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Relevant bibliographies by topics / Device integration

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Academic literature on the topic 'Device integration'

Author: Grafiati

Published: 3 June 2025

Last updated: 23 June 2025

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Journal articles on the topic "Device integration"

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Deutschle, Jennifer, Patrick Beyersdorffer, Denise Junger, Michael Tangemann, Björn Seitz, and Oliver Burgert. "Integration Models for SDC-capable Medical Devices into an Existing OR Network." Current Directions in Biomedical Engineering 10, no. 4 (2024): 179–82. https://doi.org/10.1515/cdbme-2024-2043.

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Abstract The interconnection of medical devices in an operating room (OR) represents a major step in optimizing clinical processes and increasing the quality of treatment. The IEEE 11073 Service-oriented Device Connectivity (SDC) standard family constitutes the foundation for manufacturerindependent information exchange and remote control of medical devices. However, integrating new SDC-capable devices into an existing OR network poses a major challenge for medical device manufacturers. Thus, suitable integration models are required. This work focuses on the definition of three possible integration models and their comparison according to architectural design patterns. Thereby, the use case of integrating a high-frequency (HF) surgical device to interconnect with existing SDC-capable devices is pursued. One of the models, which focuses on high expandability and low coupling, was successfully applied to interconnect an HF surgical device with an OR light in the research OR of Reutlingen University. The results indicate transferability to other integration scenarios and are intended to further promote manufacturer-independent integrated ORs.

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Chen, Changming, Junyu Li, Chunxue Wang, et al. "Study of an Integration Platform Based on an Adiabatic Active-Layer Waveguide Connection for InP Photonic Device Integration Mirroring That of Heterogeneous Integration on Silicon." Photonics 8, no. 10 (2021): 433. http://dx.doi.org/10.3390/photonics8100433.

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In this work, a photonic device integration platform capable of integration of active-passive InP-based photonic devices without the use of material regrowth is introduced. The platform makes use of an adiabatic active-layer waveguide connection (ALWC) to move an optical beam between active and passive devices. The performance of this platform is analyzed using an example made up of four main sections: (1) a fiber coupling section for enabling vertical beam coupling from optical fiber into the photonic chip using a mode-matched surface grating with apodized duty cycles; (2) a transparent waveguide section for realizing passive photonic devices; (3) an adiabatic mode connection structure for moving the optical beam between passive and active device sections; and (4) an active device section for realizing active photonic devices. It is shown that the coupled surface grating, when added with a bottom gold reflector, can achieve a high chip-to-fiber coupling efficiency (CE) of 88.3% at 1550 nm. The adiabatic active-layer mode connection structure has an optical loss of lower than 1% (CE > 99%). The active device section can achieve an optical gain of 20 dB/mm with the use of only 3 quantum wells. The optimized structural parameters of the entire waveguide module are analyzed and discussed.

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Prayag, Ganoje. "Continuous Integration and Deployment Pipelines." Journal of Scientific and Engineering Research 7, no. 3 (2020): 324–27. https://doi.org/10.5281/zenodo.13752931.

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This research paper explores the principles and best practices of Continuous Integration (CI) and Continuous Deployment (CD) pipelines, focusing on their application in the development of medical device software. As the healthcare industry increasingly relies on software-driven medical devices, ensuring efficient and reliable software delivery is paramount. This paper examines the key components of CI/CD pipelines, discusses best practices for implementation, and presents case studies of successful CI/CD strategies in the medical device industry. The paper also addresses common challenges, potential pitfalls, and future trends in CI/CD for medical device software development.

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Abubakar, Usman, and Abdullahi Abubakar Yunusa. "Investigating academic staff behavioral intention and readiness to utilise mobile devices for instructional delivery among tertiary institutions in Sokoto State, Nigeria." Advances in Mobile Learning Educational Research 4, no. 1 (2024): 1046–57. http://dx.doi.org/10.25082/amler.2024.01.015.

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This research investigates academic staff's behavioural intentions and technological readiness regarding integrating mobile devices for instructional delivery among tertiary institutions in Sokoto State, Nigeria. Descriptive statistics were used to analyse responses from 325 academic staff members regarding their behavioural intentions, technological readiness, challenges, and perceptions of mobile device integration. The findings reveal a generally positive disposition among academic staff towards mobile device utilisation, with high mean scores indicating willingness to integrate mobile devices into teaching activities and positive perceptions of their impact on student learning outcomes. Despite challenges such as inadequate technological infrastructure, limited professional development opportunities, and resistance to change, it is crucial to implement strategic interventions. Recommendations have been made to improve institutional collaboration, infrastructure, technical support systems, and professional development to facilitate effective mobile device integration. These findings contribute to the discourse on technology-enhanced learning in Nigerian higher education and offer practical insights for policy-makers, administrators, and educators seeking to harness the potential of mobile devices for educational advancement.

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Oklobdzija, Danilo, and Branislav Jevtovic. "Using XML Web services as a platform for remote access and control of embedded systems." Facta universitatis - series: Electronics and Energetics 21, no. 1 (2008): 23–36. http://dx.doi.org/10.2298/fuee0801023o.

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This paper has pointed out the need for new technologies for integrating embedded devices in heterogeneous distributed networks, and outlines the perspectives opened by applying service-oriented paradigm for realizing interaction with embedded devices. As a foundation for interaction with embedded devices, XML and Web services have been used. Strong integration power of XML and Web services make presented framework appropriate for unique approach to all resources of embedded device regardless of applied technology. Developed Web services based middleware, provides application designers with a high level of semantic abstraction, hiding the complexity of the applied technologies. This makes presented framework suitable for use in many domains, independent of embedded devices physical realization or network characteristics. Two ways to achieve such integration have been presented in this paper: device level for modern embedded devices, and using service oriented gateway for "legacy" embedded systems. .

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Furubayashi, Yutaka, Takafumi Tanehira, Kei Yonemori, Nobuhide Seo, and Shinichiro Kuroki. "3D Integration of Si-Based Peltier Device onto 4H-SiC Power Device." Materials Science Forum 858 (May 2016): 1107–11. http://dx.doi.org/10.4028/www.scientific.net/msf.858.1107.

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We propose 3-D integration of Peltier device onto a power device. In order to transport a heat from the power device, as a suitable material of the Peltier device, silicon was adopted because of its high Seebeck coefficient, high thermal conductivity, and applicability to semiconductor process. Bulk Si-based Peltier devices with conventional shape showed an active thermal transport over a Joule heat at the operation current less than 5 A. 3-D integration of 4H-SiC-based Schottky barrier diodes and Si-based film Peltier device, separated by intrinsic SiC layer, was realized by using conventional Si-based process flow.

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FUNAKI, Tsuyoshi. "Switching Device for System Integration." Journal of The Institute of Electrical Engineers of Japan 140, no. 7 (2020): 416–19. http://dx.doi.org/10.1541/ieejjournal.140.416.

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Jagadish, Chennupati, P. Daniel Dapkus, Luke J. Mawst, and Amr S. Helmy. "Special Issue: Optoelectronic Device Integration." IEEE Journal of Quantum Electronics 48, no. 2 (2012): 83–85. http://dx.doi.org/10.1109/jqe.2011.2180831.

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Colombo, Luigi, Robert M. Wallace, and Rodney S. Ruoff. "Graphene Growth and Device Integration." Proceedings of the IEEE 101, no. 7 (2013): 1536–56. http://dx.doi.org/10.1109/jproc.2013.2260114.

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Krupar, Joerg, Heiko Hauswald, and Ronny Naumann. "A Substrate Current Less Control Method for CMOS Integration of Power Bridges." Advances in Power Electronics 2010 (September 23, 2010): 1–11. http://dx.doi.org/10.1155/2010/909612.

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Modern electronical devices use high integration to decrease device size and cost and to increase reliability. More and more devices appear that integrate even power devices into VLSI circuits. When driving inductive loads, this is a critical step because freewheeling at a power device appears. In these applications usually special technologies with extra wells for the power devices, SOI technologies, or BiCMOS technologies are required to suppress any substrate current. However, the use of these technologies results in higher production cost for the device. We present a method to control the freewheeling actively. Using this approach we are able to integrate the power devices using a normal CMOS technology.

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Dissertations / Theses on the topic "Device integration"

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Raja, Hamran, and Roshan Lee. "Integration of a Drainage Device." Thesis, KTH, Tillämpad maskinteknik (KTH Södertälje), 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-190025.

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Lim, Desmond Rodney. "Device integration for silicon microphotonic platforms." Thesis, Massachusetts Institute of Technology, 2000. http://hdl.handle.net/1721.1/16784.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000.<br>Also available online at the MIT Theses Online homepage <http://thesis.mit.edu/><br>Includes bibliographical references (p. 199-211).<br>This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.<br>Silicon ULSI compatible, high index contrast waveguides and devices provide high density integration for optical networking and on-chip optical interconnects. Four such waveguide systems were fabricated and analyzed: crystalline silicon-on-insulator (SOI) strip, polycrystalline silicon (polySi) strip, silicon nitride strip and SPARROW waveguides. The loss of 15 dB/cm measured through an SOI waveguide was the smallest ever measured for a silicon strip waveguide and is due to improved side-wall roughness. The TM mode of a single mode polySi strip waveguide with a 1:2.5 aspect ratio exhibited, surprisingly, smaller loss than the TE mode. Further, analysis shows that high index contrast waveguides are more sensitive to polarization dependent loss in the presence of surface roughness. Single mode bends and splits in both silicon and silicon nitride were studied. 0.01 dB/turn loss has been measured for 2 micron radius silicon bends. Polarization dependent loss was also observed; the bending loss of a TM mode was, as expected, much larger than that of a TE mode. The splitting losses for two-degree Y-split was 0.15 dB/split. A 1x16 multi-mode interferometer splitter occupied an area of 480 sq-microns and exhibited loss of 3 dB. ULSI compatible waveguide structures integrated with micro-resonators have been studied. Qs of 10000 and efficiencies close to 100% were achieved in high index contrast ring resonators and Qs of 100 million were achieved in microsphere resonators. A thermal and mechanical tuning mechanism was demonstrated for micro-ring resonators.<br>(cont.) In addition, >95% coupling efficiency between SPARROW waveguides and microspheres was achieved, the first microspheres to be coupled to integrated optics waveguides. 1x4 wavelength division multiplexing devices have been, for the first time, demonstrated in high index contrast silicon and silicon nitride strip waveguide systems. These systems have a component density of 1-million devices/sq-cm. Higher order filters made from multiple rings exhibited flat top responses and the expected steeper roll-off resonance response. Integrated modulators and switches based on waveguides and rings were also studied. Finally, the integration of the components in systems applications was analyzed. A study of the effect of polarization and loss in silicon microphotonics waveguide systems is presented.<br>by Desmond Rodney Lim Chin Siong.<br>Ph.D.

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Bruno, B. "Secure Mobile Device Integration for Automotive Telematics." Thesis, Honours thesis, University of Tasmania, 2005. https://eprints.utas.edu.au/241/1/bpbruno_Thesis.pdf.

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The vehicle is a challenging environment in which to interact with computing devices. Therefore, the vehicle environment offers computing a unique challenge, in that a method for safe and secure mobile device integration is required in order to provide a suitable communications channel for interaction with devices without distracting from the primary driving task. Moreover, a security architecture is required for mobile device integration in the vehicle paradigm. This architecture must be scalable, efficient and most importantly built on trusted and mathematically sound algorithms. This thesis examines the relevant literature in the field of automotive telematics, including the notion of mobile device integration. Moreover, issues in the vehicle paradigm are also discussed which include driver distraction, and the legal ramifications of in-vehicle mobile phone use. From a system design view point this thesis will then provide an overview of the design requirements for telematics products, and outline possible security protocols which could be implemented on constrained mobile devices. The ultimate aim of this thesis is to develop a security architecture for mobile device integration for automotive telematics based on the simple network management protocol (SNMPv3) user security model.

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Lippitt, Alex. "Development of a bioimpedance-based swallowing biofeedback device with smart device integration." Thesis, University of Canterbury. Electrical and Computer Engineering, 2015. http://hdl.handle.net/10092/10975.

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Low resolution pharyngeal manometry is an invasive diagnostic method that has recently been used as a biofeedback device for swallowing rehabilitation. The University of Canterbury Rose Centre uses pharyngeal manometry to diagnose and rehabilitate subjects who suffer from pharyngeal mis-sequencing. Pharyngeal mis-sequencing occurs when pressure is applied simultaneously throughout the pharynx rather than sequentially. Rehabilitation can only be performed in clinic due to the need for specialized equipment and trained staff, and the invasiveness of the test limits the time that can be spent training. As an alternative method to measure the pharyngeal pressure sequence, bioimpedance has been investigated by a previous University of Canterbury Master’s student. A prototype was developed that measured bioimpedance in two locations as a proxy for pharyngeal pressure sequence. The prototype device named GULPS (Guided Utility for Latency in Pharyngeal Swallowing), measured a change in impedance during swallowing. However, the features of this waveform were inconsistent and were not present during every swallow. The frequency of the current that passes through tissue affects its path through the tissue, therefore impacting the measured impedance. To improve the consistency of the impedance measurement, the effect of current injection frequency was investigated. A modular-hardware system was created from the original design to allow testing of different injection frequencies. The hardware was further developed by replacing the method of generating the constant amplitude current injection signal. The improvement to the design resulted in a differently-shaped waveform to that of the previous prototype, including a new feature. This feature is a single peak that occurred in both channels and was reproduced in every swallow. Experimentation showed that the features were not obviously frequency dependent. The separation between the peaks of the two impedance channels was compared with the separation between the two pressure peaks recorded during simultaneous pharyngeal manometry but there was no significant correlation between the two measures of peak-peak separations. Two alternative hardware/signal conditioning changes were trialled: electrical isolation of each channel and a subtraction method, which aims to remove the effect of the changing impedance between the two electrode channels. Electrical isolation of the two channels had no effect on the impedance waveforms. However, the subtraction method produced a different output and requires further investigation as the output was inconsistent. Bluetooth communication was integrated into the GULPS hardware, and a corresponding Android Application (App) was written. The developed App was successful in displaying the impedance measurement output and adds greater user flexibility, allowing the user to interface with the bioimpedance measurement hardware from their tablet or phone. With no measured significant correlation between GULPS and pharyngeal manometry, further research needs to be performed to better relate the features measured by GULPS to those seen during pharyngeal manometry. Until this can be achieved, the GULPS device cannot replace pharyngeal manometry for biofeedback-based rehabilitation of pharyngeal mis-sequencing.

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Liddiard, C. L. "Charge integration and multigrid techniques in semiconductor device simulation." Thesis, Swansea University, 1987. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.637908.

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Science and technology is experiencing a period of very rapid change which is euphemistically referred to as the information technology revolution. The main impetus for the latter is born of the ability to fabricate many thousands of devices on a single slice of monolithic crystal, otherwise known as the 'chip'. The ability to do this has meant that the power of the computer touches all facets of society. It is not surprising, therefore, that a great deal of emphasis is placed upon device fabrication. As functional circuits use more and more components, device geometries get progressively smaller, so that the only realistic way of predicting the behaviour of a device is through a computer model, or a device simulation. It is in obtaining improvements in the latter that forms the motivation for this thesis. In the early part of the thesis, the essential groundwork in electronic devices is covered. It serves to introduce both devices and approximate analytic modelling, thus showing the advantages of full numerical simulation. The results obtained serve as qualitative references, giving an idea of the type of solutions to be expected. The calculation of charge integrals is investigated. A fully consistent method contrasts the simpler 'lumping', and results for both formulations are presented. These results have prompted analytic investigations, which, in one dimension, have highlighted serious stability problems in consistent charge integration. In two dimensions, consistent charge integration has also been shown to produce oscillatory results. The origin of these 'wiggles' has been demonstrated as dependent on the mesh topology, showing fully consistent integration to be impractical. This leads to the recommendation of charge 'lumping', which extends to higher dimensions also. An exposition of the 'Multigrid' method is given, with particular emphasis on application to device simulation. All algorithms utilised are described, with detailed definition of problem dependent parameters. An optimal damping factor for damped Jacobi relaxation has been developed in respect of the Pisson equation. The contraction map defined may be extended to allow a fully consistent definition of the map for a general finite element discrete system. 'Multigrid' has been shown to be viable, within the limits of the model presented, for the continuity equations. The final chapter of the thesis serves to unite the material presented. The innovative aspects of the work are highlighted, with particular reference to previously published activity in these areas. This naturally describes the significance of the thesis in device simulation literature.

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Tibavinsky, Ivan Andres. "A microfabricated rapid desalting device for integration with electrospraying tip." Thesis, Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/52226.

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Electrospray Ionization (ESI) is a technique that permits the soft ionization of large proteins and biomolecules without fragmenting them, which allows them to be characterized via Mass Spectrometry (MS). It has the potential of permitting the identification of transient intermediate products in biological processes in situ, which would provide great insight to researchers in the growing fields of proteomics and metabolomics. However, this application presents a technical challenge in that most relevant biochemistry occurs in aqueous solutions with high salt content, which makes successful identification of analytes by ESI-MS difficult. This thesis presents the design, fabrication, and characterization of a microfabricated dialysis module that could alleviate this issue by desalting samples inline between sampling and electrospraying interfaces. Its small volume (~10 nL) minimizes sample transit time and, thus, optimizes ESI-MS analysis temporal resolution. A preliminary analytical model of dialysis elucidates the key performance parameters and sets the guidelines for consideration in its design. The device is then microfabricated in a cleanroom environment using techniques that have been well established by the microelectronics industry such as E-beam evaporation and Reactive Ion Etching. The system efficiency is demonstrated experimentally by assessing its salt removal effectiveness as a function of sample residence time. Mass spectrometry analyses of proteins in solutions with high salt content further corroborate its performance.

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FARAONE, GABRIELE. "Two-Dimensional Phosphorus: From the Synthesis Towards the Device Integration." Doctoral thesis, Università degli Studi di Milano-Bicocca, 2021. http://hdl.handle.net/10281/304380.

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Gli allotropi bidimensionali (2D) del silicio e del fosforo sono stati i predecessori fra i materiali monoelementali 2D dopo il grafene. I vantaggi scientifici e tecnologici di questi materiali richiedono lo sviluppo di schemi di processo che possano garantire la loro effettiva integrazione in nuovi dispositivi per la nanoelettronica. In questo lavoro di tesi, sono stati investigati alcuni degli ostacoli ancora irrisolti lungo la strada per l’integrazione in dispositivo degli allotropi 2D del fosforo considerando specificatamente il caso delle fasi 2D α-P (corrispondente a un singolo strato di fosforo nero o fosforene) e \ β -P (fosforene-blu). L’integrazione della fase 2D α-P nell’architettura di un dispositivo è stata oggetto di ampie ricerche e si basa su un percorso abbastanza consolidato che ha portato ad applicazioni che spaziano in un’ampia gamma di campi. Uno dei pochi ostacoli rimanenti su questo percorso è la mancanza di un metodo scalabile per produrre 2D α-P su grandi aree e con un accurato controllo dello spessore. In particolare, tale controllo è difficile da raggiungere nell’esfoliazione di cristalli stratificati di fosforo nero (BP). A questo proposito, la spettroscopia micro-Raman è stata usata sia come uno strumento metrologico per determinare lo spessore delle scaglie cristalline esfoliate che come metodo per raggiungere una controllata riduzione del loro spessore sfruttando la tecnica di assottigliamento laser. Tuttavia, i metodi di determinazione dello spessore basati sulla calibrazione delle intensità delle bande Raman sono stati investigati poco nel caso di scaglie cristalline multistrato. In questo lavoro di tesi abbiamo proposto un nuovo approccio basato sulla spettroscopia Raman che ha permesso di discriminare velocemente lo spessore di scaglie cristalline esfoliate di BP tra i 5 nm e i 100 nm. Inoltre, al fine di raggiungere un controllo migliore nel processo di assottigliamento laser, abbiamo anche investigato gli effetti dovuti al substrato sul riscaldamento e ablazione laser in scaglie multistrato di BP. Esperimenti di termometria Raman e calcoli numerici sul problema della diffusione del calore hanno chiarito che effetti ottici, termici e meccanici causati dalla presenza del substrato possono agire differentemente sul riscaldamento e sull’ablazione laser a seconda dello spessore delle scaglie cristalline. Il percorso di integrazione in dispositivo per la fase 2D β -P, invece, è ancora assente a causa delle richieste più stringenti nella sintesi, basata su tecniche epitassiali, e dei problemi di instabilità fuori dall’ambiente di crescita in UHV. Questi ostacoli sono comunemente condivisi con gli altri membri della famiglia degli Xeni 2D e, in questo lavoro, sono stati studiati considerando il caso di β -P cresciuto epitassialmente su substrati di Au(111)/mica. I dettagli della sua struttura atomica e la reattività chimica all’esposizione in-situ ed ex-situ all’ossigeno sono stati analizzati con l’aiuto della microscopia a scansione ad effetto tunnel (STM) e spettroscopia fotoelettronica a raggi X (XPS). I problemi di instabilità in aria sono stati affrontati sviluppando una opportuna strategia di incapsulamento basata sulla crescita in-situ di un film protettivo di Al2O3 che, a sua volta, ha permesso di maneggiare il fosforo epitassiale lungo i primi passi di un processo di integrazione in dispositivo. Da questo punto di vista, sono stati esaminati due nuovi approcci per il trasferimento di un materiale epitassiale da un substrato di crescita verso substrati target. Ambedue questi metodi di trasferimento possono essere adeguatamente generalizzati all’intera classe degli Xeni epitassiali 2D cresciuti su metallo/mica. In particolare, l’universalità di questi approcci è stata impiegata per la fabbricazione di dispositivi FET e MIM sia su membrane di Al2O3/silicene multistrato/Ag(111) che su Al2O3/fosforo epitassiale/Au(111).<br>Phosphorus and silicon two-dimensional (2D) allotropes have been the forerunners among the post-graphene monoelemental 2D materials. The scientific and technological advantages of these materials require the development of processing methods to guarantee their effective integration in new devices for nanoelectronics. In the present thesis work, some of the unresolved bottlenecks along the device integration path of 2D elemental phosphorus allotropes have been examined considering specifically the case of the α-P (single-layer black phosphorus or phosphorene) and β-P (blue phosphorene) 2D polymorphs. The integration of the 2D α-P phase in devices has been the subject of extensive investigations and nowadays relies on an almost consolidated path that has led to applications spanning a wide range of fields. One of the few remaining obstacles on this path is the lack of a scalable method to produce 2D α-P layers on large areas and with accurate control of the thickness. In particular, such control is difficult to achieve in the exfoliation of layered black phosphorus (BP) crystals. In this respect, micro-Raman spectroscopy has been used both as a metrological tool to determine the thickness of the exfoliated flakes and as method to achieve their controllable thickness reduction employing the laser thinning technique. However, thickness determination methods based on the calibration of the intensity of the Raman bands have been poorly investigated in the case of multilayer BP flakes due to difficulties caused by optical interferences and anisotropy effects. In this thesis work, we have proposed a novel Raman spectroscopy approach that, carefully accounting for these effects, allowed the quick discrimination of the thickness of exfoliated BP flakes between 5 nm and 100 nm. Moreover, in order to achieve a better control of the laser thinning process down to the ultimate 2D limit, we have also investigated the effects of the substrate on the laser heating and ablation of multilayer BP flakes. Raman thermometry experiments and numerical calculations of the heat diffusion problem have elucidated that optical, thermal, and mechanical effects caused by the substrate may act differently on the laser heating and ablation of the flakes depending on their thickness. An effective device integration route for the 2D β-P phase, instead, is still missing due to more stringent requirements in its synthesis, based on epitaxial techniques, and to the instability issue outside the UHV growth environment. These obstacles are commonly shared with other members of the family of 2D epitaxial Xenes and, in this work, have been investigated considering the case of β-P epitaxially grown on Au(111)/mica substrates. The details of its atomic structure and the chemical reactivity to ex-situ and in-situ oxygen exposure have been analyzed with the aid of Scanning Tunneling Microscopy (STM) and X-Ray Photoelectron Spectroscopy (XPS). The air-instability issues have been tackled by developing a suitable encapsulation strategy based on the in-situ growth of an Al2O3 capping layer that, in turn, allowed the handling of epitaxial phosphorus along the preliminary steps of a device integration process. In this respect, two novel approaches for the transfer of the epitaxial membrane from the growth substrate towards target substrates have been surveyed. Both the transfer methods can be suitably generalized to the whole class of 2D epitaxial Xenes grown on metal/mica paving the way for the establishment of methodological standards for their manipulation. In particular, the universality of such approaches has been exploited for the successful fabrication of back-gated FET and MIM devices on Al2O3/multilayer silicene/Ag(111) and Al2O3/epitaxial phosphorus/Au(111) mica-delaminated membranes, respectively. The epitaxial phosphorus MIM devices may open intriguing perspectives in the study of the non-volatile resistive switching in monoelemental epitaxial 2D materials.

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Gupta, Sanjay M. Eng Massachusetts Institute of Technology. "Key supply chain integration factors for success of medical device startups." Thesis, Massachusetts Institute of Technology, 2018. http://hdl.handle.net/1721.1/117921.

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Thesis: M. Eng. in Supply Chain Management, Massachusetts Institute of Technology, Supply Chain Management Program, 2018.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (pages 60-62).<br>Healthcare cost are on the rise and becoming a major concern in the US economy. In fact, healthcare spending is the largest individual contributor to US gross domestic product. Various stakeholders such as government, insurance and payors are now looking at the healthcare providers and manufacturers to come up with innovative and cost-effective solutions. Medical device manufacturers rely heavily on startups to provide new technology solutions to market. Yet, survival rate of these startups is very low. Various factors contribute to the success of these startups such as: market scope, financial support, supply chain integration, patent protection, regulatory compliance, founders experience and more. This thesis investigates supply chain integration factors contributing to the success of medical device startups. Sixteen key supply chain integration factors were identified using systematic literature review and interview research methodology. A survey was conducted to a range of industry participants to validate these factors. Survey responses were then analyzed and validated using statistical application SAS JIMP. Most of the factors stem from regulatory requirements as laid down by U.S. Food and Drug Administration. Out of sixteen factors, Quality management system, good manufacturing practice and collaboration with suppliers and distributors were identified as most critical to the success of medical device startups. These supply chain integration factors were further categorized under three major categories namely compliance, cost and collaboration. A medical device startup need to manage simultaneously all supply chain integration factors under these three categories. The findings of the research would be useful to medical device startups to bring lifesaving innovative solutions in market and contribute to success of these startups.<br>by Sanjay Gupta.<br>M. Eng. in Supply Chain Management

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Dayeh, Shadi A. "Semiconductor nanowires for future electronics growth, characterization, device fabrication, and integration /." Diss., Connect to a 24 p. preview or request complete full text in PDF format. Access restricted to UC campuses, 2008. http://wwwlib.umi.com/cr/ucsd/fullcit?p3316154.

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Thesis (Ph. D.)--University of California, San Diego, 2008.<br>Title from first page of PDF file (viewed September 4, 2008). Available via ProQuest Digital Dissertations. Vita. Includes bibliographical references.

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Samandari, Rohan. "Integration of Bluetooth Sensors in a Windows-Based Research Platform." Thesis, Malmö universitet, Institutionen för datavetenskap och medieteknik (DVMT), 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:mau:diva-43037.

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This thesis describes how to build a solution for transmitting data from an Electroencephalography (EEG) device to a server in real-time while guiding the user through a number of predefined exercises. This solution will be used by Spinal Cord Injury (SCI) patients suffering from neuropathic pain, in order to understand if it is possible to predict such pain from EEG. The collected data will help clinicians analyze the brain activity data from patients who can submit the data from their home. To accomplish this development task, an application was built that connects to a portable EEG device, gather brain activity data from patients, guides patients through a set of imaginary tasks and sends the data to a server. This project made use of a Software Development Kit (SDK) for the Python programming language and a web sockets server written in JavaScript. The application was tested both in terms of usability and end-to-end latency, showing high usability and low latency. The proposed solution will support a clinical trial in Spain with 40 SCI patients.

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Books on the topic "Device integration"

1

Gonschorek, Karl-Heinz, and Ralf Vick. Electromagnetic Compatibility for Device Design and System Integration. Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-03290-5.

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L, Engl W., ed. Process and device modelling. North-Holland, 1986.

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Workshop on Large Scale Computational Device Modeling (1985 Naperville, Ill.). Large scale computational device modeling. Coordinated Science Laboratory, University of Illinois, 1986.

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Kwyro, Lee, ed. Semiconductor device modeling for VLSI. Prentice Hall, 1993.

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Wolfgang, Karthe, Commission of the European Communities. Directorate-General for Science, Research, and Development., European Optical Society, and Society of Photo-optical Instrumentation Engineers., eds. Nanofabrication technologies and device integration: 13-14 April 1994, Lindau, FRG. SPIE, 1994.

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Huang, Weixin. Economic integration as a development device: The case of the EC and China. Verlag breitenbach Publishers, 1992.

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Man, Cham Kit, ed. Computer-aided design and VLSI device development. Kluwer Academic Publishers, 1986.

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Källbäck, Bengt. High-Speed Electronics: Basic Physical Phenomena and Device Principles. Springer Berlin Heidelberg, 1986.

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David, Burnett, Kimura Shiníchiro, Singh Bhanwar, et al., eds. Challenges in process integration and device technology: 18-19 September 2000, Santa Clara, USA. SPIE, 2000.

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J, Motta Ricardo, Berberian Hapet A, IS & T--the Society for Imaging Science and Technology., and Society of Photo-optical Instrumentation Engineers., eds. Device-independent color imaging and imaging systems integration: 1-3 February 1993, San Jose, California. SPIE, 1993.

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Book chapters on the topic "Device integration"

1

Weik, Martin H. "integration device." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_9250.

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Weik, Martin H. "wire integration device." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_21152.

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Weik, Martin H. "wire-optical integration device." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_21161.

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Weik, Martin H. "optical-wire integration device." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_13183.

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Weik, Martin H. "radio-wire integration device." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_15423.

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Schulz, B., T. Köpnick, and M. Schirmer. "New Functional Materials for MicroNano Fabrication and Device." In MicroNano Integration. Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-642-18727-8_30.

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Lair, Robert. "System Integration and Device Support." In Beginning Silverlight 4 in C#. Apress, 2010. http://dx.doi.org/10.1007/978-1-4302-2989-6_10.

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Lair, Robert. "System Integration and Device Support." In Beginning Silverlight 5 in C#. Apress, 2012. http://dx.doi.org/10.1007/978-1-4302-3462-3_10.

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Weik, Martin H. "fiber optic-wire integration device." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_7045.

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Weik, Martin H. "wire-fiber optic integration device." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_21146.

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Conference papers on the topic "Device integration"

1

CHEN, CONG, and QING LIU. "Design and verification of a miniaturized high density WDM array device." In Optical Devices and Integration, edited by Linjie Zhou. SPIE, 2024. https://doi.org/10.1117/12.3050837.

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Maehara, Masataka, Jaber Derakhshandeh, Carine Gerets, et al. "IMC Assisted Die-Bonding for Stacked Device Integration." In 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). IEEE, 2024. http://dx.doi.org/10.1109/estc60143.2024.10712004.

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Belkin, Mikhail A. "Mid-infrared Photonic Integration and Nonlinear Optics on InP." In CLEO: Applications and Technology. Optica Publishing Group, 2024. http://dx.doi.org/10.1364/cleo_at.2024.aw4h.5.

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Due to its transparency and intersubband devices compatibility, InP platform is well-suited for mid-infrared photonic integration. We characterize mid-infrared losses and nonlinearities, demonstrate supercontinuum generation, and present functional components and device integration on this platform.

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Qiao Li and Feng Liu. "The future of the device integration: Field device integration." In 2011 IEEE 2nd International Conference on Software Engineering and Service Science (ICSESS). IEEE, 2011. http://dx.doi.org/10.1109/icsess.2011.5982422.

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Bauer, Charles E., and Herbert J. Neuhaus. "3D device integration." In 2009 11th Electronics Packaging Technology Conference (EPTC). IEEE, 2009. http://dx.doi.org/10.1109/eptc.2009.5416508.

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Stephan, K. D. "New device/circuit integration." In IEEE Antennas and Propagation Society International Symposium 1992 Digest. IEEE, 1992. http://dx.doi.org/10.1109/aps.1992.221649.

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Zhang, Yu, and Feng Liu. "Fieldbus Device United Integration Architecture." In 2010 International Conference on Computational Intelligence and Software Engineering (CiSE). IEEE, 2010. http://dx.doi.org/10.1109/cise.2010.5676758.

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Du, Baolin, Hong-Xia Wu, and Jiapeng Wang. "Calibration device for laser target simulator." In Optoelectronic Devices and Integration, edited by Daoxin Dai, Xiao-Cong Yuan, and Zhiping Zhou. SPIE, 2019. http://dx.doi.org/10.1117/12.2547589.

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Chao Chen and A. Helal. "Device Integration in SODA Using the Device Description Language." In 2009 Ninth Annual International Symposium on Applications and the Internet (SAINT 2009). IEEE, 2009. http://dx.doi.org/10.1109/saint.2009.24.

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Kliem, Andreas, Marc Koner, Soren Weissenborn, and Marvin Byfield. "The Device Driver Engine - Cloud enabled ubiquitous device integration." In 2015 IEEE Tenth International Conference on Intelligent Sensors, Sensor Networks and Information Processing (ISSNIP). IEEE, 2015. http://dx.doi.org/10.1109/issnip.2015.7106921.

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Reports on the topic "Device integration"

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Xu, Xiaodong, Mark Mirotznik, Michael Hochberg, and David Castner. Optoelectronic Device Integration in Silicon (OpSIS). Defense Technical Information Center, 2015. http://dx.doi.org/10.21236/ad1003428.

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Martinez, Carlos J., Amit Goyal, Alberto Saiani, David Gracias, and Rajesh R. Naik. Integrated Miniaturized Materials - From Self-Assembly to Device Integration. Volume 1272. Defense Technical Information Center, 2011. http://dx.doi.org/10.21236/ada537907.

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Smith, J. H., S. Montague, J. J. Sniegowski, and J. R. Murray. Characterization of the embedded micromechanical device approach to the monolithic integration of MEMS with CMOS. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/380312.

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Barton, Thomas, Morris Argyle, and Tiberiu Popa. The Integration of a Structural Water Gas Shift Catalyst with a Vanadium Alloy Hydrogen Transport Device. Office of Scientific and Technical Information (OSTI), 2009. http://dx.doi.org/10.2172/968223.

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Davis, R. F., M. Harris, S. Halpern, S. Siebert, and M. Patel. Materials Processing and Device Development to Achieve Integration of Low Defect Density III Nitride Based Radio Frequency. Defense Technical Information Center, 2001. http://dx.doi.org/10.21236/ada389624.

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Davis, Robert F., and Kevin J. Linthicum. Materials Processing and Device Development to Achieve Integration of Low Defect Density III Nitride Based Radio Frequency. Defense Technical Information Center, 2000. http://dx.doi.org/10.21236/ada383629.

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VAWTER, GREGORY A., SHAWN-YU LIN, CHARLES T. SULLIVAN, et al. Photonics Integration Devices and Technologies. Office of Scientific and Technical Information (OSTI), 2001. http://dx.doi.org/10.2172/780313.

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Golovacheva, Larissa. Integration modules for electronic systems. Intellectual Archive, 2024. http://dx.doi.org/10.32370/iaj.3067.

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As the innovative practice of recent years has shown, one of the main issues and problems of complex smart electronic devices, especially those including laser diodes, is the issue of reliable and efficient cooling In order to eliminate energy losses and increase the output of effective energy, especially in various lighting systems, an active search is being carried out for integrative technical solutions that allow, without the use of additional structural elements and additional energy costs for cooling, In parallel, we are searching for and developing technical solutions that make it possible, with the most concise and simple design, to increase the output light power of lighting devices with a relatively low power and, accordingly, low energy consumption.

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Choquette, K. D., K. M. Geib, H. Q. Hou, et al. Wafer Fusion for Integration of Semiconductor Materials and Devices. Office of Scientific and Technical Information (OSTI), 1999. http://dx.doi.org/10.2172/8371.

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Smith, J. H., S. Montague, J. J. Sniegowski, and P. J. McWhorter. Embedded micromechanical devices for the monolithic integration of MEMS and CMOS. Office of Scientific and Technical Information (OSTI), 1995. http://dx.doi.org/10.2172/114489.

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