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Relevant bibliographies by topics / Direct bonded copper

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Academic literature on the topic 'Direct bonded copper'

Author: Grafiati

Published: 4 June 2021

Last updated: 6 February 2022

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Journal articles on the topic "Direct bonded copper"

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Squires, Matthew B., James A. Stickney, Evan J. Carlson, Paul M. Baker, Walter R. Buchwald, Sandra Wentzell, and Steven M. Miller. "Atom chips on direct bonded copper substrates." Review of Scientific Instruments 82, no. 2 (February 2011): 023101. http://dx.doi.org/10.1063/1.3529434.

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Cavaco, Celso, Lan Peng, Koen De Leersnijder, Stefano Guerrieri, Deniz S. Tezcan, and Haris Osman. "Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000594–97. http://dx.doi.org/10.4071/isom-2015-tha26.

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We show for the first time complete data on 200mm wafer to wafer copper oxide direct bonding of two metal levels. Both surface acoustic microscope (SAM) and cross-section scanning electron microscope (X-SEM) images taken across the bonded wafer pairs confirm the good direct bonding quality of the resulting interface. Daisy chains with up to 3200 copper to copper bonded pads and of about 50mOhm/pad, are shown to be connected successfully and its resistance value to match a target value, as well as to scale linearly with the increase of connections in the chain.

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Schulz-Harder, Jürgen. "Advantages and new development of direct bonded copper substrates." Microelectronics Reliability 43, no. 3 (March 2003): 359–65. http://dx.doi.org/10.1016/s0026-2714(02)00343-8.

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Mei, Yunhui, Guo-Quan Lu, Xu Chen, Chen Gang, Shufang Luo, and Dimeji Ibitayo. "Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates." Journal of Electronic Materials 40, no. 10 (July 30, 2011): 2119–25. http://dx.doi.org/10.1007/s11664-011-1716-8.

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Hagiwara, Naoki, Shinji Koyama, and Ikuo Shohji. "Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid." Advanced Materials Research 922 (May 2014): 219–23. http://dx.doi.org/10.4028/www.scientific.net/amr.922.219.

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The effect of formic acid and citric acid surface modification on the bonded strength of the solid-state direct bonded interface of copper was investigated by SEM observations of interfacial microstructures and fractured surfaces. Copper surfaces were modified by boiling in 98% formic acid for 0.6 ks and 17% aqueous solution of citric acid for 0.96 s. Solid-state bonding was performed in a vacuum chamber at bonding temperature of 423 ~ 673 K under a pressure of 588 N (bonding time of 0.9 ks). As a result of surface modification by formic acid and citric acid, bonded joints were obtained at a bonding temperature 150 K (formic acid) and 100 K (citric acid) lower than that required for non-modified surfaces, and the bond strength was comparable to that of the maximum load.

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Grzesiak, Wojciech, Piotr Maćków, Tomasz Maj, Beata Synkiewicz, Krzysztof Witek, Ryszard Kisiel, Marcin Myśliwiec, Janusz Borecki, Tomasz Serzysko, and Marek Żupnik. "Application of direct bonded copper substrates for prototyping of power electronic modules." Circuit World 42, no. 1 (February 1, 2016): 23–31. http://dx.doi.org/10.1108/cw-10-2015-0051.

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Purpose – This paper aims to present certain issues in direct bonded copper (DBC) technology towards the manufacture of Al2O3 or AlN ceramic substrates with one or both sides clad with a copper (Cu) layer. Design/methodology/approach – As part of the experimental work, attempts were made to produce patterns printed onto DBC substrates based on four substantially different technologies: precise cutting with a diamond saw, photolithography, the use of a milling cutter (LPKF ProtoMat 93s) and laser ablation with differential chemical etching of the Cu layer. Findings – The use of photolithography and etching technology in the case of boards clad with a 0.2-mm-thick Cu layer, can produce conductive paths with a width of 0.4 mm while maintaining a distance of 0.4 mm between the paths, and in the case of boards clad with a 0.3-mm-thick copper layer, conductive paths with a width of 0.5 mm while maintaining a distance of 0.5 mm between paths. The application of laser ablation at the final step of removing the unnecessary copper layer, can radically increase the resolution of printed pattern even to 0.1/0.1 mm. The quality of the printed pattern is also much better. Research limitations/implications – Etching process optimization and the development of the fundamentals of technology and design of power electronic systems based on DBC substrates should be done in the future. A limiting factor for further research and its implementation may be the relatively high price of DBC substrates in comparison with typical PCB printed circuits. Practical implications – Several examples of practical implementations using DBC technology are presented, such as full- and half-bridge connections, full-wave rectifier with an output voltage of 48 V and an output current of 50 A, and part of a battery discharger controller and light-emitting diode illuminator soldered to a copper heat sink. Originality/value – The paper presents a comparison of different technologies used for the realization of precise patterns on DBC substrates. The combination of etching and laser ablation technologies radically improves the quality of DBC-printed patterns.

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Akhtar, S. S., L. T. Kareem, A. F. M. Arif, M. U. Siddiqui, and A. S. Hakeem. "Development of a ceramic-based composite for direct bonded copper substrate." Ceramics International 43, no. 6 (April 2017): 5236–46. http://dx.doi.org/10.1016/j.ceramint.2017.01.049.

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Piekoszewski, J., Wieslawa Olesińska, J. Jagielski, D. Kaliński, M. Chmielewski, Z. Werner, M. Barlak, and Wiesław Szymczyk. "Ion Implanted Nanolayers in AlN for Direct Bonding with Copper." Solid State Phenomena 99-100 (July 2004): 231–34. http://dx.doi.org/10.4028/www.scientific.net/ssp.99-100.231.

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Experiments to directly bond AlN with Cu were conducted for different pre-treatments of the bonded components. AlN substrates were implanted either with oxygen, or titanium or iron ions at low (15 keV) or high (70 keV) energy, or thermally oxidized. Some Ti-implanted samples were also thermally oxidized. The copper component was annealed and thermally oxidized. The best results, with respect to the bond shear strength, were obtained for low-energy implantation of oxygen and titanium.

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NING, HONGLONG, USHENG MA, FUXIANG HUANG, YONGGANG WANG, JIMAN ZHU, and ZHITING GENG. "INVESTIGATION OF THE INTERFACE OF THE DCB SUBSTRATE." Surface Review and Letters 10, no. 01 (February 2003): 95–99. http://dx.doi.org/10.1142/s0218625x03004640.

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DCB means direct copper bonding and denotes a process in which copper and a ceramic material are directly bonded. Between the temperature of the metal's melting point and the eutectic temperature of the metal-oxygen, DCB depends on the eutectic compound to join the copper and the ceramic. We do some research to investigate the interface between the copper foils and Al2O3 ceramics; it is the key factor in influencing the performance of the DCB substrate. We also discuss how to get good microstructure of the DCB interface.

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Akhtar, S. S., K. T. Lemboye, A. F. M. Arif, and K. S. Al-Athel. "Design and Performance Evaluation of Al2O3-SiC Composite for Direct-Bonded Copper Substrate." Journal of Materials Engineering and Performance 27, no. 11 (October 15, 2018): 5831–44. http://dx.doi.org/10.1007/s11665-018-3702-2.

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Dissertations / Theses on the topic "Direct bonded copper"

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Gaiser, Patrick [Verfasser], and Jürgen [Akademischer Betreuer] Wilde. "Lebensdauermodellierung von Aluminiumoxid-basierten Direct Bonded Copper-Substraten." Freiburg : Universität, 2019. http://d-nb.info/1202712762/34.

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Mabille, Loïc. "Vers la compréhension des mécanismes de dégradation et de vieillissement des assemblages photovoltaïques pour des applications sous haute concentration." Phd thesis, Université Paris Sud - Paris XI, 2014. http://tel.archives-ouvertes.fr/tel-00985464.

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Les systèmes photovoltaïques à concentration, ou CPV, reposent sur le principe de la concentration des rayons du soleil sur une cellule photovoltaïque à très haut rendement. Le CPV reste jeune face au photovoltaïque (PV) classique qui accumule plus de 30 ans de retour d'expérience.La pérennisation de cette technologie CPV ne passera que par la démonstration d'une certaine maturité. Aussi, la question de la fiabilité de ces systèmes est plus que jamais d'actualité. Dans ce contexte, le Commissariat à L'Energie Atomique et aux Energies Alternatives (CEA) a répondu à la sollicitation lancée par des fabricants de modules CPV français sur la thématique de la conception et de la fiabilisation de modules CPV par une collaboration de ses différents laboratoires, dont le Laboratoire des Modules Photovoltaïques (LMPV). C'est au sein de ce laboratoire que s'effectuent les travaux de thèse. La diversité des éléments constituant un module CPV a poussé les travaux de thèse à se concentrer sur le coeur fonctionnel des modules : les assemblages CPV. Une première partie des travaux de thèse a consisté à mettre en place les bons outils de caractérisation, en partant parfois d'une feuille blanche. La mesure de caractéristique IV dans l'obscurité, la mesure de réponse spectrale, la tomographie RX ou encore l'électroluminescence sont autant de moyens de caractérisation de cellules multi-jonctions amenés par les travaux de thèse. Les efforts conduits sur l'électroluminescence auront permis l'invention d'une nouvelle technique de caractérisation des interfaces cellule/ substrat des assemblages CPV, concrétisée par le dépôt d'un brevet. Une collaboration entre le laboratoire d'accueil et l'Institut de l'Energie Solaire (IES) à Madrid a permis l'accès à la mesure de performance des assemblages CPV sous éclairement. Tous ces moyens ont rendu possible une caractérisation fine des assemblages CPV et ont permis de s'intéresser à leur robustesse-fiabilité, deuxième partie des travaux de thèse. Deux types d'assemblages CPV ont été étudiés durant les travaux de thèse. Le premier, basé sur un substrat Direct Bonded Copper (DBC) correspond à l'état de l'art et est le plus utilisé dans l'industrie CPV. Le deuxième, en rupture technologique avec l'état de l'art, repose sur un Substrat Métal Isolé (SMI), et a été intégralement développé par le CEA et ses partenaires industriels. L'étude de la robustesse de ces assemblages CPV a été faite par l'emploi de tests de vieillissement accéléré dont la nature est justifiée par le retour d'expérience et la définition des spécifications environnementales. Aucune défaillance n'a été observé sur chacun des types d'assemblage. Les assemblages SMI se comportent comme les assemblages DBC, considérés comme références. Les travaux de thèse offrent donc un premier retour d'expérience propre au laboratoire d'accueil et la mise en place d'une infrastructure complète de caractérisation d'assemblage CPV permet aujourd'hui au CEA d'être un acteur clé du CPV en France.

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Watt, Grace R. "Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module." Thesis, Virginia Tech, 2020. http://hdl.handle.net/10919/96559.

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This paper describes the design, fabrication, and testing of a 1.2 kV, 6.5 mΩ, half-bridge, SiC MOSFET power module to evaluate the impact of parametric device tolerances on electrical and thermal performance. Paralleling power devices increases current handling capability for the same bus voltage. However, inherent parametric differences among dies leads to unbalanced current sharing causing overstress and overheating. In this design, a symmetrical DBC layout is utilized to balance parasitic inductances in the current pathways of paralleled dies to isolate the impact of parametric tolerances. In addition, the paper investigates the benefits of flexible PCB in place of wire bonds for the gate loop interconnection to reduce and minimize the gate loop inductance. The balanced modules have dies with similar threshold voltages while the unbalanced modules have dies with unbalanced threshold voltages to force unbalanced current sharing. The modules were placed into a clamped inductive DPT and a continuous, boost converter. Rogowski coils looped under the wire bonds of the bottom switch dies to observe current behavior. Four modules performed continuously for least 10 minutes at 200 V, 37.6 A input, at 30 kHz with 50% duty cycle. The modules could not perform for multiple minutes at 250 V with 47.7 A (23 A/die). The energy loss differential for a ~17% difference in threshold voltage ranged from 4.52% (~10 µJ) to -30.9% (~30 µJ). The energy loss differential for a ~0.5% difference in V_th ranged from -2.26% (~8 µJ) to 5.66% (~10 µJ). The loss differential was dependent on whether current unbalance due to on-state resistance compensated current unbalance due to threshold voltage. While device parametric tolerances are inherent, if the higher threshold voltage devices can be paired with devices that have higher on-state resistance, the overall loss differential may perform similarly to well-matched dies. Lastly, the most consistently performing unbalanced module with 17.7% difference in V_th had 119.9 µJ more energy loss and was 22.2°C hotter during continuous testing than the most consistently performing balanced module with 0.6% difference inV_th.
Master of Science
This paper describes the design, construction, and testing of advanced power devices for use in electric vehicles. Power devices are necessary to supply electricity to different parts of the vehicle; for example, energy is stored in a battery as direct current (DC) power, but the motor requires alternating current (AC) power. Therefore, power electronics can alter the energy to be delivered as DC or AC. In order to carry more power, multiple devices can be used together just as 10 people can carry more weight than 1 person. However, because the devices are not perfect, there can be slight differences in the performance of one device to another. One device may have to carry more current than another device which could cause failure earlier than intended. In this research project, multiple power devices were placed into a package, or "module." In a control module, the devices were selected with similar properties to one another. In an experimental module, the devices were selected with properties very different from one another. It was determined that the when the devices were 17.7% difference, there was 119.9 µJ more energy loss and it was 22.2°C hotter than when the difference was only 0.6%. However, the severity of the difference was dependent on how multiple device characteristics interacted with one another. It may be possible to compensate some of the impact of device differences in one characteristic with opposing differences in another device characteristic.

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Ha, Min Seok. "Thermal analysis of high power led arrays." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31803.

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Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2010.
Committee Chair: Samuel Graham; Committee Member: J. Rhett Mayor; Committee Member: Yogendra Joshi. Part of the SMARTech Electronic Thesis and Dissertation Collection.

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Letowski, Bastien. "Intégration technologique alternative pour l'élaboration de modules électroniques de puissance." Thesis, Université Grenoble Alpes (ComUE), 2016. http://www.theses.fr/2016GREAT114.

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Les performances, l’encombrement, l’efficacité et la fiabilité des dispositifs sont parmi les enjeux majeurs de l’électronique de puissance. Ils se traduisent sur la conception, la fabrication et le packaging des semiconducteurs. Aujourd’hui, le packaging 3D apporte des réponses concrètes à ces problématiques en regard de l’approche standard (2D). Malgré les excellentes propriétés de ces modules 3D au niveau de la réduction de la signature CEM et du refroidissement, la réalisation, notamment les interconnexions, est complexe. Une approche globale prenant en compte un maximum de paramètres a été développée dans cette thèse. L’ensemble de ce travail s’appuie sur deux propositions que sont la conception couplée entre les composants et le packaging ainsi qu’une fabrication collective à l’échelle de la plaque des modules de puissance. Elles se combinent par la mise en place d’une filière d’étapes technologiques appuyée sur une boite à outils de procédés génériques. Cette approche est concrétisée par la réalisation d’un module de puissance 3D performant et robuste adressant des convertisseurs polyphasés avec des gains aussi bien sur les procédés de fabrication que le module lui-même ainsi que sur le système final.Ce travail offre une nouvelle vision alternative pour l’élaboration des modules électroniques de puissance. Il ouvre également des opportunités pour une fabrication et un packaging plus performants pour les nouveaux semiconducteurs grand gap
Performances, efficiency and reliability are among the main issues in power electronics. Nowadays, 3D packaging solutions increase standard planar module (2D) performances, for instance EMC. However such integrations are based on complex manufacturing, especially concerning interconnections. Improvements require global and advanced solutions. This work depends on two proposed concepts: a coupled design of the power devices and their associated package and a collective wafer-level process fabrication. A technological offer is proposed based on an innovative power packaging toolbox. Our approach is materialized by the fabrication of a 3D polyphase power module which proved to be more efficient and reliable. The benefits are more precise process manufacturing, lower EMI generation and lower inductive interconnections.As a matter of fact, this work offers a new and advanced technological integration for future power electronics modules, perfectly suitable for the wide bandgap semiconductors

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Ivanova, Mariya. "Conception et réalisation de fonctions thermiques intégrées dans lesubstrat de composants électroniques de puissance. Apport de lagestion des flux thermiques par des mini et micro caloducs." Phd thesis, 2005. http://tel.archives-ouvertes.fr/tel-00171856.

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Les modules de puissance ont tendance à devenir de plus en plus compacts et ceci engendre une
augmentation significative des densités de flux à évacuer. Un refroidissement plus performant est devenu
impératif. Les caloducs plats présentent un intérêt certain lorsque les applications visées intéressent le
domaine spatial où les critères de masse, d'encombrement et d'isolation électrique sont primordiaux.
L'objectif des travaux de thèse est de réaliser la conception et l'étude des mini et micro caloducs pour le
refroidissement de l'électronique embarquée. Dans un premier temps, des études théoriques et
expérimentales ont été conduites pour concevoir et réaliser de micro caloducs en silicium. La seconde
partie des travaux consiste l'étude de conception, de réalisation et de caractérisation des caloducs intégrés
dans un substrat DBC (Direct Bonded Copper). L'ensemble de ces travaux a montré tout l'apport des
mini et micro caloducs dans la gestion thermique des systèmes électroniques.

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Potukuchi, Harish Kumar. "Catalytic syntheses and copper- or ruthenium-catalyzed direct C H bond arylations of (hetero)arenes." Doctoral thesis, 2011. http://hdl.handle.net/11858/00-1735-0000-0006-B0A3-7.

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Books on the topic "Direct bonded copper"

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Sielepin, Adelajda. Ku nowemu życiu : teologia i znaczenie chrześcijańskiej inicjacji dla życia wiarą. Uniwersytet Papieski Jana Pawła II w Krakowie. Wydawnictwo Naukowe, 2019. http://dx.doi.org/10.15633/9788374388047.

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TOWARDS THE NEW LIFE Theology and Importance of Christian Initiation for the Life of Faith The book is in equal parts a presentation and an invitation. The subject matter of both is the mystagogical initiation leading to the personal encounter with God and eventually to the union within the Church in Christ, which happens initially and particualry in the sacramental liturgy. Mystagogy was the essential experience of life in the early Church and now is being so intensely discussed and postulated by the ecclesial Magisterium and through the teaching of the recent popes and synods. Within the ten chapters of this book the reader proceeds through the aspects strictly associated with Christian initiation, noticeable in catechumenate and suggestive for further Christian life. It is not surprising then, that the study begins with answering the question about the sense of dealing with catechumenate at all. The response developed in the first chapter covers four key points: the contemporary state of our faith, the need for dialogue in evangelization, the importance of liturgy in the renewal of faith and the obvious requirement of follo- wing the Church’s Magisterium, quite explicit in the subject undertaken within this book. The introductory chapter is meant to evoke interest in catechumenate as such and encourage comprehension of its essence, in order to keep it in mind while planning contemporary evangelization. For doing this with success and avoiding pastoral archeology, we need a competent insight into the main message and goal of Christian initiation. Catechumenate is the first and most venerable model of formation and growth in faith and therefore worth knowing. The second chapter tries to cope with the reasons and ways of the present return to the sources of catechumenate with respect to Christian initiation understood to be the building of the relationship with God. The example of catechumenate helps us to discover, how to learn wisely from the history. This would definitely mean to keep the structure and liturgy of catechumenate as a vehicle of God’s message, which must be interpreted and adapted always anew and with careful and intelligent consideration of the historical flavour on particular stages within the history of salvation and cultural conditions of the recipients. For that reason we refer to the Biblical resources and to the historical examples of catechumenate including its flourishing and declining periods, after which we are slowly approaching the present reinterpretation of the catechumenal process enhanced by the official teaching of the Church. As the result of the latter, particularly owing to the Vatican Council II, we are now dealing with the renewed liturgy of baptism displayed in two liturgical books: The Rite of Baptism for Children and the Rite of Christian Initiation of Adults (RCIA). This version for adults is the subjectmatter of the whole chapter, in which a reader can find theological analyses of the particular rites as well as numerous indications for improving one’s life with Christ in the Church. You can find interesting associations among the rites of initiation themselves and astounding coherence between those rites and the sacraments of the Eucharist, penance and other sacraments, which simply means the ordinary life of faith. Deep and convincing theology of the process of initiation proves the inspiring spiritual power of the initial and constitutive sacraments of baptism and confirmation, which may seem attractive not only for catechumens but also for the faithful baptized in their infancy, and even more, since they might have not yet had a chance to see what a plausible treasure they have been conveying in their baptismal personality. How much challenge for further and constant realization in life may offer these introductory events of Christian initiation, yet not sufficiently appreciated by those who have already been baptized and confirmed! We all should submit to permanent re-evangelization according to this primary pattern, which always remains essential and fundamental. Very typical and very post-conciliar approach to Christian formation appears in the communal dimension, which guards and guarantees the ecclesial profile of initiation and prepares a person to be a living member of the Church. The sixth chapter of the book is dealing with ecclesial issues in liturgy. They refer to comprehending the word of God, especially in the context of liturgy, which brings about a peculiar theological sense to it and giving a special character to proclaiming the Gospel, which the Pope Francis calls “liturgical proclamation”. The ecclesial premises influence the responsibility for the fact of accompanying the candidates, who aim at becoming Christ’s disciples. As the Church is teaching also in the theological and pastoral introduction to the RCIA, this is the duty of all Christians, which means: priests, religious and the lay, because the Church is one organism in whose womb the new members are conceived and raised. As this fact is strongly claimed by the Church the method of initiation arises to great importance. The seventh chapter is dedicated to the analysis of the catechumenal method stemming from Christ’s pedagogy and His mystery of Incarnation introducing a very important issue of implementing the Divine into the human. The chapter concerning this method opens a more practical part of the book. The crucial message of it is to make mystagogy a natural and obvious method which is the way of building bonds with Christ in the community of the people who already have these bonds and who are eager to tighten them and are aware of the beauty and necessity of closeness with Christ. Christian initiation is the process of entering the Kingdom of God and meeting Christ up to the union with Him – not so much learning dogmas and moral requirements. This is a special time when candidates-catechumens-elected mature in love and in their attitude to Christ and people, which results in prayer and new way of life. As in the past catechumenate nowadays inspires the faithful in their imagination of love and mercy as well as reminds us about various important details of the paschal way of life, which constitute our baptismal vocation, but may be forgotten and now with the help of catechumenate can be recognized anew, while accompanying adults on their catechumenal way. The book is meant for those who are already involved in catechumenal process and are responsible for the rites and formation as well as for those who are interested in what the Church is offering to all who consciously decide to know and follow Christ. You can learn from this book, what is the nature and specificity of the method suggested by the Rite itself for guiding people to God the Saviour and to the community of His people. The aim of the study is to present the universal way of evangelization, which was suggested and revealed by God in His pedagogy, particularly through Jesus Christ and smoothly adopted by the early Church. This way, which can be called a method, is so complete, substantial and clear that it deserves rediscovery, description and promotion, which has already started in the Church’s teaching by making direct references to such categories as: initiation, catechumenate, liturgical formation, the rereading the Mystery of Christ, the living participation in the Mystery and faith nourished by the Mystery. The most engaging point with Christian initiation is the fact, that this seems to be the most effective way of reviving the parish, taking place on the solid and safe ground of liturgy with the most convincing and objective fact that is our baptism and our new identity born in baptismal regenerating bath. On the grounds of our personal relationship with God and our Christian vocation we can become active apostles of Christ. Evangelization begins with ourselves and in our hearts. Thinking about the Church’s mission, we should have in mind our personal mission within the Church and we should refer to it’s roots – first to our immersion into Christ’s death and resurrection and to the anointment with the Holy Spirit. In this Spirit we have all been sent to follow Christ wherever He goes, not necessarily where we would like to direct our steps, but He would. Let us cling to Him and follow Him! Together with the constantly transforming and growing Church! Towards the new life!

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Book chapters on the topic "Direct bonded copper"

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Atkins, Peter. "Electric Occurrence: Electrolysis." In Reactions. Oxford University Press, 2011. http://dx.doi.org/10.1093/oso/9780199695126.003.0010.

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Electrolysis makes use of electric currents, a stream of electrons, to bring about chemical change. It puts electricity to work by using it to break or form bonds by forcing electrons on to molecules or sucking electrons out of them. Electrolysis is an application of the redox processes I described in Reaction 5, where I showed that reduction is the gain of electrons and that oxidation is their loss. All that happens in electrolysis is the use of an external supply of electrons from a battery or other direct-current (DC) source to push them on to a species and so bring about its reduction, or the use of the electron-sucking power of a battery to remove them from a species to bring about its oxidation. Electrolysis, in other words, is electrically driven reduction and oxidation. In fact, the process is rather broader than just forcing species to accept or give up electrons because, as I have hinted, molecules might respond to the change in their number of electrons by discarding or rearranging atoms. For instance, when water is electrolysed, the H–O bonds of the H2O molecules are broken and hydrogen and oxygen gases are formed. When an electric current is passed through molten common salt (sodium chloride, NaCl), metallic sodium and gaseous chlorine, Cl2, are formed. Electrolysis is a major technology in the chemical industry, for among other applications it is used to make chlorine, to purify copper, and to extract aluminium. To bring about electrolysis, two metal or graphite rods, the ‘electrodes’, are inserted into the molten substance or solution and connected to a DC electrical supply. The electrons that form the electric current enter the substance through one electrode (the ‘cathode’) and leave it through the other electrode (the ‘anode’). A molecule or ion close to the cathode is forced to collect one or more electrons from that electrode and be reduced. A molecule or ion close to the anode is forced to release them to that electrode and thereby become oxidized. A reasonably simple first example is the purification of copper.

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Emsley, John. "Malevolent arsenic." In The Elements of Murder. Oxford University Press, 2005. http://dx.doi.org/10.1093/oso/9780192805997.003.0012.

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We can never know who committed the first murder with arsenic or even who discovered the deadly nature of arsenical compounds. Although the natural arsenic minerals orpiment and realgar are poisonous, they are not particularly effective as murder weapons because they are insoluble and highly coloured, so that feeding them undetected to the intended victim would not be easy. The most reliable form in which to administer arsenic, knowing that it would succeed in killing someone, would have to be as the oxide. This is not a naturally occurring substance but it was easily obtained. When copper ores that had arsenic as an impurity were smelted, the arsenic was oxidized and emitted as white smoke, some of which sublimed (changed directly from a solid to a vapour) onto the walls of flues and chimneys of the smelter, from where it could be gathered. When people talk of ‘arsenic’ they are almost invariably referring to its oxide, whose chemical formula is As2O3, with arsenic atoms bonded to oxygen atoms. Over the centuries this has had many names such as white arsenic, arsenious oxide, arsenious acid (because it dissolves in water to form an acidic solution), arsenic trioxide, and its proper chemical name, arsenic(III) oxide. I shall call it by the name which is still in common use even among chemists: arsenic trioxide. Some murderers used solid arsenic trioxide, stirring it into foods like stews, porridge, or rice pudding to disguise it, but the more usual method was to dissolve it in something that the victim would drink. Not only is arsenic trioxide soluble, but the solution in which it is dissolved does not betray its presence because it is colourless and almost tasteless; if anything it imparts a slightly sweetish taste to the water. Yet even with such advantages favouring the would-be poisoner, it was still possible to fail to kill, either by not understanding arsenic trioxide’s simple chemistry or misjudging the dose required. Sometimes the ignorance and incompetence of murderers worked in their favour because repeated small doses of the poison gave the impression that the victim was suffering from some deep-seated illness, so that when a final fatal dose was administered the end was not unexpected.

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3

Taber, Douglass. "The Takayama Synthesis of (-)-Cernuine." In Organic Synthesis. Oxford University Press, 2011. http://dx.doi.org/10.1093/oso/9780199764549.003.0094.

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(-)-Cernuine 3 falls in the subset of the Lycopodium alkaloids that feature a bicyclic aminal core. There had not been a total synthesis of this class of alkaloids until the recent (Organic Lett. 2008, 10, 1987) work of Hiromitsu Takayama of Chiba University. The key step in this synthesis was a diastereoselective intramolecular reductive amination, converting 1 to 2. As is apparent from the 3-D projection, (-)-cernuine 3 has a tricyclic trans-anti-trans aminal core, with an appended six-membered ring, both branches of which are axial on the core. While the branch that is part of the aminal could be expected to equilibrate, the other branch had to be deliberately installed. The synthesis began with (+)-citronellal 4, each enantiomer of which is commercially available in bulk. After protection and ozonolysis, the first singly-aminated stereogenic center was installed by enantioselective, and therefore diastereoselective, addition of 5 to the azodicarboxylate 6, mediated by the organocatalyst 7. Reductive cleavage of the N-N bond followed by acetal methanolysis converted 8 to 9. Ionization followed by allyl silane addition then delivered 11, having the requisite axial alkyl branch. The next two tasks were the assembly of the second of the four rings of 3, and the construction of the second single-aminated stereogenic center. The ring was assembled by deprotection of 11 followed by acylation with acryloyl chloride, to give 12. Grubbs cyclization followed by hydrogenation then led to 13. Homologation of 13 to the aldehyde 14 set the stage for condensation with the camphor-derived tertiary amine 15, following the protocol developed by Kobayashi. Sequential imine formation, aza-Cope rearrangement, and hydrolysis led to 1 in 94% de. One could envision reduction of the lactam carbonyl of 1 to an aldehyde equivalent, that would then, under acidic conditions, condense to form the desired aminal 2. This approach was, however, not successful. As an alternative, conditions were developed to convert 1 to the amidine 16. Reduction then proceeded with the expected high diastereocontrol, to give the cis 1,3-fused aminal 2. This was not isolated, but was directly acylated with acryloyl chloride, to 17.

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4

"at the bottom flange and six on the web. Eight gages were installed at the approximate locations of the maximum positive and maximum negative moments. At each location four gages were installed; one at the top flange, one at the bottom flange and two equally spaced on the web. Finally, four gages were installed on two cross-bracing diaphragms between girders 5 and 6 one at about mid-span and the other over the support. The gages at each cross-bracing were located one on a chord member and the other on a diagonal. The weldable strain gages used are constantan alloy gages with backing and encapsulation of polyimide film. The gages are bonded to stainless steel carriers, 0.005 in. thick, and have exposed copper coated integral solder tabs to which wire cables were soldered directly. The cables were connected to three switch and balance units (10 channels each unit) thus providing a method of sequentially reading the strain gage information on a single strain indicator. As mentioned earlier the bridge was tested during construction; hence strain measurements were taken due to the weight of the wet concrete before and after three placements. After the deck slab has reached its design strength, and before placing the bituminous wearing surface, strain measurements were taken due to truck loads positioned at sixteen different positions on the bridge deck. Eight 3-axel trucks weighting about 60 kips each were used. The overall length of each truck is 24'-8" and the overall width is 8' 6". The aforementioned sixteen positions of the trucks consist of the following, In twelve positions the trucks were forming a line about 200 ft long at mid-span A between pier 3 and pier A,." In Composite Steel Structures, 48. CRC Press, 1987. http://dx.doi.org/10.1201/9781482286359-9.

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Conference papers on the topic "Direct bonded copper"

1

Lim, D. F., X. F. Ang, J. Wei, C. M. Ng, and C. S. Tan. "Copper to Copper Direct Bonding Assisted by Self-Assembled Monolayer." In ASME 2010 International Mechanical Engineering Congress and Exposition. ASMEDC, 2010. http://dx.doi.org/10.1115/imece2010-38565.

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In this article, a self-assembled monolayer (SAM) is applied onto the copper surface in an attempt to lower the required bonding temperature. Alkane-thiol with 6-carbon chain length is used and tested for bonding experiment. The adsorption of SAM is confirmed by the sharp rise of the water contact angle measurement and the reduced in the surface roughness. Next, the desorption of SAM is done at a high temperature anneal (<300°C) in an inert ambient and its properties are characterized by the water contact angle measurement and XPS. It is found that the water contact angle measurement decreases sharply close back to the contact angle of the pure blanket copper surface after annealing of SAM. The XPS results also show the ability of SAM in protecting Copper surface from oxidation. Finally, shear test is performed on Cu-Cu structures bonded at low temperature (250°C) in order to verify the SAM behavior in protecting the copper surface from oxidation and enhancement for bonding. The wafer pairs with and without SAM are intentionally exposed in clean room environment for few days. The bonded pieces are diced and subject to shear stress and results show that with SAM protection, shear strength is improved due to the enhancement in grain growth as a result of cleaner surface.

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2

Dehmel, Alfred, Jurgen Schulz-Harder, Alexander Roth, and Ingo Baumeister. "Direct Copper Bonded Ceramic Substrates for Use with Power LEDS." In 2007 8th International Conference on Electronic Packaging Technology. IEEE, 2007. http://dx.doi.org/10.1109/icept.2007.4441481.

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Schulz-Harder, J., and K. Exel. "Recent developments of direct bonded copper (DBC) substrates for power modules." In ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings. IEEE, 2003. http://dx.doi.org/10.1109/eptc.2003.1298787.

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Park, Ah-Young, Daniel Ferrone, Stephen Cain, Dae Young Jung, Bruce T. Murray, Seungbae Park, and Klaus Hummler. "Thermo-mechanical simulations of a copper-to-copper direct bonded 3D TSV chip package interaction test vehicle." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575892.

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5

Schulz-Harder, J. "Advanced DBC (direct bonded copper) substrates for high power and high voltage electronics." In Twenty-Second Annual IEEE Semiconductor Thermal Measurement and Measurement Symposium. IEEE, 2006. http://dx.doi.org/10.1109/stherm.2006.1625233.

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Schulz-Harder, J. "Advanced DBC (direct bonded copper) substrates for high power and high voltage electronics." In 2005 IEEE 11th European Conference on Power Electronics and Applications. IEEE, 2005. http://dx.doi.org/10.1109/epe.2005.219687.

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7

Park, Ah-Young, Satish Chaparala, and Seungbae Park. "A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73280.

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Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.

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Narumanchi, Sreekant, Douglas DeVoto, Mark Mihalic, Tim Popp, and Patrick McCluskey. "Thermal Performance and Reliability of Large-Area Bonded Interfaces in Power Electronics Packages." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-65399.

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In automotive power electronics packages (e.g., insulated gate bipolar transistor [IGBT] packages), conventional polymeric thermal interface materials (TIMs) such as greases, gels, and phase-change materials pose a bottleneck to heat removal and are also associated with reliability concerns. High thermal performance bonded interfaces have become an industry trend. However, due to mismatches in the coefficient of thermal expansion between materials/layers and the resultant thermomechanical stresses, there could be voids and crack formations in these bonded interfaces as well as delaminations, which pose a problem from a reliability standpoint. These defects manifest themselves in increased thermal resistance in the package, which acts as a bottleneck to heat removal from the package. Hence, the objective of this research is to investigate and improve the thermal performance and reliability of novel bonded interface materials for power electronics packaging applications. Thermal performance and reliability of bonds/joints is presented for bonds based on a thermoplastic (polyamide) adhesive with embedded micron-sized carbon fibers, sintered silver (Ag), and conventional lead (Pb)-based solder materials. These materials form a bond between 50.8 mm × 50.8 mm footprint direct-bond-copper (DBC) substrate and copper (Cu) base plate samples. Samples undergo thermal cycling (−40°C to 150°C) for up to 2,000 cycles as an upper limit. Damage occurrence is monitored every 100 temperature cycles by several non-destructive techniques, including steady-state thermal resistance measurement, acoustic microscopy, and high-voltage potential testing. This yields a consistent story on the thermal performance and reliability of large-area joints under accelerated stress conditions.

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Copeland, Lucas, and Mukul Saran. "Copper to Aluminum Bonding: IMC Characterization through New Mechanical Sectioning Methods." In ISTFA 2010. ASM International, 2010. http://dx.doi.org/10.31399/asm.cp.istfa2010p0181.

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Abstract This paper presents a mechanical cross-sectioning approach that produces an image clarity not yet demonstrated in published literature. It demonstrates how a critical sequence of polishing, basic slurry optimization and staining, in conjunction with correct imaging parameters can be used to highlight the growth morphology of the intermetallic compound (IMCs). Utilizing this approach, the paper describes the results of a SEM imaging study of the intermetallic formation and growth at the Cu-Al bond interface during thermal ageing for up to 4000hrs at 150 deg C. The paper uses direct SEM imaging to catalog observations which are used to create an initial model for IMC and void growth at the wire bonded interface. It examines the effect of aluminum splash and concludes that growth of intermetallics at the Cu-Al interface is rapid into the bond-pad aluminum than into the Cu-ball, but the growth thickness uniformity is much higher into the Cu-ball.

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Muench, S., M. Roellig, U. Cikalova, B. Bendjus, L. Chen, and S. Sudip. "A laser speckle photometry based non-destructive method for measuring stress conditions in direct-copper-bonded ceramics for power electronic application." In 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2017. http://dx.doi.org/10.1109/eurosime.2017.7926273.

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