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Journal articles on the topic 'Diffusional Creep'

Author: Grafiati

Published: 4 June 2021

Last updated: 7 September 2023

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1

Greenwood, G. W. "Diffusional Creep." Defect and Diffusion Forum 66-69 (January 1991): 1187–204. http://dx.doi.org/10.4028/www.scientific.net/ddf.66-69.1187.

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2

Mesarovic, Sinisa Dj. "Lattice continuum and diffusional creep." Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences 472, no. 2188 (2016): 20160039. http://dx.doi.org/10.1098/rspa.2016.0039.

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Diffusional creep is characterized by growth/disappearance of lattice planes at the crystal boundaries that serve as sources/sinks of vacancies, and by diffusion of vacancies. The lattice continuum theory developed here represents a natural and intuitive framework for the analysis of diffusion in crystals and lattice growth/loss at the boundaries. The formulation includes the definition of the Lagrangian reference configuration for the newly created lattice, the transport theorem and the definition of the creep rate tensor for a polycrystal as a piecewise uniform, discontinuous field. The values associated with each crystalline grain are related to the normal diffusional flux at grain boundaries. The governing equations for Nabarro–Herring creep are derived with coupled diffusion and elasticity with compositional eigenstrain. Both, bulk diffusional dissipation and boundary dissipation accompanying vacancy nucleation and absorption, are considered, but the latter is found to be negligible. For periodic arrangements of grains, diffusion formally decouples from elasticity but at the cost of a complicated boundary condition. The equilibrium of deviatorically stressed polycrystals is impossible without inclusion of interface energies. The secondary creep rate estimates correspond to the standard Nabarro–Herring model, and the volumetric creep is small. The initial (primary) creep rate is estimated to be much larger than the secondary creep rate.

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3

Wolfenstine, J., T. R. Armstrong, W. J. Weber, M. A. Boling-Risser, K. C. Goretta, and J. L. Routbort. "Elevated temperature deformation of fine-grained La0.9Sr0.1MnO3." Journal of Materials Research 11, no. 3 (1996): 657–62. http://dx.doi.org/10.1557/jmr.1996.0079.

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Compressive creep behavior of fine-grained (5 μm) La0.9Sr0.1MnO3with a relative theoretical density between 85 and 90% was investigated over the temperature range 1150–1300 °C in air. The fine grain size, brief creep transients, stress exponent close to unity, and absence of deformation-induced dislocations, suggested that the deformation was controlled by a diffusional creep mechanism. The activation energy for creep of La0.9Sr0.1MnO3was 490 kJ/mole. A comparison of the activation energy for creep of La0.9Sr0.1MnO3with existing diffusion and creep data for perovskite oxides suggested that the diffusional creep of La0.9Sr0.1MnO3was controlled by lattice diffusion of the cations, either lanthanum or manganese.

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4

Kovacevic, S., and S. Dj Mesarovic. "Diffusion-induced stress concentrations in diffusional creep." International Journal of Solids and Structures 239-240 (March 2022): 111440. http://dx.doi.org/10.1016/j.ijsolstr.2022.111440.

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5

Berdichevsky, V., P. Hazzledine, and B. Shoykhet. "Micromechanics of diffusional creep." International Journal of Engineering Science 35, no. 10-11 (1997): 1003–32. http://dx.doi.org/10.1016/s0020-7225(97)00005-0.

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6

Xu, Z. R., and R. B. McLellan. "Hydrogen enhanced diffusional creep." Acta Materialia 46, no. 13 (1998): 4543–47. http://dx.doi.org/10.1016/s1359-6454(98)00152-9.

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7

Salama, K., G. Majkic, and U. (Balu) Balachandran. "Review: Stress-Induced Diffusion and Cation Defect Chemistry Studies of Perovskites." Defect and Diffusion Forum 242-244 (September 2005): 43–64. http://dx.doi.org/10.4028/www.scientific.net/ddf.242-244.43.

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In this paper we review a number of studies of stress-induced diffusional matter transport in perovskites, with an emphasis on creep studies used as a means of studying defect chemistry on the cation sublattices. Studies of diffusional creep in air or fixed atmospheres are reviewed first, and the common characteristics among these perovskites are identified. Creep studies of several perovskiterelated or perovskite-like structures are reviewed next, and the similarities/dissimilarities to perovskites are outlined. The diffusional creep studies in controlled atmosphere are reviewed next, with the emphasis on defect chemistry modeling from creep data. The paper presents a detailed review of two creep studies in oxygen controlled atmosphere that show particularly interesting and remarkedly different behavior from that predicted by standard defect chemistry models. Defect chemistry modeling from creep data is presented for these two cases. The potential and limitations of using creep experiments for studying diffusional matter transport and cation defect chemistry are discussed.

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8

Jamnik, Janez, and Rishi Raj. "Space-Charge-Controlled Diffusional Creep: Volume Diffusion Case+." Journal of the American Ceramic Society 79, no. 1 (1996): 193–98. http://dx.doi.org/10.1111/j.1151-2916.1996.tb07898.x.

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9

Greenwood, G. W. "Denuded zones and diffusional creep." Scripta Metallurgica et Materialia 30, no. 12 (1994): 1527–30. http://dx.doi.org/10.1016/0956-716x(94)90302-6.

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10

Burton, B., and G. L. Reynolds. "In defense of diffusional creep." Materials Science and Engineering: A 191, no. 1-2 (1995): 135–41. http://dx.doi.org/10.1016/0921-5093(94)09643-0.

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11

Schneibel, J. H., and W. D. Porter. "Coble creep in a powder-metallurgical nickel aluminide of composition Ni–22.8Al–0.6Hf–0.1B (at. %)." Journal of Materials Research 3, no. 3 (1988): 403–6. http://dx.doi.org/10.1557/jmr.1988.0403.

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Coble creep, which is controlled by mass transport along grain boundaries, has been identified in a powder-metallurgically prepared nickel aluminide with the nominal composition Ni–22.8Al–0.6Hf–0.1B (at. %). Diffusional creep rates ∊ as a function of temperature T, stress σ, and grain size L are well described by ∊ = 33δb Db Ωσ (kTL3), where δb Db = 3 × 10−6 m3 s−1 × exp [– (313 kJ/mol)/(RT) (δb is the diffusional grain boundary width, Db is the grain boundary diffusivity, R is the gas constant, and T is the absolute temperature). The activation energy of 313 kJ/mol is unusually high as compared to that for volume diffusion.

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12

Zhevnenko, Sergei, and Eugene Gershman. "Interface Controlled Diffusional Creep of Cu + 2.8 at.% Co Solid Solution." Defect and Diffusion Forum 322 (March 2012): 33–39. http://dx.doi.org/10.4028/www.scientific.net/ddf.322.33.

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High-temperature creep experiments were performed on a Cu-2.8 ат.% Co solid solution. Cylindrical foils of 18 micrometers thickness were used for this purpose. Creep tests were performed in a hydrogen atmosphere in the temperature range of about from 1233 K to 1343 K and at stresses lower than 0.25 MPa. For comparison, a foil of pure copper and Cu-20 at.% Ni solid solution were investigated on high temperature creep. Measurements on the Cu foil showed classical diffusional creep behavior. The activation energy of creep was defined and turned out to be equal 203 kJ/mol, which is close to the activation energy of bulk self-diffusion of copper. There was a significant increase in activation energy for the Cu-20 at.% Ni solid solution. Its activation energy was about 273 kJ/mol. The creep behavior of Cu-Co solid solution was more complicated. There were two stages of diffusional creep at different temperatures. The extremely large activation energy (about 480 kJ/mol) was determined at relatively low temperature and a small activation energy (about 105 kJ/mol) was found at high temperatures. The creep rate of Cu-Co solid solution was lower than that of pure copper at all temperatures. In addition, the free surface tension of Cu-2.8 ат.% Co was measured at different temperatures from 1242 K to 1352 K. The surface tension increases in this temperature range from 1.6 N/m to 1.75 N/m. There were no features on the temperature dependence of the surface tension.

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13

Zhang, B. B., Y. G. Tang, Q. S. Mei, X. Y. Li, and K. Lu. "Inhibiting creep in nanograined alloys with stable grain boundary networks." Science 378, no. 6620 (2022): 659–63. http://dx.doi.org/10.1126/science.abq7739.

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Creep, the time-dependent deformation of materials stressed below the yield strength, is responsible for a great number of component failures at high temperatures. Because grain boundaries (GBs) in materials usually facilitate diffusional processes in creep, eliminating GBs is a primary approach to resisting high-temperature creep in metals, such as in single-crystal superalloy turbo blades. We report a different strategy to inhibiting creep by use of stable GB networks. Plastic deformation triggered structural relaxation of high-density GBs in nanograined single-phased nickel-cobalt-chromium alloys, forming networks of stable GBs interlocked with abundant twin boundaries. The stable GB networks effectively inhibit diffusional creep processes at high temperatures. We obtained an unprecedented creep resistance, with creep rates of ~10 –7 per second under gigapascal stress at 700°C (~61% melting point), outperforming that of conventional superalloys.

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14

Kobrinsky, Mauro J., Carl V. Thompson, and Mihal E. Gross. "Diffusional creep in damascene Cu lines." Journal of Applied Physics 89, no. 1 (2001): 91–98. http://dx.doi.org/10.1063/1.1326856.

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15

TANAKA, Hidehiko, and Yoshizo INOMATA. "Diffusional Creep in Sintered Silicon Carbide." Journal of the Ceramic Association, Japan 93, no. 1073 (1985): 55–60. http://dx.doi.org/10.2109/jcersj1950.93.55.

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16

Wang, Jian Nong. "On the transition from power-law creep to diffusional creep." Philosophical Magazine A 73, no. 4 (1996): 1181–91. http://dx.doi.org/10.1080/01418619608243713.

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17

Тукмакова, А. С., Н. И. Хахилев, Д. Б. Щеглова та ін. "Анализ механизмов уплотнения термоэлектрических порошков скуттерудитов и сплавов Гейслера в процессе активированного полем спекания". Физика и техника полупроводников 55, № 12 (2021): 1132. http://dx.doi.org/10.21883/ftp.2021.12.51695.10.

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The analysis of the shrinkage rate of powders, based on the power-law creep model of a porous body, was carried out in this paper to calculate the compaction parameters of CoSb3-based skutterudites and Fe2VAl-based Heusler alloys within field-activated sintering. It was indicated that this method, which had already been used for metal and ceramic powders, is applicable for thermoelectric powders. The values of strain rate sensitivity were obtained, and the corresponding powder compaction mechanisms have been defined. The main creep mechanism for skutterudites was found to be a dislocation climb, that later was replaced by grain boundary sliding, and the last sintering stage was associated with diffusional creep. The main creep mechanism for Heusler alloys was grain boundary sliding, later replaced by diffusional creep.

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18

Goretta, K. C., J. L. Routbort, A. C. Biondo, Y. Gao, A. R. de Arellano-López, and A. Domínguez-Rodríguez. "Compressive creep of YBa2Cu3Ox." Journal of Materials Research 5, no. 12 (1990): 2766–70. http://dx.doi.org/10.1557/jmr.1990.2766.

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YBa2Cu3Ox was deformed from 850 to 980 °C in oxygen partial pressures of 103 to 105 Pa. Steady-state creep rate, ̇, for P(O2) from 104 to 105 Pa could be expressed as ̇ = Aσ1.0 (GS)−2.8±0.6 exp −(970 ± 130 kJ/mole)/RT, where A is a constant, σ the steady-state stress, GS the average grain size, and R and T have their usual meanings, For P(O2) from 103 to 3 ⊠ 103 Pa, the activation energy decreased to about 650 kJ/mole and for a given temperature creep kinetics were much faster. The data and microscopic observations indicated that creep occurred by diffusional flow. Comparisons with diffusion data for YBa2Cu3Ox suggested that Y or Ba may be rate-controlling diffusing species.

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19

Tukmakova A.S., Khakhilev N.I., Shcheglova D.B., et al. "The analysis of thermoelectric powder compaction mechanisms within field-activated sintering of skutterudites and Heusler alloys." Semiconductors 55, no. 14 (2022): 2110. http://dx.doi.org/10.21883/sc.2022.14.53886.10.

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The analysis of the shrinkage rate of powders, based on the power-law creep model of a porous body, was carried out in this paper to calculate the compaction parameters of CoSb3-based skutterudites and Fe2VAl-based Heusler alloys within field-activated sintering. It was indicated that this method, which had already been used for metal and ceramic powders, is applicable for thermoelectric powders. The values of strain rate sensitivity were obtained, and the corresponding powder compaction mechanisms have been defined. The main creep mechanism for skutterudites was found to be a dislocation climb, that later was replaced by grain boundary sliding, and the last sintering stage was associated with diffusional creep. The main creep mechanism for Heusler alloys was grain boundary sliding, later replaced by diffusional creep. Keywords: field-assisted sintering, numerical simulation, powders compaction, skutterudites, Heusler alloys, thermoelectrics.

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20

Josell, D., T. P. Weihs, and H. Gao. "Diffusional Creep: Stresses and Strain Rates in Thin Films and Multilayers." MRS Bulletin 27, no. 1 (2002): 39–44. http://dx.doi.org/10.1557/mrs2002.18.

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AbstractIn this article, we discuss creep deformation as it relates to thin films and multilayer foils. We begin by reviewing experimental techniques for studying creep deformation in thin-film geometries, listing the pros and cons of each; then we discuss the use of deformation-mechanism maps for recording and understanding observed creep behavior. We include a number of cautionary remarks regarding the impact of microstructural stability, zero-creep stresses, and transient-creep strains on stress–strain rate relationships, and we finish by reviewing the current state of knowledge for creep deformation in thin films. This includes both thin films that are heated on substrates as well as multilayer films that are tested as freestanding foils.

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21

Kang, Suk-Joong L., and Han-Il Yoo. "Ambipolar Diffusion in Sintering and Diffusional Creep of Ionic Compounds." Journal of the American Ceramic Society 87, no. 12 (2004): 2286–87. http://dx.doi.org/10.1111/j.1151-2916.2004.tb07506.x.

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22

Yao, Huan, Tianzhou Ye, Pengfei Wang, Junmei Wu, Jing Zhang, and Ping Chen. "Structural Evolution and Transitions of Mechanisms in Creep Deformation of Nanocrystalline FeCrAl Alloys." Nanomaterials 13, no. 4 (2023): 631. http://dx.doi.org/10.3390/nano13040631.

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FeCrAl alloys have been suggested as one of the most promising fuel cladding materials for the development of accident tolerance fuel. Creep is one of the important mechanical properties of the FeCrAl alloys used as fuel claddings under high temperature conditions. This work aims to elucidate the deformation feature and underlying mechanism during the creep process of nanocrystalline FeCrAl alloys using atomistic simulations. The creep curves at different conditions are simulated for FeCrAl alloys with grain sizes (GS) of 5.6–40 nm, and the dependence of creep on temperature, stress and GS are analyzed. The transitions of the mechanisms are analyzed by stress and GS exponents firstly, and further checked not only from microstructural evidence, but also from a vital comparison of activation energies for creep and diffusion. Under low stress conditions, grain boundary (GB) diffusion contributes more to the overall creep deformation than lattice diffusion does for the alloy with small GSs. However, for the alloy with larger GSs, lattice diffusion controls creep. Additionally, a high temperature helps the transition of diffusional creep from the GB to the dominant lattice. Under medium- and high-stress conditions, GB slip and dislocation motion begin to control the creep mechanism. The amount of GB slip increases with the temperature, or decreases with GS. GS and temperature also have an impact on the dislocation behavior. The higher the temperature or the smaller the GS is, the smaller the stress at which the dislocation motion begins to affect creep.

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23

Yang, Fuqian, and J. C. M. Li. "Impression and diffusional creep of anisotropic media." Journal of Applied Physics 77, no. 1 (1995): 110–17. http://dx.doi.org/10.1063/1.359524.

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24

Burton, B. "Grain boundary dislocation geometry during diffusional creep." Materials Science and Technology 2, no. 12 (1986): 1202–4. http://dx.doi.org/10.1179/mst.1986.2.12.1202.

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25

Goretta, K. "Diffusional creep of BaCe0.8Y0.2O3−α mixed conductors". Solid State Ionics 111, № 3-4 (1998): 295–99. http://dx.doi.org/10.1016/s0167-2738(98)00176-3.

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26

Jiménez-Melendo, M., A. Dominguez-Rodriguez, R. Marquez, and J. Castaing. "Diffusional and dislocation creep of NiO polycrystals." Philosophical Magazine A 56, no. 6 (1987): 767–81. http://dx.doi.org/10.1080/01418618708204487.

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27

McMeeking, R. M., and L. T. Kuhn. "A diffusional creep law for powder compacts." Acta Metallurgica et Materialia 40, no. 5 (1992): 961–69. http://dx.doi.org/10.1016/0956-7151(92)90073-n.

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28

Yang, Fuqian, Jason Chen, Iris Seidmann, and James C. M. Li. "Punch tip effects in diffusional impression creep." Materials Science and Engineering: A 207, no. 1 (1996): 30–35. http://dx.doi.org/10.1016/0921-5093(95)10014-8.

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29

Ruano, Oscar A., Oleg D. Sherby, Jeffrey Wadsworth, and Jeffrey Wolfenstine. "Rebuttal to “In defense of diffusional creep”." Materials Science and Engineering: A 211, no. 1-2 (1996): 66–71. http://dx.doi.org/10.1016/0921-5093(95)10090-3.

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30

Zhevnenko, S. "Diffusional creep in Cu–Fe solid solutions." Journal of Alloys and Compounds 586 (February 2014): S210—S213. http://dx.doi.org/10.1016/j.jallcom.2012.11.026.

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31

Schneibel, J. H., G. F. Petersen, and C. T. Liu. "Creep behavior of a polycrystalline nickel aluminide: Ni-23.5 at.% A1-0.5 at.% Hf-0.2 at.% B." Journal of Materials Research 1, no. 1 (1986): 68–72. http://dx.doi.org/10.1557/jmr.1986.0068.

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The creep behavior of a poly crystalline nickel aluminide with the composition Ni-23.5 at.% Al-0.5 at. % Hf-0.2 at. % B has been measured as a function of stress, temperature, and grain size. At high stresses, of the order of 100 MPa, the strain rate is nonlinear in the stress, with a stress exponent greater than two. Below approximately 10 MPa, at 1033 K, the steady-state strain rate is almost proportional to the stress, indicating that diffusional creep is rate controlling. Calculations of expected Nabarro—Herring and Coble creep rates did not answer whether diffusive mass transport through the grains, or along the grain boundaries, is rate controlling. The grain-size dependence of the strain rate, however, indicates predominance of volume diffusion control, i.e., Nabarro—Herring creep, for our experimental conditions.

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32

Schneibel, J. H., and J. A. Horton. "Evolution of dislocation structure during inverse creep of a nickel aluminide: Ni–23.5 Al–0.5 Hf–0.2B (at. %)." Journal of Materials Research 3, no. 4 (1988): 651–55. http://dx.doi.org/10.1557/jmr.1988.0651.

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A well-annealed polycrystalline nickel aluminide of composition Ni–23.5Al–0.5 Hf–0.2B (at. %) shows inverse creep behavior at 1033 K and 250 MPa. The minimum creep rate does not correspond to a steady-state creep condition. The increase in the creep rate with strain and time is accompanied by an increase in the volume fraction of dislocation-containing regions. The inverse transient can be eliminated by prestraining at room temperature. It is absent in the diffusional creep regime.

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33

Kim, Byung Nam, Keijiro Hiraga, Koji Morita, and Hidehiro Yoshida. "Analysis of Creep Deformation Due to Grain-Boundary Diffusion/Sliding." Key Engineering Materials 345-346 (August 2007): 565–68. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.565.

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For steady-state deformation caused by grain-boundary diffusion and viscous grain-boundary sliding, the creep rate of regular polyhedral grains is analyzed by the energy-balance method. For the microstructure, the grain-grain interaction increases the degree of symmetry of diffusional field, resulting in a decrease of the effective diffusion distance. Meanwhile, the viscous grain-boundary sliding is found to decrease the creep rate. The present analysis reveals that the grain-size exponent is dependent on the grain size and the grain-boundary viscosity: the exponent becomes unity for small grain sizes and/or high viscosity, while it is three for large grain sizes and/or low viscosity.

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34

Li, Hongping, Xiaodong Liu, Quan Sun, Lingying Ye, and Xinming Zhang. "Superplastic Deformation Mechanisms in Fine-Grained 2050 Al-Cu-Li Alloys." Materials 13, no. 12 (2020): 2705. http://dx.doi.org/10.3390/ma13122705.

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The deformation behavior and microstructural evolution of fine-grained 2050 alloys at elevated temperatures and slow strain rates were investigated. The results showed that significant dynamic anisotropic grain growth occurred at the primary stage of deformation. Insignificant dislocation activity, particle-free zones, and the complete progress of grain neighbor switching based on diffusion creep were observed during superplastic deformation. Quantitative calculation showed that diffusion creep was the dominant mechanism in the superplastic deformation process, and that grain boundary sliding was involved as a coordination mechanism. Surface studies indicated that the diffusional transport of materials was accomplished mostly through the grain boundary, and that the effect of the bulk diffusion was not significant.

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35

Cao, Penghui, Michael P. Short, and Sidney Yip. "Understanding the mechanisms of amorphous creep through molecular simulation." Proceedings of the National Academy of Sciences 114, no. 52 (2017): 13631–36. http://dx.doi.org/10.1073/pnas.1708618114.

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Molecular processes of creep in metallic glass thin films are simulated at experimental timescales using a metadynamics-based atomistic method. Space–time evolutions of the atomic strains and nonaffine atom displacements are analyzed to reveal details of the atomic-level deformation and flow processes of amorphous creep in response to stress and thermal activations. From the simulation results, resolved spatially on the nanoscale and temporally over time increments of fractions of a second, we derive a mechanistic explanation of the well-known variation of creep rate with stress. We also construct a deformation map delineating the predominant regimes of diffusional creep at low stress and high temperature and deformational creep at high stress. Our findings validate the relevance of two original models of the mechanisms of amorphous plasticity: one focusing on atomic diffusion via free volume and the other focusing on stress-induced shear deformation. These processes are found to be nonlinearly coupled through dynamically heterogeneous fluctuations that characterize the slow dynamics of systems out of equilibrium.

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36

Birringer, Rainer, H. Thomas Hahn, H. J. Höfler, J. Karch, and H. Gleiter. "Diffusion and Low Temperature Deformation by Diffusional Creep of Nanocrystalline Materials." Defect and Diffusion Forum 59 (January 1991): 17–32. http://dx.doi.org/10.4028/www.scientific.net/ddf.59.17.

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37

Ekaputra, I. M. W., and Gunawan Dwi Haryadi. "Karakteristik Laju Regangan Melar pada Baja Tahan Karat Austenitic 316L." ROTASI 19, no. 4 (2017): 201. http://dx.doi.org/10.14710/rotasi.19.4.201-205.

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In this study, the creep strain rate characteristics of austenitic 316L stainless steel was investigated from the uniaxial creep-rupture test. The tests were conducted under various applied load levels with a constant temperature at 525oC. The creep exponent was obtained by applying a Norton’s law equation on a regression line of creep strain rate vs. stress curve. The steel clearly showed an instantaneous primary stage, following with the secondary and tertiary stages on the creep curve. It was found that the creep rupture time decreased systematically with an increase in the stress. The secondary stage of creep curve almost dominated the creep’s lifetime. Therefore, the creep strain rate was determined from the minimum strain rate on this stage. The obtained creep exponent indicated that the responsible creep mechanism was grain boundary sliding or diffusional creep mechanism

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38

Ruano, O. A., O. D. Sherby, J. Wadsworth, and J. Wolfenstine. "Diffusional Creep and Diffusion-Controlled Dislocation Creep and Their Relation to Denuded Zones in Mg-ZrH2 Materials." Scripta Materialia 38, no. 8 (1998): 1307–14. http://dx.doi.org/10.1016/s1359-6462(98)00021-9.

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39

Sharma, Pradeep, and Abhijit Dasgupta. "Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation." Journal of Electronic Packaging 124, no. 3 (2002): 292–97. http://dx.doi.org/10.1115/1.1493202.

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This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void nucleation, void growth, and void coalescence model based on micro-structural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding, its blocking at second-phase particles, and diffusional creep relaxation. In Part II of this paper, the developed creep-fatigue damage model is quantified and parametric studies are provided to better illustrate the utility of the developed model.

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40

Gaál, I. "Non-Stationary Diffusional Creep in Dispersion Strengthened Tungsten." Defect and Diffusion Forum 129-130 (March 1996): 279–80. http://dx.doi.org/10.4028/www.scientific.net/ddf.129-130.279.

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41

Cai, B., Q. P. Kong, L. Lu, and K. Lu. "Interface controlled diffusional creep of nanocrystalline pure copper." Scripta Materialia 41, no. 7 (1999): 755–59. http://dx.doi.org/10.1016/s1359-6462(99)00213-4.

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42

Kim, Byung-Nam, and Keijiro Hiraga. "Contribution of grain boundary sliding in diffusional creep." Scripta Materialia 42, no. 5 (2000): 451–56. http://dx.doi.org/10.1016/s1359-6462(99)00369-3.

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43

Mishra, R. S., H. Jones, and G. W. Greenwood. "Enhanced diffusional creep: The effect of grain growth." Scripta Metallurgica 22, no. 3 (1988): 323–27. http://dx.doi.org/10.1016/s0036-9748(88)80198-4.

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44

Wadsworth, Jeffrey, Oscar A. Ruano, and Oleg D. Sherby. "Denuded zones, diffusional creep, and grain boundary sliding." Metallurgical and Materials Transactions A 33, no. 2 (2002): 219–29. http://dx.doi.org/10.1007/s11661-002-0084-7.

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45

Wakashima, K., and Fubi Liu. "Unsteady diffusional creep of a dual-phase material." Scripta Materialia 36, no. 10 (1997): 1081–87. http://dx.doi.org/10.1016/s1359-6462(96)00485-x.

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46

Wang, J. N. "Newtonian flow process in polycrystalline silicon carbides: diffusional creep or Harper-Dorn creep?" Journal of Materials Science 29, no. 23 (1994): 6139–46. http://dx.doi.org/10.1007/bf00354553.

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47

Xiao, Lai Rong, Xi Min Zhang, Yan Wang, Wei Li, Quan Sheng Sun, and Zhan Ji Geng. "High Temperature Creep Behavior of Zn-1.0Cu-0.2Ti Alloy." Advanced Materials Research 287-290 (July 2011): 769–76. http://dx.doi.org/10.4028/www.scientific.net/amr.287-290.769.

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Abstract:

In the present work, Zn-1.0Cu-0.2Ti alloy was prepared by melt casting and extruding processes. High temperature creep property of the alloy was determined using electronic creep relaxation testing machine. Microstructures of the alloy before and after creep test were observed and its high temperature creep mechanism was discussed. The results show that the steady-state creep rate of the alloy increases with temperature and stress. The logarithm of steady-state creep rate (ln) shows a linearity relationship with the logarithm of the stress (lnσ) and reciprocal of temperature (1/T). The stress exponent and apparent activation energy for creep have been determined to be 5.10 and 83.7 kJ/mol, separately. The predominant mechanism is mainly self-diffusional creep. The second phases on the grain boundary can block the slip of grain boundary and dislocation motion which can improve creep resistance of the alloy.

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Tsukamoto, Hideaki. "Effect of Creep on Thermal Stresses in ZrO₂/Ti Functionally Graded Thermal Barrier Coatings." Applied Mechanics and Materials 510 (February 2014): 79–85. http://dx.doi.org/10.4028/www.scientific.net/amm.510.79.

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This study numerically investigates the effect of creep on thermal stress states and design of ZrO2/Ti functionally graded thermal barrier coatings (FG TBCs) based on a mean-field nonlinear micromechanical approach, which takes into account the time-independent and dependent inelastic deformation, such as plasticity of metals, creep of metals and ceramics, and diffusional mass flow at the ceramic/metal interface. The effect of creep on micro-stress states in the FG TBCs has been examined in terms of the compositional gradation patterns. The suitable compositional gradation patterns have been proposed for typical thermo-mechanical boundary conditions with different creep abilities of constitute phases in the FG TBCs.

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49

Baskin, Don, Jeff Wolfenstine, and Enrique J. Lavernia. "Elevated temperature mechanical behavior of CoSi and particulate reinforced CoSi produced by spray atomization and co-deposition." Journal of Materials Research 9, no. 2 (1994): 362–71. http://dx.doi.org/10.1557/jmr.1994.0362.

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Monolithic CoSi and TiB2 reinforced CoSi materials were produced by spray atomization and co-deposition. The creep behavior of both materials at elevated temperature was investigated. The unreinforced material of grain size ≍25 μm exhibited a stress exponent of three, activation energy for creep of 320 kJ/mole, dislocation substructure of homogeneously distributed dislocations, and inverse creep transients upon stress increases. These results suggest that the creep behavior of CoSi is controlled by a dislocation glide mechanism. In contrast, the reinforced material of a finer grain size (≍10 μm) exhibited a stress exponent of unity, activation energy for creep of 240 kJ/mole, and negligible creep transients upon stress increases, suggesting that the creep behavior of the reinforced material is controlled by a diffusional creep mechanism. The creep resistance of the reinforced material was lower than that for the unreinforced material. This is a result of the finer grain size and higher porosity in the reinforced material.

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50

Shao, Shan-Shan, Fuqian Yang, and Fu-Zhen Xuan. "Effect of electromigration on diffusional creep in polycrystalline materials." International Journal of Applied Electromagnetics and Mechanics 40, no. 2 (2012): 165–71. http://dx.doi.org/10.3233/jae-2012-1583.

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