Relevant bibliographies by topics / CuSn6

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  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'CuSn6'

Author: Grafiati
Published: 4 June 2021
Last updated: 7 February 2022

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Journal articles on the topic "CuSn6"

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Nuckowski, P. M., W. Kwaśny, Z. Rdzawski, W. Głuchowski, and M. Pawlyta. "Influence of the Repetitive Corrugation on the Mechanism Occuring During Plastic Deformation of CuSn6 Alloy." Archives of Metallurgy and Materials 61, no. 3 (September 1, 2016): 1261–64. http://dx.doi.org/10.1515/amm-2016-0208.

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Abstract This paper presents the research results of CuSn6 alloy strip at semi-hard state, plastically deformed in the process of repetitive corrugation. The influence of process parameters on the mechanical properties and structure of examined alloy were investigated. Examination in high-resolution transmission electron microscopy (HRTEM) confirmed the impact of the repetitive corrugation to obtain the nano-scale structures. It has been found, that the application of repetitive corrugation increases the tensile strength (Rm), yield strength (Rp0.2) and elastic limit (Rp0,05) of CuSn6 alloy strips. In the present work it has been confirmed that the repetitive corrugation process is a more efficient method for structure and mechanical properties modification of commercial CuSn6 alloy strip (semi-hard) as compared with the classic rolling process.
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Lorenz, Martina, and Dietrich Bergner. "Investigations of precipitates in heat treated AgPd30/CuSn6 layers." Mikrochimica Acta 125, no. 1-4 (March 1997): 131–35. http://dx.doi.org/10.1007/bf01246175.

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Spann, Thomas, Dietrich Bergner, Bettina Teige, Siegfried D�britz, and Wolfgang Hauffe. "Short circuit diffusion in CuSn6/Ni/Au planar tricouples." Mikrochimica Acta 125, no. 1-4 (March 1997): 381–87. http://dx.doi.org/10.1007/bf01246215.

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Kwaśny, Waldemar. "Wpływ procesu naprzemiennego gięcia na mikrostrukturę i własności stopu CuSn6." INŻYNIERIA MATERIAŁOWA 1, no. 3 (July 5, 2015): 4–8. http://dx.doi.org/10.15199/28.2015.3.1.

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Haduch, J. "Effects of welding parameters on the quality of CuSn6 bronze overlays." Welding International 10, no. 7 (January 1996): 509–13. http://dx.doi.org/10.1080/09507119609549041.

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Amne Elahi, Mahdi, and Peter Plapper. "Dissimilar Laser Micro-Welding of Nickel Wire to CuSn6 Bronze Terminal." Transactions of the Indian Institute of Metals 72, no. 1 (November 30, 2018): 27–34. http://dx.doi.org/10.1007/s12666-018-1457-y.

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Lorenz, M., D. Bergner, and H. Baum. "Reactive diffusion in Pd/Ni/CuSn6 layer systems at 500�C." Fresenius' Journal of Analytical Chemistry 349, no. 1-3 (1994): 253–54. http://dx.doi.org/10.1007/bf00323304.

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Zhou, Li, Fei Xu, Mingrun Yu, Zhihua Jiang, Degang Zhao, Wenxiong He, and Yongxian Huang. "Microstructural Characteristics and Mechanical Properties of Friction-Stir-Welded CuSn6 Tin Bronze." Journal of Materials Engineering and Performance 28, no. 7 (July 2019): 4477–84. http://dx.doi.org/10.1007/s11665-019-04186-w.

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Głuchowski, Wojciech, Justyna Domagała-Dubiel, Jerzy Stobrawa, Zbigniew Rdzawski, and Joanna Sobota. "Effect of Continuous RCS Deformation on Microstructure and Properties of Copper and Copper Alloys Strips." Key Engineering Materials 641 (April 2015): 294–303. http://dx.doi.org/10.4028/www.scientific.net/kem.641.294.

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The aim of this work was to study the microstructure and mechanical properties of copper, brass CuZn36 and bronze CuSn6 strips annealed and after repetitive corrugation and straightening (RCS) process. The influence of process parameters on the functional properties of strips was investigated. The study found an increase in the yield strength and tensile strength of the material after RCS process. Crystallite size measurement confirmed the presence of nanoscale structures in the studied materials after deformation by RCS process. The used method of plastic deformation is promising for development materials with improved functional properties. The paper presents also the results of numerical simulations of Cu strip after corrugation on groove and tooth rolls and next straightening. Rolling process simulations were conducted using Forge 2011® based on the finite element method.
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Shang, Quanbo, Aibing Yu, Jianzhao Wu, Chenchun Shi, and Weiyang Niu. "Influence of heat affected zone on tribological properties of CuSn6 bronze laser dimple textured surface." Tribology International 105 (January 2017): 158–65. http://dx.doi.org/10.1016/j.triboint.2016.10.008.

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Dissertations / Theses on the topic "CuSn6"

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Kočka, Jiří. "Výroba konektoru." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2014. http://www.nusl.cz/ntk/nusl-231636.

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The diploma thesis deal with the proposal of connector manufacturing from bronze sheet CuSn6, thickness 1.5mm in production volume of 1.600.000 parts per year. From considered manufacturing variants there was chosen shearing and forming technology of thread in the progressive stamping die. For part production was selected pressing machine Bruderer 1250 with nominal pressing force 1250 kN from company E. Bruderer Maschinenfabrik AG. In the economical evaluation there were determined expenses 21.6 Kč per one piece including demanded profit. The turning point was calculated at production of 165.522 parts.
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Meudre, Charline. "Obtention de revêtements électrochimiques de bronze en milieu acide avec ajout d'additifs organique à base de gélatine." Thesis, Besançon, 2015. http://www.theses.fr/2015BESA2011/document.

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Les normes environnementales, en constante évolution, deviennent de plus en plus strictes pour réduire la présence de métaux et / ou composés organiques volatils dans l’environnement. Cette restriction constitue donc une préoccupation industrielle majeure dans le domaine des traitements de surface où les métaux sont prépondérants. Depuis peu le nickel a été placé en CMR (cancérogène, mutagène et reprotoxique) et appartient donc à la liste de produits à éviter. En conséquence, des alternatives au revêtement de nickel sont très sollicitées par les industriels afin de respecter l’environnement tout en gardant les mêmes performances de dépôts que le nickel (bonne résistance à la corrosion,…). Notre axe de recherche concerne la formulation et la caractérisation de dépôts électrolytiques d’alliages cuivre – étain considérés comme alternative au nickel. Une première partie porte sur les mécanisme d’électrodéposition des alliage cuivre étain en présence de gélatine et en milieu acide et sulfate. Une deuxième partie apporte des compléments d’informations sur les mécanismes mis en œuvre lors de l’électrodéposition des alliages CuSn. La gélatine, présent [Sic] dans l’électrolyte, modifie les revêtements CuSn élaborés identifiant un phénomène d’adsorption de substrat de platine. Un mode d’action de la gélatine suivant le modèle de Norde a été proposé. Cette étude s’oriente vers une application industrielle, c’est pourquoi une troisième partie est dédiée à l’élaboration et la caractérisation des revêtements CuSn sur différents substrats (laiton, acier
To date, nickel electrodeposition plays a key role in a variety of decorative, engineering and electroforming applications due to its costs that are maintained at an acceptable level, and their excellent functional properties (corrosion resistance…). Environmental constraints lead to increasingly severe regulations. […] This study focuses on the formulation of an acid and sulfate electrolyte. […] In the present study, deposition of Cu-Sn on platinum substrate was studied, and the role of gelatin at the interface was investigated. A phenomenon of gelatin adsorption is determined by different techniques of the characterization. The third part of this study deals with the electrodeposition of CuSn alloys on different substrates moving towards industrial application. The end goal is to identify optimum operating conditions based on gelatin action
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Choi, Sikyung. "Synthesis of new molybdenum perfluoropinacolate complexes and investigation of CuSn alloys for nitrate reduction." Thesis, 2020. https://hdl.handle.net/2144/40942.

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Fluorinated alkoxide ligands, including perfluoropinacol (H2pinF), have been investigated for their ability to support high oxidation status for 3d transition metals. Molybdenum is a 4d transition metal used for its catalytic effect in nature as well as in industry. Three new Mo pinF -containing anions [MoO3(pinF)]2-, [Mo2O4(μ2-O)(pinF)2]2-, [Mo2O2(μ-O)2(pinF)2]2- have been synthesized and structurally characterized. The pinF ligands have been found to stabilize both monomeric and dimeric Mo(V) complexes and a dimeric Mo(VI) complex. These compounds can be further studied to look for catalytic redox reactions, and for potential understanding of the rates and mechanism of catalysis. Algal blooms are environmentally hazardous phenomena that cause major damage to aquatic ecosystems. One factor responsible for this effect is the overuse of nitrogen-based fertilizers that has led to accumulation of nitrate (NO3-) in open waters. Nitrate is a nutrient for algae, and when algae proliferate too quickly it causes hypoxia of water. Cu is a well-known catalyst for the electrocatalytic reduction of NO3- and Sn is known to promote selectivity for N2 as the final product of NO3- reduction. The catalytic effect of CuSn alloys for the reduction of nitrate and nitrite have been studied to find the optimum Cu to Sn ratio for this application. It was found that a ratio of 1:1 resulted in the highest peak catalytic current but still less than pure Cu. Additionally, deposition methods on a glassy carbon electrode (GCE) were optimized. It was found that Cu-Sn co-deposition on GCE by controlled potential electrolysis (CPE) was found to be most stable when surfactant K3citrate was added to the deposition solution. Analysis of the final products of NO3- reduction through a microcolorimetric assay was inconclusive and requires further optimization to obtain meaningful data.
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Book chapters on the topic "CuSn6"

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Spittel, Marlene, and Thilo Spittel. "Flow stress, mechanical and physical properties of CuSn6." In Part 3: Non-ferrous Alloys - Heavy Metals, 259–63. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-642-14174-4_36.

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Hummel, Marc, Christoph Schöler, and Arnold Gillner. "Metallographic Comparison for Laser Welding of Cu-ETP and CuSn6 with Laser Beam Sources of 515 nm and 1030 nm Wavelength." In Lecture Notes in Mechanical Engineering, 14–28. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-70332-5_2.

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Villars, P., K. Cenzual, R. Gladyshevskii, O. Shcherban, V. Dubenskyy, V. Kuprysyuk, I. Savysyuk, and R. Zaremba. "CuSn(OH)6." In Landolt-Börnstein - Group III Condensed Matter, 77. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-22847-6_31.

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Spittel, Marlene, and Thilo Spittel. "Flow stress, mechanical and physical properties of CuSn2." In Part 3: Non-ferrous Alloys - Heavy Metals, 250–53. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-642-14174-4_34.

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Spittel, Marlene, and Thilo Spittel. "Flow stress, mechanical and physical properties of CuSn4." In Part 3: Non-ferrous Alloys - Heavy Metals, 254–58. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-642-14174-4_35.

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Spittel, Marlene, and Thilo Spittel. "Flow stress, mechanical and physical properties of CuSn8." In Part 3: Non-ferrous Alloys - Heavy Metals, 264–68. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-642-14174-4_37.

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Cihak-Bayr, Ulrike, Robin Jisa, and Friedrich Franek. "Wear Protective Effects of Tribolayer Formation for Copper Based Alloys in Sliding Contacts: Alloy Dependent Sliding Surfaces and Their Effects on Wear and Friction." In Tribology [Working Title]. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.94210.

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High sliding wear resistance is generally attributed to high hardness and high mechanical strength. Novel near net shape process technologies such as metal injection moulding (MIM) or lost foam casting (LF) lack forming processes that typically increase strength. Consequently, the materials exhibit large-grained microstructures with low defect densities. Commercial copper alloys (CuSn8, CuNi9Sn6, CuSn12Ni2) well known for good sliding properties were produced using MIM and LF and characterised in the current study. Their wear and friction behaviour was compared to conventionally produced variants in a lubricated, reciprocating sliding test against steel. The results showed an equal or superior wear resistance and lower friction levels for large-grained microstructures evolving in MIM and LF. SEM, FIB and EBSD studies revealed a tribolayer on the surface and a tribologically transformed layer (TTL), composed of a nano-crystalline zone or partially rotated grains, and selective hardening of grains. The extent of the TTL was different for alloys that were chemically identical but exhibited different initial microstructures. Innovative production routes investigated here showed no tribological drawbacks, but present the potential to increase lifetime, as nano-crystalline zones may render the sample more prone to wear. We present a hypothesis on the cause for these behaviours.
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Keller, Petra, and Hans-Henning Strehblow. "Passivity of Tin and CuSn Alloys in Alkaline Media studied by X-ray Photoelectron Spectroscopy." In Passivation of Metals and Semiconductors, and Properties of Thin Oxide Layers, 137–42. Elsevier, 2006. http://dx.doi.org/10.1016/b978-044452224-5/50023-8.

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Conference papers on the topic "CuSn6"

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Zhong, Minlin, and Xichen Yang. "Laser cladding of CuSnP alloy on HT2040 cast iron." In Optical Tools for Manufacturing and Advanced Automation, edited by Leonard R. Migliore and Richard W. Walker. SPIE, 1994. http://dx.doi.org/10.1117/12.167657.

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Aboy, Blaine Corwyn D., Edward James A. Bariring, Jym Paul Carandang, Francis George C. Cabarle, Ren Tristan De La Cruz, Henry N. Adorna, and Miguel Angel Martinez-del-Amor. "optimizations in CuSNP Simulator for Spiking Neural P Systems on CUDA GPUs." In 2019 International Conference on High Performance Computing & Simulation (HPCS). IEEE, 2019. http://dx.doi.org/10.1109/hpcs48598.2019.9188174.

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Chikova, O. A., V. Yu Il’in, V. S. Tsepelev, and V. V. V’yukhin. "Electrical resistivity of liquid CuSn, CuSnBi, CuSnBiIn, CuSnBiInCd alloys of equiatomic compositions." In PHYSICS, TECHNOLOGIES AND INNOVATION (PTI-2019): Proceedings of the VI International Young Researchers’ Conference. AIP Publishing, 2019. http://dx.doi.org/10.1063/1.5134167.

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Sekhar, V. N., Lee Jun Su, Justin See Toh Wai Hong, and Chen Bangtao. "Chip to chip hermetic bonding and multi-chip stacking using CuSn bonding technology." In 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). IEEE, 2013. http://dx.doi.org/10.1109/eptc.2013.6745699.

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Park, Jongwoo, Miji Lee, Kyunghwan Min, J.-K. Choi, C.-K. Joo, S.-C. Park, Hanbyul Kang, and Sangwoo Pae. "Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation." In 2015 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2015. http://dx.doi.org/10.1109/irps.2015.7112791.

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De Vos, J., A. Jourdain, M. A. Erismis, W. Zhang, K. De Munck, A. La Manna, D. S. Tezcan, and P. Soussan. "High density 20μm pitch CuSn microbump process for high-end 3D applications." In 2011 IEEE 61st Electronic Components and Technology Conference (ECTC). IEEE, 2011. http://dx.doi.org/10.1109/ectc.2011.5898486.

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Murugesan, M., H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, and M. Koyanagi. "Minimizing the local deformation induced around Cu-TSVs and CuSn/InAu-microbumps in high-density 3D-LSIs." In 2012 IEEE International Electron Devices Meeting (IEDM). IEEE, 2012. http://dx.doi.org/10.1109/iedm.2012.6479124.

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Eckert, S., G. Gerbeth, T. Gundrum, and F. Stefani. "Velocity Measurements in Metallic Melts." In ASME 2005 Fluids Engineering Division Summer Meeting. ASMEDC, 2005. http://dx.doi.org/10.1115/fedsm2005-77089.

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Various developments of velocity measuring techniques, their tests in different liquid metals, and applications in hot melts are reported. A Mechano-Optical Probe (MOP) performing local measurements up to temperatures of about 700°C has been developed and successfully tested. The Ultrasound Doppler Velocimetry (UDV) can be considered as another attractive technique to get velocity data from opaque flows. To extend the application range to higher temperatures and to abrasive liquids a new integrated ultrasonic sensor with an acoustic wave guide has been designed. First successful measurements in a CuSn melt of about 620°C and in liquid Al of about 750°C were carried out. A fully contactless investigation of the mean velocity field is possible by magnetic tomography. Local measurements of the induced magnetic field and the application of inverse reconstruction techniques allow an analysis of the flow structure. A first demonstration experiment showing the feasibility of this approach for the reconstruction of the three-dimensional mean velocity structure is presented.
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Cherneva, S., R. Iankov, and D. Stoychev. "Investigation of the influence of the concentrations of Sn in electrochemically deposited CuSn alloy films on their mechanical properties." In RECENT DEVELOPMENTS IN NONLINEAR ACOUSTICS: 20th International Symposium on Nonlinear Acoustics including the 2nd International Sonic Boom Forum. AIP Publishing LLC, 2015. http://dx.doi.org/10.1063/1.4934287.

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Song, Ning, Jian Chen, Chang Yan, Xiaoming Wen, Xiaojing Hao, and Martin A. Green. "Effect of a ZnS intermediate layer on properties of Cu2ZnSnS4 films from sputtered Zn/CuSn precursors on Si (100) substrate." In 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC). IEEE, 2016. http://dx.doi.org/10.1109/pvsc.2016.7749871.

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