Log in

Relevant bibliographies by topics / Cu-Sn Alloy

Contents

Dissertations / Theses

Academic literature on the topic 'Cu-Sn Alloy'

Author: Grafiati

Published: 6 September 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Cu-Sn Alloy.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Dissertations / Theses on the topic "Cu-Sn Alloy"

1

Ghosh, Swatilekha. "Electrodeposition of Cu, Sn and Cu-Sn alloy from choline chloride ionic liquid." Thesis, University of Newcastle upon Tyne, 2013. http://hdl.handle.net/10443/2279.

Full text

Abstract:

Copper, tin and their alloy deposits are popular for its various applications in industrial aspects like enhance corrosion resistance and provide decorative finish. This work concentrated on the fabrication of these coatings, accomplished by electrodeposition technique which allows the control of thickness and microstructure of the films. Previously these metals and alloy were electrodeposited from different aqueous electrolytes. However these baths suffer from various environmental issues and deposits suffers from H evolution and metal oxide formation. As a result solution 2 ionic liquid (IL)

APA, Harvard, Vancouver, ISO, and other styles

2

Caris, Joshua. "Heat Treatment Effects on Mechanical Behavior of Cu-15Ni-8Sn Produced via Powder Metallurgy." Case Western Reserve University School of Graduate Studies / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=case1184360740.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Cooper, Shellene. "Creep behaviour of the ternary lead-free solder alloy, Sn-3.8wt.%Ag-0.7wt.%Cu." Thesis, Open University, 2002. http://oro.open.ac.uk/54417/.

Full text

Abstract:

Electronic equipment is facing the challenge of both miniaturisation and the need to replace lead in interconnections. In service, interconnections generally fail by thermomechanical fatigue, and this behaviour is strongly affected by the creep process. This thesis examines the creep behaviour of a popular lead-free replacement alloy, Sn-3.8wt.%Ag-0.7wt%Cu (Sn-Ag-Cu), in joint and bulk form. Experimental work involved the determination of the creep properties of this alloy at various temperatures, over a range of stresses. Over the regions tested, the creep behaviour is best described by the N

APA, Harvard, Vancouver, ISO, and other styles

4

Horsley, Robert Michael. "Microstructural characterisation of solder joints using the Sn-Ag-Cu eutectic alloy in a no-clean surface mount technology (SMT) assembly process." Thesis, University of Salford, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.272696.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Benedict, Michael Scott. "Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints." Diss., Online access via UMI:, 2007.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

6

Yassin, Amal M. "Creep microstructure relationships in Sn-Sb and Sn-Sb-Cu alloys." Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/1182.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Pewnim, Naray. "Electrodeposition of Cu-Sn alloys from methanesulfonate electrolytes." Thesis, University of Newcastle Upon Tyne, 2012. http://hdl.handle.net/10443/1790.

Full text

Abstract:

The most commonly used alloy in the electronics industry has been the ubiquitous tinlead alloy. As the demand for electronic devices continues to increase, there have been concerns about the continued use of lead and its long term environmental impact. In the last decade there has been a push to ban the use of lead in electronic products. Legislation from various governments around the world limiting the use of lead has given rise to the drive to find suitable lead-free alternatives. The aim of this research project was to establish a systematic approach for the selection of electrochemical pa

APA, Harvard, Vancouver, ISO, and other styles

8

Kent, Damon. "Age hardening of sintered Al-Cu-Mg-Si-Sn alloys /." St. Lucia, Qld, 2004. http://www.library.uq.edu.au/pdfserve.php?image=thesisabs/absthe17893.pdf.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

ISHII, HENRIQUE A. "Elaboracao de ligas Ag-Sn-Cu para amalgama dentario por moagem de alta energia." reponame:Repositório Institucional do IPEN, 2003. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11101.

Full text

Abstract:

Made available in DSpace on 2014-10-09T12:48:21Z (GMT). No. of bitstreams: 0<br>Made available in DSpace on 2014-10-09T13:57:22Z (GMT). No. of bitstreams: 1 08713.pdf: 6496941 bytes, checksum: 5803cb14028b4639afbb59fbc4cfa0d0 (MD5)<br>Tese (Doutoramento)<br>IPEN/T<br>Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP

APA, Harvard, Vancouver, ISO, and other styles

10

Picincu, Lucica. "The electrodeposition of Cu-Zn-Sn alloys from alkaline cyanide solutions." Thesis, University of Southampton, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.310845.

Full text

APA, Harvard, Vancouver, ISO, and other styles

More sources

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!