Relevant bibliographies by topics / Electrical engineering|Mechanical engineering|Materials science

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Electrical engineering|Mechanical engineering|Materials science'

Author: Grafiati
Published: 9 July 2021
Last updated: 1 February 2022

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Journal articles on the topic "Electrical engineering|Mechanical engineering|Materials science"

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Zhang, Xiang, Bhavatharini R. S. Rajaraman, Huihui Liu, and Seeram Ramakrishna. "Graphene's potential in materials science and engineering." RSC Adv. 4, no. 55 (2014): 28987–9011. http://dx.doi.org/10.1039/c4ra02817a.

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Materials have become an indispensable part of our modern life, which was tailored such as good mechanical, electrical, thermal properties, establish the basis and fundamentals and the governing rules for every modern technology.
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Weyrich, Claus. "Materials in electronics and electrical engineering." Advanced Materials 2, no. 10 (1990): 450–51. http://dx.doi.org/10.1002/adma.19900021002.

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Farrington, Gregory C. "Making Education in Materials Science and Engineering Attractive to Undergraduate Students." MRS Bulletin 15, no. 8 (1990): 23–26. http://dx.doi.org/10.1557/s0883769400058899.

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Materials research and education is currently one of the liveliest areas of science and engineering and is likely to be so for many decades. It is an outstanding example of an interdisciplinary field; persons who call themselves materials researchers are found in departments of chemistry, physics, metallurgy, ceramics, electrical engineering, chemical engineering, and mechanical engineering, and also in many departments that now call themselves by the name “materials science and engineering.” The field has grown so rapidly that the term “materials science and engineering,” has many different meanings. In fact, most of the funding that supports materials science and engineering research is awarded to investigators in the more traditional disciplines, and the vast majority of scientists and engineers working in the field were educated in these traditional core disciplines.There is no question that the field of materials science and engineering is a success. However, is materials science and engineering now a discipline as well as a field? Should MS&E departments exist and what should be their educational mission? Should MS&E departments offer undergraduate and graduate majors? These questions are being discussed by many university faculties as they work to devise effective research structures and educational programs to respond to the growth of interest in a field that does not fit neatly into any single traditional discipline, but is far too important to ignore.Recently, the University Materials Council appointed a committee to consider these issues and specifically address the challenge of creating effective, attractive programs of undergraduate education in materials science and engineering.
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YAMASHINA, Toshiro. "Vacuum engineering and materials science." SHINKU 30, no. 12 (1987): 956–58. http://dx.doi.org/10.3131/jvsj.30.956.

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Shea, J. J. "Materials science and materials engineering [Book Review]." IEEE Electrical Insulation Magazine 18, no. 4 (2002): 47. http://dx.doi.org/10.1109/mei.2002.1019910.

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Baker, G., F. A. McRobie, and J. M. T. Thompson. "Implications of chaos theory for engineering science." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 211, no. 5 (1997): 349–63. http://dx.doi.org/10.1243/0954406971522105.

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Zhang, Bai Jun, and Wang Wei. "Mechatronic Systems in Mechanical Engineering." Applied Mechanics and Materials 644-650 (September 2014): 134–36. http://dx.doi.org/10.4028/www.scientific.net/amm.644-650.134.

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With the continuous innovation and development of China's science and technology, as a set of information across many disciplines , mechanics , electronics and other technology for the integration of mechanical and electrical integration has been an unprecedented development , this technology has also been widely used in the engineering machinery. It makes reference to the technology of mechanical engineering automation or semi-automated as possible , thereby greatly increasing the accuracy and precision mechanical engineering jobs.This paper describes the key technologies and applications in mechatronics engineering machinery.
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Montoya, Francisco G., Raúl Baños, Alfredo Alcayde, and Francisco Manzano-Agugliaro. "Symmetry in Engineering Sciences II." Symmetry 12, no. 7 (2020): 1077. http://dx.doi.org/10.3390/sym12071077.

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Symmetry can be understood in two different ways: as a property or as a principle. As Plato said, the symmetry that can be seen in nature is not random in itself, because it is a result of the symmetries of the physical laws. Thus, the principles of symmetry have been used to solve mechanical problems since antiquity. Today, these principles are still being researched; for example, in chemical engineering, the spatial symmetry properties of crystal lattices are being studied, or in electrical engineering, the temporal symmetry of the periodic processes of oscillators can be observed. This Special Issue is dedicated to symmetry in engineering sciences (electrical, mechanical, civil, and others) and aims to cover both engineering solutions related to symmetry and the search for patterns to understand the phenomena observed.
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Hashimoto, Nobuaki. "Sensor, Electronics & Packaging engineering LAB., Department of Mechanical and Electrical Engineering, Faculty of Engineering, Suwa University of Science." Journal of The Japan Institute of Electronics Packaging 23, no. 7 (2020): 593. http://dx.doi.org/10.5104/jiep.23.593.

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Miyama, Katsumi. "Functional Processing Laboratory, Department of Mechanical Engineering, Faculty of Engineering, Hokkaido University of Science." Journal of The Japan Institute of Electronics Packaging 24, no. 2 (2021): 203. http://dx.doi.org/10.5104/jiep.24.203.

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Dissertations / Theses on the topic "Electrical engineering|Mechanical engineering|Materials science"

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Yu, Hong. "Modeling and Characterization of Electrical Resistivity of Carbon Composite Laminates." Thesis, University of Delaware, 2018. http://pqdtopen.proquest.com/#viewpdf?dispub=10745689.

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<p> In the past few decades, composite materials especially carbon fiber reinforced polymers (CFRP) have been widely used as structural materials for its high strength to weight ratio, tailorable properties, and excellent corrosion properties. Applications that require better understanding of the electrical properties of CFRP laminates include carbon fiber assisted heating during composites manufacturing, self-sensing of damage of composite structures, integrated electromagnetic shielding, and lightning strike protection. Accurate predictive model describing the electrical conduction behavior of CFRP laminates is the key for them to be used for such applications.</p><p> Different approaches have been explored to model the electrical conduction of CFRP under various current conditions. A comprehensive literature review revealed that most methods used to model electrical conduction of CFRP fail to capture the impact of micro-structure of CFRP, especially the fiber-fiber contact, and resin-rich layer between plies, which can drastically change the conduction pattern.</p><p> The aim of this dissertation work is to develop a model that capture key electrical conduction mechanisms of CFRP, which address the impact of the micro-structure and geometrical parameters. The model is constructed in a modular fashion by validating the model with experimental validation after the addition of each key mechanism module. First, the model constructs a resistor network framework for describing electrical conduction behavior of UD laminas and fiber tows subjected to low DC currents. The model is validated with reported experimental results, and by characterization of resistivity of dry carbon fiber tows.</p><p> The next module investigates the specific features of a multi-ply laminate such as: varying ply orientation, existence of resin-rich layer, and dependence on geometric parameters that influence the local resistivity. A meso-scale fiber bundle model is proposed to strike a balance between the level of details modeled and the computational cost. Influence of the resin-rich layer is described with an inter-ply connectivity term. Expressions for estimating contact resistance from multiple sources including direct fiber-fiber contact and tunneling resistance across thin resin layer are introduced. The refined model is compared against experimental results and finite element model. A parametric study is conducted to investigate the impact of geometrical parameters.</p><p> Finally, the dissertation work investigates the impact of high current density both numerically and experimentally. Simplified analytical model examining the impact of localized Joule heating revealed that current concentrations due to microstructure constraints can introduce excessive Joule heating at contact spots. Thus, it is vital not to under-estimate the temperature rise at contact points, even at seemingly small overall applied currents. Based on these analysis, the model is further refined with the implementation of the module that introduces Joule heating. Both reversible change in resistivity such as temperature dependent resistivity and irreversible change such as thermal and electric degradation of resin matrix is considered.</p><p> Electrical characterization under high current density is carried out for dry fiber tows and cured composites experimentally. The contributions of reversible and irreversible resistivity change are identified with carefully designed repetitive current tests. It is found that for dry fiber tows with sizing and for cured composites, thermal breakdown of the thin resin/sizing layer contributes significantly to the nonlinear conduction behavior under high current density. The developed model captures important characteristics of the electrical conduction behavior when compared with experimental results. Possible explanations are offered for cases and regions where the model shows discrepancies with experimental results. This model should prove useful to address and design and fabricate composite components in which electric and thermal conductivity play a key role in defining their functional properties. </p><p>
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Muzumdar, Manoj D. (Manoj Deepak) 1976. "ICEMENDR : intelligent capture environment for mechanical engineering drawing." Thesis, Massachusetts Institute of Technology, 1999. http://hdl.handle.net/1721.1/9470.

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Thesis (M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999.<br>Includes bibliographical references (p. 45-46).<br>I designed and implemented an intelligent environment for recognizing simple mechanical engineering sketches. This involves the analysis of complex mechanical engineering parts and their components and consists of creating a hierarchical recognition system capable of parsing these parts with simpler geometric primitives. The system seeks to provide an intuitive pencil-and-paper-like interface for sketch recognition by allowing incremental recognition of what a user draws on the system. The system's knowledge is arranged in simple Recognizer modules that have very specialized information on a particular aspect of recognizing a part.<br>by Manoj D. Muzumdar.<br>M.Eng.
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Salary, Roozbeh Ross. "Computational Fluid Dynamics Modeling and in situ Physics-Based Monitoring of Aerosol Jet Printing toward Functional Assurance of Additively-Manufactured, Flexible and Hybrid Electronics." Thesis, State University of New York at Binghamton, 2018. http://pqdtopen.proquest.com/#viewpdf?dispub=10840384.

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<p> Aerosol jet printing (AJP)&mdash;a direct-write, additive manufacturing technique&mdash;has emerged as the process of choice particularly for the fabrication of flexible and hybrid electronics. AJP has paved the way for high-resolution device fabrication with high placement accuracy, edge definition, and adhesion. In addition, AJP accommodates a broad range of ink viscosity, and allows for printing on non-planer surfaces. Despite the unique advantages and host of strategic applications, AJP is a highly unstable and complex process, prone to gradual drifts in machine behavior and deposited material. Hence, real-time monitoring and control of AJP process is a burgeoning need. In pursuit of this goal, the objectives of the work are, as follows: (i) <i>In situ </i> image acquisition from the traces/lines of printed electronic devices right after deposition. To realize this objective, the AJP experimental setup was instrumented with a high-resolution charge-coupled device (CCD) camera, mounted on a variable-magnification lens (in addition to the standard imaging system, already installed on the AJ printer). (ii) <i>In situ </i> image processing and quantification of the trace morphology. In this regard, several customized image processing algorithms were devised to quantify/extract various aspects of the trace morphology from online images. In addition, based on the concept of shape-from-shading (SfS), several other algorithms were introduced, allowing for not only reconstruction of the 3D profile of the AJ-printed electronic traces, but also quantification of 3D morphology traits, such as thickness, cross-sectional area, and surface roughness, among others. (iii) Development of a supervised multiple-input, single-output (MISO) machine learning model&mdash;based on sparse representation for classification (SRC)&mdash;with the aim to estimate the device functional properties (e.g., resistance) in near real-time with an accuracy of &ge; 90%. (iv) Forwarding a computational fluid dynamics (CFD) model to explain the underlying aerodynamic phenomena behind aerosol transport and deposition in AJP process, observed experimentally. </p><p> Overall, this doctoral dissertation paves the way for: (i) implementation of physics-based real-time monitoring and control of AJP process toward conformal material deposition and device fabrication; and (ii) optimal design of direct-write components, such as nozzles, deposition heads, virtual impactors, atomizers, etc.</p><p>
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Herring, Jessica A. "Mechanical and electrical characterization of carbon Black-doped closed-cell Polydimethylsiloxane (PDMS) foam." Thesis, Massachusetts Institute of Technology, 2015. http://hdl.handle.net/1721.1/98652.

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Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering, 2015.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (pages 51-52).<br>Carbon Black-doped Polydimethylsiloxane (CB-PDMS) can be used as a pressure sensing material due to its piezoresistive properties. The sensitivity of such a sensor is in part dependent on the stiffness of the material. A closed-cell CB-PDMS foam is being explored as a possible flexible, lightweight, and waterproof underwater sensing material for use in unmanned underwater vehicles and other hydrodynamic sensing purposes. The percolation threshold for conduction through the CB-PDMS foam is theorized, and a number of different concentrations based on the theorized threshold are explored in order to determine the optimum weight percent of Carbon Black dopant to achieve a high sensitivity, low stiffness sensing CB-PDMS foam. Sinusoidal mechanical pressure patterns were applied and voltage response measured. An optimum dopant weight percent out of the concentrations tested was found at 5.5 wt% CB-PDMS.<br>by Jessica A. Herring.<br>S.B.
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Anant, Vikas 1980. "Engineering the optical properties of subwavelength devices and materials." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/42233.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007.<br>Includes bibliographical references (p. 145-154).<br>Many applications demand materials with seemingly incompatible optical characteristics. For example, immersion photolithography is a resolution enhancing technique used to fabricate the ever-shrinking nanostructures in integrated circuits but requires a material that has-at the same time--a large index of refraction and negligible optical loss. Other applications require devices that have optical properties that seem exorbitant given the constraints posed by the geometry, materials, and desired performance of these devices. The superconducting nanowire single-photon detector (SNSPD) is one such device that, on the one hand, needs to absorb and detect single telecom-wavelength photons (A = 1.55 pm) with near-perfect efficiency, but on the other hand, has an absorber that is subwavelength in its thickness (A/390). For both cases, it is simply not enough to look for alternative materials with the desired optical properties, because the materials may not exist in nature. In fact, it has become necessary to engineer the optical properties of these devices and materials using other means. In this thesis, we have investigated how the optical properties of materials and devices can be engineered for specific applications. In the first half of the thesis, we focused on theoretical schemes that use subwave-length, resonant constituents to realize a material with interesting optical properties. We proposed a scheme that can achieve high index (n > 6) accompanied with optical gain for an implementation involving atomic vapors. We then explored the applicability of this high-index system to immersion lithography and found that optical gain is problematic. We solved the issue of optical gain by proposing a scheme where a mixture of resonant systems is used. We predicted that this system can yield a high refractive index, low refractive index, anomalous dispersion, or normal dispersion, all with optical transparency. In the second half, we studied the optical properties of SNSPDs through theoretical and experimental methods. In the study, we first constructed a numerical model that predicts the absorptance of our devices. We then fabricated SNSPDs with varying geometries and engineered a preprocessing-free proximity-effect correction technique to realize uniform linewidths. We then constructed an optical apparatus to measure the absorptance of our devices and showed that the devices are sensitive to the polarization of single photons.<br>by Vikas Anant.<br>Ph.D.
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Kneer, Emil Anton 1965. "Electrochemical aspects of chemical mechanical polishing of tungsten and aluminum." Diss., The University of Arizona, 1998. http://hdl.handle.net/10150/282711.

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Chemical mechanical polishing (CMP) of metals has emerged as a critical process step for the fabrication of advanced integrated circuit devices in the semiconductor industry. In a typical metal CMP process, the metal film is blanket deposited to fill recessed features on a patterned dielectric on silicon. Following metal deposition and gap fill, the metal overabundance is polished away by CMP, leaving an inlayed metal pattern or damascene structure on the substrate. Removal of the metal overabundance also planarizes the wafer surface for subsequent processing steps. The material removal process occurring during CMP is thought to involve the combined action of chemical oxidation and dissolution, and mechanical removal of material by abrasives. However, the relative contribution of mechanical and chemical effects during metal CMP is not well understood. The objective of this research was to characterize the fundamental electrochemical behavior of tungsten and aluminum thin films in polishing chemistries of interest to CMP. It was also of interest to determine the extent to which electrochemical oxidation and dissolution, or mechanical removal by abrasive action assists in material removal during CMP. A simultaneous electrochemical tester and polishing tool was developed to characterize the electrochemical behavior of tungsten and aluminum during and after abrasion. Small-scale polishing experiments were also carried out to measure polishing (removal) rates of the metals during CMP. Electrochemical dissolution rates and polishing rates were compared. It was found that the electrochemical dissolution rate of tungsten or aluminum during or after abrasion was very small compared to actual polishing rates. However, the presence of an oxidant enhanced polishing rates dramatically. The findings indicate that the mechanism for removal during CMP is primarily corrosion assisted metal removal, and not electrochemical dissolution and/or removal of the oxidation product of the metal.
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Gan, Tian S. M. Massachusetts Institute of Technology. "Design and fabrication of granular materials for surface acoustic waves." Thesis, Massachusetts Institute of Technology, 2015. http://hdl.handle.net/1721.1/100133.

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Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2015.<br>Thesis: S.M., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2015.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (pages 134-147).<br>Granular materials with structural discreteness and periodicity can lead to novel propagation behaviors of mechanical waves. Acoustic studies of granular media typically involve macroscopic particles whereas contact-based vibrations of microparticles remain largely unexplored. The adhesion which can be neglected on millimeter scale is significant on micron scales and therefore microparticles are expected to yield qualitatively different dynamics. We model the microparticle array as locally resonant metamaterials for surface acoustic waves by using the effective medium approach. In experiment, we employ the convective assembly method to fabricate the centimeter-sized, two-dimensional granular crystal consisting of 1[mu]m silica spheres adhered to the substrate. Laser-induced transient grating technique is used to generate and detect surface acoustic waves in microsphere array samples. We demonstrate, both experimentally and by theoretical analysis, that the Rayleigh wave in the substrate interacts with the contact resonance of microspheres leading to hybridization and "avoided-crossing" at a high frequency regions~10 2 MHz. Furthermore, we fabricate the microsphere waveguide structure by template-assisted-self-assembly. By using the same laser technique, we have observed the waveguide behavior in experimental measurement.<br>by Tian Gan.<br>S.M.
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Smith, Craig Edward. "Monitoring Damage Accumulation In SiC/SiC Ceramic Matrix Composites Using Electrical Resistance." University of Akron / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=akron1249917100.

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Rich, Steven I. "Electrically Activated Stiffness-Switching with Low-Melting-Point Conductive Thermoplastics." Thesis, Carnegie Mellon University, 2018. http://pqdtopen.proquest.com/#viewpdf?dispub=10977483.

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<p> As technology becomes more integrated into our daily lives, the need for machines that can safely and comfortably interact with the human body has grown. While the rigidity of traditional robotic materials, such as metals and plastics, can provide mechanical and electrical stability to these devices, it can also reduce safety and comfort when placed in contact with soft human tissue. In recent years, these issues have been addressed by incorporating compliant materials, like liquids or soft polymers, into wearable or biomedical devices. However, these materials, by virtue of their softness, cannot support the high loads required for operations like stabilization or gripping. To address this apparent trade-off between load-bearing stiffness and conformable softness, several groups have constructed stiffness-tuning devices, capable of alternating between a high-stiffness state and a low-stiffness state. Although there exist a wide variety of mechanisms by which we can achieve this switching behavior, thermally activated phase change provides the highest stiffness ratio between the soft and stiff states. In this work, use low-melting point conductive thermoplastics to create electrically activated stiffness-switching devices. When a voltage is applied across this thermoplastic, the resulting electric current causes the polymer to heat and melt. This phase change corresponds to an effective stiffness change. </p><p> In the first study, we introduce a novel stiffness switch layout that employs liquid metal as compliant electrodes oriented across the face of a conductive thermoplastic. This new layout results in an 80% decrease in required voltage, a 60% decrease in activation time, and the ability to switch the stiffness of arbitrary geometries. </p><p> In the second study, we examine the effects of the composition of a conductive thermoplastic composite on its stiffness-switching properties, and use these findings can help guide the design of stiffness-switching composites for a three soft robotic applications.</p><p>
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Nittala, Aditya Kameshwara. "Electrical and Mechanical Performance of Aluminum Alloys with Graphite Nanoparticles." Ohio University / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1554117521295178.

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Books on the topic "Electrical engineering|Mechanical engineering|Materials science"

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Bolton, W. Engineering science. 5th ed. Newnes, 2006.

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Bolton, W. Engineering science. Industrial Press, 1990.

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Engineering science. 2nd ed. Newnes, 1994.

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Engineering science. Newnes, 1992.

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Engineering science. Heinemann Newnes, 1990.

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Engineering science. 3rd ed. Newnes, 1998.

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Engineering science. 4th ed. Newnes, 2001.

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Higher engineering science. Newnes, 1999.

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Materials science for electrical and electronic engineers. Oxford University Press, 2001.

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service), SpringerLink (Online, ed. Technology Developments: the Role of Mechanism and Machine Science and IFToMM. Springer Science+Business Media B.V., 2011.

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Book chapters on the topic "Electrical engineering|Mechanical engineering|Materials science"

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Askeland, Donald R. "Electrical Conductivity." In The Science and Engineering of Materials. Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-009-1842-9_17.

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Askeland, Donald R. "Electrical Behaviour of Materials." In The Science and Engineering of Materials. Springer US, 1996. http://dx.doi.org/10.1007/978-1-4899-2895-5_18.

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Askeland, Donald R. "Electrical Behaviour of Materials." In The Science and Engineering of Materials. Springer US, 1996. http://dx.doi.org/10.1007/978-1-4613-0443-2_18.

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Bian, Hanliang, Songyu Liu, Ya Chu, and Guojun Cai. "Estimation of Oil-Contaminated Soils’ Mechanical Characteristics Using Electrical Resistivity." In Environmental Science and Engineering. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-2221-1_71.

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Tonday, Hulas Raj, Pravin Kumar Singh, and Anand Mukut Tigga. "Atomic Force Microscopic Characterization of Wire Electrical Discharge Machined Samples." In Innovation in Materials Science and Engineering. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-2944-9_17.

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Walrand, Jean. "Correction to: Probability in Electrical Engineering and Computer Science." In Probability in Electrical Engineering and Computer Science. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-49995-2_16.

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Lai, L. F., J. X. Wang, and Y. N. Qiu. "Effect of deposition conditions on electrical properties of NiCr thin film." In Advances in Materials Science, Energy Technology and Environmental Engineering. CRC Press/Balkema, 2016. http://dx.doi.org/10.1201/9781315227047-62.

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Souza, Dulcina M., and Adilson L. Chinelatto. "Rare-Earth Doped Aluminous Electrical Porcelain." In Materials & Equipment/Whitewares: Ceramic Engineering and Science Proceedings, Volume 23, Issue 2. John Wiley & Sons, Inc., 2008. http://dx.doi.org/10.1002/9780470294734.ch9.

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Shafer, Wade H. "Electrical Engineering." In Masters Theses in the Pure and Applied Sciences. Springer US, 1997. http://dx.doi.org/10.1007/978-1-4615-5969-6_12.

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Shafer, Wade H. "Electrical Engineering." In Masters Theses in the Pure and Applied Sciences. Springer US, 1993. http://dx.doi.org/10.1007/978-1-4615-2453-3_12.

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Conference papers on the topic "Electrical engineering|Mechanical engineering|Materials science"

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Cieslinski, Benjamin, Mohamed Gharib, Brady Creel, and Tala Katbeh. "A Model Science-Based Learning STEM Program." In ASME 2019 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/imece2019-10352.

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Abstract In this paper, a model STEM program called Engineering Heroes: Qatar Special Investigators (QSI), aimed to familiarize young students with science and engineering in real life applications, is presented. The program theme is about forensic science and technology, which included science and engineering activities with hands-on projects to challenge students’ science and critical thinking skills. Throughout the program, students learned about forensic science as an application of science, engineering and technology to collect, preserve, and analyze evidence to be used in the course of a legal investigation. Participants learned the history of forensic analysis and how it evolved into today’s specialized career field. Forensic specialists include backgrounds in chemistry, physics, biology, toxicology, chemical and electrical engineering. Topics included in the program were a study of toxicology and chemical analysis, assays to determine drug contents, fingerprint development, environmental contamination, chromatography in forgery, presumptive vs. confirmatory testing, scanning electron microscopy, infrared analysis, and evidence handling techniques. The details of the program are presented, including the contents, preparation, materials used, case studies, and final crime scene investigation, which featured the learning outcomes.
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Zhang, Chunjuan, Feng Wang, and Liangqun Si. "Research and Exploration of Automatic Maintenance of Mechanical and Electrical Engineering." In 2018 International Conference on Mechanical, Electrical, Electronic Engineering & Science (MEEES 2018). Atlantis Press, 2018. http://dx.doi.org/10.2991/meees-18.2018.55.

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Salandro, Wesley A., Cristina Bunget, and Laine Mears. "Thermo-Mechanical Investigations of the Electroplastic Effect." In ASME 2011 International Manufacturing Science and Engineering Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/msec2011-50250.

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Recent development of Electrically-Assisted Manufacturing processes proved the advantages of using the electric current, mainly related with the decrease in the mechanical forming load and improvement in the formability when electrically-assisted forming of metals. The reduction of forming load was formulated previously assuming that a part of the electrical energy input is dissipated into heat, thus producing thermal softening of the material, while the remaining component directly aids the plastic deformation. The fraction of electrical energy applied that assists the deformation process compared to the total amount of electrical energy is given by the electroplastic effect coefficient. The objective of the current research is to investigate the complex effect of the electricity applied during deformation, and to establish a methodology for quantifying the electroplastic effect coefficient. Temperature behavior is observed for varying levels of deformation and previous cold work. Results are used to refine the understanding of the electroplastic effect coefficient, and a new relationship, in the form of a power law, is derived. This model is validated under independent experiments in Grade 2 (commercially pure) and Grade 5 (Ti-6Al-4V) titanium.
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Xue, Li, Xiong Jian-qiao, Yuan Xin-fang, and Fan Jiu-chen. "Mechanism research on the electrical discharge WED machining of engineering ceramics materials." In 2011 International Conference on Mechatronic Science, Electric Engineering and Computer (MEC). IEEE, 2011. http://dx.doi.org/10.1109/mec.2011.6025988.

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Liu, Jun. "Materials Science Challenges for Large Scale Electrical Energy Storage." In 14th Asia Pacific Confederation of Chemical Engineering Congress. Research Publishing Services, 2012. http://dx.doi.org/10.3850/978-981-07-1445-1_850.

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Poplavko, Y., and Y. Yakimenko. "Electronic materials science: Teaching in technical university." In 2017 IEEE First Ukraine Conference on Electrical and Computer Engineering (UKRCON). IEEE, 2017. http://dx.doi.org/10.1109/ukrcon.2017.8100439.

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Bar-Cohen, Y. "Electroactive Polymer (EAP) as Actuators for Biomimetic Applications." In ASME 2010 International Mechanical Engineering Congress and Exposition. ASMEDC, 2010. http://dx.doi.org/10.1115/imece2010-37168.

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Many polymers are known to vary their shape or size when subjected to electric, chemical, pneumatic, optical, or magnetic field. Electrical excitation is one of the most attractive methods for causing elastic deformation. The convenience and practicality of electrical stimulation and the recent advances in electroactive polymers (EAP) make them the most preferred among the responsive polymers. An added benefit of some of the EAP materials is their having the reverse effect of converting mechanical strain to electrical signal making them useful for sensors and energy harvesting mechanisms. To bring these materials to use in daily use products will necessitate finding niche that addresses critical needs. One of the main applications that are being considered for biologically inspired capabilities, also known as biomimetics, which were previously imaginable only in science fiction concepts. Some of the applications that are considered include Refreshable Braille Display, Robotic Fish, Fish-like Blimp, Humanlike Robots and many others. In the paper, the latest development in EAP materials and their applications will be reviewed and discussed.
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Yongzhi, Ji. "Training Strategy Research of Mechanical and Electrical Specialty Teachers Under the Background of New Engineering." In 7th International Conference on Humanities and Social Science Research (ICHSSR 2021). Atlantis Press, 2021. http://dx.doi.org/10.2991/assehr.k.210519.148.

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Yu, Xiang. "Analysis of the mechanical properties and electrical conductivity of aluminum wire by the dissolution temperature." In 2017 2nd International Conference on Materials Science, Machinery and Energy Engineering (MSMEE 2017). Atlantis Press, 2017. http://dx.doi.org/10.2991/msmee-17.2017.281.

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Watkins, Kenneth S., Shelby J. Morris, C. P. Wong, et al. "An Electrical Condition Monitoring Approach for Wire and Cable." In 12th International Conference on Nuclear Engineering. ASMEDC, 2004. http://dx.doi.org/10.1115/icone12-49559.

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An electrical cable condition monitoring (CCM) method utilizing conductive polymer age sensors provides a distributed, in-situ approach that reduces access considerations and eliminates destructive testing, increasing safety by monitoring areas otherwise impractical or impossible. It reduces the cost of Generation IV cable condition monitoring by eliminating sample-retrieval and significantly reducing testing costs associated with conventional mechanical and chemical condition monitoring. Future applications include simple, lowcost condition monitoring of virtually any polymer used in industry, transportation, construction and recreation. The proposed CCM method utilizes inert conductive particles compounded with candidate insulation materials to provide an age “sensor” distributed in the wire or cable insulation or jacket. A simple electrical measurement, the resistivity of the sensor, correlates age-related degradation of mechanical properties such as elongation at break (EAB) and provides a means to determine remaining life of the insulation material. This paper summarizes the results of research being conducted under a DOE Small Business Innovative Research grant in concert with the School of Materials Science and Engineering at Georgia Tech and Rockbestos-Surprenant Cable Corp.
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Reports on the topic "Electrical engineering|Mechanical engineering|Materials science"

1

Schlunk, Otmar S. National Defense Science and Engineering Graduate Fellowship Program in Electrical Engineering. Defense Technical Information Center, 1992. http://dx.doi.org/10.21236/ada256975.

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Silva, Michael James. Electrical Engineering in Los Alamos Neutron Science Center Accelerator. Office of Scientific and Technical Information (OSTI), 2017. http://dx.doi.org/10.2172/1411363.

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Knorr, Jeffrey B., and Murali Tummala. Summary of Research 2001, Department of Electrical and Computer Engineering, Graduate School of Engineering and Applied Sciences. Defense Technical Information Center, 2002. http://dx.doi.org/10.21236/ada415421.

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