Relevant bibliographies by topics / Cu-Si systems / Dissertations / Theses
To see the other types of publications on this topic, follow the link: Cu-Si systems.

Dissertations / Theses on the topic 'Cu-Si systems'

Author: Grafiati
Published: 6 September 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 19 dissertations / theses for your research on the topic 'Cu-Si systems.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse dissertations / theses on a wide variety of disciplines and organise your bibliography correctly.

1

Zhang, Duyao. "Thermodynamic characterisation of semi-solid processability in alloys based on Al-Si, Al-Cu and Al-Mg binary systems." Thesis, University of Leicester, 2015. http://hdl.handle.net/2381/32538.

Full text
Abstract:
The processing window is important for the semisolid processability of alloys. Applications of semi-solid metal (SSM) processing, especially aluminium alloys have been expanding for their excellent mechanical properties. However, the alloys well suited and commercially used for SSM processing today are limited in types. The main purpose of this Ph.D. project is to understand what makes an alloy suitable for SSM processing on both aspects of thermodynamics and kinetics. This research started with a fundamental study of binary alloys based on Al-Si, Al-Cu and Al-Mg systems (wt%): Al-1Si, Al-5Si,
APA, Harvard, Vancouver, ISO, and other styles
2

Bayerl, Dominik Verfasser], Rainer [Gutachter] [Schmid-Fetzer, and Babette [Gutachter] Tonn. "Beitrag zur Etablierung der Kinetik-Simulation zur Legierungs- und Prozessoptimierung ausscheidungshärtender Werkstoffe am Beispiel des Cu-Co-Ni-Si Systems / Dominik Bayerl ; Gutachter: Rainer Schmid-Fetzer, Babette Tonn." Clausthal-Zellerfeld : Technische Universität Clausthal, 2018. http://d-nb.info/1231363959/34.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Reshöft, Klaus. "Zeitaufgelöste STM-Untersuchungen zur Silizid- und Metall-Epitaxie der Systeme Fe-, Cu-, Pt-Si(111) und Cu-W(110)." [S.l. : s.n.], 2001. http://e-diss.uni-kiel.de/diss>=/d525.pdf.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Banda, Wezi. "High temperature phase equilibria in the Fe-Co-Cu-Si system pertinent to slag cleaning." Thesis, Link to the online version, 2006. http://hdl.handle.net/10019.1/1351.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Kovarik, Libor. "Microstructural study and modeling of metastable phases and their effect on strenghthening [sic] in Al-Mg-Cu-Si alloying system." The Ohio State University, 2006. http://rave.ohiolink.edu/etdc/view?acc_num=osu1149006665.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Yen, I.-Shan, and 顏意珊. "Interfacial reactions of Au/Cu/Si and Ta/Cu/Si systems." Thesis, 1994. http://ndltd.ncl.edu.tw/handle/79442262924381827660.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Liu, Lian. "μSR Study of B20 Magnetic Systems: MnSi, Mn₀.₉Fe₀.₁Si and Cu₂OSeO₃". Thesis, 2016. https://doi.org/10.7916/D82F7ND1.

Full text
Abstract:
A skyrmion is a vortex-like spin pattern which has been observed in so-called B20 magnetic systems such as MnSi, (Mn,Fe)Si and a few other metallic magnets as well as in insulating Cu₂OSeO₃. We conduct a comprehensive study of muon spin relaxation (μSR) on bulk single crystals of MnSi and (Mn,Fe)Si, a MBE thin film of MnSi, and a ceramic specimen of Cu₂OSeO₃ in this work. The generic second-order like phase transition indicated by 1/T₁ peaks at T_c in bulk systems is discussed in light of the Brazovskii-type first-order phase transition due to the presence of the DM interaction. We also discus
APA, Harvard, Vancouver, ISO, and other styles
8

Somaiah, Nalla. "Mass Transport in Cu-Interlayer-Si Systems under Various Thermo-Electro-Mechanical Excursions." Thesis, 2018. https://etd.iisc.ac.in/handle/2005/4946.

Full text
Abstract:
This work falls in general area of the electro-thermo-mechanical driven mass transport in Cu-Si systems, which often finds relevance while accessing reliability issues pertaining to thin film interconnects in microelectronic devices. In such a system, the major driving forces are electric potential gradient (and hence electromigration), current crowding induced temperature gradient (and hence thermomigration) and coefficient of thermal expansion (CTE) mismatch induced stresses. Herein, a coupling between different driving forces, such as electromigration and thermomigration, may also occur, wh
APA, Harvard, Vancouver, ISO, and other styles
9

Wang, Hong-I., and 王弘毅. "Reliability of Cu/SiO2/Si system." Thesis, 1995. http://ndltd.ncl.edu.tw/handle/63741354802081463183.

Full text
Abstract:
碩士<br>國立交通大學<br>電子研究所<br>83<br>Thermal stability of the Cu/SiO2/Si system was investigated with respect to the dielectric degradation and Cu ion migration in the Cu-gate MOS capacitor. We used the rapid thermal annealing (RTA) and the technique of bias-temperature stress in conjunction with the dielectric breakdown field (Ebd) and SiO2/ Si interface state density (Dit) measurements to characterize the thermal stability of the Cu/SiO2/Si system. We found that the Ebd degradation started to o
APA, Harvard, Vancouver, ISO, and other styles
10

Mitrasinovic, Aleksandar. "Characterization of the Cu-Si System and Utilization of Metallurgical Techniques in Silicon Refining for Solar Cell Applications." Thesis, 2010. http://hdl.handle.net/1807/26210.

Full text
Abstract:
Two methods for refining metallurgical grade silicon to solar grade silicon have been investigated. The first method involved the reduction of impurities from metallurgical grade silicon by high temperature vacuum refining. The concentrations of analyzed elements were reduced several times. The main steps in the second refining method include alloying with copper, solidification, grinding and heavy media separation. A metallographic study of the Si-Cu alloy showed the presence of only two microconstituents, mainly pure silicon dendrites and the Cu3Si intermetallic. SEM analysis showed a d
APA, Harvard, Vancouver, ISO, and other styles
11

Fang, Gu, and 方谷. "Phase Equilibria of the Sn-Ni-Si Ternary System and Sn-(Cu)/Ni-Si Interfacial Reactions." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/28636815640799973263.

Full text
Abstract:
碩士<br>中原大學<br>化學工程研究所<br>101<br>Flip chip packaging is the most important electronic packaging technology nowadays. Of all the under bump metallurgy layers, the diffusion barrier layer is the most critical. This thesis investigates the interfacial reactions between the lead-free solders and the Ni-Si alloy as the reference of the reliability assessments of lead-free solders/Ni-Si soldering joints. Ni is the commonly used diffusion barrier layer material, and the Si addition is to eliminate the ferromagnetism of Ni. The phase equilibria of the Sn-Ni-Si ternary system at 250℃ are determined expe
APA, Harvard, Vancouver, ISO, and other styles
12

林宏哲. "Ternary amorphous thin films as diffusion barriers and thermodynamic calculation in Cu-Si-O system for Cu metallization." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/99597762216240693717.

Full text
APA, Harvard, Vancouver, ISO, and other styles
13

Wu, Wei-Ding, and 吳威鼎. "Deposition of Cu thin film on SiO2/Si substrate by ionized metal plasma system." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/41469566385190781605.

Full text
Abstract:
碩士<br>國立清華大學<br>工程與系統科學系<br>90<br>Abstract This research investigated the relationship between the plasma state and the properties of Cu thin films deposited on 6000 Å SiO2/ n-type Si and 400 Å TaN/ 5000 Å SiO2/ n-type Si by ionized metal plasma system (IMP). The Langmuir probe is used to determine the plasma density, plasma potential, electron temperature for characterizing the plasma state. Field emission gun scanning electron microscopy (FEG-SEM) was used to observe the cross-sectional microstructure and determine the film thickness. The roughness and surface morphology of c
APA, Harvard, Vancouver, ISO, and other styles
14

Fu-Sheng, Shiu, and 許富聖. "Investigations of physical properties of semiconductor/metal interfaces for a Si/Cu(111) system." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/64410664369071456983.

Full text
Abstract:
碩士<br>東海大學<br>物理學系<br>92<br>Growth and annealing effects of Si/Cu(111) ultrathin films have been studied using Auger electron spectroscopy under ultrahigh vacuum environment. As deposited at ambient temperature, the kinetic energy of Si L3M23M23 and Cu L3M45M45 Auger electrons shifts to a lower value. Systematic investigations on the annealing effects of Si/Cu(111) system show that the interdiffusion occurs at 425 K and is nearly complete at temperatures above 475 K. A restoration of the Auger peak positions upon annealing treatment was observed. These phenomena could be explained by the elect
APA, Harvard, Vancouver, ISO, and other styles
15

Sarkar, Suman. "Development of New High Strength Alloy in Cu-Fe-Si System through Rapid Solidification." Thesis, 2016. http://etd.iisc.ac.in/handle/2005/3153.

Full text
Abstract:
Copper based alloys play important role in high heat flux applications, particularly in rocket technology, the liner of the combustion chamber, and also in other heat transfer vessels. In these applications, one needs excellent high-temperature strength without sacrificing the thermal conductivity significantly. However, it is a challenging and difficult task to significantly improve the balance between strength and conductivities (electrical and thermal) of Cu-based alloys. In general, microstructural attributes, responsible for increasing mechanical strength of the alloy, also affect the tra
APA, Harvard, Vancouver, ISO, and other styles
16

Sarkar, Suman. "Development of New High Strength Alloy in Cu-Fe-Si System through Rapid Solidification." Thesis, 2016. http://hdl.handle.net/2005/3153.

Full text
Abstract:
Copper based alloys play important role in high heat flux applications, particularly in rocket technology, the liner of the combustion chamber, and also in other heat transfer vessels. In these applications, one needs excellent high-temperature strength without sacrificing the thermal conductivity significantly. However, it is a challenging and difficult task to significantly improve the balance between strength and conductivities (electrical and thermal) of Cu-based alloys. In general, microstructural attributes, responsible for increasing mechanical strength of the alloy, also affect the tra
APA, Harvard, Vancouver, ISO, and other styles
17

HUNG, YU-TA, and 洪育德. "A Study on the Cu-Ni-Al-Co-Cr-Fe-Si-Ti Multicomponent Alloy System." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/93136719843618539420.

Full text
APA, Harvard, Vancouver, ISO, and other styles
18

Reshöft, Klaus [Verfasser]. "Zeitaufgelöste STM-Untersuchungen zur Silizid- und Metall-Epitaxie der Systeme Fe-, Cu-, Pt-Si(111) und Cu-W(110) / vorgelegt von Klaus Reshöft." 2001. http://d-nb.info/972153640/34.

Full text
APA, Harvard, Vancouver, ISO, and other styles
19

Meunier, Anthony. "EPITAXIE DE SYSTEMES METALLIQUES SUR Si(001) : Croissance du cuivre et structures à anisotropie magnétique perpendiculaire (Cu/Ni et FePd)." Phd thesis, 2005. http://tel.archives-ouvertes.fr/tel-00238555.

Full text
Abstract:
L'objet de ce rapport est l'étude de la croissance épitaxiale de systèmes métalliques sur Si(001). Nous présentons dans un premier temps une étude de la croissance du cuivre à température ambiante en s'appuyant sur un grand nombre de techniques de caractérisation : RHEED, AES, TEM, GIXRD. Pour la première fois nous mettons en évidence l'effet de l'hydrogénation de la surface du silicium et sa nécessité pour la croissance épitaxiale du cuivre. L'hydrogénation en inhibant l'interdiffusion conduit à la formation contrôlée d'une couche épitaxiée quasi continue de siliciure de 2 nm d'épaisseur. La
APA, Harvard, Vancouver, ISO, and other styles
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography