Relevant bibliographies by topics / Electrical and electronic

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Electrical and electronic'

Author: Grafiati
Published: 7 June 2025
Last updated: 2 August 2025

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Journal articles on the topic "Electrical and electronic"

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Chen, Sen, and Jing Liu. "Liquid metal printed electronics towards ubiquitous electrical engineering." Japanese Journal of Applied Physics 61, SE (2022): SE0801. http://dx.doi.org/10.35848/1347-4065/ac5761.

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Abstract Conventional electronic manufacturers are generally not easily accessible due to complicated procedures, time, material and energy consuming, and may generate potential pollution to the environment. From an alternative, liquid metal printed electronics to quickly fabricate electronic circuits and functional devices were proposed a decade before. To promote the further development and application of liquid metal printed electronics, this review aims to summarize and analyze the progress of liquid metal printed electronics from three aspects, namely electronic inks, printing technology
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Buchanan, W. J. "An Applied Viewpoint on Software Engineering for Electrical and Electronic Engineers." International Journal of Electrical Engineering & Education 32, no. 3 (1995): 223–34. http://dx.doi.org/10.1177/002072099503200304.

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An applied viewpoint on software engineering for electrical and electronic engineers This paper describes how Software Engineering can be taught to Electronics students in a form which reinforces electrical/electronic theory, makes code development interesting and helps explain the software development cycle.
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Pfahl, Robert C. "Materials in Electronic Manufacturing: Electronic Packaging." MRS Bulletin 17, no. 4 (1992): 38–41. http://dx.doi.org/10.1557/s0883769400041051.

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Electronic packaging involves using an appropriate combination of conductive and dielectric materials to electrically interconnect and mechanically support electronic components in a reliable and cost-effective manner. Since the invention of the integrated circuit in 1959 and mass wave-soldering in 1958, the vast majority of electronic packaging has involved a planar substrate to which semiconductor devices in protective packages are attached by melting eutectic solder. The planar substrates or printed circuit boards (PCBs) were invented in 1940, but their widespread implementation was limited
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Connolly, Christine. "Adhesives in electronic and electrical assembly." Assembly Automation 28, no. 4 (2008): 289–94. http://dx.doi.org/10.1108/01445150810904431.

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PurposeThe purpose of this paper is to report on various adhesives and their uses in the electronics industry.Design/methodology/approachA description of the different types of adhesives and their strengths and weaknesses is followed by illustrations of their applications in electronic and electrical assembly. Equipment and procedures for cleaning and surface preparation are presented, and the paper finishes with an examination of techniques for rework and repair.FindingsPolymers form the body of an adhesive, but other elements may be included to control electrical and heat conduction, light a
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Brillson, Leonard, Jonathan Cox, Hantian Gao, et al. "Native Point Defect Measurement and Manipulation in ZnO Nanostructures." Materials 12, no. 14 (2019): 2242. http://dx.doi.org/10.3390/ma12142242.

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This review presents recent research advances in measuring native point defects in ZnO nanostructures, establishing how these defects affect nanoscale electronic properties, and developing new techniques to manipulate these defects to control nano- and micro- wire electronic properties. From spatially-resolved cathodoluminescence spectroscopy, we now know that electrically-active native point defects are present inside, as well as at the surfaces of, ZnO and other semiconductor nanostructures. These defects within nanowires and at their metal interfaces can dominate electrical contact properti
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Andrei, Elena Ramona, Andreea Gabriela Oporan, Paul Ghioca, et al. "Waste Electrical and Electronic Equipment Processing as Thermoplastic Composites." Proceedings 57, no. 1 (2020): 58. http://dx.doi.org/10.3390/proceedings2020057058.

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Krasnov, M. I., and V. B. Steshenko. "Electrical, Electronic and Electromechanical Parts for Space Applications." Rocket-space device engineering and information systems 8, no. 2 (2021): 88–101. http://dx.doi.org/10.30894/issn2409-0239.2021.8.2.88.101.

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The electrical, electronic and electromechanical parts (EEE parts) used in spacecraft onboard equipment must fully provide the target technical characteristics of radio-electronic equipment in terms of functional and electrical characteristics, as well as resistance to external factors and reliability indicators. The authors of the article analyze the current situation with the EEE parts and consider the prospects for the development and creation of the necessary electronics products. Currently, the results of the work are confirmed by the active use of the created space components in space te
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Nadarajan, Santhirasegaran, Sitraselvi Chandren, and Ezanee Mohamed Elias. "Hiccups in just-in-time practices for electrical & electronic manufacturing." International Journal of Academic Research 5, no. 5 (2013): 269–71. http://dx.doi.org/10.7813/2075-4124.2013/5-5/b.41.

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Dr, Archana Singh. "E-Waste- E-Cycle Management." European Journal of Advances in Engineering and Technology 10, no. 11s (2023): 74–83. https://doi.org/10.5281/zenodo.10638950.

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<strong>ABSTRACT</strong> Electronic waste or e-waste describes discarded electrical or electronic devices. It is also commonly known as waste electrical and electronic equipment (WEEE) or end-of-life (EOL) electronics. [1] Used electronics which are destined for refurbishment, reuse, resale, salvage recycling through material recovery, or disposal are also considered e-waste. Informal processing of e-waste in developing countries can lead to adverse human health effects and environmental pollution. The growing consumption of electronic goods due to the digital revolution and innovations in sc
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Bhavana, R., Omsekhar Indela, and Mohammed Sajid Yaragatti. "Functional safety requirements of traction inverter in accordance to ISO 26262." E3S Web of Conferences 184 (2020): 01062. http://dx.doi.org/10.1051/e3sconf/202018401062.

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With the improvement and development in the automotive, the safety related aspects are also becoming more important. Hence there is a stringent demand for the Functional Safety and reliability. In these years, most of the vehicles are made with electrical and electronic components and systems which include lots of Electronic Controller Units (ECUs), electronic sensors, bus systems with coding. Due to the complexity in application of these electrical, electronics and programmable electronics, it is necessary to analyze the potential risk of malfunction for automotive systems. Thus, ISO 26262 ha
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Dissertations / Theses on the topic "Electrical and electronic"

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Su, Bin. "Electrical, thermomechanical and reliability modeling of electrically conductive adhesives." Available online, Georgia Institute of Technology, 2006, 2006. http://etd.gatech.edu/theses/available/etd-12192005-124641/.

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Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2006.<br>Qu, Jianmin, Committee Chair ; Baldwin, Daniel, Committee Member ; Wong, C. P., Committee Member ; Sitaraman, Suresh, Committee Member ; Jacob, Karl, Committee Member.
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Siebert, Wolfgang Peter. "Alternative electronic packaging concepts for high frequency electronics." Doctoral thesis, Stockholm, 2005. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-223.

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Petersen, Danyal A. "Laboratory study of electrical discharges on vapor grown ice crystals subjected to strong electric fields." abstract and full text PDF (UNR users only), 2009. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:3387817.

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Su, Bin. "Electrical, thermomechanical and reliability modeling of electrically conductive adhesives." Diss., Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/10425.

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The first part of the dissertation focuses on understanding and modeling the conduction mechanism of conductive adhesives. The contact resistance is measured between silver rods with different coating materials, and the relationship between tunnel resistivity and contact pressure is obtained based on the experimental results. Three dimensional microstructure models and resistor networks are built to simulate electrical conduction in conductive adhesives. The bulk resistivity of conductive adhesives is calculated from the computer-simulated model. The effects of the geometric properties of fill
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Neff, Clayton. "Analysis of Printed Electronic Adhesion, Electrical, Mechanical, and Thermal Performance for Resilient Hybrid Electronics." Scholar Commons, 2018. https://scholarcommons.usf.edu/etd/7551.

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Today’s state of the art additive manufacturing (AM) systems have the ability to fabricate multi-material devices with novel capabilities that were previously constrained by traditional manufacturing. AM machines fuse or deposit material in an additive fashion only where necessary, thus unlocking advantages of mass customization, no part-specific tooling, near arbitrary geometric complexity, and reduced lead times and cost. The combination of conductive ink micro-dispensing AM process with hybrid manufacturing processes including: laser machining, CNC machining, and pick & place enables the fa
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Lund, Richard. "Multilevel Power Electronic Converters for Electrical motor Drives." Doctoral thesis, Norwegian University of Science and Technology, Faculty of Information Technology, Mathematics and Electrical Engineering, 2005. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-687.

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<p>Power electronic converters are widely used in industrial power conversion systems both for utility and drives applications. As the power level increases, the voltage level is increased accordingly to obtain satisfactory efficiency. During the last years, the voltage rating of fast switching high voltage semiconductors such as the Insulated Gate Bipolar Transistor (IGBT) has increased. Still, there is a need for series connection of switching devices. In this area of applications, the Multilevel Converter has shown growing popularity.</p><p>The fundamental advantages of the Multilevel Conve
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SPANO, IVAN LUIGI. "Electromagnetic compatibility issues of electrical and electronic devices." Doctoral thesis, Università degli Studi di Cagliari, 2015. http://hdl.handle.net/11584/266575.

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The PhD dissertation addresses EMC issues of electrical and electronic devices. In the first part of this work (Part_01), EMC fundamentals are briefly resumed and discussed, particularly focusing on EMC susceptibility and conducted/radiated emissions. Subsequently, attention is moved to both intentional and nonintentional EMI sources, particularly on RFID devices and power electronic converters respectively. These last are very widespread in several application fields, such as battery chargers, personal computers, electrical drives and grid interfaces. They consists of passive elements (i
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Navaraj, William Ringal Taube. "Inorganic micro/nanostructures-based high-performance flexible electronics for electronic skin application." Thesis, University of Glasgow, 2019. http://theses.gla.ac.uk/40973/.

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Electronics in the future will be printed on diverse substrates, benefiting several emerging applications such as electronic skin (e-skin) for robotics/prosthetics, flexible displays, flexible/conformable biosensors, large area electronics, and implantable devices. For such applications, electronics based on inorganic micro/nanostructures (IMNSs) from high mobility materials such as single crystal silicon and compound semiconductors in the form of ultrathin chips, membranes, nanoribbons (NRs), nanowires (NWs) etc., offer promising high-performance solutions compared to conventional organic mat
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Galda, Alexey. "Electronic properties of Luttinger Liquid with electron-phonon interaction." Thesis, University of Birmingham, 2013. http://etheses.bham.ac.uk//id/eprint/4293/.

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This thesis addresses a theoretical study of the problem of a single impurity embedded in a one-dimensional system of interacting electrons in presence of electron-phonon coupling. First we consider a system with a featureless point-like potential impurity, followed by the case of a resonant level hybridised with a Luttinger Liquid. The stress is made on a more fundamental problem of a featureless scatterer, for which two opposite limits in the impurity strength are considered: a weak scatterer and a weak link. We have found that, regardless of the transmission properties of phonons through th
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Du, Toit J. A. (Jacques Andre). "Development and analysis of a distributed control strategy for power electronic converters." Thesis, Stellenbosch : Stellenbosch University, 2002. http://hdl.handle.net/10019.1/52761.

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Thesis (PhD)--University of Stellenbosch, 2002.<br>ENGLISH ABSTRACT: The dissertation presents an alternative approach to the control of power electronic converters. The conventional approach is to use a centralized controller with one or more measurement systems providing feedback. As converters become larger, in both power rating and complexity, a number of drawbacks to this approach emerge. The number of physical data paths increases and voltage isolation becomes a problem. This has an adverse effect on the manufacturability as well as the reliable operation of the system as a whole.
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Books on the topic "Electrical and electronic"

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Company, Mitchell Repair Information. Electrical/electronic systems. Mitchell Repair Information Co., 2001.

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Duncan, C. Electrical/electronic science. CT Projects, 1994.

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Mazur, Glen. Electrical/electronic systems. American Technical Publishers, 1995.

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Foundation, World Resource. Electrical & electronic wastes. World Resource Foundation, 1996.

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Richter, Herbert W. Electrical and electronic drafting. 2nd ed. Wiley, 1985.

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Robertson, Christopher R. Electrical and electronic principles. E. Arnold, 1993.

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Robertson, Christopher R. Electrical and electronic principles. E. Arnold, 1993.

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Warnes, Lionel. Electronic and Electrical Engineering. Macmillan Education UK, 1998. http://dx.doi.org/10.1007/978-1-349-15052-6.

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Warnes, Lionel. Electronic and Electrical Engineering. Macmillan Education UK, 2003. http://dx.doi.org/10.1007/978-0-230-21633-4.

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Warnes, L. A. A. Electronic and Electrical Engineering. Macmillan Education UK, 1994. http://dx.doi.org/10.1007/978-1-349-13012-2.

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Book chapters on the topic "Electrical and electronic"

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Wallis, R. H. "Key Electrical Devices." In Electronic Materials. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3818-9_6.

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Barr, A. "Electrical Properties of Semiconductors." In Electronic Materials. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3818-9_3.

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Kitcher, Christopher. "Electronic Symbols." In Electrical Installation Calculations, 10th ed. Routledge, 2022. http://dx.doi.org/10.1201/9781003258735-23.

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Warnes, L. A. A. "The Classical Theory of Electrical Conduction." In Electronic Materials. Springer US, 1990. http://dx.doi.org/10.1007/978-1-4615-6893-3_2.

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Warnes, L. A. A. "The Classical Theory of Electrical Conduction." In Electronic Materials. Macmillan Education UK, 1990. http://dx.doi.org/10.1007/978-1-349-21045-9_2.

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Howe, Alan. "Electrical and Electronic Systems." In Introduction to Mechanical Engineering, 2nd ed. CRC Press, 2022. http://dx.doi.org/10.1201/9780429319167-5.

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Denton, Tom. "Electrical and electronic principles." In Electric and Hybrid Vehicles. Routledge, 2020. http://dx.doi.org/10.1201/9780429296109-3.

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Denton, Tom, and Hayley Pells. "Electrical and electronic principles." In Electric and Hybrid Vehicles, 3rd ed. Routledge, 2023. http://dx.doi.org/10.1201/9781003431732-3.

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Ezrin, Myer. "Electrical and Electronic Applications." In Plastics Failure Guide. Carl Hanser Verlag GmbH & Co. KG, 2013. http://dx.doi.org/10.1007/978-3-446-42882-9_13.

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Livesey, Andrew. "Electrical and Electronic Principles." In T Level Engineering. Routledge, 2023. http://dx.doi.org/10.1201/9781003284833-10.

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Conference papers on the topic "Electrical and electronic"

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Schaaf, David A. "Preventing Corrosion Related Electrical Failures: the Response to RoHS." In CORROSION 2014. NACE International, 2014. https://doi.org/10.5006/c2014-4411.

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Abstract Corrosion by definition is the gradual destruction of a material, usually metals, by chemical reaction with its environment. During this reaction, metal is dissolved into an electrolyte, and oxygen from the atmosphere is reduced in the solution. Also, contaminants such as H2S, SO2, Cl2 can often accelerate this reaction. In recent years, the miniaturization of electronic components and the elimination of lead-based solder via restriction of hazardous substances (RoHS) have made the corrosion of electronics a matter of increasing concern. Corrosion causes failures in electronics by cre
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Hartal, Oren, and Moshe Z. Netzer. "Grounding, Electrical referencing and Bonding in Electronic Systems." In EMC_2002_Wroclaw. IEEE, 2002. https://doi.org/10.23919/emc.2002.10842437.

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Hartal, Oren, and Moshe Z. Netzer. "Grounding, Electrical Referencing and Bonding in Electronic Systems." In EMC_2002_Wroclaw. IEEE, 2002. https://doi.org/10.23919/emc.2002.10842303.

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Josse, Fabien. "Piezo-electric sensors as electronic/electrical devices." In 2009 Joint Meeting of the European Frequency and Time Forum (EFTF) and the IEEE International Frequency Control Symposium (FCS). IEEE, 2009. http://dx.doi.org/10.1109/freq.2009.5168120.

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Pecchia, Gagliardi, Di Carlo, Niehaus, Frauenheim, and Lugli. "Atomistic simulation of the electronic transport in organic nanostructures: electron-phonon and electron-electron interactions." In Electrical Performance of Electronic Packaging. IEEE, 2004. http://dx.doi.org/10.1109/iwce.2004.1407346.

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van Duijsen, P. J., D. C. Zuidervliet, and J. B. Woudstra. "Electronic Learning Experience Setup : Power Electronics and Electrical Drive Education." In 2020 43rd International Convention on Information, Communication and Electronic Technology (MIPRO). IEEE, 2020. http://dx.doi.org/10.23919/mipro48935.2020.9245230.

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Horiuchi, Ryota, Kazuhiko Sasagawa, and Kazuhiro Fujisaki. "Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading." In ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2021. http://dx.doi.org/10.1115/ipack2021-68902.

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Abstract Flexible printed circuits (FPCs) are widely used in electronic devices such as movable part line or wearable sensor. Inkjet printing is attracting attention because it can draw electric lines of any shape without a photo mask. The mechanical characteristics such as flexibility or durability of electric lines have been evaluated by bending and tensile tests. Moreover, the reliability characteristics of metal particle ink lines under electric current loading have been recently evaluated. However, the electronic line has not been evaluated under both the mechanical stress due to bending
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"Electrical Performance of electronic Packaging." In [1992 Proceedings] Electrical Performance of Electronic Packaging. IEEE, 1992. http://dx.doi.org/10.1109/epep.1992.572247.

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"Electrical Performance of Electronic Packaging." In IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. IEEE, 2005. http://dx.doi.org/10.1109/epep.2005.1563784.

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"Electrical Performance of Electronic Packaging." In Electrical Performance of Electronic Packaging. IEEE, 2004. http://dx.doi.org/10.1109/epep.2004.1407515.

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Reports on the topic "Electrical and electronic"

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Walters, E. Jane. Center for electronic and electrical engineering :. National Bureau of Standards, 1985. http://dx.doi.org/10.6028/nbs.ir.85-3181.

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Walters, E. Jane. Center for electronic and electrical engineering :. National Bureau of Standards, 1985. http://dx.doi.org/10.6028/nbs.ir.85-3181-3.

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Ven, Seyhah, and Vutha Hing. Cambodia in the Electronic and Electrical Global Value Chains. Cambodia Development Resource Institute, 2019. https://doi.org/10.64202/wp.119.201900.

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This paper maps Cambodia’s participation in Electronic and Electrical (E&amp;E) value chains using trade statistics. It also conducts SWOT analysis based on both qualitative and quantitative data from a E&amp;E firm survey, from which three major conclusions are drawn. This paper argues that E&amp;E production in Cambodia has expanded rapidly with countries in different development levels featuring coordinated and complex production networks. Companies in Cambodia have joined E&amp;E value chains since 2005; yet the scale, scope, and depth of production are so far beyond most comparable countr
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Baxter, John, Margareta Wahlstrom, Malin Zu Castell-Rüdenhausen, and Anna Fråne. Plastic value chains: Case: WEEE (Waste Electrical and Electronic Equipment). Nordic Council of Ministers, 2015. http://dx.doi.org/10.6027/tn2015-510.

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Emin, Dave, and Arthur Edwards. Experimental Studies of Electronic Transport of Chalcogenide Glass Electrical Switches. Defense Technical Information Center, 2006. http://dx.doi.org/10.21236/ada464166.

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Reczek, Karen, and Lisa M. Benson. A Guide to United States Electrical and Electronic Equipment Compliance Requirements. National Institute of Standards and Technology, 2016. http://dx.doi.org/10.6028/nist.ir.8118.

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Reczek, Karen, and Lisa M. Benson. A guide to United States electrical and electronic equipment compliance requirements. National Institute of Standards and Technology, 2017. http://dx.doi.org/10.6028/nist.ir.8118r1.

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Benson, Lisa M., and Karen Reczek. A Guide to United States Electrical and Electronic Equipment Compliance Requirements. National Institute of Standards and Technology, 2021. http://dx.doi.org/10.6028/nist.ir.8118r2.

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Avis, William. Technical Aspects of e-Waste Management. Institute of Development Studies, 2022. http://dx.doi.org/10.19088/k4d.2022.051.

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Population growth, increasing prosperity and changing consumer habits globally are increasing demand for consumer electronics. Further to this, rapid changes in technology, falling prices, increased affordability and consumer appetite for new products have exacerbated e-waste management challenges and seen millions of tons of electronic devices become obsolete. This rapid literature review collates evidence from academic, policy focussed and grey literature on the technical aspects e-waste value chains. The report should be read in conjunction with two earlier reports on e-waste management1. E
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Hall, James R. Electronic Equipment Handbook on Methods for Meeting U.S. Navy Shipboard Electrical Power Interface Requirements. Defense Technical Information Center, 2000. http://dx.doi.org/10.21236/ada377030.

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