Academic literature on the topic 'E-etching'
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Journal articles on the topic "E-etching"
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Zunic, Zora, Predrag Ujic, Igor Celikovic, and Kenzo Fujimoto. "ECE laboratory in the Vinca institute: Its basic characteristics and fundamentals of electrochemic etching on polycarbonate." Nuclear Technology and Radiation Protection 18, no. 2 (2003): 57–60. http://dx.doi.org/10.2298/ntrp0302057z.
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This paper deals with the introductory aspects of the Electrochemical Etching Laboratory installed at the VINCA Institute in the year 2003. The main purpose of the laboratory is its field application for radon and thoron large-scale survey using passive radon/thoron UFO type detectors. Since the etching techniques together with the laboratory equipment were transferred from the National Institute of Radiological Sciences, Chiba, Japan, it was necessary for both etching conditions to be confirmed and to be checked up^ i. e., bulk etching speeds of chemical etching and electrochemical etching in the VINCA Electrochemical Etching Laboratory itself. Beside this initial step, other concerns were taken into consideration in this preliminary experimental phase such as the following: the measurable energy range of the polycarbonate film, background etch pit density of the film and its standard deviation and reproducibility of the response to alpha particles for different sets of etchings.
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Yamada, Tomoya, Ryoichi Inanami, and Shinzo Morita. "Polyimide transmitted E-beam excited CF4 plasma etching." Thin Solid Films 316, no. 1-2 (March 1998): 13–17. http://dx.doi.org/10.1016/s0040-6090(98)00380-0.
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Rogozhin, A., M. Bruk, E. Zhikharev, D. Streltsov, A. Spirin, and J. Hramchihina. "Dry e-beam etching of resist for optics." Journal of Physics: Conference Series 741 (August 2016): 012115. http://dx.doi.org/10.1088/1742-6596/741/1/012115.
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Jeon, Bo-Kyung, Chang-Ha Lee, A. Reum Kim, Seung Hyun Han, Hyun-Jung Kim, Sibel A. Antonson, and Sun-Young Kim. "Effect of Etching Procedures on the Adhesion of Biofilm-Coated Dentin." Materials 13, no. 12 (June 18, 2020): 2762. http://dx.doi.org/10.3390/ma13122762.
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Oral biofilms coat all surfaces in the oral cavity including the exposed dentin surface. This study aimed to investigate biofilm removal by acid etching procedures and the effects of the residual biofilm on dentin surfaces on composite–dentin adhesion. Dentin discs were assigned to five groups: no biofilm formation (C); biofilm formation and no surface treatment (BF); biofilm formation and acid etching (BF-E); biofilm formation and acid etching followed by chlorhexidine soaking (BF-EC); and biofilm formation and rubbing with pumice, followed by acid etching (BF-RE). Biofilms were formed on saliva-precoated dentin discs by soaking the discs in Streptococcus mutans (S. mutans) suspension. Biofilm removal from the dentin surface was evaluated quantitatively and qualitatively by confocal laser scanning microscopy and scanning electron microscopy, respectively. To compare the bond strength of the biofilm-coated dentin discs with the surface treatments, specimens were assigned to four groups: no biofilm formation and acid etching (C-E); BF-E; BF-EC; and BF-RE. Assessments of the micro-shear bond strength and subsequent failure modes were performed. BF-E and BF-EC did not remove the biofilm, whereas BF-RE partially removed the biofilm attached to the dentin (p < 0.05). The bond strength of BF-RE was significantly higher than those of BF-E and BF-EC, but lower than that of C-E (p < 0.05). In conclusion, mechanical biofilm removal is recommended before etching procedures to enhance adhesion to the biofilm-coated dentin.
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Wu, Hsing Chen, Sheng Hung Tu, Min Chieh Yang, and Emanuel Cooper. "Selective Etching of Silicon Oxide versus Nitride with Low Oxide Etching Rate." Solid State Phenomena 255 (September 2016): 75–80. http://dx.doi.org/10.4028/www.scientific.net/ssp.255.75.
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This paper describes both aqueous and solvent-based formulations aimed at etching silicon oxide (SiOx) with etching rates (E/R) of the order of 10-20 A/min with selectivity greater than 5 with respect to silicon nitride (SiNx) . Diluted hydrofluoric acid (dHF) with very low pH was tried first but the selectivity was found to increase only with higher SiOx E/R. Solvent-based formulations derived from previous work also behaved in a similar way, however its SiOx E/R could be reduced by modifying the total fluoride concentration inside formulation. Finally, we found that low SiOx E/R could also be implemented in the diluted buffer-oxide etch (BOE) solution and the selectivity could be adjusted by addition of a specific surfactant at a very low concentration level.
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Ivantsov, Vladimir, and Anna Volkova. "A Comparative Study of Dislocations in HVPE GaN Layers by High-Resolution X-Ray Diffraction and Selective Wet Etching." ISRN Condensed Matter Physics 2012 (August 30, 2012): 1–6. http://dx.doi.org/10.5402/2012/184023.
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It has been shown during the present study that the E-etching at elevated temperatures can be adopted for the dislocation etching in hydride vapor-phase epitaxy (HVPE) GaN layers. It has been found that the X-ray diffraction (XRD) evaluation of the dislocation density in the thicker than 6 μm epilayers using conventional Williamson-Hall plots and Dunn-Koch equation is in an excellent agreement with the results of the elevated-temperature E-etching. The dislocation distribution measured for 2-inch GaN-on-sapphire substrate suggests strongly the influence of the inelastic thermal stresses on the formation of the final dislocation pattern in the epilayer.
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Zogheib, Lucas Villaça, Alvaro Della Bona, Estevão Tomomitsu Kimpara, and John F. Mccabe. "Effect of hydrofluoric acid etching duration on the roughness and flexural strength of a lithium disilicate-based glass ceramic." Brazilian Dental Journal 22, no. 1 (2011): 45–50. http://dx.doi.org/10.1590/s0103-64402011000100008.
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The aim of this study was to examine the effect of different acid etching times on the surface roughness and flexural strength of a lithium disilicate-based glass ceramic. Ceramic bar-shaped specimens (16 mm x 2 mm x 2 mm) were produced from ceramic blocks. All specimens were polished and sonically cleaned in distilled water. Specimens were randomly divided into 5 groups (n=15). Group A (control) no treatment. Groups B-E were etched with 4.9% hydrofluoric acid (HF) for 4 different etching periods: 20 s, 60 s, 90 s and 180 s, respectively. Etched surfaces were observed under scanning electron microscopy. Surface profilometry was used to examine the roughness of the etched ceramic surfaces, and the specimens were loaded to failure using a 3-point bending test to determine the flexural strength. Data were analyzed using one-way ANOVA and Tukey's test (?=0.05). All etching periods produced significantly rougher surfaces than the control group (p<0.05). Roughness values increased with the increase of the etching time. The mean flexural strength values were (MPa): A=417 ± 55; B=367 ± 68; C=363 ± 84; D=329 ± 70; and E=314 ± 62. HF etching significantly reduced the mean flexural strength as the etching time increased (p=0.003). In conclusion, the findings of this study showed that the increase of HF etching time affected the surface roughness and the flexural strength of a lithium disilicate-based glass ceramic, confirming the study hypothesis.
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Sponchiado, Adriane Regina, Afonso E. Wunderlich Júnior, Paulo Sérgio Galletta, and Murilo Rosa. "Avaliação do uso do Self Etching Primer na colagem de braquetes ortodônticos metálicos." Revista Dental Press de Ortodontia e Ortopedia Facial 10, no. 3 (June 2005): 66–74. http://dx.doi.org/10.1590/s1415-54192005000300008.
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Nesta pesquisa laboratorial foi avaliada a resistência de união ao cisalhamento de braquetes metálicos colados ao esmalte dentário bovino, utilizando um sistema adesivo convencional, composto de ácido fosfórico + primer + resina adesiva, e de um sistema SEP (self-etching primer) que combina ácido e primer em uma única solução, avaliado em ambiente seco e úmido (com água). Quarenta e oito incisivos inferiores bovinos foram divididos em três grupos de 16 unidades, que foram assim preparados: grupo 1 (controle) ácido fosfórico 37% + primer + resina Transbond XT; o grupo 2 Transbond Plus Self Etching Primer em ambiente seco + resina Transbond XT e no grupo 3 o Transbond Plus Self Etching Primer foi aplicado em ambiente úmido com água + Transbond XT. Efetuada a colagem, procedeu-se o ensaio mecânico em uma máquina Instron, a uma velocidade de 1mm/min. As médias da resistência de união ao cisalhamento encontradas foram: 9,29MPa para o grupo 1; 10,57MPa para o grupo 2 e 7,45MPa para o grupo 3, sendo que os três grupos apresentaram resistência compatível com o uso clínico. Não houve diferença estatisticamente significante entre o sistema convencional e o SEP em ambiente seco, nem em ambiente úmido. Houve redução significativa na resistência de união ao cisalhamento para o SEP em ambiente úmido quando comparado ao SEP em ambiente seco. Concluímos que o Transbond Plus Self Etching Primer apresenta resistência de união ao esmalte similar ao ácido fosfórico 37% + primer, sendo indicado para uso clínico na colagem de braquetes ortodônticos.
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Li, Zhong Yang, Zhao Yang Zhang, Yao Min Wang, and Wei Ping Mao. "Stress-Etching Using Laser Electrochemical Micromachining with Masks." Applied Mechanics and Materials 268-270 (December 2012): 468–72. http://dx.doi.org/10.4028/www.scientific.net/amm.268-270.468.
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Metal workpiece was processed by nanosecond pulsed laser electrochemical micro-etching with masks patterns in the shape of letter "E". In the experimental system established, the effect of different laser energy on processing quality was studied in air. In the different concentrations of the electrolyte, through optimized composite machining parameters, machining results of different laser energy with the masks were analyzed and compared in Aluminum alloy and Stainless steel. There was a large of difference in machining morphology by laser electrochemical micromachining with masks in two different metal materials. The results show that laser electrochemical micro-etching with masks has high efficiency and the prospects for the large-scale production, but the etching precision should be also further improved. Moreover, the nanosecond pulsed laser thermal-stress etching, electrochemical etching and the two combined coupling etching are the main factors to achieve the metal removal.
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Schwimmer, Yair, Nurit Beyth, Diana Ram, Eitan Mijiritsky, and Esti Davidovich. "Laser Tooth Preparation for Pit and Fissure Sealing." International Journal of Environmental Research and Public Health 17, no. 21 (October 26, 2020): 7813. http://dx.doi.org/10.3390/ijerph17217813.
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Objectives: Various approaches are available for pit and fissure sealing, including: the use of sealants, with or without mechanical preparation; the use of etching, with or without bonding; and the use of lasers as an alternative to mechanical preparation. The objective of this study is to evaluate pit and fissure sealing by comparing the retention and microleakage of sealants, between mechanical and Er:Yag laser enamel preparation. Methods: Sixty extracted sound third molars are classified into six groups: A, bur mechanical preparation and sealant application; B, bur mechanical preparation, etching and sealant; C, bur mechanical preparation, etching, bonding and sealant; D, laser mechanical preparation and sealant; E, laser mechanical preparation, etching and sealant application; F, laser mechanical preparation, etching, bonding, and sealant. Statistical analysis methods include Fisher’s exact test, a general linear model for one-way analysis of variance (ANOVA) of multiple comparisons, and Bonferroni multiple comparison tests. Results: All the groups showed dye microleakage beneath the sealants. Less microleakage was observed for those that used bur rather than laser, 41 versus 44 specimens, respectively. The number of specimens without microleakage decreased as follows: group E (24), group A (18), groups B and F (17), group C (14), and group D (5). Retention was 100% in all groups except group D. Conclusion: Mechanical preparation increases retention of sealants, especially when etching material is used; additionally, bonding can help the retention. The best technique is mechanical preparation via laser and subsequent use of etching, without bonding prior to application of the dental sealant.
Dissertations / Theses on the topic "E-etching"
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Orf, Bryan J. "Comparison of advanced resist etching In e-beam generated plasmas." College Park, Md. : University of Maryland, 2006. http://hdl.handle.net/1903/3660.
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Thesis (M.S.) -- University of Maryland, College Park, 2006.Thesis research directed by: Dept. of Materials Science and Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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Macedo, Maria Gracinda Ferreira Pereira de. "Integridade da camada de adesivo em diferentes áreas topográficas da dentina, utilizando sistemas de adesão de total ecthing e self-etching." Dissertação, Faculdade de Medicina Dentária da Universidade do Porto, 2009. http://hdl.handle.net/10216/61052.
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Macedo, Maria Gracinda Ferreira Pereira de. "Integridade da camada de adesivo em diferentes áreas topográficas da dentina, utilizando sistemas de adesão de total ecthing e self-etching." Master's thesis, Faculdade de Medicina Dentária da Universidade do Porto, 2009. http://hdl.handle.net/10216/61052.
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Saavedra, Guilherme de Siqueira Ferreira Anzaloni. "Efeito da neutralização e limpeza sônica do precipitado do ácido fluorídrico sobre a resistência de união entre uma cerâmica feldspática e um cimento resinoso /." São José dos Campos : [s.n.], 2006. http://hdl.handle.net/11449/97416.
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Orientador: Estevão Tomomitsu KimparaBanca: Rander Pereira Avelar
Banca: Tarcisio José de Arruda Paes
Resumo: O objetivo deste trabalho foi avaliar três hipóteses: a) o processo de neutralização influencia nos valores de resistência de união entre uma cerâmica feldspática e um cimento resinoso; b) limpeza sônica dos precipitados do ácido fluorídrico aumenta os valores de resistência de união; c) associação entre o do processo de neutralização e a limpeza sônica melhora a resistência de união. Confeccionou-se 32 blocos cerâmicos (VM7 VITA Zahnfabrik), os quais foram duplicados em resina composta (W3D Master). Os resultados deste estudo confirmaram que: a) o processo de neutralização influencia nos valores de resistência de união entre uma cerâmica feldspática e um cimento resinoso; b) a limpeza sônica dos precipitados do ácido fluorídrico aumenta os valores de resistência de união; c) a associação entre o processo de neutralização e a limpeza sônica melhora a resistência de união.
Abstract: This study evaluated three hypotheses: a) the neutralization process influences the bond strength values between a feldspar ceramic and a resin cement; b) ultrasonic cleaning of hydrofluoric acid precipitates increases the bond strength values; c) association between the neutralization process and ultrasonic cleaning improves the bond strength. The present results confirmed that: a) the neutralization process influences the bond strength values between a feldspar ceramic and a resin cement; b) ultrasonic cleaning of hydrofluoric acid precipitates increases the bond strength values; c) association between the neutralization process and ultrasonic cleaning improves the bond strength.
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Camargo, Janine Sanches Gonzaga de. "Modificação da molhabilidade da celulose por processos subsequentes de ablação e deposição a plasma." Universidade Federal de São Carlos, 2017. https://repositorio.ufscar.br/handle/ufscar/9001.
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
Cellulose is a biopolymer available in abundance in nature, which presents very interesting properties mainly for the textile, packaging and paper industry. However, due to its strongly hydrophilic character, resulting from the presence of a large number of free hydroxyl groups in its molecule, its use in certain areas becomes limited. In order to promote the modification of the wetting characteristic of the cellulose, and make it superhydrophobic, samples of this material were submitted to plasma processes performed in two steps: ablation and film deposition. Initially, the effect of variation of ablation time on the creation of adequate surface topography was studied. For this, the samples were exposed to the oxygen plasma at a pressure of 13 Pa and power of 150 W, varying the treatment time from 5 to 60 minutes. Then, the treated samples were submitted to the process called PECVD (Plasma Enhanced Chemical Vapor Deposition), in which a film was deposited on the surface from the precursor hexamethyldisiloxane (HMDSO) in the presence of argon, in a ratio of 70 e 30%, respectively. The deposition time was set to 30 minutes and the power applied was 150 W. In a second investigation, the effect of the thickness of the deposited film was studied. In this case, the cellulose samples were previously exposed to the oxygen ablation plasma for 60 minutes and then led to the PECVD process, with the deposition time varying from 5 to 30 minutes. In a third investigation, the duration of the ablation and deposition steps was reduced to 30 and 1 minute, respectively, in order to optimize the methodology. The samples were characterized by Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS), Fourier Transform Infrared Spectroscopy (FTIR), profilometry, static contact angle measurements and hysteresis and sliding angle measurements. The results demonstrated that longer exposure times for the ablation step provide a significant modification in the material, through the creation of nanoscale structures on the surface of the fibers. The deposition step promoted the formation of films with organosilicon character on the cellulose surface, with thicknesses varying between 144 and 910 nm. The combination of the topography created after 30 minutes of ablation with the thin film resulting from the deposition step for 1 minute provided a surface with low receptivity for both polar (? = 150°) and nonpolar (? ~ 120°) liquids, whose wettability property remained stable with treatment aging time. The low values obtained for hysteresis (9°) and sliding angle (7°) confirm the creation of a superhydrophobic roll-off surface.
A celulose é um biopolímero disponível em abundância na natureza e que possui propriedades bastante interessantes principalmente para a indústria têxtil, de embalagens e papel. No entanto, devido ao seu caráter fortemente hidrofílico, proveniente da presença de um grande número de grupos hidroxila livres em sua molécula, sua utilização em determinadas áreas se torna limitada. Com o objetivo de promover a modificação da característica de molhabilidade da celulose, de modo a torná-la superhidrofóbica, amostras deste material foram submetidas a processos a plasma realizados em duas etapas: ablação e deposição de filme. Inicialmente, estudou-se o efeito da variação do tempo de ablação na criação da topografia adequada da superfície. Para isto, as amostras foram expostas ao plasma de oxigênio a uma pressão de 13 Pa e 150 W de potência, variando-se o tempo de tratamento de 5 a 60 minutos. Em seguida, as amostras tratadas foram submetidas ao processo denominado PECVD (Plasma Enhanced Chemical Vapor Deposition), no qual foi depositado um filme sobre a superfície das mesmas, a partir do precursor hexametildisiloxano (HMDSO) na presença de argônio, numa proporção de 70 e 30%, respectivamente. O tempo de deposição foi fixado em 30 minutos e a potência aplicada foi de 150 W. Numa segunda investigação, foi estudado o efeito da espessura do filme depositado. Neste caso, as amostras de celulose foram previamente expostas ao plasma de ablação com oxigênio durante 60 minutos e posteriormente ao processo de PECVD, variando-se o tempo de deposição de 5 a 30 minutos. Numa terceira investigação, o tempo de duração das etapas de ablação e deposição foi reduzido para 30 e 1 minuto, respectivamente, com o intuito de otimizar a metodologia. As amostras foram caracterizadas por Microscopia Eletrônica de Varredura (MEV), Espectroscopia de Energia Dispersiva (EDS), Espectroscopia de Absorção no Infravermelho por Transformada de Fourier (FTIR), perfilometria, medição de ângulo de contato estático e medição de histerese e ângulo de deslizamento. Os resultados demonstraram que maiores tempos de exposição à etapa de ablação proporcionam uma modificação significativa no material, por meio da criação de estruturas em nanoescala na superfície das fibras. A etapa de deposição promoveu a formação de filmes de caráter organosilicone sobre a superfície da celulose, com espessuras variando entre 144 e 910 nm. A combinação entre a topografia criada após 30 minutos de ablação e o filme de menor espessura resultante da etapa de deposição durante 1 minuto, possibilitaram a obtenção de uma superfície de baixa receptividade tanto a líquidos polares (? =150°) quanto apolares (? ~120°), cuja propriedade de molhabilidade se manteve estável com o tempo de envelhecimento. Os baixos valores de histerese (9°) e ângulo de deslizamento (7°) obtidos confirmam a criação de uma superfície superhidrofóbica do tipo “roll-off”.
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Azevedo, Paola Cristine Almeida. "Gravura em luz : uma possibilidade holistica da calcogravura e a holografia." [s.n.], 2007. http://repositorio.unicamp.br/jspui/handle/REPOSIP/284315.
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Orientador: Jose Joaquim LunazziTese (doutorado) - Universidade Estadual de Campinas, Instituto de Artes
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Resumo: Esta pesquisa objetivou criar e refletir sobre o alargamento de linguagens usadas na arte e a tecnologia como parâmetros de criação de um trabalho em poéticas visuais. Para estruturar esses conceitos, foram levantadas leituras referentes à mudança paradigmática da segunda metade do século XX relativa ao campo da física quântica, assim como a retomada de uma postura unificadora das áreas do conhecimento proposta pela visão holística. Dessa maneira, no tratamento empírico realizaram-se os trabalhos poéticos considerados ? as hologravuras ? com objetivo de aproximar o observador de um estado de percepção maior ao vivido cotidianamente, com ênfase na fenomenologia da percepção, descrita e recorrente na produção de artistas nas últimas cinco décadas. O trabalho tem quatro partes. A primeira é dedicada às questões teóricas; a segunda ao histórico dos meios técnicos calcogravura e holografia; no terceiro a recorrência da fenomenologia e a utilização da linha como elementos pertinentes na ambientação do trabalho artístico, como método comparativo, nas duas últimas partes, uso das obras de artistas consolidados na área que fazem aproximações com esta pesquisa; na quarta e última parte, relato a produção empírica desta pesquisa envolvendo questões de imaterialidade do trabalho e sua relação frente à arte contemporânea. Esta pesquisa tem aplicações pertinentes a um estado de reflexão e sistematização em termos científicos na produção de trabalhos em poéticas visuais; as hipóteses aqui levantadas são compatíveis com os resultados alcançados no que se refere a um alargamento das linguagens artísticas usando como recurso a arte e a tecnologia, pois os trabalhos desenvolvidos a partir daí incluem informação científica e tecnológica, mas é atualizada dentro de moldes poéticos próprios, tornando-se exemplo do que é possível fazer: unir dois campos do conhecimento.Nesse sentido, buscando uma conscientização de dentro para fora, a fenomenologia pode ser tomada como modelo pelas artes que lidam com a tecnologia
Abstract: The present research project entitled Light Etchings; a Holistic Possibility of Calcogravure and Holography has as it?s main objective to reflect upon the widening of languages through the fusion of art and technology emphasizing these two quite different approaches as parameters for the creation of a visual poetics. In order to mount these concepts, readings regarding the paradigmatic changes in the area of Quantum Physics during the second half of the twentieth century became instrumental especially when placed in context to the vision proposed by Holistic Theory. In this way, in what regards empirical treatment, a number of Holoetchings (Hologravura) were elaborated with the objective of bringing the observer to a higher state of observation than that normally experienced and thus emphasizing methods recurrent in the production of artists during the past five decades regarding the phenomenology of perception. The work is organized in four parts. The first, dedicated to theoretical questions, the second to the technical aspects of metal engraving and holography, the third to the recurrence of phenomenology and the use of linearity as pertinent elements in the environment of the artistic work, as a comparative method in the last two parts I use the works of established artists whose work border this research, and in the fourth part, a description of the empirical work of this research involving questions of the immateriality of the work and it?s relation to contemporary art. This research has pertinent applications in relation to the reflection and systematization in scientific terms in relation to works in visual poetics, to the hypotheses here proposed which are compatible to the results obtained pertinent to the widening of artistic languages using as resources art and technology since works effected from that point contain information which is both scientific and technological, but brought up-to date within definite poetic molds, becoming thus, an example of what it is possible to achieve by blending two fields of knowledge. In this sense, searching for concicousness from inside out, phenomenology can be taken as a model by arts that deal with technology
Doutorado
Artes Visuais
Mestre em Artes
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Coppini, Erick Kamiya 1989. "Influence of enamel acid-etching on mechanical properties and nanoleakage of resin composite restorations after thermomechanical aging = Influência do condicionamento ácido do ângulo cavosuperficial nas propriedades mecânicas e nanoinfiltração de restaurações após envelhecimento termomecânico." [s.n.], 2013. http://repositorio.unicamp.br/jspui/handle/REPOSIP/289649.
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Orientador: Luís Alexandre Maffei Sartini PaulilloDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Odontologia de Piracicaba
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Resumo: The aim of this study was to evaluate the cavosuperficial enamel acid-etching influence in class I cavities, filled with composites on microtensile bond strength, Knoop microhardness and nanoleakage after thermomechanic ageing. It was selected 76 sound molar splitted on: 32 teeth to microtensile test (n=8); 32 teeth to Knoop microhardness (n=8); and 12 teeth (n=3) to nanoleakage analysis. The cavities were prepared on a standard cavity preparation machine. Half of the teeth had the cavosuperficial enamel etched with 35% phosphoric acid and restored with a Silorane restorative system or a Methacrylate restorative system. After the conclusion of the restoration procedures, the teeth were taken to a thermomechanic cycling machine where the artificial ageing was performed with 200.000 mechanical cycles with an 80 N load in a 2HZ frequency and thermocycling by filling the chambers for 30 seconds and 15 seconds drainage with the temperatures varying between 5ºC and 55ºC. The samples were submitted to the microtensile bond strength test, Knoop microhardness and nanoleakage evaluation. To statistical analysis it was performed the ANOVA two-way and Tuckey test (p ? 0,05). The group restored with methacrylate without acid-etching showed the lowest values of microtensile bond strength and it was statistically different to the other groups that have no difference between them. The methacrylate composite presented statistically higher values on Knoop microhardness compared to silorane composite. The nanoleakage analysis showed low infiltration to silorane restorative system and moderate infiltration to the methacrylate restorative system. The methacrylate group restored without enamel acid-etching showed the formation of Water Trees. It can be concluded that the acid-etching improved the bond strength to the methacylate system. The methacrylate composite has bigger Knoop microhardness than silorane composite. The methacrylate restorative system showed moderate infiltration on nanoleakage analysis
Abstract: The aim of this study was to evaluate the cavosuperficial enamel acid-etching influence in class I cavities, filled with composites on microtensile bond strength, Knoop microhardness and nanoleakage after thermomechanic ageing. It was selected 76 sound molar splitted on: 32 teeth to microtensile test (n=8); 32 teeth to Knoop microhardness (n=8); and 12 teeth (n=3) to nanoleakage analysis. The cavities were prepared on a standard cavity preparation machine. Half of the teeth had the cavosuperficial enamel etched with 35% phosphoric acid and restored with a Silorane restorative system or a Methacrylate restorative system. After the conclusion of the restoration procedures, the teeth were taken to a thermomechanic cycling machine where the artificial ageing was performed with 200.000 mechanical cycles with an 80 N load in a 2HZ frequency and thermocycling by filling the chambers for 30 seconds and 15 seconds drainage with the temperatures varying between 5ºC and 55ºC. The samples were submitted to the microtensile bond strength test, Knoop microhardness and nanoleakage evaluation. To statistical analysis it was performed the ANOVA two-way and Tuckey test (p ? 0,05). The group restored with methacrylate without acid-etching showed the lowest values of microtensile bond strength and it was statistically different to the other groups that have no difference between them. The methacrylate composite presented statistically higher values on Knoop microhardness compared to silorane composite. The nanoleakage analysis showed low infiltration to silorane restorative system and moderate infiltration to the methacrylate restorative system. The methacrylate group restored without enamel acid-etching showed the formation of Water Trees. It can be concluded that the acid-etching improved the bond strength to the methacylate system. The methacrylate composite has bigger Knoop microhardness than silorane composite. The methacrylate restorative system showed moderate infiltration on nanoleakage analysis
Mestrado
Dentística
Mestre em Clínica Odontológica
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Freitas, Marcela Santiago 1987. "Effect of pre-etching to enamel and dentin on bond strength and interfacial morphology of different adhesives systems = Efeito do pré-condicionamento ácido do esmalte da dentina na resistência de união e morfologia de interface de diferentes sistemas adesivos." [s.n.], 2013. http://repositorio.unicamp.br/jspui/handle/REPOSIP/288307.
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Orientadores: Mirela Sanae Shinohara, Mário Fernando de GóesDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Odontologia de Piracicaba
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Resumo: Estudos mostram que a resistência de união (RU) alcançada pelos sistemas adesivos autocondicionantes em superfície de esmalte pré-condicionado é significativamente maior se comparada aos valores obtidos em esmalte não condicionado. A partir destas evidências, este estudo teve como objetivo avaliar a RU e a morfologia da interface adesiva (MI) em esmalte e dentina de um adesivo autocondicionante de passo único multi-mode e um adesivo autocondicionante de dois passos com e sem pré-condicionamento ácido da superfície comparado a dois sistemas adesivos de condicionamento total, de dois e três passos. Terceiros molares humanos recém-extraídos foram seccionados para obtenção de superfícies planas em esmalte e dentina, as quais foram desgastadas com lixa SiC #600 para padronização da smear layer. Estas amostras foram divididas aleatoriamente em 6 grupos: (SBU) Scotchbond Universal; (SBUcond) SBU précondicionado; (CSE) Clearfil SE Bond; (CSEcond) CSE pré-condicionado; (SBMP) Scotchbond Multi-Purpose; e (EX) Excite F. Os grupos de condicionamento total e os autocondicionantes a serem avaliados com pré-condicionamento receberam a aplicação do ácido fosfórico por 15s em dentina e 30s em esmalte. Todos os sistemas adesivos foram aplicados de acordo com as recomendações dos fabricantes. Em seguida, um bloco de resina composta (Filtek Supreme Plus) foi construído incrementalmente sobre cada superfície preparada para o teste de RU, e para a MI, as superfícies foram restauradas com resina flow (Filtek Z-350 Flowable Restorative) formando um "sanduíche", de esmalte ou dentina. Após 24h, para avaliação da RU, as amostras foram seccionadas em palitos com área transversal de 0,8mm2 e submetidos ao teste de microtração com velocidade de 1,0mm/min. Os resultados foram analisados estatisticamente pelos testes one-way ANOVA e Fisher's PLSD (?=0.05) e os padrões de fratura analisados em Microscopia Eletrônica de Varredura (MEV). Para análise da MI, duas amostras de cada grupo foram incluídas em resina epóxica, polidas e observadas em MEV. Para esmalte, os resultados de RU mostraram que o SBUcond e CSEcond obtiveram os maiores valores, seguidos dos grupos SBMP, SBU e CSE que não apresentaram diferenças entre si. O grupo EX obteve os menores valores comparados aos outros grupos. Na análise da MI, os grupos SBUcond e CSEcond apresentaram nítidas extensões do adesivo penetrado no esmalte desmineralizado, semelhante aos sistemas de condicionamento total. Já para dentina, os resultados de RU mostraram que o condicionamento ácido prévio diminuiu significativamente os valores de RU dos sistemas autocondicionantes. Os maiores valores foram obtidos pelo SBU, CSE e SBMP, com valores de RU estatisticamente equivalentes entre si. Como em esmalte, o sistema adesivo EX obteve os menores valores. A análise em MEV da MI mostrou que o condicionamento prévio da dentina com adesivos autocondicionantes forma uma camada híbrida mais espessa com formação de tags resinosos, semelhantes aos sistemas adesivos de condicionamento total. Pode-se concluir que em esmalte, o condicionamento prévio aumentou significativamente os valores de RU para os sistemas autocondicionantes. Contudo, estes sistemas adesivos não apresentaram diferença estatística do adesivo convencional SBMP. E para dentina, o pré-condicionamento dos adesivos autocondicionantes diminuiu significativamente os valores de RU, entretanto, os valores de SBUcond não foram diferentes significativamente dos obtidos pelo sistema adesivo convencional SBMP
Abstract: Studies show that the bond strength (BS) achieved by self-etching adhesive systems on pre-etched enamel surface is significantly higher compared with the values obtained on unetched enamel. From this evidence, this study aimed to assess the BS and morphology of the adhesive interface (AI) on enamel and dentin of a one-step self-etching adhesive multi-mode and a two-step selfetching adhesive with and without pre-etching of surface compared with two totaletching adhesive systems, two and three steps. Recently extracted human third molars were sectioned to obtain flat surfaces in enamel and dentin, which were ground with #600 SiC sandpaper to standardize the smear layer. These samples were randomly assigned into 6 groups: (SBU) Scotchbond Universal; (SBU-et) SBU pre-etched; (CSE), Clearfil SE Bond, (CSE-et) CSE pre-etched; (SBMP) Scotchbond Multi-Purpose, and (EX) Excite F. The groups total-etching and selfetching to be evaluated with pre-etching received the application of phosphoric acid for 15s in dentin and 30s in enamel. All adhesive systems were applied according to manufacturers' recommendations. Then, a block of composite resin (Filtek Supreme Plus) was constructed incrementally on each surface prepared for BS testing. For AI, the areas were filled with flowable resin (Filtek Flowable Restorative Z-350) forming a "sandwich" of enamel or dentin. After 24 hours, to review the BS, the specimens were sectioned into sticks with cross-sectional area of 0.8mm² and submitted to microtensile test at a speed of 1.0mm/min. The results were statistically analyzed by one-way ANOVA test and Fisher's PLSD (?=0.05) and fracture patterns were analyzed through Scanning Electron Microscopy (SEM). For analysis of AI, two samples from each group were embedded in epoxy resin, polished and observed through SEM. For enamel, the results of BS showed that SBU-et and CSE-et obtained the highest values, followed by SBMP groups, SBU and CSE with no differences among them. The EX group obtained the lowest values of all other groups. In the analysis of AI, and CSE-et and SBU-et groups showed sharp tag extensions of the adhesive penetrated in the demineralized enamel, similar to total-etching systems. As for dentin, BS results showed that acid etching significantly reduced the BS values of self-etching systems. The highest values were obtained by the SBU, CSE and SBMP with BS values statistically equivalent to each other. As in enamel, the adhesive system EX obtained the lowest values. SEM analysis showed that BS for pre-etched dentin with selfetching adhesive forms a thicker hybrid layer with resin tags formation, similar to total-etching adhesive systems. It can be concluded that on enamel, the preetching significantly increased BS for self-etching systems. However, these adhesive systems showed no statistical difference from conventional adhesive SBMP. And to dentin, pre-etching of sel-etching adhesives significantly reduced BS, however, SBU-et values were not significantly different from those obtained by the conventional adhesive system SBMP
Mestrado
Dentística
Mestra em Materiais Dentários
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Iost, Rodrigo Michelin. "Biocélula a combustível on-chip utilizando folhas individuais de grafeno." Universidade de São Paulo, 2016. http://www.teses.usp.br/teses/disponiveis/75/75134/tde-22092016-104129/.
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A miniaturização de uma biocélula a combustível (BC) enzimática de glicose/O2 para aplicação em dispositivos bioeletrônicos implantáveis representa um grande desafio em eletroquímica moderna. Isso porque é preciso desenvolver bioeletrodos com alta atividade bioeletrocatalítica, com enzimas fortemente ligadas a superfície eletródica. Além disso, o próprio processo de micromanipulação é desafiador, uma vez que é desejável obter biocélulas miniaturizadas e com alta densidade de potência. Assim, propõe-se aqui o desenvolvimento de uma BC que atenda os requisitos supracitados. Para isso, desenvolveram-se bioânodos e biocátodos compostos por folhas de grafeno individuais modificadas com as enzimas glicose desidrogenase (GDh) e bilirrubina oxidase (BOx), respectivamente. Eletrodos de grafeno com área de 10-3 cm2 e espessura de 0,9 ± 0,2 nm foram utilizados em um microchip de Si/SiO2. Observou-se que o grafeno transferido para o microchip permanecia com contaminações de cobre, mesmo após a utilização dos métodos químicos tradicionais de remoção desse metal. A presença de cobre é decorrente do processo de fabricação do grafeno, neste caso, a deposição química em fase vapor (CVD). Para remover qualquer resíduo deste metal, submeteu-se o grafeno a um procedimento de remoção eletroquímica de cobre, denominada aqui como e-etching. Uma vez não observada qualquer corrente faradaica residual associada às impurezas, obtiveram-se os bioeletrodos com a GDh e a BOx. Para a imobilização enzimática, utilizou-se a ligação covalente via funcionalização com o ácido 4-aminobenzóico. As curvas de polarização de estado quase-estacionário obtidas com os bioeletrodos em tampão fosfato pH 7,0 revelaram correntes de onset para oxidação de glicose em -0,13 V e redução de oxigênio em 0,45 V. Por fim, os eletrodos foram utilizados em uma BC sem membrana, operando no microchip de Si/SiO2, em eletrólito tampão fosfato saturado com O2 e glicose 8,0 mmol L-1. A BC apresentou um potencial de circuito aberto em 0,55 V, com densidade de potência volumétrica igual a 1,7 W cm-3, o maior valor reportado até os dias de hoje para uma BC.The miniaturization of a glucose/O2 enzymatic biofuel cell (BFC) for application in implantable bioelectronic devices is a challenge in electrochemistry. For this purpose, the necessity of bioelectrodes development with high biocatalytic activity such as enzymes strongly attached to electrode surfaces is a current trend. Moreover, the micromanipulation procedure itself is a challenge since the obtention of BFCs with high power density is desirable. Then, the present study shows the partial results obtained in the development of a glucose/O2 BFC with the characteristics exemplified. For the later, bioanodes and biocathodes were obtained with single graphene flakes modified with the enzymes glucose dehydrogenase (GDh) and bilirubin oxidase (BOx), respectively. Graphene flakes electrodes with area of about 10-3 cm2 and thickness of 0,9 ± 0,2 nm were used in a Si/SiO2 microchip. It was observed that transferred graphene to the microchip remained with copper/copper oxide contamination even after the use of conventional methodologies for the remotion of the metal from single graphene foils. The presence of the remaining copper is due to the fabrication process of graphene by chemical vapor deposition (CVD). For the remotion of remaining impurities from graphene, the electrochemical remotion of copper from graphene was carried out in acidic media by the so called e-etching procedure. Since no residual faradaic current was observed due to metal/metal oxide impurities in graphene electrodes, the bioelectrodes were obtained with the enzymes GDh and BOx. The covalent functionalisation of graphene with 4-aminobenzoic acid via diazonium coupling reaction was used for the enzymatic immobilization. The quasi-stationary polarization curves obtained with the bioelectrodes in phosphate buffer pH = 7,0 showed onset oxidation current for glucose at -0.13V and reduction of molecular oxygen starting at +0.45V. Finally, the bioelectrodes were used in a membraneless BFC operating in a Si/SiO2 microchip under saturated oxygen and glucose 8 mmol L-1 in the electrolyte media. The BFC showed an open circuit potential at 0.55V and volumetric power density of 1.7 W cm-3, the highest value reported for an enzymatic BFC so far.
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Hamaya, Pedro Yukio de Barros. "Paisagens flutuantes." Universidade de São Paulo, 2016. http://www.teses.usp.br/teses/disponiveis/27/27159/tde-22032017-104803/.
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Este trabalho é o resultado de uma pesquisa envolvendo estudos, reflexões e experimentações poéticas que buscam problematizar a percepção visual sobre a representação bidimensional e sobre a realidade cotidiana - o conjunto aqui apresentado reúne textos reflexivos, imagens produzidas (desenhos, pinturas e gravuras) e anotações sobre o processo. Num primeiro momento, ele centra na exploração das possibilidades em torno da construção de um efeito flutuante na visualidade imagética, tentando tensionar os modos de apreender a representação bidimensional. Num segundo momento, ele acrescenta a seu quadro de reflexões uma indagação sobre a experiência visual na realidade cotidiana, mais especificamente no deslocamento diário pela cidade de São Paulo, e tenta abordar a paisagem urbana pela perspectiva da representação flutuante. Como um meio de aprofundar certas questões que permeiam o processo poético, são apresentadas três reflexões independentes sobre temas distintos: 1. a espacialidade na tradição pictórica sino-japonesa do Suibokuga; 2. a relação entre cor e linguagem na pintura de Mark Rothko; e 3. possibilidades de se orientar visualmente pela cidade de São Paulo a partir da referência a algumas características básicas compreendidas nas construções espaciais da cultura japonesa. Esses textos tem como objetivo complementar as imagens produzidas, tentando mapear o conjunto de inquietações que impulsionaram o seu desenvolvimento.The present work is the result of a process involving studies, reflections and poetic experiments which seek to approach the visual perception of the two-dimensional representation and the everyday reality - the contents presented here gather together reflexive texts, produced images (drawings, paintings and engravings) and notes on the process. At first, the process focused on the exploration of possibilities surrounding the construction of a floating effect on visual imagery, attempting to generate discomfort and doubts on the ways of visually apprehending the two-dimensional representation. Secondly, it adds to its set of reflections an inquiry about the visual experience in everyday reality, specially in the daily routine in the city of São Paulo, and attempts to approach the urban landscape from the perspective of the floating representation. As a mean to develop certain issues that permeate the poetic process, three independent reflexive texts about distinctive themes are here presented: 1. one about spatiality in Sino-Japanese pictorial tradition of Suibokuga; 2. one about the relationship between color and language in Mark Rothko\'s paintings; and 3. one about possibilities for one to visually guide himself through the city of São Paulo from the point of view of some basic features inherent to spatial constructions of Japanese culture. These texts have the objective to supplement the images produced along the poetic process, in an attempt of mapping the set of concerns which drove its development.
Books on the topic "E-etching"
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Malignaggi, Diana. L'acquaforte: Vincenzo Riolo, Francesco La Farina, Bartolomeo e Luca Costanzo, incisori. Palermo: Caracol, 2008.
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L'acquaforte: Vincenzo Riolo, Francesco La Farina, Bartolomeo e Luca Costanzo, incisori. Palermo: Caracol, 2008.
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Tomasi, Lucia Tongiorgi. La Toscana descritta: Incisori e viaggiatori del '700. Pisa: Pacini editore, 1990.
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Peter, Ackermann. Peter Ackermann: Immagini per un libro e altre acqueforti. Cremona: Biblioteca statale di Cremona, 2005.
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Peter, Ackermann. Peter Ackermann: Immagini per un libro e altre acqueforti. Cremona: Biblioteca statale di Cremona, 2005.
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Ackermann, Peter. Peter Ackermann: Immagini per un libro e altre acqueforti. Cremona: Biblioteca statale di Cremona, 2005.
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Centre, Macdonald Stewart Art, W.K.P. Kennedy Gallery., Art Gallery of Ontario, and Laurentian University Museum and Arts Centre., eds. A real amateur: The Elizabeth E. Dales Collection of nineteenth-century French prints. Toronto: Art Gallery of Ontario = Musée des beaux-arts de l'Ontario, 1991.
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Galleries, Cincinnati Art, ed. The etchings of E. T. Hurley. Cincinnati, Ohio: Cincinnati Art Galleries, 1996.
Find full textBook chapters on the topic "E-etching"
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"Etching." In Encyclopedia of Optical and Photonic Engineering, Second Edition, 1–9. CRC Press, 2015. http://dx.doi.org/10.1081/e-eoe2-120038531.
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"Atomic Layer Etching." In Encyclopedia of Plasma Technology, 128–32. CRC Press, 2016. http://dx.doi.org/10.1081/e-eplt-120049598.
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"Etching: Endpoint Detection." In Encyclopedia of Plasma Technology, 476–90. CRC Press, 2016. http://dx.doi.org/10.1081/e-eplt-120049619.
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"Graphene: Plasma Etching." In Encyclopedia of Plasma Technology, 540–48. CRC Press, 2016. http://dx.doi.org/10.1081/e-eplt-120053944.
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Karmakar, Anirban, and Anuradha Saha. "Fractal-Inspired Ultra-Wideband Diversity Slot Antenna for Wireless Communication Systems." In Contemporary Developments in High-Frequency Photonic Devices, 103–30. IGI Global, 2019. http://dx.doi.org/10.4018/978-1-5225-8531-2.ch005.
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A novel compact ultra-wideband (UWB) multiple-input multiple-output (MIMO) slot antenna with band notch characteristics is presented for portable wireless UWB applications. The antenna comprises of co-planar waveguide feed (CPW) and two radiating monopoles oriented in orthogonal orientation for providing orthogonal radiation patterns. A Minkowski fractal parasitic stub along with a Minkowski fractal grounded stub has been placed at 45° between the monopoles to reduce the coupling between them, which in turn establishes high isolation between the radiators. An excellent band notch characteristic is obtained at 5.5 GHz by etching a modified E-shaped compact slot on the radiators. Results show that the designed antenna meets -10 dB impedance bandwidth and -17 dB isolation throughout the entire operating band (3.1 -12 GHz). Novelty of this design lies in improving isolation using fractal which occupies less space in compared to other isolation mechanisms in MIMO structures. The simulated and measured results depict that the proposed antenna is convenient for MIMO diversity systems.
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Koshevoi, Veniamin, Anton Belorus, Ilya Pleshanov, Anton Timchenko, Roman Denisenko, Daniyar Sherimov, and Ekaterina Vodkailo. "Study of Composite Structures Based on a Porous Silicon Matrix and Nanoparticles Ag/Zno Used as Non-Invasive Highly Sensitive Biosensor Devices." In Composite Materials. IntechOpen, 2021. http://dx.doi.org/10.5772/intechopen.92850.
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In this work composite structures based on a porous silicon were obtained and studied. Porous matrices were formed by electrochemical etching in aqueous solutions of hydrofluoric acid. Based on the obtained substrates, por-silicon (Si)/silver (Ag) and por-Si/zinc oxide (ZnO) composite structures were formed. These composites were functionalized by various methods (electro (E)-, thermo (T)-, electrothermal exposure) as a result of which the structures were modified. When studying the samples by scanning electron microscopy (SEM), it was concluded that silver nanoparticles actively diffused into the pores under these technological modes of functionalization. The por-Si/Ag and por-Si/ZnO composite structures were also studied using the following methods: infrared (IR) spectroscopy and Raman ultrasoft X-ray emission spectroscopy. Also, the photoluminescent characteristics of the samples were studied. Based on the obtained results, it was concluded that functionalization methods actively change the phase composition of structures and the optical properties of composites.
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"Atomic Layer Etching: Directional." In Encyclopedia of Plasma Technology, 133–42. CRC Press, 2016. http://dx.doi.org/10.1081/e-eplt-120053939.
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"Boron Trichloride Dry Etching." In Encyclopedia of Plasma Technology, 193–202. CRC Press, 2016. http://dx.doi.org/10.1081/e-eplt-120053961.
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"Wide Bandgap Materials: Plasma Etching." In Encyclopedia of Plasma Technology, 1530–40. CRC Press, 2016. http://dx.doi.org/10.1081/e-eplt-120053981.
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"Semiconductors: Etching with Sulfur Hexafluoride (SF6)." In Encyclopedia of Plasma Technology, 1288–94. CRC Press, 2016. http://dx.doi.org/10.1081/e-eplt-120053954.
Full textConference papers on the topic "E-etching"
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Rogozhin, Alexander E., Fedor A. Sidorov, Mark A. Bruk, and Eugene N. Zhikharev. "Simulation of dry e-beam etching of resist and experimental evidence." In The International Conference on Micro- and Nano-Electronics 2018, edited by Vladimir F. Lukichev and Konstantin V. Rudenko. SPIE, 2019. http://dx.doi.org/10.1117/12.2522458.
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Tajalli, A., E. Canato, A. Nardo, M. Meneghini, A. Stockman, P. Moens, E. Zanoni, and G. Meneghesso. "Impact of Sidewall Etching on the Dynamic Performance of GaN-on-Si E-Mode Transistors." In 2019 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2019. http://dx.doi.org/10.1109/irps.2019.8720445.
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Chen, Xianfeng, Qiang Gao, Ming Li, Chorng Niou, and W. T. Kary Chien. "Deformation Study of Low K Dielectric after E-beam Exposure." In ISTFA 2006. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.istfa2006p0246.
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Abstract In this paper, the deformation mechanism of low K dielectric film under electron beams (E-beams) is discussed, and the effect of film deformation on the development of a low K dielectric film etching recipe is investigated. To provide meaningful data for process development, numerical analysis was used in the failure analysis procedure. A correction factor is formulated to calculate the change in thickness of the low K dielectric film after E-beam exposure. In addition, scanning electron microscope (SEM) settings for imaging low K dielectric films are optimized to minimize deformation.
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Quijada, Manuel A., David R. Boris, Vivek Dwivedi, Javier Del Hoyo, Scott G. Walton, Edward J. Wollack, and Alexander C. Kozen. "E-beam generated plasma etching for developing high-reflectance mirrors for far-ultraviolet astronomical instrument applications." In Space Telescopes and Instrumentation 2018: Ultraviolet to Gamma Ray, edited by Jan-Willem A. den Herder, Kazuhiro Nakazawa, and Shouleh Nikzad. SPIE, 2018. http://dx.doi.org/10.1117/12.2314391.
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Kishihara, M., M. Murakami, A. Yamaguchi, Y. Utsumi, and I. Ohta. "Trial fabrication of PTFE-based E-plane waveguide coupler for short millimeter-wave by SR etching." In 2015 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT). IEEE, 2015. http://dx.doi.org/10.1109/rfit.2015.7377909.
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De Pauw, H., J. De Baets, J. Vanfleteren, and A. Van Calster. "Integrated Optics in a Standard MCM-D Motherboard Technology Demonstrated in O/E Measurement Probes." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35192.
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An ongoing trend in packaging technology is the introduction of optical interconnections to cope with the problems of increased data transmission speed and the raised interconnection density. Hence, improving packaging and interconnection technologies is only viable if the aspects of optical interfaces and opto-electronic (O/E) components are considered. In this paper, we will demonstrate an MCM-D technology with O/E features. We achieved to integrate high-precision V-grooves for alignment and fixation of the optical fibers into a standard MCM-D technology. The V-groove shape of the fiber fixation structures is a result of the anisotropic etching of (100) silicon by means aqueous KOH. The technology aspects of this aggressive wet etching step are discussed as well as the optimisation results of a suitable KOH masking layer: a low refractive index PECVD nitride. The extension of an MCM-D technology with V-grooves generates the possibility to integrate side-emitting O/E components and fibers with the electronics on the same MCM-Si motherboard. This implies a more dense and compact motherboard with the potential of obtaining higher bandwidths due to the minimal distance between optics and electronics. Additionally, low coupling losses between O/E components and fibers are obtained by means of passive alignment as the accuracy of the V-grooves in silicon allow us to place the fibers with high precision. The feasibility of this optics-extended MCM-D technology will be shown in the example of O/E measurement probes. In the fabrication process of such O/E measurement probes, we will focus on the multilayer MCM-D motherboard extended with V-grooves, on the FC mounting of both RF-amplifier chip and laserdiode, and on the alignment of the fiber.
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Nagayama, Gyoko, Ryuji Ando, Kei Muramatsu, and Takaharu Tsuruta. "Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems." In 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70323.
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We applied the anodic etching (i. e. photo assisted electrochemical etching) to the n type silicon substrate of orientation (100) without masking to fabricate macropores penetrated Si substrate. The anodic etching conditions of the macroporous formation were discussed and the effects of the resistivity, voltage, current density, electrolyte concentration and illumination etc. on the pore size and the porosity were investigated. The pores in high aspect ratio through the cross section of the silicon wafer were obtained with polishing and RIE (reactive ion etching) from the back side. It is found that the pore size at the back side is about 1.5 to 2 times larger than that of the front side. Also, as one example of the applications of porous silicon to microsystems, we demonstrate the results obtained in a micro fuel cell system using a porous silicon membrane (PSM). The PSM was fabricated by a porous silicon wafer which was filled with Nafion dispersion solution with ultrasonic vibrations. It was used as a proton conduction membrane by assembling into the H2 / air feed fuel cell at ambient conditions using conventional electrodes. We found that the Nafion filled PSM worked well and a maximum power density of 89.2 mW/cm2 were achieved under the flow rate of 100ml/min for H2 and 200ml/min for air.
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Goodyear, Andy, Monika Boettcher, Ines Stolberg, and Mike Cooke. "Direct comparison of the performance of commonly used e-beam resists during nano-scale plasma etching of Si, SiO2, and Cr." In SPIE Advanced Lithography, edited by Qinghuang Lin, Sebastian U. Engelmann, and Ying Zhang. SPIE, 2015. http://dx.doi.org/10.1117/12.2085469.
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Azeredo, Bruno, Keng Hsu, and Placid Ferreira. "Direct Electrochemical Imprinting of Sinusoidal Linear Gratings Into Silicon." In ASME 2016 11th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/msec2016-8835.
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Silicon is an excellent transparent material for building IR micro-optical elements such as holographic and blazed gratings, and curvilinear micro-lenses. Shaping this material in 3D with mirror quality finish and single-digit microscale resolution is challenging due to its brittleness and high-melting point. To achieve these patterning characteristics, electron-beam grayscale lithography is typically selected to pattern a 2.5D feature onto a resist thin-film. Subsequently, the film features are transferred into the underlying silicon substrate by deep-reactive ion etching (DRIE) [1]. Small variations in the resist thickness lead to large shape distortions and reduced patterning repeatability. Further, the direct-write nature of e-beam lithography provides for slow throughput. Developing an alternative, parallel and scalable method to nanopatterning silicon with 2.5D geometrical control may impact emerging areas such as the design of sub-wavelength photonic and micro-optic elements for silicon photonics applications. Micro and nanoscale patterning of inorganic semiconductors (e.g. Silicon) requires traditional micromachining processes such as plasma-assisted etching (e.g. DRIE) and wet-etching (e.g. KOH etching). Neither of the aforementioned processes offer the capability to control the geometry in 3D with resolution in the nanoscale range. Thus, it is desirable to develop a low-temperature, low-stress and ambient approach to nanostructuring silicon in 3D. Wet etching approaches are good candidates for achieving such goal because they bypass the need for high-temperature processing and stressing materials beyond the elastic limit. Yet, they still rely on lithographical steps and offer limited sidewall control, restricting the scope of features it can produce. In recent literature, catalyst-based wet etching processes such as metal-assisted chemical etching (MACE) have been shown to pattern high-aspect ratio structures in semiconductors [2–3]. Some researchers have achieved control over the etch profile and etching direction, generating a limited set of interesting 3D objects [4–6]. The degrees of freedom in MACE patterning are still highly constrained due to limited control of the catalyst motion. Additionally, thin-film based MACE relies on intermediate 2D masking steps to pattern the catalyst which are often lithographical. Thus, this indirect approach to patterning silicon increases lead time and processing costs. In this paper, Mac-imprint, a direct imprint configuration of MACE, is introduced to overcome these fundamental barriers. It relies on the use of a catalytic stamp immersed in the etchant and brought against a silicon chip to selectively dissolve it at contact points. Stamps can be reused multiple times to pattern substrates with lifetimes that are dependent solely on its chemical and mechanical degradation. This process is inherently non-lithographic and occurs at room temperature. As a demonstration of its high-resolution capabilities, silicon wafers were patterned with a sinusoidal wave whose pitch and amplitude were 1 μm and 250 nm, respectively. The patterned surface RMS error from the ideal surface was measured to be 13 nm. The key drawback of this approach is the generation of porous defects near the vicinity of the contact interface between stamp and substrate. Its spatial distribution is qualitatively discussed in the context of the diffusion model of MACE [7].
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Bai, John Guofeng, and Jae-Hyun Chung. "Shadow Edge Lithography for Wafer-Scale Nanofabrication." In ASME 2007 International Mechanical Engineering Congress and Exposition. ASMEDC, 2007. http://dx.doi.org/10.1115/imece2007-42265.
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We propose shadow edge lithography (SEL) as a wafer-scale nanofabrication method. The shadow effect of “line-ofsight” in high-vacuum evaporation is analyzed theoretically to predict the geometric distributions of the fabricated nanoscale gaps. In the experiment, nanoscale gap patterns are created by the shadow of Al edges which are prepatterned using e-beam evaporation and the conventional ultraviolet lithography. Feasibility of the SEL is demonstrated by the fabrication of nanogaps having the width ranging from 15 to 100 nm on 4-inch Si wafers. Furthermore, by using the height differences in the prepatterned Al edges to compensate the geometric distributions of the shadow effect, it is demonstrated that the uniformity tolerance in the nanogap width can be ±1 nm or ±5% across the 4-inch Si wafers at a resolution down to 20 nm. The experimental results agree well with the theoretical prediction considering the virtual source during the e-beam evaporation. Upon the nanogap fabrication, arrays of nanochannels are obtained by reactive ion etching (RIE) using the evaporated Al layers as the etching mask. Our results show that that the evaporated Al layers can be used as the RIE mask to transfer the nanoscale patterns with a high yield and throughput. Thus, the SEL provides a robust method for wafer-scale fabrication especially for sub 50-nm structures.