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Journal articles on the topic 'Cu-V'

Author: Grafiati

Published: 4 June 2021

Last updated: 2 February 2022

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1

Okamoto, H. "Cu-V (Copper-Vanadium)." Journal of Phase Equilibria and Diffusion 31, no. 1 (2009): 83–84. http://dx.doi.org/10.1007/s11669-009-9631-x.

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2

Guo, Shi Ping, Wei He, Yun Hong Zhao, and Ling Min Zeng. "Phase Equilibria in the Er-Cu-V and Dy-Cu-V at 773K." Advanced Materials Research 815 (October 2013): 3–7. http://dx.doi.org/10.4028/www.scientific.net/amr.815.3.

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The isothermal sections of the Er-Cu-V and Dy-Cu-V ternary systems at 773K were investigated by experiments. The isothermal section of Er-Cu-V consists of 8 single-phase regions, 13 two-phase regions and 6 three-phase regions. The binary compounds ErCu5, ErCu2, ErCu, Er2Cu9and Er2Cu7were observed at 773K. The isothermal section of Dy-Cu-V consists of 7 single-phase regions, 11 two-phase regions and 5 three-phase regions. The binary compounds DyCu5, DyCu2, DyCu and Dy2Cu9were confirmed at 773K. No ternary compound was found in the two sections. There is no solubility of V in the Er-Cu and Dy-Cu

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3

Yaşyerli, Sena, Gülşen Dogu, AR Irfan, and Timur Dogu. "Breakthrough Analysis OF H 2 S removal on CU-V-MO, CU-V, and CU-MO mixed oxides." Chemical Engineering Communications 190, no. 5-8 (2003): 1055–72. http://dx.doi.org/10.1080/00986440302101.

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4

Chen, Huaqiang, Jinlong Du, Yanxia Liang, et al. "Comparison of Vacancy Sink Efficiency of Cu/V and Cu/Nb Interfaces by the Shared Cu Layer." Materials 12, no. 16 (2019): 2628. http://dx.doi.org/10.3390/ma12162628.

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This paper provides a new method to compare and then reveal the vacancy sink efficiencies quantitively between different hetero-interfaces with a shared Cu layer in one sample, in contrast to previous studies, which have compared the vacancy sink efficiencies of interfaces in different samples. Cu-Nb-Cu-V nanoscale metallic multilayer composites (NMMCs) containing Cu/V and Cu/Nb interfaces periodically were prepared as research samples and bombarded with helium ions to create vacancies which were filled by helium bubbles. A special Cu layer shared by adjoining Cu/V and Cu/Nb interfaces exists,

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5

García, César Pascual, and Francesco Giazotto. "Josephson current in nanofabricated V/Cu/V mesoscopic junctions." Applied Physics Letters 94, no. 13 (2009): 132508. http://dx.doi.org/10.1063/1.3114522.

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6

Cao, Fei, Gao-hui Wu, and Long-tao Jiang. "Evaluation of Cu(V) self-forming barrier for Cu metallization." Journal of Alloys and Compounds 657 (February 2016): 483–86. http://dx.doi.org/10.1016/j.jallcom.2015.10.158.

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7

Raghavan, V. "Cu-Fe-V (copper-iron-vanadium)." Journal of Phase Equilibria 23, no. 3 (2002): 272–73. http://dx.doi.org/10.1361/105497102770331811.

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8

Kishi, Kosaku, Katsunori Hirai, and Tatsuro Yamamoto. "XPS and XAES study for oxidation of V/Cu(100) and V,Na/Cu(100) surfaces." Surface Science 290, no. 3 (1993): 309–18. http://dx.doi.org/10.1016/0039-6028(93)90715-v.

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9

Kishi, Kosaku, Katsunori Hirai, and Tatsuro Yamamoto. "XPS and XAES study for oxidation of V/Cu(100) and V,Na/Cu(100) surfaces." Surface Science Letters 290, no. 3 (1993): A538. http://dx.doi.org/10.1016/0167-2584(93)90941-b.

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10

Park, Jae-Hyung, Dae-Yong Moon, Dong-Suk Han, Yu-Jin Kang, So-Ra Shin, and Jong-Wan Park. "Self-forming barrier characteristics of Cu–V and Cu–Mn films for Cu interconnects." Thin Solid Films 547 (November 2013): 141–45. http://dx.doi.org/10.1016/j.tsf.2013.04.052.

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11

Murakami, Satoshi, Manabu Mizutani, Kenji Matsuda, Katsuhiko Nishimura, Tokimasa Kawabata, and Yoshimitsu Hishinuma. "Microstructure of the New Route Wire Fabrication of V₃Ga Compound Superconducting Wire Using High Ga Content Cu-Ga/V Precursor Composite Material." Materials Science Forum 706-709 (January 2012): 677–80. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.677.

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Our co-worker, Hishinuma et. al. has established a new route Powder-In-Tube (PIT) process using a high Ga content Cu-Ga compound in order to improve the superconducting property of the V3Ga compound wire. In this study, we investigated microstructure of this high Ga content Cu-Ga/V composite superconducting wire. The different contrasts of matrix, V-Ga phase and Cu-Ga core were observed by SEM observation in cross section of 19 multifilamentary wire. And V-Ga phase was confirmed by SEM mapping. The area fraction of V-Ga phase increased when Ga content increased from 30% to 50%. Thin film sampl

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12

Murakami, Satoshi, Manabu Mizutani, Kenji Matsuda, Katsuhiko Nishimura, Tokimasa Kawabata, and Yoshimitsu Hishinuma. "Microstructure of the New Route Wire Fabrication of V₃Ga Compound Superconducting Wire Using High Ga Content Cu-Ga/V Precursor Composite Material." Advanced Materials Research 409 (November 2011): 205–8. http://dx.doi.org/10.4028/www.scientific.net/amr.409.205.

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Our co-worker, Hishinuma et. al. has established a new route Powder-In-Tube (PIT) process using a high Ga content Cu-Ga compound in order to improve the superconducting property of the V3Ga compound wire. In this study, we investigated microstructure of this high Ga content Cu-Ga/V composite superconducting wire. The different contrasts of matrix, V-Ga phase and Cu-Ga core were observed by SEM observation in cross section of 19 multifilamentary wire. And V-Ga phase was confirmed by SEM mapping. The area fraction of V-Ga phase increased when Ga content increased from 30% to 50%. Thin film sampl

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13

KURMAEV, E. Z., A. MOEWES, N. D. ZHIGADLO, et al. "LOCAL ELECTRONIC STRUCTURE OF DOPING ATOMS IN MA2Can-1CunO2n+3 HIGH-Tc SUPERCONDUCTORS WITH [M-12(n-1)n] TYPE STRUCTURES." Surface Review and Letters 09, no. 02 (2002): 1345–49. http://dx.doi.org/10.1142/s0218625x02003780.

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Results of X-ray fluorescence measurements of MA 2 Ca n-1 Cu n O 2n + 3 compounds with [ M -12(n-1)n] type structures, ( C 0.8 N 0.2 Sr 2 CuO 5.3, [ Cu 0.25 (C,N) 0.75] Sr 2 CaCu 2 O y, Cu 0.5 V 0.5 Sr 2 CaCu 2 O 7.5, Cu 0.5 V 0.5 Sr 2 Ca 2 Cu 3 O 9.4, Cu 0.5 V 0.5 Sr 2( Ca 3.6 Sr 0.4) Cu 5 O 13.5 and Cu 0.5 V 0.5 Sr 2( Ca 4.7 Sr 0.3) Cu 6 O 15.3, are presented. The experiments show that C-atoms form a distorted CO 3 oxyacid group with a partial substitution of copper and nitrogen atoms in the M-sites. We conclude that the CO 32- group in (C,N) Sr 2 Ca n-1 Cu n O y and (Cu,C,N) Sr 2 Ca n-1 Cu

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14

Hämäläinen, M., K. Jääskeläinen, R. Luoma, M. Nuotio, P. Taskinen, and O. Teppo. "A thermodynamic analysis of the binary alloy systems Cu-Cr, Cu-Nb and Cu-V." Calphad 14, no. 2 (1990): 125–37. http://dx.doi.org/10.1016/0364-5916(90)90014-q.

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15

Senuma, Takehide, Masanori Sakamoto, and Yoshito Takemoto. "Precipitation and Precipitation Hardening Behavior of V and/or Cu Bearing Middle Carbon Steels." Materials Science Forum 638-642 (January 2010): 3491–95. http://dx.doi.org/10.4028/www.scientific.net/msf.638-642.3491.

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In this study, the precipitation and precipitation hardening behavior of a 0.3%V and 2%Cu bearing middle carbon steel has been investigated in comparison with that of a 0.3%V bearing steel and a 2%Cu bearing steel. The precipitation treatment was carried out isothermally at 600°C.The amount of the precipitation hardening of the 0.3%V and 2%Cu bearing steel is nearly equal to the sum of the precipitation hardening of the 0.3%V bearing steel and the 2%Cu bearing steel In the 0.3%V bearing steel, precipitates were observed in rows, which indicates the occurrence of the interphase precipitation wh

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16

Dediu, V. I., V. V. Kabanov, and A. S. Sidorenko. "Dimensional effects in V/Cu superconducting superlattices." Physical Review B 49, no. 6 (1994): 4027–32. http://dx.doi.org/10.1103/physrevb.49.4027.

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17

Chen, Chih-chi, Sinn-wen Chen, and Chih-horng Chang. "Solid/solid interfacial reactions between Sn–0.7 wt% Cu and Ni–7 wt% V." Journal of Materials Research 23, no. 7 (2008): 1895–901. http://dx.doi.org/10.1557/jmr.2008.0235.

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Sn–0.7 wt% Cu alloy is an important Pb-free solder, and Ni–7 wt% V is the major diffusion barrier layer material of flip chip technology. Reactions at the Sn–0.7 wt% Cu/Ni–7 wt% V interface are examined at 160, 180, and 210 °C. Only the Cu6Sn5 phase is formed in the Sn–0.7 wt% Cu/Ni–7 wt% V couple reacted at 160 and 180 °C; however, in addition to the Cu6Sn5 and Ni3Sn4 phases, a quaternary Q phase is formed in the Sn–0.7 wt% Cu/Ni–7 wt% V couple reacted at 210 °C. The Q phase is a mixture of nanocrystalline Ni3Sn4 phase and an amorphous phase. With longer reaction time at 210 °C in the Ni–V/Q/

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18

Choi, J. H., B. Y. Jung, S. W. Jun, Y. Kim, and Tae Sung Oh. "Reaction between Sn-In Solder and Under Bump Metallurgy." Materials Science Forum 449-452 (March 2004): 401–4. http://dx.doi.org/10.4028/www.scientific.net/msf.449-452.401.

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Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nmTi/8µm Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.

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19

Wiebe, Jacqueline, Vasyl Zaliskyy, and Eric A. C. Bushnell. "A Computational Investigation of the Binding of the Selenium Analogues of Ergothioneine and Ovothiol to Cu(I) and Cu(II) and the Effect of Binding on the Redox Potential of the Cu(II)/Cu(I) Redox Couple." Journal of Chemistry 2019 (February 7, 2019): 1–7. http://dx.doi.org/10.1155/2019/9593467.

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The complexes formed from the binding of ovoselenol (OSeH) and ergoseloneine (ESeH) to Cu(II) and Cu(I) have been investigated with DFT methods. From the calculated thermodynamics, the binding of OSeH and ESeH to Cu(II) and Cu(I) ions increases the reduction potential for the Cu(II)/Cu(I) redox couple. The calculated reduction potentials for the Cu(II)(OSe)2/Cu(I)(OSeH)3+ and Cu(II)(ESe)2/Cu(I)(ESeH)3+ redox couples were found to be 1.15 V and 1.24 V in a dilute aqueous solution. By combining the half reactions for the oxidation of OSeH to the diselenide OSeSeO with the reduction of Cu(II)(OSe

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20

Wang, Xiaochen, Qinglin Xia, Tongfei Li, et al. "Application of fractal models to delineate mineralized zones in the Pulang porphyry copper deposit, Yunnan, southwestern China." Nonlinear Processes in Geophysics 26, no. 3 (2019): 267–82. http://dx.doi.org/10.5194/npg-26-267-2019.

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Abstract. The aim of this study is to delineate and identify various mineralized zones and barren host rocks based on surface and subsurface lithogeochemical data from the Pulang porphyry copper deposit, southwestern China, utilizing the number–size (N-S), concentration–volume (C-V) and power-spectrum–volume (S-V) fractal models. The N-S model reveals three mineralized zones characterized by Cu thresholds of 0.28 % and 1.45 %: <0.28 % Cu represents weakly mineralized zones and barren host rocks, 0.28 %–1.45 % Cu represents moderately mineralized zones, and > 1.45 % Cu represents highly m

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21

Zhu, Lei, Taku Kitanosono, Pengyu Xu та Shū Kobayashi. "A Cu(ii)-based strategy for catalytic enantioselective β-borylation of α,β-unsaturated acceptors". Chemical Communications 51, № 58 (2015): 11685–88. http://dx.doi.org/10.1039/c5cc04295j.

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22

Urbaniak, M., H. Brückl, F. Stobiecki, T. Luciński, and G. Reiss. "Néel's Magnetostatic Coupling in Sputtered Cu/Py/V/Py/MnIr/Cu Multilayers." Acta Physica Polonica A 105, no. 3 (2004): 307–13. http://dx.doi.org/10.12693/aphyspola.105.307.

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23

Breza, Martin. "CNDO studies of Y-Ba-Cu-O superconductors V. Co/Cu substitution." Czechoslovak Journal of Physics 46, no. 9 (1996): 873–80. http://dx.doi.org/10.1007/bf01742457.

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24

Cai, Yanqing, Xinggang Chen, Qian Xu, and Ying Xu. "Anodic behaviour of Cu, Zr and Cu–Zr alloy in molten LiCl–KCl eutectic." Royal Society Open Science 6, no. 1 (2019): 181278. http://dx.doi.org/10.1098/rsos.181278.

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The anodic dissolution behaviours of Cu, Zr and Cu–Zr alloy were analysed in LiCl–KCl at 500°C by anode polarization curve and potentiostatic polarization curve. The results show that the initial and fast-dissolving potentials of Cu are −0.50 and −0.29 V, and Zr are −1.0 and −0.88 V, respectively. But, in the Cu–Zr alloy, the initial and fast-dissolving potentials of Cu are −0.52 and −0.41 V, and Zr are −0.96 and −0.92 V, respectively. The potentials satisfy the selection dissolution principle that Zr in the alloy dissolves first, while Cu is left in the anode and is not oxidized. The passivat

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25

Ronzani, Alberto, Matthieu Baillergeau, Carles Altimiras, and Francesco Giazotto. "Micro-superconducting quantum interference devices based on V/Cu/V Josephson nanojunctions." Applied Physics Letters 103, no. 5 (2013): 052603. http://dx.doi.org/10.1063/1.4817013.

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26

Kumari, Swati, João R. C. Junqueira, Suchismita Sarker, Apurva Mehta, Wolfgang Schuhmann, and Alfred Ludwig. "Structural and photoelectrochemical properties in the thin film system Cu–Fe–V–O and its ternary subsystems Fe–V–O and Cu–V–O." Journal of Chemical Physics 153, no. 1 (2020): 014707. http://dx.doi.org/10.1063/5.0009512.

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27

CHEN, Z. Y., Y. T. Qian, H. M. LUO, B. QU, Z. Z. SHENG, and L. M. WANG. "EFFECTS OF V- OR Cr-DOPING ON PHASE FORMATION, ELECTRIC PROPERTIES AND SUPERCONDUCTIVITY OF THE 3212-TYPE PHASE Pb2Sr2(Ca0.5Y0.5)Cu3Oz." Modern Physics Letters B 10, no. 13 (1996): 609–14. http://dx.doi.org/10.1142/s0217984996000663.

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The effects of vanadium or chromium on the formation, electric properties and superconductivity of Pb-3212 phase ( Pb 2 Cu ) Sr 2( Ca 0.5 Y 0.5) Cu 2 O z are studied. The sites of V or Cr in PbO–CuO δ– PbO structure unit for Pb -3212 phase is also investigated. Compared with the effects of Cr-doping, V can totally substitute Ca to form a new compound Pb 2 Sr 2( V 0.5 Y 0.5) Cu 3 O z, and V has relatively greater substitution amount in ( Pb 2–x M x) Sr 2( Ca 0.5 Y 0.5) Cu 3 O z( M = Cr or V ). Moreover, the resistivity and superconductivity of the above samples decrease with increasing V or Cr

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28

Li, M., F. Zhang, W. T. Chen, et al. "Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films." Journal of Materials Research 17, no. 7 (2002): 1612–21. http://dx.doi.org/10.1557/jmr.2002.0239.

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The evolution of interfacial microstructure of eutectic SnAgCu and SnPb solders on Al/Ni(V)/Cu thin films was investigated after various heat treatments. In the eutectic SnPb system, the Ni(V) layer was well protected after 20 reflow cycles at 220 °C. In the SnAgCu solder system, after 5 reflow cycles at 260 °C, the (Cu,Ni)6Sn5 ternary phase formed and Sn was detected in the Ni(V) layer. After 20 reflow cycles, the Ni(V) layer disappeared and spalling of the (Cu,Ni)6Sn5 was observed, which explains the transition to brittle failure mode after ball shear testing. The different interfacial react

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29

Santos, Éder José dos, Amanda Beatriz Herrmann, José Luiz Olkuszewski, Tatiana D. Saint'Pierre, and Adilson José Curtius. "Determination of trace metals in electrolytic copper by ICP OES and ICP-MS." Brazilian Archives of Biology and Technology 48, no. 5 (2005): 681–87. http://dx.doi.org/10.1590/s1516-89132005000600002.

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The performance of axial view ICP OES and ICP-MS techniques were compared through the determination of As, Fe, Mn, Pb, Sb and Sn in electrolytic copper. Samples were prepared by two procedures: 1. Total dissolution with 5 % v/v HNO3 and 2. Dissolution with 1.4 % v/v HNO3 plus 2.0 % v/v H2SO4, followed by separation of the Cu by electrodeposition. The methods were applied for the analysis of standard copper solutions, using calibration against aqueous solutions with or without the addition of Cu. The results obtained by the two techniques were similar, but the separation of Cu from the sample m

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30

Fei, Cao, Wu Gao-hui, Jiang Long-tao, and Chen Guo-qin. "Application of Cu–C and Cu–V alloys in barrier-less copper metallization." Vacuum 122 (December 2015): 122–26. http://dx.doi.org/10.1016/j.vacuum.2015.09.011.

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31

Ono, Teruo, Yasunari Sugita, Kunji Shigeto, Ko Mibu, Nobuyoshi Hosoito, and Teruya Shinjo. "Magnetoresistance study of Co/Cu/NiFe/Cu multilayers prepared on V-groove substrates." Physical Review B 55, no. 21 (1997): 14457–66. http://dx.doi.org/10.1103/physrevb.55.14457.

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32

Mandal, R. K., A. Mandal, D. K. Misra, R. S. Tiwari, and O. N. Srivastava. "Indentation characteristics of rapidly solidified Al-Cu-V and Al-Cu-Ti alloys." Transactions of the Indian Institute of Metals 61, no. 1 (2008): 7–12. http://dx.doi.org/10.1007/s12666-008-0059-5.

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33

Mao, Shimin, Shipeng Shu, Jian Zhou, Robert S. Averback, and Shen J. Dillon. "Quantitative comparison of sink efficiency of Cu–Nb, Cu–V and Cu–Ni interfaces for point defects." Acta Materialia 82 (January 2015): 328–35. http://dx.doi.org/10.1016/j.actamat.2014.09.011.

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34

Ortún-Palacios, Jaime, Antonio Mario Locci, Sarah Fadda, Francesco Delogu, and Santiago Cuesta-López. "Role of Interface in Multilayered Composites under Irradiation: A Mathematical Investigation." Advances in Materials Science and Engineering 2017 (2017): 1–16. http://dx.doi.org/10.1155/2017/1079735.

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A continuum model of point-defects evolution during irradiation of a multilayer composite material is presented in this work. Nonstationary balance equations are used to describe production, recombination, transport, and annihilation, or removal, of vacancies and interstitials in a β-α-β three-layer system (α = Cu and β = Nb, V, or Ni). In addition, transport and trapping of point-defects at interfaces are taken into account. Numerical investigation on similarities and differences between Cu/Nb, Cu/V, and Cu/Ni systems is also performed. A general comparison of model results reveals that avera

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35

Zhou, D. W., and R. W. Kreilick. "V-Band EPR Spectra of Some Cu Complexes." Journal of Magnetic Resonance, Series A 108, no. 1 (1994): 93–95. http://dx.doi.org/10.1006/jmra.1994.1093.

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36

Wu, Daqing, Luke L. Y. Chang, and Charles R. Knowles. "Phase relations in the CuVS system." Journal of the Less Common Metals 115, no. 2 (1986): 243–51. http://dx.doi.org/10.1016/0022-5088(86)90146-3.

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37

Tsai, An-Pang, Akihisa Inoue, and Tsuyoshi Masumoto. "Ductile Al-Cu-V amorphous alloys without metalloid." Metallurgical Transactions A 19, no. 2 (1988): 391–93. http://dx.doi.org/10.1007/bf02652554.

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38

Yasrebi, Amir Bijan, Peyman Afzal, Andy Wetherelt, Patrick Foster, and Reza Esfahanipour. "Correlation between geology and concentration-volume fractal models: significance for Cu and Mo mineralized zones separation in the Kahang porphyry deposit (Central Iran)." Geologica Carpathica 64, no. 2 (2013): 153–63. http://dx.doi.org/10.2478/geoca-2013-0011.

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Abstract This study identifies the major mineralized zones including supergene enrichment and hypogene enrichment in the Kahang Cu-Mo porphyry deposit which is located in Central Iran based on subsurface data and utilization of the concentration-volume (C-V) fractal model. Additionally, a correlation between results achieved from a C-V fractal model and geological models consisting of zonation, mineralography and alteration have been conducted in order to have an accurate recognition and modification of the main mineralized zones. Log-log plots indicate five geochemical populations for Cu and

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39

Pincus, Lauren N., Isabel S. Gonzalez, Eli Stavitski, and Julie B. Zimmerman. "Aerobic oxidation of arsenite to arsenate by Cu(ii)–chitosan/O2 in Fenton-like reaction, a XANES investigation." Environmental Science: Water Research & Technology 6, no. 10 (2020): 2713–22. http://dx.doi.org/10.1039/d0ew00326c.

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40

Bassett, Mark J. "A Test Cross Protocol for Determining the Seedcoat Genotype at the C Locus in Common Bean." HortScience 35, no. 2 (2000): 286–89. http://dx.doi.org/10.21273/hortsci.35.2.286.

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Studying the genetics of seedcoat color in common bean (Phaseolus vulgaris L.) in F2 progenies is very difficult because of complex epistatic interactions, and the analysis is complicated further by multiple allelism, especially at the C locus. An alternative approach is to study seedcoat genetics by analyzing the F1 progeny of test crosses between a variety with unknown seedcoat genotype and genetic tester stocks with known genotypes. Twenty varieties, 18 with known genotype at C, were test crossed with the genetic tester stock cu BC3 5-593, where 5-593 is a recurrent parent with seedcoat gen

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41

Bassett, Mark J. "A Test Cross Protocol for Determining the Genotype of Dark Red Seedcoat Colors in Common Bean." Journal of the American Society for Horticultural Science 123, no. 6 (1998): 1048–52. http://dx.doi.org/10.21273/jashs.123.6.1048.

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The red common bean (Phaseolus vulgaris L.) seedcoat colors produced by the dominant gene R and the dark red kidney gene rkd are very similar, making it difficult for breeders of red bean varieties to know which genotype is in their materials. A protocol employing test crosses with genetic stocks having known genotypes for seedcoat colors was developed to identify genotypes with either of two very similar dark red seedcoat colors: garnet brown controlled by rkd and oxblood controlled by R. Twenty bean varieties and breeding lines were test crossed with genetic tester stocks cu BC3 5-593 and b

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42

Jahan, S. A., M. Y. A. Mollah, S. Ahmed, and M. A. B. H. Susan. "Copper-doped Hydroxyapatite for Removal of Arsenic(V) from Aqueous System." Journal of Scientific Research 9, no. 4 (2017): 383–402. http://dx.doi.org/10.3329/jsr.v9i4.32606.

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In this work, pure and copper-doped hydroxyapatite (various wt% of Cu) were synthesized by wet chemical precipitation method using eggshells as source of calcium. The efficiency of the prepared materials for removal of arsenic(V) from aqueous system has been investigated. Pure and Cu(II)-doped HAP were calcined at different temperatures ranging from 100-600 °C. The synthesized HAPs were characterized by Fourier Transform Infrared (FT-IR) spectroscopy, X-ray Diffraction (XRD), Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscpic Analysis (EDS), particle size analysis based o

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43

Chang, Chun-Chih, Elise Y. Li, and Ming-Kang Tsai. "A computational exploration of CO2 reduction via CO dimerization on mixed-valence copper oxide surface." Physical Chemistry Chemical Physics 20, no. 25 (2018): 16906–9. http://dx.doi.org/10.1039/c8cp00592c.

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44

Sun, Lin Hua. "Statistical Analysis of Heavy Metals in Bottom Sediments from the Tuo River in Suzhou City, China and its Implications for Source Identification." Advanced Materials Research 518-523 (May 2012): 1621–24. http://dx.doi.org/10.4028/www.scientific.net/amr.518-523.1621.

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Heavy metal (Zn, V, Cr, Co, Cu and Pb) concentrations in bottom sediments from Tuo River in Suzhou City have been analyzed for determing their average levels and distribution concentrations, and statistical analysis (correlation, cluster and principle component) have been taken place for evaluating their lithogenic and/or anthropogenic sources. The results imply that the concentration of metals following the order Co>Zn>V>Cr>Cu>Pb with homogeneous distribution. The lithogenic metals (V, Cr and Co) are enriched out of the city, whereas the anthropogenic (industry and vehicle rela

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Pantsyrny, V. I., N. E. Khlebova, S. V. Sudyev, O. V. Kukina, N. A. Beliakov, and M. V. Polikarpova. "Thermal Stability of the High Strength High Conductivity Cu–Nb, Cu–V, and Cu–Fe Nanostructured Microcomposite Wires." IEEE Transactions on Applied Superconductivity 24, no. 3 (2014): 1–4. http://dx.doi.org/10.1109/tasc.2013.2293655.

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Zhang, F., M. Li, C. C. Chum, and K. N. Tu. "Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages." Journal of Materials Research 17, no. 11 (2002): 2757–60. http://dx.doi.org/10.1557/jmr.2002.0397.

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In flip-chip packages, the effect of Ni metallization on the substrate side on interfacial reactions between solders and an Al/Ni(V)/Cu under-bump metallization (UBM) on the chip side was investigated during the reflow process. The Ni substrate metallization greatly accelerated interfacial reactions on the chip side and quickly degraded the thermal stability of the UBM due to a fast consumption of the Ni(V) layer. This phenomenon can be explained in terms of rapid Ni or Sn diffusion in the ternary (Cu,Ni)6Sn5 phase, which was formed in the solder adjacent to the Ni(V) layer and the enhanced di

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Jang, Hyun Tae, and Wang Seog Cha. "NOxremoval of Mn-Cu-TiO2and V/TiO2catalysts for the reaction conditions." Journal of the Korea Academia-Industrial cooperation Society 17, no. 7 (2016): 713–19. http://dx.doi.org/10.5762/kais.2016.17.7.713.

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Lu, Y., Y. X. Xiao, T. Dai, C. P. Wang, S. Y. Yang, and X. J. Liu. "Diffusion Barrier Behaviors of V-Ta, V-Ta-N and V-Ta/V-Ta-N Alloy Films in Cu Interconnects." Journal of Electronic Materials 49, no. 7 (2020): 4231–36. http://dx.doi.org/10.1007/s11664-020-08146-2.

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Liu, R. S., W. Zhou, R. Janes, and P. P. Edwards. "An investigation of the new high-TcTl-V-Sr-Ca-Cu-O and Tl-V-Sr-Ca-Y-Cu-O superconductors." Superconductor Science and Technology 4, no. 1S (1991): S310—S312. http://dx.doi.org/10.1088/0953-2048/4/1s/089.

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Karayilan, Dilek, Timur Dogu, Sena Yasyerli, and Gulsen Dogu. "Mn−Cu and Mn−Cu−V Mixed-Oxide Regenerable Sorbents for Hot Gas Desulfurization." Industrial & Engineering Chemistry Research 44, no. 14 (2005): 5221–26. http://dx.doi.org/10.1021/ie0492496.

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