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Dissertations / Theses on the topic 'Deep reactive ion etching (DRIE)'

Author: Grafiati

Published: 4 June 2021

Last updated: 2 February 2022

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1

Chung, Charles Choi. "Thermomigrated Junction Isolation of Deep Reactive Ion Etched, Single Crystal Silicon Devices, and its Application to Inertial Navigation Systems." Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/5120.

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The introduction of deep reactive ion etching (DRIE) technology has greatly expanded the accessible design space for microscopic systems. Structures that are hundreds of micrometers tall with aspect ratios of 40:1, heretofore impossible, can now be achieved. However, this technology is primarily a forming technology, sculpting structures from a substrate. This work seeks to complement deep reactive ion etching by developing an electrical isolation technology to enable electro-mechanical function in these new deep reactive ion etched structures. The objective of the research is twofold. The

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2

Perng, John Kangchun. "High Aspect-Ratio Nanoscale Etching in Silicon using Electron Beam Lithography and Deep Reactive Ion Etching (DRIE) Technique." Thesis, Georgia Institute of Technology, 2006. http://hdl.handle.net/1853/11543.

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This thesis reports the characterization and development of nanolithography using Electron Beam Lithography system and nanoscale plasma etching. The standard Bosch process and a modified three-pulse Bosch process were developed in STS ICP and Plasma ICP system separately. The limit of the Bosch process at the nanoscale regime was investigated and documented. Furthermore, the effect of different control parameters on the process were studied and summarized in this report. 28nm-wide trench with aspect-ratio of 25 (smallest trench), and 50nm-wide trench with aspect ratio of 37 (highest aspect-rat

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3

Yung, Chi-Fan 1973. "A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding." Thesis, Massachusetts Institute of Technology, 1999. http://hdl.handle.net/1721.1/80148.

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4

Aydemir, Akin. "Deep-trench Rie Optimization For High Performance Mems Microsensors." Master's thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/12608719/index.pdf.

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This thesis presents the optimization of deep reactive ion etching process (DRIE) to achieve high precision 3-dimensional integrated micro electro mechanical systems (MEMS) sensors with high aspect ratio structures. Two optimization processes have been performed to achieve 20 &amp<br>#956<br>m depth for 1 &amp<br>#956<br>m opening for a dissolved wafer process (DWP) and to achieve 100 &amp<br>#956<br>m depth for 1 &amp<br>#956<br>m opening for silicon-on-glass (SOG) process. A number of parameters affecting the etch rate and profile angle are investigated, including the step times, etch step p

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Shearrow, Anne M. "Ionic liquid-mediated sol-gel sorbents for capillary microextraction and challenges in glass microfabrication." [Tampa, Fla] : University of South Florida, 2009. http://purl.fcla.edu/usf/dc/et/SFE0002988.

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6

Morgan, Brian C. "Development of a deep silicon phase Fresnel lens using gray-scale lithography and deep reactive ion etching." College Park, Md. : University of Maryland, 2004. http://hdl.handle.net/1903/240.

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Thesis (M.S.) -- University of Maryland, College Park, 2004.<br>Thesis research directed by: Dept. of Electrical and Computer Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.

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7

Gould, Parker Andrew, and Mitchell David Hsing. "Design, fabrication, and characterization of a compact deep reactive ion etching system for MEMS processing." Thesis, Massachusetts Institute of Technology, 2014. http://hdl.handle.net/1721.1/93835.

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Thesis: S.M., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2014.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (pages 123-126).<br>A general rule of thumb for new semiconductor fabrication facilities (Fabs) is that revenues from the first year of production must match the capital cost of building the fab itself. With modem Fabs routinely exceeding $1 billion to build, this rule serves as a significant barrier to entry for groups seeking to commercialize new semiconductor devices aimed at smaller market segme

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8

Diaz, Jaime O. (Jaime Oscar Diaz Villamil). "A feature-to-wafer-scale model of etch-rate non-uniformity in deep reactive ion etching/." Thesis, Massachusetts Institute of Technology, 2010. http://hdl.handle.net/1721.1/61572.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2010.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (p. 76-77).<br>Deep Reactive Ion Etching (DRIE) is an inherently complex dry etching process commonly used in the semiconductor manufacturing industry. This work presents a new modeling approach to capture global etch rate variation in DRIE by integrating wafer- and feature-scale nonuniformity models that are grounded on an ion-neutral synergy model for etch rate. Our method focuses on diffusive tran

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9

Malik, Adnan Muhammad. "Development of High Aspect Ratio Nano-Focusing Si and Diamond Refractive X-ray optics using deep reactive ion etching." Thesis, University of Oxford, 2013. http://ora.ox.ac.uk/objects/uuid:588ca438-e4c6-4d51-8f13-30bcb3c437a3.

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This thesis is devoted to the development of nano-focusing refractive optics for high energy X-rays using planar microelectronic technology. The availability of such optics is the key for the exploitation of high brilliance third and fourth generation X-ray sources. Advancements in the quality of optics available are commensurate with advancements in the fabrication technology. The fabrication process directly influences the quality and performance, so must be understood and controlled. In the first part of this thesis, the development of high aspect ratio Si kinoform lenses is examined. It is

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10

Dhru, Shailini Rajiv. "Process Development For The Fabrication Of Mesoscale Electrostatic Valve Assembly." Master's thesis, University of Central Florida, 2007. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/4244.

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This study concentrates on two of the main processes involved in the fabrication of electrostatic valve assembly, thick resist photolithography and wet chemical etching of a polyamide film. The electrostatic valve has different orifice diameters of 25, 50, 75 and 100 μm. These orifice holes are to be etched in the silicon wafer with deep reactive ion etching. The photolithography process is developed to build a mask of 15 μm thick resist pattern on silicon wafer. This photo layer acts as a mask for deep reactive ion etching. Wet chemical etching process is developed to etch kapton po

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11

Kremin, Christoph [Verfasser], Martin [Akademischer Betreuer] Hoffmann, Peter [Akademischer Betreuer] Schaaf, and Uwe [Akademischer Betreuer] Schnakenberg. "Fabrication and application of self-masked silicon nanostructures in deep reactive ion etching processes / Christoph Kremin. Martin Hoffmann. Peter Schaaf. Uwe Schnakenberg." Ilmenau : Universitätsbibliothek Ilmenau, 2010. http://d-nb.info/1008088250/34.

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12

Chaudhary, Ashish. "Miniature Ion Optics Towards a Micro Mass Spectrometer." Scholar Commons, 2014. https://scholarcommons.usf.edu/etd/5410.

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This PhD dissertation reports the development of miniature ion optics components of a mass spectrometer (MS) with the ultimate goal to lay the foundation for a compact low-power micromachined MS (µMS) for broad-range chemical analysis. Miniaturization of two specific components a) RF ion traps and b) an ion funnel have been investigated and miniature low-power versions of these components have been developed and demonstrated successfully in lab experiments. Power savings, simpler electronics and packaging schemes required to operate the micro-scale RF cylindrical ion traps have been the key mo

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13

Yildirim, Alper. "Development Of A Micro-fabrication Process Simulator For Micro-electro-mechanical-systems(mems)." Master's thesis, METU, 2005. http://etd.lib.metu.edu.tr/upload/12606850/index.pdf.

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ABSTRACT DEVELOPMENT OF A MICRO-FABRICATION PROCESS SIMULATOR FOR MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) Yildirim, Alper M.S, Department of Mechanical Engineering Supervisor: Asst. Prof. Dr. Melik D&ouml<br>len December 2005, 140 pages The aim of this study is to devise a computer simulation tool, which will speed-up the design of Micro-Electro-Mechanical Systems by providing the results of the micro-fabrication processes in advance. Anisotropic etching along with isotropic etching of silicon wafers are to be simulated in this environment. Similarly, additive processes like do

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14

Griss, Patrick. "Micromachined Interfaces for Medical and Biochemical Applications." Doctoral thesis, KTH, Signals, Sensors and Systems, 2002. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3353.

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15

Šilhan, Lukáš. "Konstrukce spektroskopického systému pro systém reaktivního iontového leptání." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2019. http://www.nusl.cz/ntk/nusl-400965.

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Measurement of absorption spectra of plasma during reactive ion etching enables characterization of etched species and control over the etching process. Aim of this diploma thesis is to design spectroscope with Czerny-Turner configuration for reactive ion etching system. Developed spectroscope achieves 1 nm resolution in 350-800 nm range. Device was tested during reactive ion etching of silicon.

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16

Montgomery, Matthew. "Magnetically Deflectable MEMS Actuators for Optical Sensing Applications." Master's thesis, University of Central Florida, 2009. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/6226.

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In this work, new small deflection magnetic actuators have been proposed, designed, and tested for applications in Surface Enhanced Raman Scattering optical sensors. Despite the fact that SERS sensors have been shown to increase Raman over ten orders of magnitude for molecular detection, several technological challenges have prevented the design of practical sensors, such as making SERS sensors that can efficiently detect a wide variety of molecules. Since the optimum signal-to-noise in SERS occurs at different excitation wavelengths for different molecules, individual metal nanostructures nee

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17

Wallis, Kirsty. "Design of experiment studies for the fabrication processes involved in the micro-texturing of surfaces for fluid control." Thesis, Cranfield University, 2013. http://dspace.lib.cranfield.ac.uk/handle/1826/8456.

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This thesis focuses on the use of a design of experiment approach to examine the significance of process factors and interactions on the fabrication of micro- textured surfaces. The micro-textured surfaces examined contain pillar and hole features ranging from 80 – 2 micrometers in diameter. The processes examined are the deep reactive ion etching of silicon wafers for the production of silicon mould inserts and the micro-injection moulding of polypropylene, high density polyethylene and 316LS stainless steel replicate samples of the silicon mould insert. During the deep reactive ion etching o

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18

Haubold, Marco. "Erarbeitung einer Fertigungstechnologie und Charakterisierungsmethodik für die Herstellung hochsensitiver Vibrationssensoren unter Nutzung des Mikroschweißprozesses." Doctoral thesis, Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-197160.

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Die vorliegende Arbeit beschreibt einen neuartigen Ablauf zur Herstellung eines Vibrationssensors auf Waferebene. Die Besonderheit des Sensors liegt in der Reduktion des Spaltmaßes der kapazitiven Elektroden im Anschluss an die Strukturerzeugung. Dies gelingt unter Nutzung des Mikroschweißprozess von Siliziumelementen. Hierbei sieht die innovative Fertigungstechnologie eine Strukturhöhe von 100 μm vor. Zusätzlich wird die Erarbeitung einer Struktur für die Durchführung eines Mikrozugversuchs auf Waferebene beschrieben. Dieser dient der Bestimmung der maximal ertragbaren Zugkraft mikromechanisc

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19

Helke, Christian. "Herstellung von neuartigen Reflektorsystemen und Erarbeitung einer systembezogenen Integrationstechnologie für VIS und IR Fabry-Pérot Interferometer." Universitätsverlag Chemnitz, 2018. https://monarch.qucosa.de/id/qucosa%3A33494.

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Die vorliegende Arbeit beschreibt die Entwicklung und Herstellung von Fabry-Pérot Interferometern (FPI) für die spektrale Analyse von Gasen und Flüssigkeiten. Die FPI werden miniaturisiert mittels Siliziumtechnologie hergestellt und ermöglichen kleine Mikrospektrometer mit hohem Auflösungsvermögen. Die vorliegende Dissertation untersucht Technologie- und Herstellungskonzepte für den sichtbaren (VIS) und infraroten (IR) Spektralbereich mit jeweils unterschiedlichen Reflektorkonzepten. Im VIS-Spektralbereich erfolgt neben der Entwicklung von Bragg-Reflektoren auch die Betrachtung von strukturie

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20

Piot, Adrien. "Etude de la fabrication et de la transduction d'un microgyromètre piézoélectrique tri-axial en GaAs." Thesis, Université Paris-Saclay (ComUE), 2018. http://www.theses.fr/2018SACLS059/document.

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Un microgyromètre 3 axes permet avec une structure unique de mesurer la vitesse de rotation d’un objet autour des trois axes de l’espace. Les micro-gyromètres 3 axes existants sont peu nombreux et typiquement résonants, fabriqués en technologie silicium par micro-usinage de surface, à transductions électro-statiques, et conçus pour des applications de fort volume ou la taille et le coût sont des critères majeurs. Dans cette thèse nous avons étudié la transduction et le procédé de fabrication d’un gyromètre résonant 3 axes à actionnement et détection piézoélectriques, fabriqué par micro-usinage

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21

Chapellier, Paul. "MEMS piézo-électriques pour applications temps-fréquence." Thesis, Bourgogne Franche-Comté, 2019. http://www.theses.fr/2019UBFCD058.

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Les oscillateurs hautes performances mettent en œuvre un résonateur mécanique présentant un facteur de qualité élevé et vibrant à une fréquence typique de 10 MHz. Le résonateur est généralement une pastille de quartz, réalisée par usinage individuel, d’environ 200 mm3, et placée dans une enceinte thermalisée. Dans le contexte de miniaturisation des composants électroniques, conséquence du développement des technologies embarquées, des objets connectés et des nouvelles normes de télécommunication, une réduction du volume du résonateur et l’utilisation de procédés de fabrication collectifs perme

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22

Haubold, Marco. "Erarbeitung einer Fertigungstechnologie und Charakterisierungsmethodik für die Herstellung hochsensitiver Vibrationssensoren unter Nutzung des Mikroschweißprozesses." Doctoral thesis, Universitätsverlag der Technischen Universität Chemnitz, 2015. https://monarch.qucosa.de/id/qucosa%3A20393.

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Die vorliegende Arbeit beschreibt einen neuartigen Ablauf zur Herstellung eines Vibrationssensors auf Waferebene. Die Besonderheit des Sensors liegt in der Reduktion des Spaltmaßes der kapazitiven Elektroden im Anschluss an die Strukturerzeugung. Dies gelingt unter Nutzung des Mikroschweißprozess von Siliziumelementen. Hierbei sieht die innovative Fertigungstechnologie eine Strukturhöhe von 100 μm vor. Zusätzlich wird die Erarbeitung einer Struktur für die Durchführung eines Mikrozugversuchs auf Waferebene beschrieben. Dieser dient der Bestimmung der maximal ertragbaren Zugkraft mikromechanisc

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23

Teng, Yuan-Chi, and 鄧元吉. "Microfluidics Fabrication Using Deep Reactive Ion Etching Technology." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/21029943836663976779.

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碩士<br>逢甲大學<br>資訊電機工程碩士在職專班<br>99<br>Based on semiconductor and deep reactive ion etching techniques, the microfulidic fabrication is studied. To fabricate PMMA microfluidic disc, The reaction process parameters are discussed for studying Polymethyl methacrylate（PMMA）etching effects, such as RF power, etching time, gas flow rate, ESC temperature, helium flow rate, and chamber pressure. The PMMA etching depth is proportional to etching time. The higher output power of RF generator is, the deeper PMMA depth is. But high output power may induce temperature rise on etching surface that caused surfa

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24

Taylor, Hayden K., Hongwei Sun, Tyrone F. Hill, Martin A. Schmidt, and Duane S. Boning. "A Two-level Prediction Model for Deep Reactive Ion Etch (DRIE)." 2004. http://hdl.handle.net/1721.1/7469.

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We contribute a quantitative and systematic model to capture etch non-uniformity in deep reactive ion etch of microelectromechanical systems (MEMS) devices. Deep reactive ion etch is commonly used in MEMS fabrication where high-aspect ratio features are to be produced in silicon. It is typical for many supposedly identical devices, perhaps of diameter 10 mm, to be etched simultaneously into one silicon wafer of diameter 150 mm. Etch non-uniformity depends on uneven distributions of ion and neutral species at the wafer level, and on local consumption of those species at the device, or die, leve

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25

Imura, Yuki. "In situ laser etch-depth monitoring of the deep reactive ion etching process." Thesis, 2003. http://library1.njit.edu/etd/fromwebvoyage.cfm?id=njit-etd2003-005.

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Thesis (M.S.) -- New Jersey Institute of Technology, Committee for the Interdisciplinary Program in Materials Science and Engineering, 2003.<br>Includes bibliographical references. Also available via the World Wide Web.

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26

Wang, Ying-ming, and 王英名. "Investigation of Micro-Thermoforming Process Using Silicon Mold Fabricated by Deep Reactive Ion Etching." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/22665765567902674074.

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碩士<br>國立成功大學<br>化學工程學系碩博士班<br>96<br>In this study, we investigated the micro-thermoforming process for fabrication of polymeric thin film microstructures using silicon molds. The silicon molds with high aspect ratio microstructures (HARMs) were fabricated via inductive coupled plasma-reactive ion etching (ICP-RIE) process. The polymeric thin films with two different thicknesses were used and various processing conditions such as film temperature, applied pressure and thermoforming time were discussed. The result showed that the silicon molds with and without the through holes were constructed

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27

Lee, Hsieh-Yu, and 李協宇. "Fabrication of the Underwater Acoustic Sensor by using one-step Deep Reactive-Ion Etching process." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/86454585656291712810.

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碩士<br>國立成功大學<br>系統及船舶機電工程學系碩博士班<br>94<br>This study reports a novel design of a MEMS type underwater acoustic sensor using 6”single-crystalline silicon wafer. At resonant frequent of the membrane structure , a high signal-to-noise ratio is expected by chemical vapor deposition thin layers of silicon nitride and poly-silicon , the sensing membrane and piezo-resistive material are patterned and etched using lithography and dry etching process, respectively. After the gold wire is patterned, the entire back side of the sensing membrane is etched in order to create the cavity by back-side etching

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28

Chou, Qiong-Ru, and 周瓊茹. "Fabrication of deep sub-micrometer silicon cylinder array using e-beam lithography and reactive ion etching." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/00880349585709860408.

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碩士<br>國立中正大學<br>物理所<br>94<br>In electron beam lithography, the matter wave length of electron, which be added 20 keV voltage, is pproximately 10-11m. The wave length is smaller than 193 nm or 157 nm that the Optical lithography excimer laser wave length has. In general, the electron beam lithography has the very good ability of high resolution, and the resolution can reach several nm degree(ignoring exposure depth).The electron beam lithography can be used in photo masks fabrication, direct e-bean writing, and nanometer structures fabrication. In our article, we try to fabricate high aspect r

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