Academic literature on the topic 'Current and voltage reference'

SAR-ADCs are very popular and suitable for conversions up to few tens of MHz with 8 to 12 bits of resolution. A very popular type is the Charge Redistribution SAR-ADC which is based on a capacitive array. Higher speeds can be achieved by using the interleaving technique where a number of SAR-ADCs are working in parallel. These speeds, however, can only be achieved if the reference voltage can cope with the switching of the capacitive array. In this thesis the design of a programmable voltage reference generator for a Charge Redistribution SAR-ADC was studied. A number of architectures were studied and one based on a Current Steering DAC was chosen because of the settling time that could offer to the Charge Redistribution SAR-ADC switching operation. This architecture was further investigated in order to spot the weak points of the design and try to minimize the settling time. In the end, the final design was evaluated and possible trimming techniques were proposed that could further speed up the design.

In this diploma thesis there is elaborated design of low-voltage power supply block using I3T25 technology. The theoretical part describes the basic structures used in the design, using CMOS and bipolar devices. Furthermore, the properties and the analysis used in the evaluation are described. In the design part there is an elaborated design of individual parts, including voltage references, current references, DAC converter, operational amplifier. In the last part, the power supply block is subjected to simulations for verification of temperature compensated output variables and analyzed circuit functionality.

The topic of the master´s thesis are voltage and current reference sources. There is detailed description of current and voltage references, which are basic building blocks of many analog circuits, in the theoretical part. Next part of the master´s thesis is the design of a voltage reference source, the design of a voltage reference generating two voltages and a current reference source. The correct function of all circuits have been verified using simulations, especially dependence of the output voltage or current on supply voltage or dependence of the output voltage or current when the ambient temperature is changed.

A contínua miniaturização das tecnologias CMOS oferece maior capacidade de integração e, consequentemente, as variações de temperatura dentro de uma pastilha de silício têm se apresentado cada vez mais agressivas. Ademais, dependendo da aplicação, a temperatura ambiente a qual o CHIP está inserido pode variar. Dessa maneira, procedimentos para diminuir o impacto dessas variações no desempenho do circuito são imprescindíveis. Tais métodos devem ser incluídos em ambos fluxos de projeto CMOS, analógico e digital, de maneira que o desempenho do sistema se mantenha estável quando a temperatura oscilar. A ideia principal desta dissertação é propor uma metodologia de projeto CMOS analógico que possibilite circuitos com baixa dependência térmica. Como base fundamental desta metodologia, o efeito de coeficiente térmico nulo no ponto de polarização da corrente de dreno (ZTC) e da transcondutância (GZTC) do MOSFET são analisados e modelados. Tal modelamento é responsável por entregar ao projetista analógico um conjunto de equações que esclarecem como a temperatura influencia o comportamento do transistor e, portanto, o comportamento do circuito. Essas condições especiais de polarização são analisadas usando um modelo de MOSFET que é contínuo da inversão fraca para forte. Além disso, é mostrado que as duas condições ocorrem em inversão moderada para forte em qualquer processo CMOS. Algumas aplicações são projetadas usando a metodologia proposta: duas referências de corrente baseadas em ZTC, duas referências de tensão baseadas em ZTC, e quatro circuitos gm-C polarizados em GZTC. A primeira referência de corrente é uma Corrente de Referência CMOS Auto-Polarizada (ZSBCR), que gera uma referência de 5uA. Projetada em CMOS 180 nm, a referência opera com uma tensão de alimentação de 1.4 à 1.8 V, ocupando uma área em torno de 0:010mm2. Segundo as simulações, o circuito apresenta um coeficiente de temperatura efetivo (TCeff ) de 15 ppm/oC para -45 à +85 oC e uma sensibilidade à variação de processo de = = 4:5% incluindo efeitos de variabilidade dos tipos processo e descasamento local. A sensibilidade de linha encontrada nas simulações é de 1%=V . A segunda referência de corrente proposta é uma Corrente de Referência Sem Resistor Auto-Polarizada com Capacitor Chaveado (ZSCCR). O circuito é projetado também em 180 nm, resultando em uma corrente de referência de 5.88 A, para uma tensão de alimentação de 1.8 V, e ocupando uma área de 0:010mm2. Resultados de simulações mostram um TCeff de 60 ppm/oC para um intervalo de temperatura de -45 à +85 oC e um consumo de potência de 63 W. A primeira referência de tensão proposta é uma Referência de Tensão resistente à pertubações eletromagnéticas contendo apenas MOSFETs (EMIVR), a qual gera um valor de referência de 395 mV. O circuito é projetado no processo CMOS 130 nm, ocupando em torno de 0.0075 mm2 de área de silício, e consumindo apenas 10.3 W. Simulações pós-leiaute apresentam um TCeff de 146 ppm/oC, para um intervalo de temperatura de 55 à +125oC. Uma fonte EMI de 4 dBm (1 Vpp de amplitude) aplicada na alimentação do circuito, de acordo com o padrão Direct Power Injection (DPI), resulta em um máximo de desvio DC e ondulação Pico-à-Pico de -1.7 % e 35.8m Vpp, respectivamente. A segunda referência de tensão é uma Tensão de Referência baseada em diodo Schottky com 0.5V de alimentação (SBVR). Ela gera três saídas, cada uma utilizando MOSFETs com diferentes tensões de limiar (standard-VT , low-VT , e zero-VT ). Todos disponíveis no processo adotado CMOS 130 nm. Este projeto resulta em três diferentes voltages de referências: 312, 237, e 51 mV, apresentando um TCeff de 214, 372, e 953 ppm/oC no intervalo de temperatura de -55 à 125oC, respectivamente. O circuito ocupa em torno de 0.014 mm2, consumindo um total de 5.9 W. Por último, circuitos gm-C são projetados usando o conceito GZTC: um emulador de resistor, um inversor de impedância, um filtro de primeira ordem e um filtro de segunda ordem. Os circuitos também são simulados no processo CMOS 130 nm, resultando em uma melhora na estabilidade térmica dos seus principais parâmetros, indo de 27 à 53 ppm/°C.<br>Continuing scaling of Complementary Metal-Oxide-Semiconductor (CMOS) technologies brings more integration and consequently temperature variation has become more aggressive into a single die. Besides, depending on the application, room ambient temperature may also vary. Therefore, procedures to decrease thermal dependencies of eletronic circuit performances become an important issue to include in both digital and analog Integrated Circuits (IC) design flow. The main purpose of this thesis is to present a design methodology for a typical CMOS Analog design flow to make circuits as insensitivity as possible to temperature variation. MOSFET Zero Temperature Coefficient (ZTC) and Transconductance Zero Temperature Coefficient (GZTC) bias points are modeled to support it. These are used as reference to deliver a set of equations that explains to analog designers how temperature will change transistor operation and hence the analog circuit behavior. The special bias conditions are analyzed using a MOSFET model that is continuous from weak to strong inversion, and both are proven to occur always from moderate to strong inversion operation in any CMOS fabrication process. Some circuits are designed using proposed methodology: two new ZTC-based current references, two new ZTC-based voltage references and four classical Gm-C circuits biased at GZTC bias point (or defined here as GZTC-C filters). The first current reference is a Self-biased CMOS Current Reference (ZSBCR), which generates a current reference of 5 A. It is designed in an 180 nm process, operating with a supply voltage from 1.4V to 1.8 V and occupying around 0:010mm2 of silicon area. From circuit simulations the reference shows an effective temperature coefficient (TCeff ) of 15 ppm/oC from 45 to +85oC, and a fabrication process sensitivity of = = 4:5%, including average process and local mismatch. Simulated power supply sensitivity is estimated around 1%/V. The second proposed current reference is a Resistorless Self-Biased ZTC Switched Capacitor Current Reference (ZSCCR). It is also designed in an 180 nm process, resulting a reference current of 5.88 A under a supply voltage of 1.8 V, and occupying a silicon area around 0:010mm2. Results from circuit simulation show an TCeff of 60 ppm/oC from -45 to +85 oC and a power consumption of 63 W. The first proposed voltage reference is an EMI Resisting MOSFET-Only Voltage Reference (EMIVR), which generates a voltage reference of 395 mV. The circuit is designed in a 130 nm process, occupying around 0.0075 mm2 of silicon area while consuming just 10.3 W. Post-layout simulations present a TCeff of 146 ppm/oC, for a temperature range from 55 to +125oC. An EMI source of 4 dBm (1 Vpp amplitude) injected into the power supply of circuit, according to Direct Power Injection (DPI) specification results in a maximum DC Shift and Peak-to-Peak ripple of -1.7 % and 35.8m Vpp, respectively. The second proposed voltage reference is a 0.5V Schottky-based Voltage Reference (SBVR). It provides three voltage reference outputs, each one utilizing different threshold voltage MOSFETs (standard-VT , low-VT , and zero-VT ), all available in adopted 130 nm CMOS process. This design results in three different and very low reference voltages: 312, 237, and 51 mV, presenting a TCeff of 214, 372, and 953 ppm/oC in a temperature range from -55 to 125oC, respectively. It occupies around 0.014 mm2 of silicon area for a total power consumption of 5.9 W. Lastly, a few example Gm-C circuits are designed using GZTC technique: a single-ended resistor emulator, an impedance inverter, a first order and a second order filter. These circuits are simulated in a 130 nm CMOS commercial process, resulting improved thermal stability in the main performance parameters, in the range from 27 to 53 ppm/°C.

The programmability property of floating-gate transistors is exploited in this work to compensate for mismatch and device parameter variations in various high performance analog circuits. A careful look is taken at the characteristics and behavior of floating-gate transistors; issues such as programming, precision, accuracy, and charge retention are addressed. An alternate approach to reduce the offset voltage of the amplifier is presented. The proposed approach uses floating-gate transistors as programmable current sources that provide offset compensation while being a part of the amplifier of interest during normal operation. This results in an offset voltage cancelation that is independent of other amplifier parameters and does not dissipate additional power. Two compact programmable architectures that implement a voltage reference based on the charge difference between two floating-gate transistors are introduced. The references exhibit a low temperature coefficient (TC) as all the transistors temperature dependencies are canceled. Programming the charge on the floating-gate transistors provides the flexibility of an arbitrary accurate voltage reference with a single design and allows for a high initial accuracy of the reference. Also, this work presents a novel programmable temperature compensated current reference. The proposed circuit achieves a first order temperature compensation by canceling the negative TC of an on-chip poly resistor with the positive TC of a MOS transistor operating in the ohmic region. Programmability of the ohmic resistor enables optimal temperature compensation while programmability of the reference voltage allows for an accurate current reference for a wide range of values. Finally, this work combines the already established DAC design techniques with floating-gate circuits to obtain a high precision converter. This approach enables higher accuracy along with a substantial decrease of the die size.

This diploma thesis deals with the design of eight-bit digital to analog coverter with fully differential outputs in technology I3T25 of ON Semiconductor company. The work contains the description of basic structures and characteristics of digital to analog converters. The main focus of the work is to design a converter and auxiliary circuits at the transistor level. The functionality of designed circuits is verified by simulation environment Cadence.

Frequency reference oscillator is a critical component of modern radio transceivers. Currently, most reference oscillators are based on low-frequency quartz crystals that are inherently bulky and incompatible with standard micro-fabrication processes. Moreover, their frequency limitation (<200MHz) requires large up-conversion ratio in multigigahertz frequency synthesizers, which in turn, degrades the phase-noise. Recent advances in MEMS technology have made realization of high-frequency on-chip low phase-noise MEMS oscillators possible. Although significant research has been directed toward replacing quartz crystal oscillators with integrated micromechanical oscillators, their phase-noise performance is not well modeled. In addition, little attention has been paid to developing electronic frequency tuning techniques to compensate for temperature/process variation and improve the absolute frequency accuracy. The objective of this dissertation was to realize high-frequency temperature-compensated high-frequency (>100MHz) micromechanical oscillators and study their phase-noise performance. To this end, low-power low-noise CMOS transimpedance amplifiers (TIA) that employ novel gain and bandwidth enhancement techniques are interfaced with high frequency (>100MHz) micromechanical resonators. The oscillation frequency is varied by a tuning network that uses frequency tuning enhancement techniques to increase the tuning range with minimal effect on the phase-noise performance. Taking advantage of extended frequency tuning range, and on-chip temperature-compensation circuitry is embedded with the sustaining circuitry to electronically temperature-compensate the oscillator. Finally, detailed study of the phase-noise in micromechanical oscillators is performed and analytical phase-noise models are derived.

Master’s thesis deals with design of laboratory supply with precise voltage and current measuring. At the beginning it presents properties, advantages and disadvantages of linear and switching supplies, based on these facts it chooses a linear type of regulator. The design continues with detailed description of power and control analog and digital circuits. The thesis includes description of taking control over the supply from the front panel or through computer. The last part is devoted to measurement results and to presentation of some static and dynamic parameters of the designed supply.

Disertační práce se zabývá proudovými konvejery CCII v proudovém modu s nízkým napájecím napětím. Potřeba velké rychlosti, vysokého výkonu a nízkého napájecího napětí pro mobilní elektroniku a komunikační systémy a potíže se současným stavem tlačí analogové návrháře k nalezení obvodové architektury a nové nízkopříkonové techniky. Je zde podrobně rozebrána technika složené kaskody a substrátu řízeného tranzistoru, která pomáhá produkci nízkopříkonových nízkovoltových obvodů. Dále jsou rozebrány a diskutovány základní funkční bloky, jako jsou proudová zrcadla, diferenční zesilovače a další, schopné pracovat při nízkých napájecích napětích. Jádrem práce je návrh konvejerů typu CCII s nízkým napájecím napětím. Jsou rozebrány jejich výhody a srovnání s konvenčními obvody. Princip a implementace operačního zesilovače založeného na proudovém konvejeru CCII je v práci navržen a popsán.