi.org/10.1155/2020/1724095.

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In the present work, one near-eutectic and three hypoeutectic Sn-Ag-Cu alloys have been employed for soldering by induction heating. The alloys were produced by induction melting of high purity Ag, Cu, and Sn lumps. The melting behavior of the alloys was investigated by differential scanning calorimetry. The solder alloys were subsequently applied for soldering by conventional hot-plate heating as well as induction heating and both soldering times and peak temperatures were recorded during soldering. Solder joints of two copper sheets were produced. The electrical resistance, tensile strength,
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26

Lee, J. K., G. Choi, W. T. Kim, and D. H. Kim. "Precipitation of icosahedral phase from amorphous Zr65Cu17.5−xAl7.5Ni10Agx (x = 0, 5) alloys." Journal of Materials Research 16, no. 5 (2001): 1311–17. http://dx.doi.org/10.1557/jmr.2001.0183.

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Crystallization behavior of amorphous Zr65Cu17.5−xAl7.5Ni10Agx (x = 0, 5) alloys prepared by melt spinning and injection casting techniques has been studied using differential scanning calorimetry, x-ray diffractometry, and transmission electron microscopy. Ag addition changes crystallization sequence of the amorphous phase. The amorphous Zr65Cu17.5Al7.5Ni10 alloy crystallizes via simultaneous precipitation of icosahedral phase and NiZr2 phase in the first crystallization step whereas that in Zr65Cu12.5Al7.5Ni10Ag5 alloy crystallizes via precipitation of only icosahedral the phase. Partial rep
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27

Durov, O. V., and V. P. Krasovskyy. "In situ observation of Ag–Cu–Ti liquid alloy/solid oxide interfaces." Materials Science and Engineering: A 495, no. 1-2 (2008): 164–67. http://dx.doi.org/10.1016/j.msea.2007.10.098.

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28

Zhang, Wei, Qingsheng Zhang, and Akihisa Inoue. "Fabrication of Cu–Zr–Ag–Al glassy alloy samples with a diameter of 20 mm by water quenching." Journal of Materials Research 23, no. 5 (2008): 1452–56. http://dx.doi.org/10.1557/jmr.2008.0183.

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The melting behavior, thermal stability, and glass-forming ability (GFA) of Cu84−xZrxAg8Al8 (x = 42 to 50) glassy alloys were investigated. The alloy with x = 46 exhibits the highest reduced glass transition temperature (Trg). However, the best GFA was obtained for alloy with x = 48 corresponding to the largest supercooled liquid region (ΔTx) and a deep eutectic composition. At the best GFA composition, full glassy samples with diameters of over 20 mm could be fabricated by injection copper mold casting and water quenching without flux. The underlying mechanism of the unusual GFA of the alloy
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29

Ohno, H., Y. Araki, and K. Endo. "A New Method for Promoting Adhesion between Precious Metal Alloys and Dental Adhesives." Journal of Dental Research 71, no. 6 (1992): 1326–31. http://dx.doi.org/10.1177/00220345920710061001.

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A new, simple method of modifying the adherend metal surface by a liquid Ga-Sn alloy (Adlloy) was applied to dental precious and base-metal alloys for adhesion with 4-META adhesive resin. Adhesions of 4-META resin to three other surface states-as-polished, oxidized at high temperature, and electroplated tin-were also performed for comparison with the adhesion on Adlloy-modified surfaces. Bond strength measurements were made, and the durability against water at the adhering interface was evaluated. The Adlloy-modified gold alloys (Type IV and 14 K) and silverbasedalloys (Ag-Pd and Ag-Cu) showed
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30

Yau Musa, Arma, Ellen Tingström, and Mathilde Luneau. "Dilute Alloy Electrocatalysts for CO2 Electroreduction." ECS Meeting Abstracts MA2025-01, no. 52 (2025): 2564. https://doi.org/10.1149/ma2025-01522564mtgabs.

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The extensive use of fossil fuels has significantly raised atmospheric CO2 levels, leading to serious environmental concerns. CO2 electroreduction holds promise by enabling excess renewable energy to be stored in the form of valuable chemical feedstock and fuels, turning an environmental problem into an opportunity. This approach creates the potential for a sustainable artificial carbon cycle, helping to balance energy supply and demand while reducing atmospheric CO2[1]. A variety of electrocatalysts have been methodically investigated and copper-based electrocatalysts, when combined with carb
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31

Daswa, Pfarelo, Heinrich Möller, and Gonasagren Govender. "Optimization of the Solution Heat Treatment of Rheo-High Pressure Die Cast Al-Cu-Mg-Ag 2139 Alloy." Materials Science Forum 828-829 (August 2015): 226–31. http://dx.doi.org/10.4028/www.scientific.net/msf.828-829.226.

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This paper investigates the optimization of the solution heat treatment parameters of the rheo-high pressure die cast (R-HPDC) 2139 aluminium alloy. Differential Scanning Calorimetry (DSC) and optical microscopy were used to investigate the incidence of incipient melting and therefore determine suitable solution heat treatment temperatures. A three-step solution heat treatment where the alloy was heat treated from 400°C to 513°C using controlled heating conditions and held at 513°C for 2 hours and finally heated up from 513°C to 525°C and held there for 16 hours was done. R-HPDC is known to pr
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32

Heo, Hoejun, Yoon-Cheol Park, Chung-Yun Kang, and Keeyoung Jung. "Dealloying of a Ag-Cu-Ti alloy in liquid sodium at 350 °C." Corrosion Science 144 (November 2018): 35–43. http://dx.doi.org/10.1016/j.corsci.2018.07.020.

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33

Hammood, Shahad Ali, Haydar Abdul Hassan Al-Ethari, and Abdolreza Rahimi. "Optimization the Machining Parameters of Electro Chemical Discharge Machining of NiTi Shape Memory Alloys." Materials Science Forum 1039 (July 20, 2021): 117–26. http://dx.doi.org/10.4028/www.scientific.net/msf.1039.117.

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The electrochemical discharge machining (ECDM) is a combination effect of electrochemical machining in which metal is removed through the electrochemical process and electrical discharge machining in which metal is removed by rapid current discharges between two electrodes which are separated by a dielectric liquid and subject to an electric voltage. Difficulty of machining nickel titanium alloys by conventional methods such as; the significant tool wear, the need of highly experienced operators, and an excessive degradation in the material performance due to the high thermal and mechanical ef
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34

Yakymovych, Andriy, and Ihor Shtablavyi. "Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States." Metals 13, no. 6 (2023): 1093. http://dx.doi.org/10.3390/met13061093.

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The Sn-Ag-Cu (SAC) alloy family is commonly used in lead-free solders employed in the electronics industry, for instance, SAC305, SAC387, SAC405, etc. However, the trend in manufacturing small electronic products and device miniaturization faces some disadvantages in terms of mechanical properties and their higher melting temperatures compared to Pb-Sn solders, prompting new research relating to the reinforcement of existing SAC solders. The current study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu)100−x(nanoNi)x solders with 0.5 wt.%, 1.0 wt.%, and 2.0 wt.% Ni. Structural an
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35

Chen, Sihai, Guangyu Fan, Xue Yan, Chris LaBarbera, Lee Kresge, and Ning-Cheng Lee. "PRESSURELESS SINTERING OF NANO- AG PASTE WITH LOW POROSITY FOR DIE ATTACH." International Symposium on Microelectronics 2014, no. 1 (2014): 000092–98. http://dx.doi.org/10.4071/isom-ta35.

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A novel nano-Ag sintering paste C has been developed for a pressureless sintering process under air. Paste C was sintered at 250°C (C1) and 280°C (C2), respectively; C1 showed a slightly higher porosity but higher shear strength after aging at 250°C for 840 hours. Both C1 and C2 exhibited a microstructure much more stable than the control solder 92.5Pb/5Sn/2.5Ag, which suffered both IMC spalling after thermal aging and voiding. Ag migration toward the DBC to form a dense layer of AgCuNi(Au) was observed for all nano-Ag pastes that were studied, with C1 and C2 being more moderate in the migrati
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36

Zhang, L. C., Z. Q. Shen, and J. Xu. "Glass formation in a (Ti, Zr, Hf)–(Cu, Ni, Ag)–Al high-order alloy system by mechanical alloying." Journal of Materials Research 18, no. 9 (2003): 2141–49. http://dx.doi.org/10.1557/jmr.2003.0300.

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In this work, glass formation under high-energy ball milling was investigated for a (Ti0.33Zr0.33Hf0.33)50(Ni0.33Cu0.33Ag0.33)40Al10 high-order alloy system with equiatomic substitution for early and late transition-metal contents. For comparison, an amorphous alloy ribbon with the same composition was prepared using the melt-spinning method as well. Structural features of the samples were characterized using x-ray diffraction, transmission electron microscopy, and differential scanning calorimetry. Mechanical alloying resulted in a glassy alloy similar to that obtained by melt spinning. Howev
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37

López-Cuevas, Jorge, Juan Carlos Rendón-Angeles, J. L. Rodríguez-Galicia, M. Herrera-Trejo, and J. Méndez-Nonell. "High Temperature Chemical Interaction Between SSiC Substrates and Ag-Cu Based Liquid Alloys in Vacuo." Materials Science Forum 509 (March 2006): 111–16. http://dx.doi.org/10.4028/www.scientific.net/msf.509.111.

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The interfaces formed at 850 °C under vacuum between polished or oxidized substrates of pressureless sintered α-SiC (SSiC) and Cusil, Cusil-ABA and Incusil-ABA brazing alloys have been characterized by X-ray diffraction, scanning electron microscopy and energy dispersive spectroscopy. No chemical interaction is observed for Cusil on both SSiC substrates. In contrast, the Ti contained in the Cusil-ABA and Incusil-ABA alloys promotes the occurrence of chemical reactions at the metal/ceramic interface with both SSiC substrates. The formation of TiC and Ti5Si3 is observed for Cusil-ABA and Incusil
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38

Rahaghi, S. H. Hashemian, R. Poursalehi, and R. Miresmaeili. "Optical Properties of Ag-Cu Alloy Nanoparticles Synthesized by DC Arc Discharge in Liquid." Procedia Materials Science 11 (2015): 738–42. http://dx.doi.org/10.1016/j.mspro.2015.11.062.

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39

Ruan, Y., and W. J. Xie. "Peri-eutectic solidification and complicated microstructural evolution of liquid undercooled Cu–Ag–Sb alloy." Intermetallics 31 (December 2012): 232–41. http://dx.doi.org/10.1016/j.intermet.2012.07.011.

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40

Gafner, Yuri Ya, Svetlana L. Gafner, and Daria A. Ryzhkova. "Estimating Ag-Cu Nanoalloy Applicability for PCM Data Recording." Solid State Phenomena 310 (September 2020): 47–52. http://dx.doi.org/10.4028/www.scientific.net/ssp.310.47.

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The paper studies applicability of individual particles of Ag-Cu nanoalloys as data bits in the next generation memory devices constructed on the phase change memory principle. To fulfill this task, the structure formation was simulated with the molecular dynamics method on cooling from the melt of Ag-Cu nanoparticles of the diameter of 2.0 – 8.0 nm of different chemical compositions (with copper content in the alloy from 10 to 50 percent), based on the modified tight-binding potential (TB-SMA). The authors investigated the influence of the size effects and the heat removal rate on the formati
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41

Agrotis, Stefanos, Daren J. Caruana, Albertus Denny Handoko, Mustafa Emre Sener, and Oliver S. J. Hagger. "Atmospheric Pressure Plasma Jet Synthesis and Characterization of Copper-Silver Bimetallic Materials as Electrocatalysts for CO2 Reduction." ECS Meeting Abstracts MA2024-01, no. 24 (2024): 1403. http://dx.doi.org/10.1149/ma2024-01241403mtgabs.

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Copper-silver (Cu-Ag) bimetallics and alloys are attractive due to their enhanced performance compared to their parent metals in various fields including electronics, batteries, biomedicine, solar technology, energy storage, and catalysis.[1] Existing methods for synthesizing Cu-Ag bimetallics suffer from major drawbacks such as intense temperature and pressure conditions, pre and post-treatment processes, and multiple time-consuming steps.[2, 3] In this work, Cu-Ag bimetallic films were synthesized under various ratios for the first time using a newly developed Atmospheric Pressure Plasma Jet
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42

Kolenak, Roman, Igor Kostolny, Jaromir Drapala, Paulina Babincova, and Peter Gogola. "Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper." Metals 11, no. 4 (2021): 624. http://dx.doi.org/10.3390/met11040624.

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The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with sil
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43

Wang, Jie, Ge Li, Haotian Yang, et al. "TLP diffusion bonding of C–C composite and TC4 alloy using AgCuNiLi alloy as joining material." International Journal of Materials Research 113, no. 3 (2022): 214–21. http://dx.doi.org/10.1515/ijmr-2021-8239.

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Abstract In this study, AgCuNiLi alloy was successfully used as the intermediate layer to join Ti-6Al-4V (TC4) alloy and silicon carbide (SiC) coated carbon–carbon (C–C) composites by transient liquid phase diffusion bonding (TLP). Through the characterization and analysis of microstructure, element distribution, phases and fracture behavior of as-prepared joints by optical microscopy, scanning electron microscope, energy dispersive X-ray spectrometry, X-ray diffraction, mechanical testing etc., the influences of the SiC coating on the surface of C–C composites on the microstructure and mechan
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44

Bushby, R. S., and V. D. Scott. "Liquid phase bonding of aluminium and aluminium/Nicalon composite using interlayers of Cu–Ag alloy." Materials Science and Technology 11, no. 7 (1995): 643–49. http://dx.doi.org/10.1179/026708395790165336.

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45

Bushby, R. S., and V. D. Scott. "Liquid phase bonding of aluminium and aluminium/Nicalon composite using interlayers of Cu-Ag alloy." Materials Science and Technology 11, no. 7 (1995): 643–49. http://dx.doi.org/10.1080/17432847.1995.11945557.

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46

Okabe, T., and R. J. Mitchell. "Setting Reactions in Dental Amalgam Part 2. the Kinetics of Amalgamation." Critical Reviews in Oral Biology & Medicine 7, no. 1 (1996): 23–35. http://dx.doi.org/10.1177/10454411960070010201.

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The literature on the setting mechanisms of dental amalgams made from powders of silver-rich alloys of tin and/or copper has been critically reviewed. Part 2 is a review of the kinetics of the reactions that convert the mixture of alloy powder and liquid mercury to hardened amalgam containing the phases and microstructures described in Part I . It is emphasized that amalgamation is a non-equilbrium process in which hardened microstructures are determined as much by kinetics as by chemistry. The setting reaction begins with dissolution of silver and tin into liquid mercury; most of the product
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47

Bernt, Marvin, and Adam McClure. "Consumable Anode Process for SnAg Electroplating." International Symposium on Microelectronics 2014, no. 1 (2014): 000117–21. http://dx.doi.org/10.4071/isom-ta44.

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Near eutectic tin-silver (SnAg) is currently the alloy of choice for electroplated lead-free solder bumping and Cu pillar capping. While lead-tin (PbSn) is still used in some applications, there has been considerable momentum in moving away from the use of lead in semiconductor packaging. Both solders are normally electroplated as alloys with specific compositions to target a desired melting point. Since the deposition potentials of lead and tin are very close together, they plate with similar characteristics. This makes it possible for PbSn plating systems to use a consumable anode system whe
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48

Torimoto, Tsukasa, Ryuichi Ito, Kazutaka Akiyoshi, Tatsuya Kameyama, Yuhki Yui, and Masaya Ibe. "(Invited) Preparation of Aucu Alloy Nanoparticles Via Ionic Liquid/Metal Sputtering for Electrocatalytic CO2 Reduction." ECS Meeting Abstracts MA2024-02, no. 68 (2024): 4800. https://doi.org/10.1149/ma2024-02684800mtgabs.

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Development of highly active electrocatalysts for carbon dioxide reduction has been intensively investigated for the efficient utilization of CO2 and the lowering of electric energy consumption. Among various strategies, alloy nanoparticles (NPs) have attracted significant interest due to their tunable catalytic properties, which can be adjusted by altering their chemical composition and particle size. Recently, we reported novel preparation methods of metal nanoparticles through the sputter deposition of metals onto room-temperature ionic liquids (RTILs), a technique we termed “RTIL/metal spu
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Kang, Youngjo, Jihye Han, Hyelim Kim, and Joonho Lee. "Effect of oxygen on the wettability of 304L stainless steel by liquid Ag–Cu eutectic alloy." Journal of Materials Science 51, no. 4 (2015): 1713–21. http://dx.doi.org/10.1007/s10853-015-9511-1.

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50

Muolo, Maria Luigia, Fabrizio Valenza, Natalia Sobczak, and Alberto Passerone. "Overview on Wetting and Joining in Transition Metals Diborides." Advances in Science and Technology 64 (October 2010): 98–107. http://dx.doi.org/10.4028/www.scientific.net/ast.64.98.

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The ultra high temperature performance of ceramic-based complex structures may require the development of liquid-assisted joining techniques; this in turn requires the definition of the wettability of these materials by various metals over a wide range of compositions and temperatures. After a short description of the relevant experimental aspects of wettability studies at high temperatures, a discussion is presented on how these results can be used to derive chemical and structural information on the solid-liquid interactions. Reference is made mainly to metal-ceramic systems; a summary of th
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