Log in

Relevant bibliographies by topics / Electrical and electronic / Journal articles

To see the other types of publications on this topic, follow the link: Electrical and electronic.

Journal articles on the topic 'Electrical and electronic'

Author: Grafiati

Published: 7 June 2025

Last updated: 2 August 2025

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Electrical and electronic.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Chen, Sen, and Jing Liu. "Liquid metal printed electronics towards ubiquitous electrical engineering." Japanese Journal of Applied Physics 61, SE (2022): SE0801. http://dx.doi.org/10.35848/1347-4065/ac5761.

Full text

Abstract:

Abstract Conventional electronic manufacturers are generally not easily accessible due to complicated procedures, time, material and energy consuming, and may generate potential pollution to the environment. From an alternative, liquid metal printed electronics to quickly fabricate electronic circuits and functional devices were proposed a decade before. To promote the further development and application of liquid metal printed electronics, this review aims to summarize and analyze the progress of liquid metal printed electronics from three aspects, namely electronic inks, printing technology

APA, Harvard, Vancouver, ISO, and other styles

2

Buchanan, W. J. "An Applied Viewpoint on Software Engineering for Electrical and Electronic Engineers." International Journal of Electrical Engineering & Education 32, no. 3 (1995): 223–34. http://dx.doi.org/10.1177/002072099503200304.

Full text

Abstract:

An applied viewpoint on software engineering for electrical and electronic engineers This paper describes how Software Engineering can be taught to Electronics students in a form which reinforces electrical/electronic theory, makes code development interesting and helps explain the software development cycle.

APA, Harvard, Vancouver, ISO, and other styles

3

Pfahl, Robert C. "Materials in Electronic Manufacturing: Electronic Packaging." MRS Bulletin 17, no. 4 (1992): 38–41. http://dx.doi.org/10.1557/s0883769400041051.

Full text

Abstract:

Electronic packaging involves using an appropriate combination of conductive and dielectric materials to electrically interconnect and mechanically support electronic components in a reliable and cost-effective manner. Since the invention of the integrated circuit in 1959 and mass wave-soldering in 1958, the vast majority of electronic packaging has involved a planar substrate to which semiconductor devices in protective packages are attached by melting eutectic solder. The planar substrates or printed circuit boards (PCBs) were invented in 1940, but their widespread implementation was limited

APA, Harvard, Vancouver, ISO, and other styles

4

Connolly, Christine. "Adhesives in electronic and electrical assembly." Assembly Automation 28, no. 4 (2008): 289–94. http://dx.doi.org/10.1108/01445150810904431.

Full text

Abstract:

PurposeThe purpose of this paper is to report on various adhesives and their uses in the electronics industry.Design/methodology/approachA description of the different types of adhesives and their strengths and weaknesses is followed by illustrations of their applications in electronic and electrical assembly. Equipment and procedures for cleaning and surface preparation are presented, and the paper finishes with an examination of techniques for rework and repair.FindingsPolymers form the body of an adhesive, but other elements may be included to control electrical and heat conduction, light a

APA, Harvard, Vancouver, ISO, and other styles

5

Brillson, Leonard, Jonathan Cox, Hantian Gao, et al. "Native Point Defect Measurement and Manipulation in ZnO Nanostructures." Materials 12, no. 14 (2019): 2242. http://dx.doi.org/10.3390/ma12142242.

Full text

Abstract:

This review presents recent research advances in measuring native point defects in ZnO nanostructures, establishing how these defects affect nanoscale electronic properties, and developing new techniques to manipulate these defects to control nano- and micro- wire electronic properties. From spatially-resolved cathodoluminescence spectroscopy, we now know that electrically-active native point defects are present inside, as well as at the surfaces of, ZnO and other semiconductor nanostructures. These defects within nanowires and at their metal interfaces can dominate electrical contact properti

APA, Harvard, Vancouver, ISO, and other styles

6

Andrei, Elena Ramona, Andreea Gabriela Oporan, Paul Ghioca, et al. "Waste Electrical and Electronic Equipment Processing as Thermoplastic Composites." Proceedings 57, no. 1 (2020): 58. http://dx.doi.org/10.3390/proceedings2020057058.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Krasnov, M. I., and V. B. Steshenko. "Electrical, Electronic and Electromechanical Parts for Space Applications." Rocket-space device engineering and information systems 8, no. 2 (2021): 88–101. http://dx.doi.org/10.30894/issn2409-0239.2021.8.2.88.101.

Full text

Abstract:

The electrical, electronic and electromechanical parts (EEE parts) used in spacecraft onboard equipment must fully provide the target technical characteristics of radio-electronic equipment in terms of functional and electrical characteristics, as well as resistance to external factors and reliability indicators. The authors of the article analyze the current situation with the EEE parts and consider the prospects for the development and creation of the necessary electronics products. Currently, the results of the work are confirmed by the active use of the created space components in space te

APA, Harvard, Vancouver, ISO, and other styles

8

Nadarajan, Santhirasegaran, Sitraselvi Chandren, and Ezanee Mohamed Elias. "Hiccups in just-in-time practices for electrical & electronic manufacturing." International Journal of Academic Research 5, no. 5 (2013): 269–71. http://dx.doi.org/10.7813/2075-4124.2013/5-5/b.41.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Dr, Archana Singh. "E-Waste- E-Cycle Management." European Journal of Advances in Engineering and Technology 10, no. 11s (2023): 74–83. https://doi.org/10.5281/zenodo.10638950.

Full text

Abstract:

<strong>ABSTRACT</strong> Electronic waste or e-waste describes discarded electrical or electronic devices. It is also commonly known as waste electrical and electronic equipment (WEEE) or end-of-life (EOL) electronics. [1] Used electronics which are destined for refurbishment, reuse, resale, salvage recycling through material recovery, or disposal are also considered e-waste. Informal processing of e-waste in developing countries can lead to adverse human health effects and environmental pollution. The growing consumption of electronic goods due to the digital revolution and innovations in sc

APA, Harvard, Vancouver, ISO, and other styles

10

Bhavana, R., Omsekhar Indela, and Mohammed Sajid Yaragatti. "Functional safety requirements of traction inverter in accordance to ISO 26262." E3S Web of Conferences 184 (2020): 01062. http://dx.doi.org/10.1051/e3sconf/202018401062.

Full text

Abstract:

With the improvement and development in the automotive, the safety related aspects are also becoming more important. Hence there is a stringent demand for the Functional Safety and reliability. In these years, most of the vehicles are made with electrical and electronic components and systems which include lots of Electronic Controller Units (ECUs), electronic sensors, bus systems with coding. Due to the complexity in application of these electrical, electronics and programmable electronics, it is necessary to analyze the potential risk of malfunction for automotive systems. Thus, ISO 26262 ha

APA, Harvard, Vancouver, ISO, and other styles

11

Alder, Mark, and Noel Morris. "Mastering Electronic and Electrical Calculations." Mathematical Gazette 83, no. 496 (1999): 151. http://dx.doi.org/10.2307/3618716.

Full text

APA, Harvard, Vancouver, ISO, and other styles

12

Kim, Jong-Woong, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, and Seung-Boo Jung. "Electrical Characterization of Electronic Package." Journal of the Korean Welding and Joining Society 26, no. 1 (2008): 17–23. http://dx.doi.org/10.5781/kwjs.2008.26.1.017.

Full text

APA, Harvard, Vancouver, ISO, and other styles

13

Kellermann, Helmut, Géza Németh, Jörg Kostelezky, Kai L. Barbehön, Fathi El-Dwaik, and Ludwig Hochmuth. "Electrical and Electronic System Architecture." ATZextra worldwide 13, no. 8 (2008): 30–37. http://dx.doi.org/10.1365/s40111-008-0098-2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

14

Henderson, K. "Educating electrical and electronic engineers." Engineering Science & Education Journal 6, no. 3 (1997): 95–98. http://dx.doi.org/10.1049/esej:19970304.

Full text

APA, Harvard, Vancouver, ISO, and other styles

15

MURAMATSU, Hisayoshi, Tatsuya SONOBE, Yuta KAKIMI, and Ken-ichi NOMURA. "Different Fields' Viewpoint for Electrical and Electronic Field from Pharmacy to Electrical and Electronic." Journal of The Institute of Electrical Engineers of Japan 138, no. 8 (2018): 551–54. http://dx.doi.org/10.1541/ieejjournal.138.551.

Full text

APA, Harvard, Vancouver, ISO, and other styles

16

Madadnia, Behnam, Jan Vanfleteren, and Frederick Bossuyt. "Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics." Micromachines 14, no. 12 (2023): 2248. http://dx.doi.org/10.3390/mi14122248.

Full text

Abstract:

Three new methods for accurate electronic component positioning for thermoformed electronics are presented in this paper. To maintain the mechanical and electrical properties of printed-ink tracks, prevent deformation and stretching during thermoforming, and ensure reproducibility, the component positioning principle for all three proposed methods is based on keeping the temperature of some regions in the thermoplastic substrate less than the glass transition temperature of the thermoplastic carrier, to keep those regions resistant to plastic deformation. We have verified the accuracy of the d

APA, Harvard, Vancouver, ISO, and other styles

17

Peng, Yukun. "Analysis of Electronic and Electrical Technology in Electrical Automation." Academic Journal of Science and Technology 8, no. 3 (2023): 155–57. http://dx.doi.org/10.54097/3m008r80.

Full text

Abstract:

Electronic and electrical technology plays an important role in electrical automation system, including but not limited to circuit design, motor control, sensor application, etc. By analyzing the advantages and limitations of these applications, engineers and researchers can better understand the working principles and optimization methods of electrical automation systems, and provide ideas and methods for system design and control.

APA, Harvard, Vancouver, ISO, and other styles

18

Abdubannopov, M. I., and Х. T. Yuldashev. "OPTICAL AND ELECTRICAL PROPERTIES OF SEMICONDUCTOR CRYSTALS." International Journal of Advance Scientific Research 03, no. 04 (2023): 83–89. http://dx.doi.org/10.37547/ijasr-03-04-12.

Full text

Abstract:

Electronic elements are mainly made on the basis of semiconductor materials. Therefore, knowing the optical and photoelectric properties of electronic elements requires studying the structure of semiconductor materials, their differences from metals and dielectric materials, and the properties that are directly fundamental to semiconductor materials.

APA, Harvard, Vancouver, ISO, and other styles

19

Díez-Pascual, Ana M., and Abbas Rahdar. "Graphene-Based Polymer Composites for Flexible Electronic Applications." Micromachines 13, no. 7 (2022): 1123. http://dx.doi.org/10.3390/mi13071123.

Full text

Abstract:

Graphene-based nanomaterials have gained a lot of interest over the last years in flexible electronics due to their exceptional electrical, mechanical, and optoelectronic properties, as well as their potential of surface modification. Their flexibility and processability make them suitable for electronic devices that require bending, folding, and stretching, which cannot be fulfilled by conventional electronics. These nanomaterials can be assembled with various types of organic materials, including polymers, and biomolecules, to generate a variety of nanocomposites with greater stretchability

APA, Harvard, Vancouver, ISO, and other styles

20

Pavlenko, Olha. "Research into professional training of elecronics engineers in Ukraine and the USA: basic concepts." Continuing Professional Education: Theory and Practice, no. 3-4 (2018): 57–61. http://dx.doi.org/10.28925/1609-8595.2018.3-4.5761.

Full text

Abstract:

The article explores the impact of the rapid development of electronic devices and systems in the world, in particular in the USA on setting the new challenges for Ukrainian engineering universities to attract advanced experience in training Electronics Engineering professionals. Since there are differences in the interpretation of a number of concepts in the area of Electronic Engineering in Ukrainian education as compared to the US, the article examines the relationship between the terms «electrical» and «electronic engineering», defines and compares such concepts as «electronics specialist»

APA, Harvard, Vancouver, ISO, and other styles

21

Marinis, Thomas F., and Joseph W. Soucy. "Isolation Resistance of Encapsulated Electrical Conductors and Terminations for Biomedical Applications." International Symposium on Microelectronics 2015, no. 1 (2015): 000536–43. http://dx.doi.org/10.4071/isom-2015-tha11.

Full text

Abstract:

Implanted electronic medical devices are evolving into architectures that are comprised of multiple packages that require reliable, high density electrical interconnections. Both power and digital signals must be routed between devices on cables that are immersed in an ionic, electrically conductive medium. Electronics are typically housed in hermetic packages with electrical feed throughs that must also be protected from the implant environment. The polymer materials used to encapsulate cable conductors and terminations must be biocompatible, compliant and of minimal thickness. These requirem

APA, Harvard, Vancouver, ISO, and other styles

22

FURUTA, Kiyoto. "Activities in Electronic and Electronics Industry." Journal of The Institute of Electrical Engineers of Japan 126, no. 3 (2006): 146–49. http://dx.doi.org/10.1541/ieejjournal.126.146.

Full text

APA, Harvard, Vancouver, ISO, and other styles

23

Kim, Sun Hong, Yewon Kim, Heewon Choi, et al. "Mechanically and electrically durable, stretchable electronic textiles for robust wearable electronics." RSC Advances 11, no. 36 (2021): 22327–33. http://dx.doi.org/10.1039/d1ra03392a.

Full text

Abstract:

Stretchable MED-ET was fabricated by a soaking process of self-healing stretchable Ag ink. Conductive pathways in MED-ET under a damaged environment were stably maintained due to an electrical recovery phenomenon which enables a robust device system.

APA, Harvard, Vancouver, ISO, and other styles

24

Wada, Keiji. "Tokyo Metropolitan University, Department of Electrical and Electronic Engineering, Power Electronics Laboratory." Journal of The Japan Institute of Electronics Packaging 16, no. 1 (2013): 77. http://dx.doi.org/10.5104/jiep.16.77.

Full text

APA, Harvard, Vancouver, ISO, and other styles

25

Toral-López, Víctor, Cristian González, Francisco J. Romero, et al. "Reconfigurable electronics: Addressing the uncontrolled increase of waste electrical and electronic equipment." Resources, Conservation and Recycling 138 (November 2018): 47–48. http://dx.doi.org/10.1016/j.resconrec.2018.07.010.

Full text

APA, Harvard, Vancouver, ISO, and other styles

26

Ranskiy, Anatoliy, Olga Gordienko, Bogdan Korinenko, et al. "Pyrolysis Processing of Polymer Waste Components of Electronic Products." Chemistry & Chemical Technology 18, no. 1 (2024): 103–8. http://dx.doi.org/10.23939/chcht18.01.103.

Full text

Abstract:

The recycling of ABS plastic as a component of electronic and electrical equipment waste by the method of low-temperature pyrolysis is shown and substantiated as well as obtaining alternative sources of energy: pyrolysis liquid, gas mixture, and pyrocarbon. The main components of electronic and electrical equipment waste, which consists of plastic and refractory oxides, along with copper and iron compounds, were analyzed. The composition of precious, toxic, rare, basic metals, and plastic waste is given. It is shown that the waste of electronic and electrical equipment is a valuable secondary

APA, Harvard, Vancouver, ISO, and other styles

27

Hassan, Huda Bukheet, Hayder M. Abduljalil, and Ahmed Hashim. "Augmented the Structure, Electronic and Optical Characteristics of PEO Doped NiO for Electronics Applications." Physics and Chemistry of Solid State 22, no. 3 (2021): 501–8. http://dx.doi.org/10.15330/pcss.22.3.501-508.

Full text

Abstract:

This paper aims to investigate the structural, optical and electrical properties of PEO doped with NiO. The DFT calculations have been performed using Gaussian 09 package of programs. The calculated electronic properties included the total energy, HOMO and LUMO energies, energy gap, ionization energy, electron affinity, electronegativity, electrochemical hardness, electronic softness and electrophilic index. The obtained results showed that the doping PEO with NiO improved the structural, optical, electronic and electrical characteristics where the energy band gap decreases about 67.4% with ad

APA, Harvard, Vancouver, ISO, and other styles

28

Savvova, Oksana, Oleksii Fesenko, Maksym Tymoshchuk, Viacheslav Bilous, and Anna Skripinets. "NEW TYPES OF GLASS-CERAMIC MATERIALS FOR ELECTRONIC SYSTEMS." Bulletin of the National Technical University "KhPI". Series: Chemistry, Chemical Technology and Ecology, no. 1(13) (June 3, 2025): 80–86. https://doi.org/10.20998/2079-0821.2025.01.12.

Full text

Abstract:

The growth and main trends in the development of the global market of advanced materials for electronics and electrical engineering are analyzed, which indicate dynamic development with an average annual growth rate of 17% and intensive growth in demand for reliable, effective and stable functional ceramic and glass materials. The main types and properties of ceramic and glass materials for electrical purposes and the prospects for their development are considered. The relevance of developing new generation glass-ceramic materials to meet the needs of the electronic and electrical industry, in

APA, Harvard, Vancouver, ISO, and other styles

29

Pandey, Dr Shakuntala. "ELECTRICAL AND ELECTRONIC WASTE: A GROWING ISSUE." International Journal of Engineering Technologies and Management Research 4, no. 12 (2020): 85–88. http://dx.doi.org/10.29121/ijetmr.v4.i12.2017.596.

Full text

Abstract:

“WEEE” or Waste electrical and electronic equipments” A computer complete with monitor, keyboard, mouse and the central processing unit weight about 32 kg. But with no scientific system of recycling in place they are dumped as E-waste. Pile after pile of chips and assorted bits and pieces of computers are contributed by IT companies. As the IT segment tries to keep pace the recycling market gets flooded with fresh stocks of electronics materials - stripped, pounded and extracted. The BPO/IT segment is one of the largest generators of e-waste. As the problem of e-waste continues to

APA, Harvard, Vancouver, ISO, and other styles

30

Jones, Andrew, and Vinod Sikka. "Superhydrophobic Coatings on Electronic Components." International Symposium on Microelectronics 2011, no. 1 (2011): 000113–16. http://dx.doi.org/10.4071/isom-2011-ta3-paper6.

Full text

Abstract:

Superhydrophobic coatings provide exceptional protection to electrical circuits, switches, and other electrical devices which operate in wet environments, such as food processing plants or outdoor applications. Among various electrical device applications, electric motors and electrical switches have been successfully tested in the field at two food processors for nearly 20 months with exceptionally good results. Coated microelectronic circuit board has been in operation without any incidence for over 1 year.

APA, Harvard, Vancouver, ISO, and other styles

31

Sharp, A. A., L. F. Abbott, and E. Marder. "Artificial electrical synapses in oscillatory networks." Journal of Neurophysiology 67, no. 6 (1992): 1691–94. http://dx.doi.org/10.1152/jn.1992.67.6.1691.

Full text

Abstract:

1. We use an electronic circuit to artificially electrically couple neurons. 2. Strengthening the coupling between an oscillating neuron and a hyperpolarized, passive neuron can either increase or decrease the frequency of the oscillator depending on the properties of the oscillator. 3. The result of electrically coupling two neuronal oscillators depends on the membrane potentials, intrinsic properties of the neurons, and the coupling strength. 4. The interplay between chemical inhibitory synapses and electrical synapses can be studied by creating both chemical and electrical synapses between

APA, Harvard, Vancouver, ISO, and other styles

32

Guenther, B., J. Koeble, J. Chrost, et al. "Precision Local Electrical Probing: Potential for the Analysis of Nanocontacts and Nanointerconnects." Microscopy Today 21, no. 2 (2013): 30–33. http://dx.doi.org/10.1017/s1551929513000084.

Full text

Abstract:

A major challenge in the development of novel devices in nano and molecular electronics is their interconnection with larger-scale electrical circuits required to control and characterize their functional properties. Local electrical probing by multiple probes with ultimate scanning tunneling microscopy (STM) precision can significantly improve efficiency in analyzing individual nano-electronic devices without the need for full electrical integration.

APA, Harvard, Vancouver, ISO, and other styles

33

SHUBOV, L. Ya, I. G. DORONKINA, T. S. SMIRNOVA, and O. V. GOLUB. "Complex use electronic and electrical scrap." Iindustrial Ecology, no. 2 (2022): 12–18. http://dx.doi.org/10.52190/2073-2589_2022_2_12.

Full text

APA, Harvard, Vancouver, ISO, and other styles

34

Sato, Yukihiko. "Education in Electrical and Electronic Engineering." IEEJ Transactions on Fundamentals and Materials 127, no. 1 (2007): 2–3. http://dx.doi.org/10.1541/ieejfms.127.2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

35

Brown, Mark. "Interconnection as an electrical/electronic interface." Electronics and Power 32, no. 9 (1986): 677. http://dx.doi.org/10.1049/ep.1986.0394.

Full text

APA, Harvard, Vancouver, ISO, and other styles

36

Polanco, S., and A. K. Behera. "Shelf like of electronic/electrical devices." IEEE Transactions on Nuclear Science 40, no. 4 (1993): 809–15. http://dx.doi.org/10.1109/23.256666.

Full text

APA, Harvard, Vancouver, ISO, and other styles

37

Mohammad, F., P. D. Calvert, and N. C. Billingham. "Electrical and electronic properties of polyparaphenylenes." Journal of Physics D: Applied Physics 29, no. 1 (1996): 195–204. http://dx.doi.org/10.1088/0022-3727/29/1/030.

Full text

APA, Harvard, Vancouver, ISO, and other styles

38

Nuij, Robert. "Electrical and Electronic Practical Ecodesign Guide." Environmental Impact Assessment Review 22, no. 6 (2002): 731. http://dx.doi.org/10.1016/s0195-9255(02)00018-5.

Full text

APA, Harvard, Vancouver, ISO, and other styles

39

de Marco, I., B. M. Caballero, M. J. Chomón, et al. "Pyrolysis of electrical and electronic wastes." Journal of Analytical and Applied Pyrolysis 82, no. 2 (2008): 179–83. http://dx.doi.org/10.1016/j.jaap.2008.03.011.

Full text

APA, Harvard, Vancouver, ISO, and other styles

40

Rodrigo, Julio, and Francesc Castells. "Electrical and electronic practical ecodesing guide." International Journal of Life Cycle Assessment 8, no. 2 (2003): 114. http://dx.doi.org/10.1007/bf02978440.

Full text

APA, Harvard, Vancouver, ISO, and other styles

41

Bourdin, E., S. Curran, A. Davey, et al. "Electronic properties of polydiheteroarylenemethines: Electrical conductivity." Advanced Materials for Optics and Electronics 4, no. 1 (1994): 43–49. http://dx.doi.org/10.1002/amo.860040106.

Full text

APA, Harvard, Vancouver, ISO, and other styles

42

KAKIMI, Yuta, Hisayoshi MURAMATSU, and Ryogo KUBO. "Different Fields' Viewpoint for Electrical and Electronic Field from Medical Science to Electrical and Electronic Engineering." Journal of The Institute of Electrical Engineers of Japan 138, no. 9 (2018): 618–21. http://dx.doi.org/10.1541/ieejjournal.138.618.

Full text

APA, Harvard, Vancouver, ISO, and other styles

43

Li, Jinghua, Enming Song, Chia-Han Chiang, et al. "Conductively coupled flexible silicon electronic systems for chronic neural electrophysiology." Proceedings of the National Academy of Sciences 115, no. 41 (2018): E9542—E9549. http://dx.doi.org/10.1073/pnas.1813187115.

Full text

Abstract:

Materials and structures that enable long-term, intimate coupling of flexible electronic devices to biological systems are critically important to the development of advanced biomedical implants for biological research and for clinical medicine. By comparison with simple interfaces based on arrays of passive electrodes, the active electronics in such systems provide powerful and sometimes essential levels of functionality; they also demand long-lived, perfect biofluid barriers to prevent corrosive degradation of the active materials and electrical damage to the adjacent tissues. Recent reports

APA, Harvard, Vancouver, ISO, and other styles

44

Komolafe, Torah, Tudor, and Beeby. "Modelling Reliable Electrical Conductors for E-Textile Circuits on Polyimide Filaments." Proceedings 32, no. 1 (2019): 11. http://dx.doi.org/10.3390/proceedings2019032011.

Full text

Abstract:

The weaving of flexible electronic filaments directly into the body of textiles during manufacture represents the state-of-the-art process for integrating electronic functionality into fabrics in a manner that obscures the presence of the electronics from the wearer. The reliability of emerging prototypes under typical stresses from washing and bending is primarily dependent on the durability of the electrical conductors and on their interconnections with the electronic components attached to them on polyimide filaments. To improve the durability of these filaments, this paper uses the classic

APA, Harvard, Vancouver, ISO, and other styles

45

Dr., Shakuntala Pandey. "ELECTRICAL AND ELECTRONIC WASTE: A GROWING ISSUE." International Journal of Engineering Technologies and Management Research 4, no. 12 : SE (2017): 85–88. https://doi.org/10.5281/zenodo.1163017.

Full text

Abstract:

<strong><em>“WEEE” or Waste electrical and electronic equipments”</em></strong> <strong><em>A computer complete with monitor, keyboard, mouse and the central processing unit weight about 32 kg. But with no scientific system of recycling in place they are dumped as E-waste. Pile after pile of chips and assorted bits and pieces of computers are contributed by IT companies. As the IT segment tries to keep pace the recycling market gets flooded with fresh stocks of electronics materials - stripped, pounded and extracted. The BPO/IT segment is one of the largest generators of e-wa

APA, Harvard, Vancouver, ISO, and other styles

46

Veerabhadra Rao, Kodumuri, Padala Ashok, and B. Appa Rao. "MULTIFUNCTIONAL CrxCa(10-x)Al30Si60 GLASSES, ELECTRICAL CONDUCTIVITY AND THERMOLUMINESCENCE." Rasayan Journal of Chemistry 15, no. 01 (2022): 509–15. http://dx.doi.org/10.31788/rjc.2022.1516827.

Full text

Abstract:

The SiO2 glasses embedded with Cr3+ ions are notable for solid state optical resource, which are useful in various opto-electronic and semiconducting applications. However, the available thermoluminescent resource, which include different electronic and semiconducting materials, need some refinement in their structure, luminescence, and electronic properties towards development of advanced glass resource. In this vision, CrxCa(10-x)Al30Si60 glassy materials have planned for synthesis and testing. The GT, and GC phase transition points, and thermal stability (~1.2639) of test samples are identi

APA, Harvard, Vancouver, ISO, and other styles

47

Pu, Hai. "Application Electrical Engineering Training and Intelligent Technology of Electrical and Electronic Technology under Artificial Intelligence Technology." E3S Web of Conferences 253 (2021): 01070. http://dx.doi.org/10.1051/e3sconf/202125301070.

Full text

Abstract:

With the development of the times and the improvement of modern industrial technology, computer technology has been greatly developed, so a new concept has been put forward, that is, artificial intelligence. And the composition of modern life is mainly electricity, so in the current era, electronic technology has been rapidly developed. But the original electrical and electronic technology can no longer match today's intelligent technology, but electronic technology is the basis of the development of modern intelligent technology. Therefore, the purpose of this paper is to use artificial intel

APA, Harvard, Vancouver, ISO, and other styles

48

Chi, Aobing, Enming Zhang, and Xu Hang. "Development of nanomaterials in flexible electronics." Highlights in Science, Engineering and Technology 43 (April 14, 2023): 40–49. http://dx.doi.org/10.54097/hset.v43i.7404.

Full text

Abstract:

Flexible electronics, with its excellent flexibility, leading-edge and lightweight, has become a frontier technology capability in the field of electronics, which integrates well with the characteristics of nanomaterials for applications in various disciplines such as sensors, information, medical, and energy. This paper systematically summarizes the main structures of flexible electronics featuring flexible substrates with their outstanding flexibility as well as mechanical and electrical properties. Afterwards, it delves into the four major properties of nanomaterials along with their extens

APA, Harvard, Vancouver, ISO, and other styles

49

Zamtinah, I. Mustaqim, and HS Pramono. "Utilization of Electronic Waste for Energy-saving Lamp Circuits." Journal of Physics: Conference Series 2111, no. 1 (2021): 012021. http://dx.doi.org/10.1088/1742-6596/2111/1/012021.

Full text

Abstract:

Abstract Indonesia is one of the largest electronic consumer countries in the world. The negative impact unless the increase in the use of electrical energy, there is also an increase in electronic waste or e-waste. If electronic waste (e-waste) is not managed properly, it will cause its own problems, especially environmental health problems. One alternative to overcome these problems is the use of e-waste as a raw material for a series of Waste-Based Energy Saving Lamps, abbreviated as SLHE BBL. This study aims to develop SLHE BBL prototypes base on electric and electronics waste, and test th

APA, Harvard, Vancouver, ISO, and other styles

50

Kang, Minji, and Tae-Wook Kim. "Recent Advances in Fiber-Shaped Electronic Devices for Wearable Applications." Applied Sciences 11, no. 13 (2021): 6131. http://dx.doi.org/10.3390/app11136131.

Full text

Abstract:

Fiber electronics is a key research area for realizing wearable microelectronic devices. Significant progress has been made in recent years in developing the geometry and composition of electronic fibers. In this review, we present that recent progress in the architecture and electrical properties of electronic fibers, including their fabrication methods. We intensively investigate the structural designs of fiber-shaped devices: coaxial, twisted, three-dimensional layer-by-layer, and woven structures. In addition, we introduce remarkable applications of fiber-shaped devices for energy harvesti

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!