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Journal articles on the topic 'Cu-based Intermetallics'

Author: Grafiati
Published: 6 September 2023
Last updated: 31 July 2025

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1

Hanim, M. A. Azmah, A. Ourdjini, I. Siti Rabiatul Aisha, and O. Saliza Azlina. "Effect of Isothermal Aging 2000 Hours on Intermetallics Formed between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders." Advanced Materials Research 650 (January 2013): 194–99. http://dx.doi.org/10.4028/www.scientific.net/amr.650.194.

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The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetallic morphology to coarser and dense structure. The intermetallic compound formed for the interconnection of the lead free solder changes with increased aging time from (Cu,Ni)6Sn5 compound to (Ni,Cu)3Sn4. At the end of the 2000 hours aging time, it changes to Ni3Sn4. This is the effect of Cu element
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2

Mayappan, Ramani, Nur Nadiah Zainal Abidin, Noor Asikin Ab Ghani, Iziana Yahya, and Norlin Shuhaime. "Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder." Materials Science Forum 857 (May 2016): 3–7. http://dx.doi.org/10.4028/www.scientific.net/msf.857.3.

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Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there are many lead-free solders available, the Sn-Ag-Cu solders are considered the best replacement due to their good wettability and joint strength. Although the Sn-Ag-Cu solders are accepted widely, but there are still some room for improvement. In this study, 1wt% Zn, which can be considered high percentage for a dopant, was added into the solder via powder metallurgy route. The effects of adding this dopant into the Sn-3.5Ag-1.0Cu solder on th
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3

Alba-Galvín, Juan Jesús, Leandro González-Rovira, Manuel Bethencourt, Francisco Javier Botana, and José María Sánchez-Amaya. "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy." Metals 9, no. 3 (2019): 320. https://doi.org/10.3390/met9030320.

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Published version of the open acces manuscript "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy". Abstract: A standard three-step surface pretreatment employed in the aerospace sector for Al alloys have been investigated prior to the generation of cerium conversion coatings (CeCC) on aluminium-copper alloy 2024. Two pretreatments were analysed, one without final acid etching (Pretreatment 1) and another with this step (Pretreatment 2). Both pretreatments affect the alloy intermetallic phases, playing a key role in the develo
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4

Alba-Galvín, Juan, Leandro González-Rovira, Manuel Bethencourt, Francisco Botana, and José Sánchez-Amaya. "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy." Metals 9, no. 3 (2019): 320. http://dx.doi.org/10.3390/met9030320.

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A standard three-step surface pretreatment employed in the aerospace sector for Al alloys have been investigated prior to the generation of cerium conversion coatings (CeCC) on aluminium-copper alloy 2024. Two pretreatments were analysed, one without final acid etching (Pretreatment 1) and another with this step (Pretreatment 2). Both pretreatments affect the alloy intermetallic phases, playing a key role in the development of the CeCC, and also in the susceptibility to localised corrosion in NaCl medium. Scanning electron microscopy coupled with energy-dispersive X-ray analysis (SEM-EDX) reve
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5

Lee, Dong Suk, Taek Kyun Jung, Mok Soon Kim, and Won Yong Kim. "Effect of Cu and Mg on Forging Property and Mechanical Behavior of Powder Forged Al-Si-Fe Based Alloy." Materials Science Forum 534-536 (January 2007): 389–92. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.389.

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Two atomized alloy powders, those chemical compositions are Al-10Si-5Fe-1Zr and Al- 10Si-5Fe-4Cu-2Mg-1Zr, were pre-compacted by cold pressing with 350MPa and subsequently hot forged at temperatures ranging from 653K to 845K and at an initial strain rate of 10-2/s in order to produce bulk cylindrical type alloys with the diameter of 10 mm. The addition of Cu and Mg into the present alloy causes a decrease in the eutectic reaction temperature of Al-10Si-5Fe-1Zr alloy from 841K to 786K and results in a decrease of flow stress at the given forging temperature. TEM observation revealed that in addi
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6

Thirunavukarasu, Gopinath, Sukumar Kundu, Tapas Laha, Deb Roy, and Subrata Chatterjee. "Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper." Metallurgical Research & Technology 115, no. 1 (2017): 115. http://dx.doi.org/10.1051/metal/2017080.

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An investigation was carried out to know the extent of influence of bonding-time on the interface structure and mechanical properties of diffusion bonding (DB) of TiA|Cu|SS. DB of Ti6Al4V (TiA) and 304 stainless steel (SS) using pure copper (Cu) of 200-μm thickness were processed in vacuum using 4-MPa bonding-pressure at 1123 K from 15 to 120 min in steps of 15 min. Preparation of DB was not possible when bonding-time was less than 60 min as the bonding at Cu|SS interface was unsuccessful in spite of effective bonding at TiA|Cu interface; however, successful DB were produced when the bonding-t
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7

Mayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn lntermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (2010): 1. http://dx.doi.org/10.24191/srj.v7i2.9416.

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Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6Sn5 and Cu3Sn. The growth of Cu6Sn5 and Cu3Sn intermetallics have been investigated with respect to Sn-40Pb/Cu solder joints. The joints were aged under long-term thermal exposure using single shear lap joints and the intermetallics were observed using scanning electron microscopy. As-soldered solder joints exhibit a single Cu6Sn5 phase, however after aging a Cu3Sn layer below
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8

Ma, Y., T. Arnesen, J. Gj⊘nnes, and J. Taft⊘. "Laser processed Al3Ti-based intermetallics: Al5±XTi2±Y(Fe, Ni, or Cu)1±z." Journal of Materials Research 7, no. 7 (1992): 1722–34. http://dx.doi.org/10.1557/jmr.1992.1722.

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A new processing route for intermetallics starting from elemental metal powders and using laser beam heating has been investigated, by which three Al3Ti-based ternary intermetallic systems alloyed with Fe, Ni, or Cu, respectively, have been produced. Structures and compositions of five phases found in the three systems have been analyzed using optical metallography, transmission electron diffraction and microscopy, and thin foil energy dispersive x-ray spectrometry. The structure of three matrix phases in the three systems was identified as L12 type, which is consistent with previous work. The
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9

Mayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn Intermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (2010): 1. http://dx.doi.org/10.24191/srj.v7i2.5016.

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Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6Sn5 and Cu3Sn. The growth of Cu6Sn5 and Cu3Sn intermetallics have been investigated with respect to Sn-40Pb/Cu solderjoints. The joints were aged under long-term thermal exposure using single shear lap joints and the intermetallics were observed using scanning electron microscopy. As-soldered solder joints exhibit a single Cu6Sn5 phase, however after aging a Cu3Sn layer below
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10

Liu, Wen, Chi Zhang, Chunge Wang, et al. "Theoretical investigations on correlations between elastic behavior of Al-based alloys and their electronic structures." International Journal of Materials Research 112, no. 8 (2021): 636–41. http://dx.doi.org/10.1515/ijmr-2021-8235.

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Abstract In this work, using the first-principles method, the alloying stability, electronic structure, and elastic properties of Al-based intermetallics were investigated. It was found that these alloys have a strong alloying ability and structural stability due to the negative formation energies and the cohesive energies. The valence bonds of these intermetallic compounds are attributed to the valence electrons of Cu 3δ states for AlCu3, Cu 3δ and Zr 4δ states for AlCu2Zr, and Al 3s, Zr 5s and 4δ states for AlZr3, respectively. Furthermore, the correlation between elastic properties of these
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11

Sainis, Salil, and Caterina Zanella. "A Study of the Localized Ceria Coating Deposition on Fe-Rich Intermetallics in an AlSiFe Cast Alloy." Materials 14, no. 11 (2021): 3058. http://dx.doi.org/10.3390/ma14113058.

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Corrosion inhibiting conversion coating formation is triggered by the activity of micro-galvanic couples in the microstructure and subsequent local increase in pH at cathodic sites, which in the case of aluminium alloys are usually intermetallics. Ceria coatings are formed spontaneously upon immersion of aluminium alloys in a cerium conversion coating solution, the high pH gradient in the vicinity of intermetallics drives the local precipitation of ceria conversion compounds. Cu-rich intermetallics demonstrate a highly cathodic nature and have shown the local precipitation reaction to occur re
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12

Mayappan, Ramani, Amirah Salleh, Nurul Atiqah Tokiran, and N. A. Awang. "Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder." Soldering & Surface Mount Technology 32, no. 2 (2019): 65–72. http://dx.doi.org/10.1108/ssmt-07-2019-0025.

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Purpose The purpose of this study is to investigate the addition of 0.05 Wt.% carbon nanotube (CNT) into the Sn-1.0Ag-0.5Cu (SAC) solder on the intermetallic (IMC) growth. Lead-based solders play an important role in a variety of applications in electronic industries. Due to the toxicity of the lead in the solder, lead-free solders were proposed to replace the lead-based solders. Sn-Ag-Cu solder family is one of the lead-free solders, which are proposed and considered as a potential replacement. Unfortunately, the Sn-Ag-Cu solder faces some reliability problems because of the formation of the
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13

Zhang, Jie, and Yan Ming He. "Effect of Ti Content on Microstructure and Mechanical Properties of Si3N4/Si3N4 Joints Brazed with Ag-Cu-Ti+Mo Composite Filler." Materials Science Forum 654-656 (June 2010): 2018–21. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.2018.

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Mo particles have been introduced into Ag-Cu-Ti brazing alloy for the joining of Si3N4 ceramic. Effects of Ti content on microstructure and mechanical properties of the joints were investigated. The results present that a compact reaction layer which is composed of TiN and Ti5Si3 was formed at the Si3N4/solder interface. The central part of the joint was composed of Ag based solid solution, Cu based solid solution, Mo particles and Cu-Ti intermetallics. By increasing Ti content in the composite filler, both the thickness of reaction layer and the amount of Cu-Ti intermetallics in the joint inc
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14

Kim, Yong Keun, Pyung Woo Shin, and Sun Ig Hong. "Effect of Heat Treatment on the Mechanical Properties and Interface Structure of 3-ply Ti/Cu/Ti Clad Composite." Advanced Materials Research 1102 (May 2015): 51–54. http://dx.doi.org/10.4028/www.scientific.net/amr.1102.51.

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The effect of heat treatment on the mechanical properties and interface structure of 3-ply Ti/Cu/Ti clad composite was investigated. Strength decreased and the ductility increased with increase of heat treatment temperature. The gradual increase of hardness at 700°C and 800°C indicates the growth of intermetallic compounds at the interface. No visible intermetallic compound formation was observed up to 400°C. The intermetallic layer grew very rapidly above 600°C and its thickness reached ~10μm after heat treatment at 800°C. The absence of cracks emanating from the corners of the indentation ma
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15

Moffat, Thomas P., Yihua Liu, Dincer Gokcen, et al. "(Invited) Investigations into the Role of Adsorption Processes in Alloy Deposition." ECS Meeting Abstracts MA2022-01, no. 22 (2022): 1108. http://dx.doi.org/10.1149/ma2022-01221108mtgabs.

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The interplay between adsorption, underpotential deposition and excess bond enthalpy in the deposition of alloys and intermetallic will be discussed based on selections from recent work. Examples of limiting behavior will be presented that range from the deposition of solid-solutions, e.g. Pt-Cu and Pt-Fe group alloys, to intermetallics, e.g. Pt-Pb, to immiscible, e.g. Cu-Pb, systems. In addition, the impact of “parasitic” reactions, such as electrolyte breakdown, on the deposition of elements and alloys will be briefly discussed. The utility of a close coupling between electroanalytical, grav
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16

Yahya, Iziana, Noor Asikin Ab Ghani, Nur Nadiah Zainal Abiddin, Hamidi Abd Hamid, and Ramani Mayappan. "Intermetallic Evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu Interface under Thermal Aging." Advanced Materials Research 620 (December 2012): 142–46. http://dx.doi.org/10.4028/www.scientific.net/amr.620.142.

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Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu is considered the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. To improve the solder, a fourth element Zn was added into the solder. The new composite solders were synthesized via powder metallurgy route. This research studies the effect of 0.1wt% Zn addition on the hardness and intermetallic formation on Cu substrate. For the h
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17

Lee, Min Ku, Jung G. Lee, Jong Keuk Lee, Jin Ju Park, Young Rang Uhm, and Chang Kyu Rhee. "The Effect of Ag Diffusion Barrier on the Microstructure of a Titanium Dissimilar Joining." Solid State Phenomena 135 (February 2008): 135–38. http://dx.doi.org/10.4028/www.scientific.net/ssp.135.135.

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In this study, joining characteristics of dissimilar Ti and Cu metals have been investigated, when using both an Ag-based eutectic alloy as a filler and an Ag layer present on Ti base metal as a diffusion barrier. The observed microstructures were classified into three characteristic types, depending on the presence of a Ag layer at the Ti interface, e.g. first, the sample retaining thick continuous intermetallic layers, e.g. Ti2Cu, TiCu, Ti3Cu4, Ti2Cu3, and TiCu4 by a significant dissolution of the Ti atoms into the molten filler, in the absence of a Ag coating layer onto the Ti base metal, s
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18

Tsukamoto, Hideaki, Zhi Gang Dong, Han Huang, Tetsura Nishimura, and Kazuhiro Nogita. "Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface." Materials Science Forum 654-656 (June 2010): 2446–49. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.2446.

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The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/ Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)6Sn5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the
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19

Ab Ghani, Noor Asikin, Iziana Yahya, Mohd Arif Anuar Mohd Salleh, Shamsuddin Saidatulakmar, Zainal Arifin Ahmad, and Ramani Mayappan. "Microstructure Evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu System Lead Free Solder under Long Term Thermal Aging." Advanced Materials Research 620 (December 2012): 263–67. http://dx.doi.org/10.4028/www.scientific.net/amr.620.263.

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Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was considered the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. In this study, the effect of 0.5wt% Ni addition on the microstructure of the Sn-3.5Ag-1.0Cu solder was investigated. The solder was synthesized via powder metallurgy route which includes blending, compacting and sintering. The solders were characterized for i
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20

Boyarchenko, O. D., S. G. Vadchenko, N. V. Sachkova, and A. E. Sytschev. "SHS Joining Via Combustion of Ti-Containing Systems." Eurasian Chemico-Technological Journal 15, no. 2 (2013): 95. http://dx.doi.org/10.18321/ectj145.

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The joining of intermetallic parts to the metals (Ti, Al, Cu, Ni) or different intermetallics (e.g. NiAl, TiAl) is important for high-temperature applications. Traditional fusion welding is difficult to apply due to the large thermal expansion mismatch between the intermetallics to be joined and the filler material.<br />Brazing and diffusion bonding are also inefficient, energy-consuming, and must be carried out in vacuum or protective atmosphere. Meanwhile, Self-propagating High-temperature Synthesis (SHS) that is widely used for production of powders, compact materials and parts holds
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21

Mayappan, Ramani, and Iziana Yahya. "The Effect of Zn addition on the Intermetallic Formation and Joint Strength of Sn-3.5Ag-1.0Cu Lead-free." Scientific Research Journal 22, no. 1 (2025): 1–17. https://doi.org/10.24191/srj.v22i1.15637.

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The need to replace lead-based solders has received considerable attention among researchers because of their toxicity. The Sn-Ag-Cu family is the most promising candidate. However, these solder systems require some improvement in terms of their performances in terms of mechanical properties. In this study, Sn-3.5Ag-1.0Cu solder was investigated with the addition of 0.1, 0.4 and 0.7 wt.% Zn. The solder was prepared using a powder metallurgy method to form the discs. An intermetallic compound study was conducted by melting a solder disc on a Cu substrate at 250 oC for 1 min. For the shear stren
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22

Zhu, Yandan, Mufu Yan, and Quanli Zhang. "Microstructure Formation and Mechanical Properties of Multi-Phase Coating by Thermos Plasma Nitriding of Gradient Cu-Ti Films on C61900 Cu Alloy." Applied Sciences 11, no. 22 (2021): 10843. http://dx.doi.org/10.3390/app112210843.

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To improve the processing efficiency and the surface properties of C61900 Cu alloy, a gradient Cu-Ti film with a Ti/Cu atom ratio of 7:1, 7:4, and 1:2 was pre-fabricated by the unbalanced magnetron sputtering process and then nitrided by thermos plasma nitriding. The phase structure, elemental composition, and morphology of the modified surface were characterized, and the mechanical properties, including the wear resistance and adhesion properties, were examined. Combining calculation by the first principle method with thermodynamic analysis, the microstructural formation and phase composition
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23

Osório, Wislei R., Celia M. Freire, Rubens Caram, and Amauri Garcia. "The role of Cu-based intermetallics on the pitting corrosion behavior of Sn–Cu, Ti–Cu and Al–Cu alloys." Electrochimica Acta 77 (August 2012): 189–97. http://dx.doi.org/10.1016/j.electacta.2012.05.106.

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24

Martin, S., A. Winkelmann, and A. Leineweber. "Revisiting the phase transformations involving Cu6Sn5 intermetallic: resolving local domain structures induced by ordering." IOP Conference Series: Materials Science and Engineering 1249, no. 1 (2022): 012014. http://dx.doi.org/10.1088/1757-899x/1249/1/012014.

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Abstract Cu6Sn5 is one of the most important intermetallics present in solder joints based on Cu and Sn. Due to still uncertain reasons for failure of these joints, detailed microstructural research can help to figure out the underlying mechanisms. For Cu- and as well for Sn-rich environments of the Cu6Sn5 the microstructural occurrence of the phase transformations are investigated. During the formation of stable η′ from the disordered high temperature η phase the formation of metastable modulated incommensurately ordered η′′ takes place. For the copper rich samples long-range ordering and twi
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25

Nascimento, Maurício Silva, Givanildo Alves dos Santos, Rogério Teram, Vinícius Torres dos Santos, Márcio Rodrigues da Silva, and Antonio Augusto Couto. "Effects of Thermal Variables of Solidification on the Microstructure, Hardness, and Microhardness of Cu-Al-Ni-Fe Alloys." Materials 12, no. 8 (2019): 1267. http://dx.doi.org/10.3390/ma12081267.

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Aluminum bronze is a complex group of copper-based alloys that may include up to 14% aluminum, but lower amounts of nickel and iron are also added, as they differently affect alloy characteristics such as strength, ductility, and corrosion resistance. The phase transformations of nickel aluminum–bronze alloys have been the subject of many studies due to the formations of intermetallics promoted by slow cooling. In the present investigation, quaternary systems of aluminum bronze alloys, specifically Cu–10wt%Al–5wt%Ni–5wt%Fe (hypoeutectoid bronze) and Cu–14wt%Al–5wt%Ni–5wi%Fe (hypereutectoid bro
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26

Pandya, Shailesh N., and Jyoti Menghani. "A preliminary investigation on microstructure and mechanical properties of dissimilar Al to Cu friction stir welds prepared using silver interlayer." Metallurgical and Materials Engineering 24, no. 1 (2018): 45–57. http://dx.doi.org/10.30544/294.

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Due to its solid-state nature, friction stir welding (FSW) process can be considered a better alternative for dissimilar welding metals. However, like fusion welding techniques, in friction stir welding growth of thick layers of brittle intermetallics - Cu9Al4 and CuAl2 is a significant issue. One solution to this problem is the use of the suitable interlayer material. Use of interlayer material modifies the joint microstructure with the replacement of thick, brittle intermetallics by more ductile intermetallics in a thin layer or particle form. The present study is a preliminary investigation
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27

Kaiser, Samiul, та Mohammad Salim Kaiser. "IMPACT OF COLD PLASTIC DEFORMATION AND THERMAL POST-TREATMENT ON THE PHYSICAL PROPERTIES OF COPPER BASED ALLOYS Al-BRONZE AND α-BRASS". Acta Metallurgica Slovaca 27, № 3 (2021): 114–21. http://dx.doi.org/10.36547/ams.27.3.951.

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The copper based alloys Al-bronze and α-brass containing each of 10wt% aluminum and zinc were prepared by casting. Afterwards, the specimens were cold-rolled with various percentages of deformation and the cold-rolled samples were aged subsequently at the varied time for four hours and temperatures ranging up to 500°C. Samples underwent characterizations by microhardness testing, electrical resistivity, optical properties, differential scanning calorimetry as well as microstructure analysis using an optical microscope. The results showed that the hardening of Cu-based alloys was taken place du
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28

Lee, Unhae, and Jae Wung Bae. "Microstructural Changes and Mechanical Properties of Precipitation-Strengthened Medium-Entropy Fe71.25(CoCrMnNi)23.75Cu3Al2 Maraging Alloy." Materials 16, no. 9 (2023): 3589. http://dx.doi.org/10.3390/ma16093589.

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Metal alloys with enhanced mechanical properties are in considerable demand in various industries. Thus, this study focused on the development of nanosized precipitates in Fe71.25(CoCrMnNi)23.75Cu3Al2 maraging medium-entropy alloy (MEA). The Fe-based alloying design in the MEA samples initially formed a body-centered cubic (BCC) lath martensite structure. After a subsequent annealing process at 450 °C for varying durations (1, 3, 5, and 7 h), nanosized precipitates (B2 intermetallic) enriched with Cu and with a diameter of approximately 5 nm formed, significantly increasing the hardness of the
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29

Simões, Sónia, Carlos Tavares та Aníbal Guedes. "Joining of γ-TiAl Alloy to Ni-Based Superalloy Using Ag-Cu Sputtered Coated Ti Brazing Filler Foil". Metals 8, № 9 (2018): 723. http://dx.doi.org/10.3390/met8090723.

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Joining γ-TiAl alloy to Ni-based superalloy Hastelloy using Ag-Cu sputtered coated Ti foil as brazing filler was investigated in this study. Brazing experiments were performed at 900, 950, and 980 °C with a dwelling stage of 10 min in vacuum. The microstructure and the chemical composition of the resulting interfaces were analyzed by scanning electron microscopy (SEM) and by energy dispersive X-ray spectroscopy (EDS), respectively. Sound joints were produced after brazing at 980 °C, presenting a multilayered interface, consisting mainly of Ti-Al and Ti-Ni-Al intermetallics close to the γ-TiAl
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30

Hernandez-Sandoval, J., A. M. Samuel, S. Valtierra, and F. H. Samuel. "Ni- and Zr-Based Intermetallics in Al–Si–Cu–Mg Cast Alloys." Metallography, Microstructure, and Analysis 3, no. 5 (2014): 408–20. http://dx.doi.org/10.1007/s13632-014-0164-2.

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31

Belin-Ferré, Esther, and Jean Marie Dubois. "Wetting of aluminium-based complex metallic alloys." International Journal of Materials Research 97, no. 7 (2006): 985–95. http://dx.doi.org/10.1515/ijmr-2006-0156.

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Abstract Many complex metallic alloys are known to form in aluminium-based systems containing transition metals like Cu, Pd, Fe or Cr, the most famous one being the stable icosahedral quasicrystal discovered in the Al –Cu –Fe system. Although covered by a thin native oxide layer, adhesion of water onto the complex compounds is very different from that onto the oxide or onto oxidised aluminium. We show here how this atypical behaviour is related to the structural complexity of the compound. We then produce data that allows us to estimate the actual surface energy of the same compounds, a proper
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32

SINGH, R. P., R. K. SINGH, SHALU, and M. RAJAGOPALAN. "FIRST-PRINCIPLE STUDY ON STRUCTURAL, ELASTIC AND ELECTRONIC PROPERTIES OF BINARY RARE EARTH INTERMETALLIC COMPOUNDS: GdCu AND GdZn." International Journal of Computational Materials Science and Engineering 01, no. 01 (2012): 1250005. http://dx.doi.org/10.1142/s2047684112500054.

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First principle study on structural, elastic and electronic properties of binary copper and zinc based rare earth intermetallics have been carried out using the full-potential augmented plane waves plus local orbital (APW+ lo) within density functional theory (DFT). Results on elastic properties are obtained using generalized gradient approximation (GGA) for exchange correlation potentials. The equilibrium lattice parameter, bulk modulus and its pressure derivative have been obtained using optimization method. Young's modulus, shear modulus, Poisson ratio, sound velocities for longitudinal and
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33

Vuksanovic, D., V. Asanovic, J. Scepanovic, and D. Radonjic. "Effect of chemical composition and T6 heat treatment on the mechanical properties and fracture behaviour of Al-Si alloys for IC engine components." Journal of Mining and Metallurgy, Section B: Metallurgy 57, no. 2 (2021): 195–207. http://dx.doi.org/10.2298/jmmb190510014v.

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The microstructural examinations of Al-Si alloys intended to manufacture IC engine components revealed a complex phase composition in all the samples. The polyhedral crystals of primary silicon were detected in the Al-12.5Si alloy, besides the ?-Al phase, eutectic silicon, and several intermetallic phases, identified in the cast samples of both alloys. Better tensile properties were found for the samples of Al-11Si. A predominantly intercrystalline fracture with features of ductile failure was observed in both alloys. In as-cast specimens of the Al-11Si alloy, the cracks were formed by the dec
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34

Mali, Vjacheslav I., Iuliia N. Maliutina, and K. A. Skorokhod. "Microstructure and Strength of Explosively Welded Titanium/Ni-Based Alloy Composite with Cu/Ta as Interlayer." Applied Mechanics and Materials 682 (October 2014): 21–24. http://dx.doi.org/10.4028/www.scientific.net/amm.682.21.

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In current research composite copper/tantalum were used as interlayer for explosive welding of titanium and Ni-based alloy sheets. Defects such as cracks coupled with brittle intermetallics compounds were not detected at the interface of dissimilar materials by metallographic analysis. Strength test of obtained composite material reveals growth of yield strength in 2 times in comparison with Ni-based alloy.
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35

Xu, Hongyan, Yaochun Shen, Yihua Hu, Jianqiang Li, and Ju Xu. "Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature application." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (2019): 000075–84. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000075.

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Abstract A highly reliable three-dimensional network structure joint was fabricated based on Cu@Ni@Sn core-shell powder and transient liquid phase bonding (TLPB) technology for high temperature application. Cu@Ni@Sn joint is characterized by Cu metal particles embedded in the matrix of (Cu,Ni)6Sn5/Ni3Sn4 intermetallics (IMCs), low level of voiding is achieved, they can be reflowed at a low temperatures (<260°C), but reliably working at high temperature up to 415°C. Cu@Ni@Sn double-layer microparticles with different Sn layer and Ni layer thickness were fabricated and compressed as prefo
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36

Liu, Qianli, Hao Zhang, Peng Jiang та Yifan Lv. "The Alloying Strategy to Tailor the Mechanical Properties of θ-Al13Fe4 Phase in Al-Mg-Fe Alloy by First-Principles Calculations". Metals 12, № 12 (2022): 1999. http://dx.doi.org/10.3390/met12121999.

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As an important strengthening phase in Al-Mg-Fe alloy, the elastic and ductile–brittle characteristics of Al13Fe4 intermetallics hold prime significance in ascertaining the mechanical properties and potential application of Al-Mg-Fe alloys. In this study, multialloying of Co, Cu, Cr, Mn, and Ni has been adopted for tuning the mechanical characteristics of the Al13Fe4 phase; their effects on mechanical features and electronic structure of the Al13Fe4 phase have been scrutinized systematically by first-principles calculations employing the density functional theory. The replacement of Fe with M
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37

Zhu, Yandan, Zecheng Li, Hongchao Bi, Qilong Shi, Yujun Han, and Quanli Zhang. "Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion." Materials 15, no. 22 (2022): 8002. http://dx.doi.org/10.3390/ma15228002.

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To improve the wear resistance and fatigue life of Cu alloys, surface modification by combining the magnetron sputtering of Ti film followed by vacuum thermal diffusion is always applied, where the structure and composition of the fabricated film play a determinant role on the mechanical properties. In the present work, the evolution of the layered structure and the element distribution of the formed multi-phases coating on C17200 Cu alloy are investigated by mathematical calculation based on Fick’s law, and the experimental verification by the thermal diffusion of the gradient Cu-Ti film was
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38

Mohamed, Adel M. A., Ehab Samuel, Yasser Zedan, Agnes M. Samuel, Herbert W. Doty, and Fawzy H. Samuel. "Intermetallics Formation during Solidification of Al-Si-Cu-Mg Cast Alloys." Materials 15, no. 4 (2022): 1335. http://dx.doi.org/10.3390/ma15041335.

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The present study was undertaken to examine the effect of iron, manganese, copper and magnesium on the microstructural characteristics of Al-11%Si-2%Cu-Mg-based alloy referred to as 396 under different working conditions. The results show that strontium (Sr) has high affinity to react with magnesium (Mg), resulting in reduced effectiveness as eutectic silicon modifier or age hardening agent. In addition, Sr alters the sequence of the precipitation of the α-AlFeMnSi phase from post-eutectic to pro-eutectic which would harden the soft α-Aluminum matrix. The mechanism is still under investigation
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39

Chu, Qiaoling, Min Zhang, Jihong Li, Qingyang Fan, Weiwei Xie, and Zongyue Bi. "Intermetallics in CP-Ti/X65 bimetallic sheets filled with Cu-based flux-cored wires." Materials & Design 90 (January 2016): 299–306. http://dx.doi.org/10.1016/j.matdes.2015.10.136.

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40

Samuel, A. M., E. M. Elgallad, M. G. Mahmoud, H. W. Doty, S. Valtierra, and F. H. Samuel. "Rare Earth Metal-Based Intermetallics Formation in Al–Cu–Mg and Al–Si–Cu–Mg Alloys: A Metallographic Study." Advances in Materials Science and Engineering 2018 (2018): 1–15. http://dx.doi.org/10.1155/2018/7607465.

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This study was conducted on Al–Cu–Mg and Al–Si–Cu–Mg alloys containing either 5%La or 5%Ce. Two levels of Ti addition were examined, i.e., 0.05% and 0.15%. Thermal analysis was the only technique used to obtain castings, from which samples were then sectioned for metallographic examination. Based on the results obtained, the following points may be highlighted. Addition of a fairly large amount of RE metals (La or Ce) leads to the appearance of several peaks in the solidification curve between the precipitation of the primary α-Al phase and the (Al–Al2Cu) eutectic reaction. Although a signific
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41

Shcheretskyi, O. A., A. M. Verkhovliuk, and D. S. Kanibolotsky. "Thermodynamic analysis of aluminium-based sacrificial anode alloys phase composition." Metaloznavstvo ta obrobka metalìv 101, no. 1 (2022): 3–14. http://dx.doi.org/10.15407/mom2022.01.003.

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Literature review on magnesium, zinc and aluminum-based sacrificial anode alloys chemical and phase compositions have been performed. Technological phase diagrams of aluminum-based sacrificial anode alloys with different content of harmful additives, such as iron, silicon and copper, have been calculated and constructed. It is determined that the harmful effect of iron is in faster dissolution of the anode due to large inclusions of iron intermetallic. This iron negative effect can be eliminated in several ways: a) maximization of the melt cooling rate, which will lead to significant grinding
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42

Tupaj, Mirosław, Antoni Władysław Orłowicz, Marek Mróz, Andrzej Trytek, Anna Janina Dolata, and Andrzej Dziedzic. "A Study on Material Properties of Intermetallic Phases in a Multicomponent Hypereutectic Al-Si Alloy with the Use of Nanoindentation Testing." Materials 13, no. 24 (2020): 5612. http://dx.doi.org/10.3390/ma13245612.

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The paper concerns modeling the microstructure of a hypereutectic aluminum-silicon alloy developed by the authors with the purpose of application for automobile cylinder liners showing high resistance to abrasive wear at least equal to that of cast-iron liners. With the use of the nanoindentation method, material properties of intermetallic phases and matrix in a hypereutectic Al-Si alloy containing Mn, Cu, Cr, Ni, V, Fe, and Mg as additives were examined. The scanning electron microscope equipped with an adapter for chemical composition microanalysis was used to determine the chemical composi
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43

Yang, Li, and Na Zhang. "Effect of Metal Particles on Spreading Properties of Sn0.7Cu Based Composite Solder." Advanced Materials Research 152-153 (October 2010): 1759–62. http://dx.doi.org/10.4028/www.scientific.net/amr.152-153.1759.

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The particle-reinforced composite solder is prepared by adding 1 μm Ag, 1 μm Ni and 8 μm Cu into Sn0.7Cu eutectic solder which serve as the base material in current research. The formation of a thin layer of intermetallics around the particle-reinforced will promote the closer integration between base-solder and particle-reinforced, and thus form the particle-reinforced composite solder. The appropriate reinforcement particles were selected and the effects of reinforcement particles on physical properties, mechanical properties and solderability of the composite solder were studied. The spread
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44

Morozov, A., A. B. Freidin, V. A. Klinkov, A. V. Semencha, W. H. Müller, and T. Hauck. "Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects." Journal of Electronic Materials 49, no. 12 (2020): 7194–210. http://dx.doi.org/10.1007/s11664-020-08433-y.

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AbstractIn this paper, the growth of intermetallic compound (IMC) layers is considered. After soldering, an IMC layer appears and establishes a mechanical contact between eutectic tin-silver solder bumps and Cu interconnects in microelectronic components. Intermetallics are relatively brittle in comparison with copper and tin. In addition, IMC formation is typically based on multi-component diffusion, which may include vacancy migration leading to Kirkendall voiding. Consequently, the rate of IMC growth has a strong implication on solder joint reliability. Experiments show that the intermetall
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45

Grigoreva, T. F., S. A. Kovaleva, V. I. Kvashnin, et al. "Tin Bronze Reinforced with Cu9Al4 Particles: Mechanochemical Synthesis and Consolidation by Sintering under Pressure." Физика металлов и металловедение 124, no. 1 (2023): 61–67. http://dx.doi.org/10.31857/s0015323022600666.

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X-ray diffraction analysis and optical and electron microscopy have been used to study the effect of mechanical activation conditions of the Cu–12% Sn mixture with different Cu9Al4 modifier contents on the structure and phase composition and morphology of formed composites. The mechanochemical intro-duction of 10 wt % of the modifying additive into the matrix of mechanically synthesized tin bronze mainly results in the formation of a ternary Al0.05Cu0.9Sn0.05 solid solution of aluminum and tin in copper. In the case of the 20 wt % modifying additive, the final product contains a Cu0.9Sn0.1 tin
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46

Gao, Feng, Hiroshi Nishikawa, and Tadashi Takemoto. "Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish." Journal of Electronic Materials 36, no. 12 (2007): 1630–34. http://dx.doi.org/10.1007/s11664-007-0243-0.

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47

Samuel, Ehab, Agnes M. Samuel, Victor Songmene, Herbert W. Doty, and Fawzy H. Samuel. "Analysis of Ni-Cu Interaction in Aluminum-Based Alloys: Hardness, Tensile and Precipitation Behavior." Materials 17, no. 18 (2024): 4676. http://dx.doi.org/10.3390/ma17184676.

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The present work was aimed at quantifying the effects of Ni addition in the range of 0–4% together with 0.3%Zr on the hardness and the tensile properties, volume fraction of intermetallics, and changes in size and distribution of phase precipitation in Sr-modified Al-9%Si-2%Cu-0.6%Mg cast alloys. The study was mainly carried out using high-resolution FESEM and TEM microscopes equipped with EDS facilities. Samples were solidified at the rate of ~3 °C/s and examined at different aging conditions. The investigations are supported by thermal analysis carried out at a solidification rate of ~0.8 °C
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48

Lee, Han-Young. "The Effect of Ball-milling Energy on Combustion Synthesis Coating of Cu-Al-Ni Based Intermetallics." Journal of the Korean Society of Tribologists and Lubrication Engineers 27, no. 1 (2011): 1–6. http://dx.doi.org/10.9725/kstle.2011.27.1.001.

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49

Al-Shammary, A. F. Y., I. T. Caga, A. Y. Tata, J. M. Winterbottom, and I. R. Harris. "Zirconium-based intermetallics as heterogeneous catalysts for the fischer-tropsch reaction: II. Zr-Ni-Cu catalysts." Journal of Chemical Technology & Biotechnology 55, no. 4 (2007): 369–74. http://dx.doi.org/10.1002/jctb.280550411.

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50

Wernicke, Tobias, Bernhard Rebhan, Vesa Vuorinen, et al. "Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration." ECS Meeting Abstracts MA2023-02, no. 33 (2023): 1619. http://dx.doi.org/10.1149/ma2023-02331619mtgabs.

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The low temperature metal bonding processes (<200°C) are attractive methods for novel applications in 3D packaging with simultaneous formation of electrical interconnections and hermetic encapsulation for microelectromechanical systems. Metal wafer bonding is a generic category of processes consisting of various sub-categories, each one defined by the different principles governing the process. One can differentiate between eutectic wafer bonding (a eutectic bonding layer is formed during process by liquid-solid interdiffusion), intermetallic bonding (an intermetallic alloy is formed as bon
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