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Dissertations / Theses on the topic 'Cu-Sn Alloy'

Author: Grafiati

Published: 6 September 2023

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1

Ghosh, Swatilekha. "Electrodeposition of Cu, Sn and Cu-Sn alloy from choline chloride ionic liquid." Thesis, University of Newcastle upon Tyne, 2013. http://hdl.handle.net/10443/2279.

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Copper, tin and their alloy deposits are popular for its various applications in industrial aspects like enhance corrosion resistance and provide decorative finish. This work concentrated on the fabrication of these coatings, accomplished by electrodeposition technique which allows the control of thickness and microstructure of the films. Previously these metals and alloy were electrodeposited from different aqueous electrolytes. However these baths suffer from various environmental issues and deposits suffers from H evolution and metal oxide formation. As a result solution 2 ionic liquid (IL)

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2

Caris, Joshua. "Heat Treatment Effects on Mechanical Behavior of Cu-15Ni-8Sn Produced via Powder Metallurgy." Case Western Reserve University School of Graduate Studies / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=case1184360740.

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3

Cooper, Shellene. "Creep behaviour of the ternary lead-free solder alloy, Sn-3.8wt.%Ag-0.7wt.%Cu." Thesis, Open University, 2002. http://oro.open.ac.uk/54417/.

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Electronic equipment is facing the challenge of both miniaturisation and the need to replace lead in interconnections. In service, interconnections generally fail by thermomechanical fatigue, and this behaviour is strongly affected by the creep process. This thesis examines the creep behaviour of a popular lead-free replacement alloy, Sn-3.8wt.%Ag-0.7wt%Cu (Sn-Ag-Cu), in joint and bulk form. Experimental work involved the determination of the creep properties of this alloy at various temperatures, over a range of stresses. Over the regions tested, the creep behaviour is best described by the N

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4

Horsley, Robert Michael. "Microstructural characterisation of solder joints using the Sn-Ag-Cu eutectic alloy in a no-clean surface mount technology (SMT) assembly process." Thesis, University of Salford, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.272696.

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5

Benedict, Michael Scott. "Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints." Diss., Online access via UMI:, 2007.

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6

Yassin, Amal M. "Creep microstructure relationships in Sn-Sb and Sn-Sb-Cu alloys." Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/1182.

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7

Pewnim, Naray. "Electrodeposition of Cu-Sn alloys from methanesulfonate electrolytes." Thesis, University of Newcastle Upon Tyne, 2012. http://hdl.handle.net/10443/1790.

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The most commonly used alloy in the electronics industry has been the ubiquitous tinlead alloy. As the demand for electronic devices continues to increase, there have been concerns about the continued use of lead and its long term environmental impact. In the last decade there has been a push to ban the use of lead in electronic products. Legislation from various governments around the world limiting the use of lead has given rise to the drive to find suitable lead-free alternatives. The aim of this research project was to establish a systematic approach for the selection of electrochemical pa

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8

Kent, Damon. "Age hardening of sintered Al-Cu-Mg-Si-Sn alloys /." St. Lucia, Qld, 2004. http://www.library.uq.edu.au/pdfserve.php?image=thesisabs/absthe17893.pdf.

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9

ISHII, HENRIQUE A. "Elaboracao de ligas Ag-Sn-Cu para amalgama dentario por moagem de alta energia." reponame:Repositório Institucional do IPEN, 2003. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11101.

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10

Picincu, Lucica. "The electrodeposition of Cu-Zn-Sn alloys from alkaline cyanide solutions." Thesis, University of Southampton, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.310845.

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11

Athavale, Saurabh. "Effect of Cu concentration and cooling rate on microstructure of Sn-3.9Ag-XCu." Diss., Online access via UMI:, 2006.

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12

Kotadia, Hirenkumar R. "Solidification behaviour of Al-Sn-Cu immiscible alloys and Al-Si cast alloys processed under intensive shearing." Thesis, Brunel University, 2010. http://bura.brunel.ac.uk/handle/2438/4517.

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Alloy castings are usually solidified with a coarse columnar grain structure under normal casting conditions unless the mode of the solidification is carefully controlled. It is desirable for the grain structure to be fine and equiaxed to improve their mechanical performance as finished castings. It is possible to develop a fine and equiaxed grain structure either by increasing the number of nucleation sites or by grain multiplication. Immiscible alloys with a microstructure in which a soft phase is dispersed homogeneously in a hard matrix have significant potential applications in advanced be

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13

SILVA, LUIS C. E. da. "Estudos do desenvolvimento e caracterização das ligas Cu-Ni-Pt e Cu-Ni-Sn para fins eletro-eletrônicos." reponame:Repositório Institucional do IPEN, 2006. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11480.

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14

Martorano, Marcelo de Aquino. "Efeitos de algumas variáveis de processo na microssegregação da liga Cu-8%Sn." Universidade de São Paulo, 1998. http://www.teses.usp.br/teses/disponiveis/3/3133/tde-23082017-073753/.

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Os processos de fundição que visam à obtenção de produtos fundidos com formatos e propriedades mais próximos dos necessários ao produto final demandam um conhecimento detalhado das relações entre processo e microestrutura e entre microestrutura e propriedades. Não há dúvida de que aspectos microestruturais como o tamanho, a morfologia e o nível de microssegregação da estrutura dendrítica são importantes em definir as suas propriedades. Por outro lado, as variáveis de processo que afetam a transferência de calor no sistema estão entre as mais importantes em definir as características de microes

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15

Silva, Luis Carlos Elias da. ""Estudos do desenvolvimento e caracterização das ligas Cu-Ni-Pt e Cu-Ni-Sn para fins eletro-eletrônicos"." Universidade de São Paulo, 2006. http://www.teses.usp.br/teses/disponiveis/85/85134/tde-31052007-153314/.

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O Cu e suas ligas têm diferentes aplicações na sociedade moderna devido as excelentes propriedades elétricas, condutividade térmica, resistência à corrosão dentre outras propriedades. Estas aplicações podem ser em válvulas, tubulações, panelas para absorção de energia solar, radiadores para automóveis, condutores de corrente e eletrônico, elementos de termostatos e partes estruturais de reatores nucleares, como, por exemplo, bobinas para campo toroidal para um reator de fusão nuclear. Dentre as ligas utilizadas em reatores nucleares, podemos destacar Cu-Be, Cu-Sn e Cu-Pt. O Ni e o Co, freqüent

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16

Wederni, Asma. "Synthèse, caractérisation et étude magnétique des alliages à mémoire de forme de type Heusler Ni-Mn-Sn-X (X= Pd, Cu)." Doctoral thesis, Universitat de Girona, 2021. http://hdl.handle.net/10803/673935.

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Shape memory alloys witch exhibit magnetically induced phase transformations at room temperatures are the most interesting for magnetic cooling applications. Heusler type alloys (both stoichiometric and non-stoichiometric) are among the most studied systems, as they permit the change of the transition temperatures due to compositional variations. The first Heusler alloys that have been studied in depth are Ni- Mn-Ga alloys. However, to overcome the high cost of Gallium and low martensitic transformation temperature, the search for Ga-free alloys has been recently endeavoured, principally, by i

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17

Hunter, Elizabeth Adele Outdoor. "The Smallest Base and Precious Metal Deposits in the World: Vapor Transport and deposition of Co-Cu-Sn-Ag alloys in vesicles." BYU ScholarsArchive, 2007. https://scholarsarchive.byu.edu/etd/1406.

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Metallic bronze-Co-Ag alloys ranging from1-90 µm have been discovered in bomb and lava vesicles from the mafic volcanoes of Kilauea in Hawaii and Vesuvius, Stromboli and Etna in Italy. It is inferred that the metals for these alloys were transported (in part) as chloride complexes, and that the metal ratios in the alloys may be a function of S/Cl. Alloy compositions in each system are extremely heterogeneous with Co concentrations from 1% to 94%, Cu from 2% to 89%, Sn from 1% to 22% and Ag from 0.5% to 42%. Maximum abundances (in wt%) of other trace or minor elements are, Fe (3.0), Zn (0.11),

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18

Zaher, Ghenwa. "Microstructure et comportement mécanique du cuivre et d'un alliage Cu-Sn nanostructurés par déformation plastique intense et implantés à l'azote." Thesis, Normandie, 2019. http://www.theses.fr/2019NORMR031/document.

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Les alliages de cuivre sont utilisés dans de nombreuses applications électriques car ils offrent un bon compromis de résistance mécanique, de résistance à la corrosion et de conductivité électrique. Cependant pour certaines applications comme les contacteurs électriques, des matériaux plus performants sont recherchés. L’affinement de la taille de grains et l’implantation ionique sont deux voies que nous avons explorées dans ce but. Afin d’obtenir un bon compromis entre la dureté, la résistance à la corrosion et la conductivité électrique du cuivre pur (99,90%) et un bronze commercial monophasé

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19

Holtmeier, Stefan. "Effets magnétovolumiques dans des composés à fermions lourds CeRu2Si2, CeCu6 et CeNiSn." Université Joseph Fourier (Grenoble), 1994. http://www.theses.fr/1994GRE10117.

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Ce memoire decrit des etudes de dilatation thermique et de magnetostriction effectuees au moyen d'un dilatometre capacitif sur des monocristaux de composes a fermions lourds, entre 0. 2 et 300 k et sous des champs magnetiques allant jusqu'a 11 t. Dans une premiere partie, sont decrits des resultats sur l'alliage ce#0#. #9#8#5y#0#. #0#1#5ru#2si#2, qui completent une etude precedente du compose ceru#2si#2 pur et de l'alliage ce#0#. #9#5la#0#. #0#5ru#2si#2. Leur energie caracteristique obeit a une loi d'echelle. Aucun des de ces trois composes ne presente d'ordre magnetique a longue distance, mai

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20

Wei, Cheng-Chang, and 魏程昶. "Electromigration Studies on Sn(Cu) and Sn(Ni) Alloy Stripes." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/60068197745363733474.

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碩士<br>國立中央大學<br>化學工程與材料工程研究所<br>92<br>By using Blech structure, we have studied the EM behaviors on four different Sn(Cu) and Sn(Ni) alloys, which are Sn, Sn0.7Cu, Sn3.0Cu, and Sn1.0Ni. The EM rates of above alloys were determined and the order of the magnitudes is: Sn0.7Cu > Sn > Sn3Cu > Sn1.0Ni. Sn0.7Cu shows the highest EM rate among three Sn(Cu) alloys. The possible reasons are that eutectic Sn0.7Cu has a high density of grain boundary and a low yielding strength. Knowing the EM fluxes of alloy stripes in different lengths, the critical lengths and the critical products were determined

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21

Liu, Chia-Yu, and 劉家佑. "The Properties of Composite Solders of Sn-3.0 wt.% Ag- 0.5 wt.% Cu alloy Added with Sn-10.0 wt.% Cu alloy." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/2q7d46.

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22

Jindal, Nikhil. "Development of Lead Free sn-bi-cu Solder Alloy." Thesis, 2018. http://ethesis.nitrkl.ac.in/9575/1/2018_MT_216MM244_NJindal_Development.pdf.

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Until recently, lead-containing alloys were considered to be the most suitable soldering materials widely applied in the automotive industry and in several other sectors.However,with the implementation of EU(European union) environmental directives, the use of such alloys has become prohibited for negative effect on health. In this work we have studied various eutectic system like Sn-8.8 wt.% Zn, Sn-3.5 wt. % Ag and Sn-57wt. %Bi and Sn-0.7 wt. % Cu to find best alternative of Sn-Pb solder alloy. The characterization of microstructure was done by optical as well as scanning electro nmi

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23

Phani, Akella Siva Durga. "A Comparative Study of the Sn-Ag, Sn-Zn, Sn-Cu, Sn-Bi Lead Free Solder Alloys with the Commercially Available Sn-Pb Solder Alloy." Thesis, 2016. http://ethesis.nitrkl.ac.in/8079/1/2016_M_Tech_711MM1132_A_Compararative_Study.pdf.

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As soldering controls the effective usage and processing of electronic components in applications and devices. Solders are used as interconnect materials in microelectronic packaging. Traditionally Pb-Sn eutectic alloys have been used due to its low melting point and good wettability. However, due to the toxic nature of lead (Pb) and it harmful effect on environment and health the usage of Pb in solder should be avoided. This is why there is a need to develop environmentally benign Pb-free solders (LFS).In this research work four different lead free solder

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24

Chen, Chun-Wei, and 陳駿維. "Interfacial reaction between Sn(Cu) solder and NiCo alloy UBM." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/49636679478494714528.

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碩士<br>國立中央大學<br>化學工程與材料工程研究所<br>97<br>In the work, we study soldering reaction between Ni-Co alloy layer and Sn(Cu) Pb-free solders. Different Co concentrations in Ni-Co alloy layer were electroplated on Cu foils. Then, Sn(Cu) solders were reflowed on the Ni-Co alloy layers at 250 ℃ to investigate the growth situation and morphology of IMCs and to discuss the effect of Co concentration and Cu concentration on the reaction between Sn(Cu) and Ni-Co layer. Experimental results show that when the composition of NiCo alloy are Ni, Ni-20at%Co, Ni-63at%Co and Co, the corresponding IMCs formed at

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25

Wu, Hsiu-Hsien, and 吳修賢. "Sn-Ag-Cu Alloy Wire Formed by Fused Deposition Modeling." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/27128323794280842656.

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碩士<br>國立宜蘭大學<br>機械與機電工程學系碩士班<br>103<br>In recent years fused deposition modeling technology could be applied widely in biomedical engineering, aerospace engineering and automotive industry and so on, because of this technology has some of the advantages like easy to operation and clean process. However, thermoplastic is widely practiced in FDM process, cause of common metals and alloy’s melting point are over than FDM’s working temperature. This research presents the development of a low melting temperature metal alloys for use in fused deposition modeling (FDM) technology to make 3-dimensiona

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26

Li, Chia-Ying, and 李佳蔭. "Phase equilibria in the Sn-rich corner of the Sn-Cu-Ni ternary alloy system." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/49157458433148202389.

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碩士<br>國立清華大學<br>材料科學工程學系<br>92<br>The interfacial reactions between solders and under bump metallization (UBM) are of highly interests recently in flip chip technology. Intermetallic compounds (IMCs), i.e. (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4, formed between solders and UBM. To fully understand the interfacial reactions and phase transformation phenomenon, a suitable phase diagram concerning solder, IMCs and UBM material is required. As a result, Sn-riched phase in Sn-Cu-Ni ternary phase diagram is very critical in determining the concentration tendency of x and y values in (Ni1-x,Cux)3Sn4 and (Cu1-y,N

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27

HSU, PO-CHUN, та 許博淳. "Fabrication and properties characterization of Cu一Sn Alloy/HDPE composites". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/96511352161313628379.

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碩士<br>國立臺灣科技大學<br>高分子系<br>98<br>In this experiment, the conductivity properties of high density polyethylene (HDPE) composites filled with (Cu-Sn ) Alloy and modified Cu-Sn Alloy (MCu-Sn ) which was modified with LICA38 . Investigates indicated that the Volume Resistivity of (CuSna/bLc)xPEy is lower than (CuSna/b)xPEy. In addition, Volume Resistivity of (CuSna/b)xPEy prepared by ball milling method decreased with thickness increa. The Fourier Infrared（FTIR），differential scanning calorimetry （DSC）and multiple function micro-electrical resistance meter (K

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28

Syu, Ruo-syun, and 徐若勳. "Interfacial Reactions Between Sn-58 wt %Bi, Sn-0.7 wt% Cu Lead-free Solders and Alloy 42 Substrate." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/22083163577046639882.

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碩士<br>國立臺灣科技大學<br>化學工程系<br>97<br>In this research, we studied the interfacial reactions between Sn-58 wt% Bi and Sn-0.7 wt% Cu lead-free solders and Alloy 42 substrate. The liquid/solid reaction couples were reflowed for 1~50 hours at 240, 270, 300 and 330℃. In this study, the kinetic, reaction mechanism and the sort of the intermetallic component of the interfacial reactions were investigated. The experiment results indicated that only the FeSn2 phase was formed on the interfaces of the SB/Alloy 42 and SC/Alloy 42 couples. After etching process, there are two kind of morphology of the interme

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29

Guo, Siao-wei, and 郭筱薇. "Developement of High-temperature Lead-free solders: Zn-Sn-Al-Cu Based Alloy." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/d63szw.

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碩士<br>國立臺灣科技大學<br>材料科學與工程系<br>99<br>Despite numerous studies on the research and development for high-temperature lead free solders, high-lead solder are still in used because high-temperature lead free solders also has been facing several serious problems during these years. Establishing high-temperature lead-free solder is an urgent priority. This study investigates the development of high-temperature lead-free solders and their properties by improve its wettability and oxidation resitivity after addition of Ni and Ge in Zn-Sn-Al-Cu based alloy. The solders are examined for microstructure, t

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30

Hong, Wei-Cheng, and 洪偉城. "Study on the Alloy Bulks and Thin Film properties of Al-Co-Cu-Sn-Ti Equal-Mole Alloys." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/36702286434826442743.

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碩士<br>中國文化大學<br>材料科學與製造研究所<br>92<br>This thesis is according to the concept of equal-mole multi-principal alloys by Dr.Ye. Using this concept to compound the elements of Al,Co,Cu,Sn,Ti into equal-mole alloys. Five 4-component equal-mole alloys and one 5-component equal-mole alloy were selected for this paper equal-more alloys. We proceed to research of microstructures, analysis of phases, thermal property, the hardness and thermal electric property. However, AlCuSnTi had the best properties among these alloys. It is a four phase equal-mole alloy and this alloy was selected to cast it into targ

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31

Alex, Sherine. "Development of Cu-based Intermetallic Reflector Materials for Concentrated Solar Power Application." Thesis, 2017. https://etd.iisc.ac.in/handle/2005/4277.

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The growing demand for energy is an important issue for the existence and development of humankind. In order to reduce the impact of conventional energy sources on the environment, attention should be paid to the development of new and renewable energy resources. Solar energy is a major environment friendly, renewable and sustainable energy source. Subsequently, with increasing drying up of the terrestrial fossil fuel, solar energy will potentially become an important part of the future energy structure. Concentrated solar power (CSP) technology is a productive way to make effective utilizatio

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32

Chen-YiLin and 林宸禕. "The Effect of Electromigration on the Interfacial Reaction between Sn-Ag-Cu-Ni-In Alloy and Ni Substrate." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/42459580931946486108.

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Ray-WenWu and 吳瑞文. "Effect of Arc-melting Tin and Copper on the Microstructure and Properties of Ti-Sn-Cu alloy during the As-casting and Heat Treatment." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/2p5cym.

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TE, JEN, and 陳仁德. "Study of Hardness on Sn(Cu) Alloys." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/55404740554883362350.

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博士<br>國立中央大學<br>化學工程與材料工程研究所<br>97<br>Solder jointing technology is very important for the modern electronic industry. Due to Pb has a toxic nature and the environmental and health hazard concerns. So, Pb-free solders are developed to replace SnPb. Yet, high strength mechanical property, the superior creep resistance and thermal fatigue are the important issues for the solder joint reliability. On the other hand, silver would be very costy in the future. The low-cost Sn(Cu) alloys offer good advantages for the future Pb-free solders. However, Cu and Ni are often used in the bond pads on the ch

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35

Huang, Sheng-Fang, and 黃聖芳. "Constituting Phases of Cu-Sn-Ti Alloys." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/28370977643119694204.

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博士<br>國立臺灣科技大學<br>機械工程系<br>91<br>This study examines the constituting phases in the Cu-Sn-Ti alloys. Three Cu-Sn-Ti alloys of different compositions, namely Cu-17Sn-23Ti、Cu-5Sn-20Ti and Cu-20Sn-5Ti (numbers are all in atomic percent unless specified otherwise), were heat-treated in vacuum. There were divided into two groups for different heat treatment. One group of specimens were heat-treated at an isothermal holding temperature of 900℃ and held for either 5 minutes, 1 hour, 3 hours, 6 hours, or 10 hours. The other group of specimens were heat-treated at an isothermal holding temperature of e

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LI, jia-feng, and 李佳峰. "Wettability and Constituting phases of Cu-Sn-Ti Alloys." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/47316013080259127316.

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碩士<br>中華技術學院<br>機電光工程研究所碩士班<br>95<br>Abstract This study examines the wettability and constituting phases in the Cu-Sn-Ti alloys. Seven Cu-Sn-Ti alloys of different compositions were heat-treated in vacuum furnace. Then were heat-treated at an isothermal holding temperature of 900℃ and held for 1 hour, and were subsequently furnace-cooled to room temperature. Microstructures of the specimens and compositional analysis of the constituting phases in the alloys were examined by electron probe microanalyzer. Experimental results revealed that the Cu-30Sn-10Ti alloy achieved the smallest wetting a

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Pan, Kai-Wen, and 潘凱文. "Directional solidification and liquidus projection of Sn-Co-Cu and Sn-Co-Ni alloys." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/42921672435896364873.

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Lee, Yen-Yu, and 李彥佑. "Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/87x84q.

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碩士<br>國立中央大學<br>材料科學與工程研究所<br>97<br>The surface oxidations of molten Sn(Ag, Ni, In, Cu) alloys are studied. We conclude that the microstructure (phase and density) of the surface oxide layer is the key factor for the surface oxidation formation. And, we found that the microstructure (phase and density) of the Sn surface oxide layer is highly influenced by the additives in the solder alloys, which can be roughly anticipated from the additives’ EMF values and Gibbs free energies of oxide formation. The detail effect (either retarding or enhancing) of the additives on the surface oxidation wou

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申有田. "Liquidus projection and solidification properties of In-Sn-Cu alloys." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/79816117725812488347.

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40

Yang, Shengyuan, and 楊盛淵. "A study of internal oxidation in Cu-Al-Ag and Cu-Al-Sn alloys." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/33764910886880491327.

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Hsien-Ming, Hsiao, and 蕭憲明. "The Phase Equilibria of the Au-Cu-Sn Ternary System, the Ag-Au-Cu-Sn Quaternary System, and the Interfacial Reaction between Sn-Cu Alloys and the Au Substrate." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/99356988147809093775.

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碩士<br>國立臺灣科技大學<br>化學工程系<br>93<br>Sn-Ag-Cu ternary and Sn-Cu binary alloys are the commercial Pb-free solders and widely used in electronic industries. The Au is commonly used in flip-chip technology, tape automated bonding as under bump metallurgy and substrate materials in printed circuit boards. In this study, the phase equilubria of the Sn-Cu-Au ternary, Sn-Ag-Cu-Au quaternary system, and interfacial reactions between Sn-Cu alloys and Au were experimentally investigated at specific temperatures. The experimental results indicate that there exists a complete solid solubility between AuSn and

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Yang, Ta-Kai, and 楊達凱. "Effect of Sn addition on the Cu-Zr-Ti amorphous alloys." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/a2863n.

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碩士<br>大同大學<br>材料工程學系(所)<br>93<br>This study examined the effect of Sn element addition on the Cu-Zr-Ti amorphous alloys by mechanical alloying technique. The microstructural evolution during mechanical alloying of the mixed powders was investigated by both X-ray diffraction and scanning electron microscopy (SEM).The phase stabilities of the as-milled powders were studied by DSC measurement. According to the result, after 5 hours of milling, the composition of Cu-Zr-Ti-Sn alloys were all amorphization. The thermal stability of the Cu-Zr-Ti-Sn amorphous powder was also investigated by differenti

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Wang, Kai-Hong, and 王凱弘. "Brazing Ti-6Al-4V with Cu-Sn-Ti alloys as filler metal." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/53982229988248506029.

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碩士<br>中華技術學院<br>機電光工程研究所碩士班<br>97<br>This study mainly develops the Cu-Sn-Ti alloys as filler metals to braze Ti-6Al-4V alloy. Four Cu-Sn-Ti alloys of different compositions were used to braze Ti-6Al-4V alloy in vacuum furnace. The brazing process was carried out to heat with a rate of 30℃/min from room temperature to 600℃ and held for 30 minutes, then keep heating to brazing temperature, and heat-treated at an isothermal holding temperature of either 850℃, 900℃, or 950℃, and held for 30 minutes. The specimens were subsequently furnace-cooled (cooling rate of 4℃/min) to room temperature. The s

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Lin, Chih-Hao, and 林志豪. "Phase equilibria and solidification properties of the ternary Sn-Cu-Ni alloys." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/80848053773786767842.

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Chang, Shu-hau, and 張書豪. "Study of Interfacial Reactions between Sn-Ag-Cu Alloys and the Au Substrate." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/07085016564123286303.

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碩士<br>國立臺灣科技大學<br>化學工程系<br>93<br>ABSTRACT This study investigated interfacial reactions between Sn-Ag-Cu alloys and Au substrate. It's distinguished three systems that different concentration of Sn. The reaction time is 12 hour to 1200 hour, reacted at 150,180 and 200°C.After reaction，we analyze the species of IMCs and observe morphology of IMCs. Reacted at 200°C, five phases, AuSn /AuSn2 / AuSn4 / (AuCu)Sn /(CuxAu1-x)6Sn5,are found between Au substrate and Sn-Ag-Cu Alloys. Reacted at 180°C，increase the Cu concentration in alloy will restrain the formation of AuSn4. Four phases, AuSn /AuSn2/(

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徐煒能. "Effects of anisotropic Beta-Sn alloys on Cu diffusion under a temperature gradient." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/33735833478425329300.

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碩士<br>國立清華大學<br>工程與系統科學系<br>102<br>As the packaging technology transitions toward the three-dimensional integrated circuit (3D IC), a larger temperature gradient is expected to be established when the heat is dissipated from the surface of the stacking module. Furthermore, one solder bump consists of only few grains when the size of the solder bump shrinks into few micrometers. The crystal structure of β-Sn is known to be body-centered tetragonal (BCT) structure and it is anisotropic. Therefore, the effect of anisotropy of Sn is an important issue in the reliability of next-generation packagin

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Lai, Yan-Bo, and 賴彥伯. "Effect of Sn, Si and B addition on the Cu-Ti-Ni Amorphous alloys." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/77059099984641209344.

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碩士<br>大同大學<br>材料工程學系(所)<br>96<br>This study examined the amorphization behavior by adding Sn, B, and Si elements to Cu50Ti40Ni10 alloy powders synthesized by mechanical alloying technique. According to the results, the mechanical alloyed powders were amorphous at compositions (Cu50Ti40Ni10)95SnxB5-x (x=0-5), (C95Snu50Ti40Ni10)95SnxSi5-x (x=0-4), and (Cu50Ti40Ni10)95SixB5-x (x=1, 2, 4). The amorphous powders were found to exhibit a wide supercooled liquid region before crystallization. The temperature interval of the supercooled liquid region (ΔTx) is 59K((Cu50Ti40Ni10)95B5), 78K((Cu50Ti40Ni10)

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Hsieh, Yu-chan, and 謝育展. "Constitutional Phases and Performances of Cu-Sn-Ti Alloys in the Brazing of Diamond." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/53589739739771918835.

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博士<br>國立臺灣科技大學<br>機械工程系<br>96<br>Cu-Sn-Ti alloys are ideal brazing filler suitable for bonding application of diamond because of its high wetting and bonding abilities. This study discussed the effects of various composition of Cu-Sn-Ti alloys on the wetting phenomena of graphite, its constitutions, and their interfaces at the temperature ranging from 850~1000℃. It was found that the additions of Titanium enhancing the wetting ability of Cu-Sn-Ti alloys; however, although the additions of Tin could lower the melting temperature of the Cu-Sn-Ti alloys, it deteriorated the interface of between g

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Hsieh, Peiyin, and 謝佩吟. "Analysis Of Cu, Zn, Fe And Sn In Alloys By Powerchip Laser-induced Breakdown Spectrometry." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/62175628571093261767.

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碩士<br>靜宜大學<br>應用化學系<br>100<br>Laser-induced breakdown spectroscopy (LIBS) has numerous advantages such as no sample pretreatment, remote measurement, non-intrusive, minimal sample volume and multi-elemental analysis. In recent years, LIBS has become one of the most popular research subjects in analytical chemistry. LIBS can be miniaturized by using a powerchip laser instead of bulky conventional laser systems. The powerchip laser, which offered low energy pulses and high pulse repetition frequency (up to several kHz), was feasible for sample detection at atmospheric pressure in air, but there

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Peng, Yu-Chang, and 彭育彰. "Effect of Minor Mg on the Various Properties of Sn-Cu Lead-Free Solder Alloys." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/sb7b2b.

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碩士<br>國立虎尾科技大學<br>材料科學與綠色能源工程研究所<br>100<br>The research was focused on the effects of Mg additions to Sn-0.7Cu lead-free solder on the melting point, microstructure, mechanical property, and joint performance. Results of differential scanning calorimeter analysis showed that alloying of Mg to Sn-0.7Cu decreased the melting temperature slightly where the melting temperature was 227.88 °C. The microstructures of Sn-0.7Cu and Sn-0.7Cu-0.01Mg solders could be clearly divided into two regions, it was identified that the dendrite arm was primary β-Sn phase while the interdendritic eutectic was the C

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