Relevant bibliographies by topics / DXRL(Deep X-ray Lithography)

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers
  5. Reports

Academic literature on the topic 'DXRL(Deep X-ray Lithography)'

Author: Grafiati
Published: 4 June 2021
Last updated: 16 February 2022

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Journal articles on the topic "DXRL(Deep X-ray Lithography)"

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Achenbach, Sven, Garth Wells, and Chen Shen. "Characterization of the surface contamination of deep X-ray lithography mirrors exposed to synchrotron radiation." Journal of Synchrotron Radiation 25, no. 3 (2018): 729–37. http://dx.doi.org/10.1107/s1600577518004939.

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In deep X-ray lithography (DXRL), synchrotron radiation is applied to pattern polymer microstructures. At the Synchrotron Laboratory for Micro and Nano Devices (SyLMAND), Canadian Light Source, a chromium-coated grazing-incidence X-ray double-mirror system is applied as a tunable low-pass filter. In a systematic study, the surface conditions of the two mirrors are analyzed to determine the mirror reflectivity for DXRL process optimization, without the need for spectral analysis or surface probing: PMMA resist foils were homogeneously exposed and developed to determine development rates for mir
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Vlnieska, Vitor, Margarita Zakharova, Andrey Mikhaylov, and Danays Kunka. "Lithographic Performance of Aryl Epoxy Thermoset Resins as Negative Tone Photoresist for Microlithography." Polymers 12, no. 10 (2020): 2359. http://dx.doi.org/10.3390/polym12102359.

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Photoresists (or photo-resins) are the main and most important raw material used for lithography techniques such as deep X-ray (DXRL), ultraviolet (UVL), deep-UV (DUVL), and extreme UV (EUVL). In previous work, we showed how complicated could be the synthesis of the resins used to produce photoresist. In this study, we follow up on the strategy of tuning deep and macro levels of properties to formulate photo-resins. They were developed from a primary basis, using epoxy resins, a solvent, and a photoinitiator in several concentrations. The formulations were evaluated initially by the UVL techni
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Schmidt, M., W. Ehrfeld, G. Feiertag, H. Lehr, and A. Schmidt. "Deep X‐ray lithography for microfabrication." Synchrotron Radiation News 9, no. 3 (1996): 36–41. http://dx.doi.org/10.1080/08940889608602879.

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Klein, J., H. Guckel, D. P. Siddons, and E. D. Johnson. "X-Ray masks for very deep X-Ray lithography." Microsystem Technologies 4, no. 2 (1998): 70–73. http://dx.doi.org/10.1007/s005420050098.

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Pérennès, F., F. De Bona, and F. J. Pantenburg. "Deep X-ray lithography beamline at ELETTRA." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 467-468 (July 2001): 1274–78. http://dx.doi.org/10.1016/s0168-9002(01)00632-5.

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Ehrfeld, Wolfgang. "Recent developments in deep x-ray lithography." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 16, no. 6 (1998): 3526. http://dx.doi.org/10.1116/1.590490.

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Börner, M., A. El‐Kholi, F. J. Panternburg, and J. Mohr. "Deep x‐ray lithography for LIGA microsystems." Synchrotron Radiation News 9, no. 4 (1996): 24–30. http://dx.doi.org/10.1080/08940889608602888.

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Nazmov, V., E. Reznikova, A. Last, M. Boerner, and J. Mohr. "Reflectivity test of X-ray mirrors for deep X-ray lithography." Microsystem Technologies 14, no. 9-11 (2008): 1299–303. http://dx.doi.org/10.1007/s00542-008-0581-8.

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Cudin, I., F. De Bona, A. Gambitta, F. Pérennès, and A. Turchet. "Heat load problems in deep X-ray lithography." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 467-468 (July 2001): 1265–68. http://dx.doi.org/10.1016/s0168-9002(01)00655-6.

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Schmidt, A., W. Ehrfeld, H. Lehr, et al. "Aligned double exposure in deep X-ray lithography." Microelectronic Engineering 30, no. 1-4 (1996): 235–38. http://dx.doi.org/10.1016/0167-9317(95)00235-9.

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Dissertations / Theses on the topic "DXRL(Deep X-ray Lithography)"

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Lietz, Daniela [Verfasser], Metin [Akademischer Betreuer] Tolan, and Thomas [Gutachter] Weis. "A New Deep X-Ray Lithography Beamline at DELTA : Setup and Performance / Daniela Lietz. Betreuer: Metin Tolan. Gutachter: Thomas Weis." Dortmund : Universitätsbibliothek Dortmund, 2011. http://d-nb.info/1102533564/34.

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"Exciting the Low Permittivity Dielectric Resonator Antenna Using Tall Microstrip Line Feeding Structure and Applications." Thesis, 2013. http://hdl.handle.net/10388/ETD-2013-08-1143.

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The development of wireless communications increases the challenges on antenna performance to improve the capability of the whole system. New fabrication technologies are emerging that not only can improve the performance of components but also provide more options for materials and geometries. One of the advanced technologies, referred to as deep X-ray lithography (XRL), can improve the performance of RF components while providing interesting opportunities for fabrication. Since this fabrication technology enables the objects of high aspect ratio (tall) structure with high accuracy, it offer
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Cheng, Chao-Min, and 鄭兆珉. "Fabrication of high aspect ratio microstructure array by deep x-ray lithography." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/00978453118329867727.

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Chou, Min-Chieh, and 周敏傑. "Deep X-ray lithography and low-stress high-hardness electroplating technologies for the micro structure." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/61752358139621229448.

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博士<br>國立清華大學<br>材料科學工程學系<br>92<br>This investigation studied the deep X-ray lithography and the Ni-based alloy electroplating technologies for the low-stress, high-hardness and high-aspect-ratio micro structures. How the exposure dosage and developing temperature affected the development and how the composition of the plating bath and current density affected the composition, metallurgical microstructure, residual stress and hardness of Ni-Co and Ni-P-SiC deposits were discussed. The results of low-aspect-ratio X-ray lithography reveal that, with ultrasonic agitation, the developing rate of
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Liu, Kun-Pei, and 劉昆沛. "A Study on Ultra-Deep X-ray Lithography Technique with Highly-Sensitive SU-8 Resist." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/93638389674511533095.

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碩士<br>國立交通大學<br>機械工程系<br>91<br>This study investigates the feasibility of using SU-8 as a highly sensitive X-ray resist. An ultra-deep X-ray lithography (UDXL) technique will be developed to give a high- efficiency and high-precision micromachining process. This technique will be used to fabricate a deep (~1.5mm) and precise (＜2μm) resonant cavity of an mm-wave power supply in the future. Via chemical amplification mechanism, the SU-8 resist revealed very high sensitivity under X-ray irradiating. The result showed that its sensitivity is about 160 times higher than that of the tradi
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Aigeldinger, Georg [Verfasser]. "Implementation of an ultra deep X-ray lithography (UDXRL) system at CAMD / vorgelegt von Georg Aigeldinger." 2002. http://d-nb.info/964435748/34.

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Li, Han-Chieh, and 李漢傑. "The Study on Fabrication of Two-Dimensional Photonic Crystal in THz Range Using Ultra Deep X-ray Lithography Technique." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/u9mp89.

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Book chapters on the topic "DXRL(Deep X-ray Lithography)"

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Sugiyama, Susumu, and Hiroshi Ueno. "Novel Shaped Microstructures Processed by Deep X-Ray Lithography." In Transducers ’01 Eurosensors XV. Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-59497-7_365.

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Tabata, Osamu, Hui You, Haruki Shiraishi, et al. "μ-CE Chip Fabricated by Moving Mask Deep X-ray Lithography Technology." In Micro Total Analysis Systems 2000. Springer Netherlands, 2000. http://dx.doi.org/10.1007/978-94-017-2264-3_33.

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Feiertag, G., W. Ehrfeld, H. Freimuth, et al. "Fabrication of Three-Dimensional Photonic Band Gap Material by Deep X-Ray Lithography." In Photonic Band Gap Materials. Springer Netherlands, 1996. http://dx.doi.org/10.1007/978-94-009-1665-4_4.

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Kudryashov, Vladimir, and Paul Lee. "Deep X-ray Lithography for MEMS — Photoelectron Exposure of the Upper and Bottom Resist Layers." In Microsystems. Springer US, 2002. http://dx.doi.org/10.1007/978-1-4757-5791-0_10.

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Meyer, Pascal, Joachim Schulz, and Volker Saile. "Deep X-Ray Lithography." In Micro-Manufacturing Engineering and Technology. Elsevier, 2010. http://dx.doi.org/10.1016/b978-0-8155-1545-6.00013-2.

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Meyer, P., and J. Schulz. "Deep X-ray Lithography." In Micromanufacturing Engineering and Technology. Elsevier, 2015. http://dx.doi.org/10.1016/b978-0-323-31149-6.00016-5.

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Zumaqué, H., G. A. Kohring, and J. Hormes. "Simulation of Energy Deposition in Deep X-Ray Lithography." In Advances in Parallel Computing. Elsevier, 1998. http://dx.doi.org/10.1016/s0927-5452(98)80027-0.

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Conference papers on the topic "DXRL(Deep X-ray Lithography)"

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Goettert, Jost. "An Introduction Into X-Ray Micromachining Using Synchrotron Radiation." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-62019.

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Micro production technologies are a driving factor in today’s continuous effort of developing new, highly functional products. The need for increased functionality is met by decreasing the size of individual components as well as consequently miniaturizing components for non-electronic properties including optical, mechanical, and fluidic functions. An important factor in this approach his the right material for a given task and the ability to shape it into the desired geometry as well as to combine micro components in a cost-effective way to build more complex modules and micro systems. One m
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Mandisloh, Kristin, Sven Achenbach, Timo Mappes, Tilmann Rogge, and Roman Truckenmueller. "Submicron Polymer Flow Cells." In ASME 4th International Conference on Nanochannels, Microchannels, and Minichannels. ASMEDC, 2006. http://dx.doi.org/10.1115/icnmm2006-96147.

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This paper investigates the fabrication processes of polymer micro channels integrated into flow cells. The cross sectional dimensions of these flow cell channels are in the range of microns containing structures or structure details in the submicron range. Single-component and double-component cells are presented. Single-component cells are entirely made of one polymer. They are composed of a micro structured substrate and a cover plate to hermetically seal the subjacent microfluidic structures. Flexible fluidic ports are added to facilitate interfacing. Polymethylmethacrylate (PMMA) is used
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Mancini, Derrick C., Nicolaie A. Moldovan, Ralu Divan, Francesco DeCarlo, and Judith Yaeger. "X-ray lenses fabricated by deep x-ray lithography." In International Symposium on Optical Science and Technology, edited by Derrick C. Mancini. SPIE, 2002. http://dx.doi.org/10.1117/12.451021.

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Christenson, Todd R., and Henry Guckel. "Deep x-ray lithography for micromechanics." In Micromachining and Microfabrication, edited by Karen W. Markus. SPIE, 1995. http://dx.doi.org/10.1117/12.221271.

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Guckel, Henry, Kenneth J. Skrobis, J. Klein, Todd R. Christenson, and T. Wiegele. "Deep x-ray lithography for micromechanics." In Optics Quebec, edited by Ian W. Boyd. SPIE, 1994. http://dx.doi.org/10.1117/12.167569.

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Scheunemann, Heinz-Ulrich, Bernd Loechel, Linke Jian, Daniel Schondelmaier, Yohannes M. Desta, and Jost Goettert. "Cost-effective masks for deep x-ray lithography." In Microtechnologies for the New Millennium 2003, edited by Jung-Chih Chiao, Vijay K. Varadan, and Carles Can‰. SPIE, 2003. http://dx.doi.org/10.1117/12.498986.

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Guckel, Henry, Kenneth J. Skrobis, Todd R. Christenson, and J. Klein. "Micromechanics for actuators via deep x-ray lithography." In SPIE's 1994 Symposium on Microlithography, edited by David O. Patterson. SPIE, 1994. http://dx.doi.org/10.1117/12.175836.

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Jian, Linke, Yohannes M. Desta, Jost Goettert, et al. "SU-8 based deep x-ray lithography/LIGA." In Micromachining and Microfabrication, edited by John A. Yasaitis, Mary Ann Perez-Maher, and Jean Michel Karam. SPIE, 2003. http://dx.doi.org/10.1117/12.478246.

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Pantenburg, F. J. "Instrumentation for Microfabrication with Deep X-ray Lithography." In SYNCHROTRON RADIATION INSTRUMENTATION: Ninth International Conference on Synchrotron Radiation Instrumentation. AIP, 2007. http://dx.doi.org/10.1063/1.2436339.

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Nazmov, V. P., B. G. Goldenberg, E. F. Reznikova, and M. Boerner. "Self-aligned single-exposure deep x-ray lithography." In SYNCHROTRON AND FREE ELECTRON LASER RADIATION: Generation and Application (SFR-2020). AIP Publishing, 2020. http://dx.doi.org/10.1063/5.0030469.

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Reports on the topic "DXRL(Deep X-ray Lithography)"

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Malek, C. K., K. H. Jackson, and R. A. Brennen. Deep-etch x-ray lithography at the ALS: First results. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/603689.

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