Academic literature on the topic 'Electrochemical deposition'

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Journal articles on the topic "Electrochemical deposition"

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Chubenko, Eugene, Alexey Klyshko, Vitaly Bondarenko, Marco Balucani, Anatoly I. Belous, and Victor Malyshev. "ZnO Films and Crystals on Bulk Silicon and SOI Wafers: Formation, Properties and Applications." Advanced Materials Research 276 (July 2011): 3–19. http://dx.doi.org/10.4028/www.scientific.net/amr.276.3.

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In present work the investigation of the electrochemical and chemical hydrothermal deposition processes of ZnO on silicon is presented. The influence of the electrochemical process parameters on the characteristics and morphology of the ZnO deposits is analyzed. Electrochemical deposition from non aqueous DMSO solutions on porous silicon buffer layer is also discussed. The details of the chemical hydrothermal deposition from the nitrate bath of high-quality ZnO crystals on silicon substrate are presented. It was shown that morphology and size of synthesized ZnO crystals depends on the temperature of the deposition bath. Differences between photoluminescence of electrochemically deposited ZnO thin films and hydrothermally synthesized crystals are shown. Electrochemically deposited ZnO films demonstrate defect-caused luminescence and hydrothermally grown ZnO crystals shows intensive exciton luminescence band in UV region. Hydrothermal deposition of high-quality ZnO crystals on the surface of electrochemically deposited ZnO seed layer with porous silicon buffer improves photoluminescence properties of the structure which is useful for optoelectronics applications. Possible applications of ZnO as gas sensors and photovoltaic devices are considered. Aspects of ZnO electrochemical deposition on bulk silicon and silicon-on-isolator wafers for integration purposes are discussed.
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Vida-Simiti, I., Nicolae Jumate, M. Guzun, V. Ajder, and J. Bobanova. "Structure of Composite Layers Reinforced with SiC Particles Obtained by Electrochemical Deposition." Advanced Materials Research 23 (October 2007): 265–68. http://dx.doi.org/10.4028/www.scientific.net/amr.23.265.

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The paper reports on a study regarding the structure of composite layers obtained by electrochemical deposition. The depositions were achieved in a bath formed of a mixture of aqueous solutions of iron salts (iron chloride), cobalt (cobalt sulphate) and solid particles of silicon carbide (SiC) in suspension. Following the electrochemical deposition on composite structures are formed as a thin layer with a metallic matrix (FeCo alloy), reinforced with hard particles of SiC. The structure of the composite layer is uniform and very fine, with crystalline granules under 500 nm. The electrochemically deposited FeCo alloy representing the metallic matrix of the composite layer has a high micro-hardness (864 HV), superior to the same alloy obtained by casting.
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Majidzade, V. A., S. F. Cafarova, A. Sh Aliyev, N. B. Farhatova, and D. B. Tagiyev. "ELECTROCHEMICAL DEPOSITION OF THIN SEMICONDUCTIVE Mo–S FILMS." Azerbaijan Chemical Journal, no. 1 (March 19, 2019): 6–13. http://dx.doi.org/10.32737/0005-2531-2019-1-6-13.

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Möller, Peter, Chaturvedula S. Sastri, Manfred Kluckner, Dieter Rhede, and Hugo M. Ortner. "Evidence for electrochemical deposition of gold onto arsenopyrite." European Journal of Mineralogy 9, no. 6 (December 2, 1997): 1217–26. http://dx.doi.org/10.1127/ejm/9/6/1217.

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Huang, Baoming M. "Electrochemical atomic layer epitaxy of semiconductor CdTe thin films." Proceedings, annual meeting, Electron Microscopy Society of America 51 (August 1, 1993): 824–25. http://dx.doi.org/10.1017/s0424820100149957.

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Semiconductor thin films have important applications in areas such as photovoltaics and luminescent displays. Electrodeposition of these films is a potential low cost, room temperature production technique. Electrochemical atomic layer epitaxy (ECALE) involves alternatively depositing individual element monolayer amount per ECALE cycle, taking advantage of the under-potential deposition (UPD) phenomena.A series of CdTe thin films have been deposited using ECALE methodology in an electrochemical flow cell system. The 0.5 mM Te4+, Te blank, 5mM Cd2+, and Cd blank solutions are made with purasonic grade TeO2 and CdSO4, research grade electrolyte, and 18 M ohm water. The gold foil substrates are cleaned electrochemically before each experiment. An ECALE cycle starts with depositing monolayer amount Te, rinsing with Te blank, then depositing monolayer amount of Cd, and ending with rinsing with Cd blank solution. The whole flow cell system is controlled by a computer with house-written codes, and the deposition process can be fully programmed.
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Kund, Julian, Sven Daboss, Tommaso Marchesi D’Alvise, Sean Harvey, Christopher V. Synatschke, Tanja Weil, and Christine Kranz. "Physicochemical and Electrochemical Characterization of Electropolymerized Polydopamine Films: Influence of the Deposition Process." Nanomaterials 11, no. 8 (July 30, 2021): 1964. http://dx.doi.org/10.3390/nano11081964.

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Polydopamine (PDA) is a synthetic eumelanin polymer which is, to date, mostly obtained by dip coating processes. In this contribution, we evaluate the physical and electrochemical properties of electrochemically deposited PDA films obtained by cyclic voltammetry or pulsed deposition. The obtained PDA thin films are investigated with respect to their electrochemical properties, i.e., electron transfer (ET) kinetics and charge transfer resistance using scanning electrochemical microscopy and electrochemical impedance spectroscopy, and their nanomechanical properties, i.e., Young’s modulus and adhesion forces at varying experimental conditions, such as applied potential or pH value of the medium using atomic force microscopy. In particular, the ET behavior at different pH values has not to date been investigated in detail for electrodeposited PDA thin films, which is of particular interest for a multitude of applications. Adhesion forces strongly depend on applied potential and surrounding pH value. Moreover, force spectroscopic measurements reveal a significantly higher percentage of polymeric character compared to films obtained by dip coating. Additionally, distinct differences between the two depositions methods are observed, which indicate that the pulse deposition process leads to denser, more cross-linked films.
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Geuli, Ori, and Daniel Mandler. "Overcoming the barrier of conventional electrochemical deposition of inorganic composites." Chemical Communications 56, no. 3 (2020): 379–82. http://dx.doi.org/10.1039/c9cc07039g.

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Elmasly, Saadeldin E. T., Luca Guerrini, Joseph Cameron, Alexander L. Kanibolotsky, Neil J. Findlay, Karen Faulds, and Peter J. Skabara. "Synergistic electrodeposition of bilayer films and analysis by Raman spectroscopy." Beilstein Journal of Organic Chemistry 14 (August 21, 2018): 2186–89. http://dx.doi.org/10.3762/bjoc.14.191.

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A novel methodology towards fabrication of multilayer organic devices, employing electrochemical polymer growth to form PEDOT and PEDTT layers, is successfully demonstrated. Moreover, careful control of the electrochemical conditions allows the degree of doping to be effectively altered for one of the polymer layers. Raman spectroscopy confirmed the formation and doped states of the PEDOT/PEDTT bilayer. The electrochemical deposition of a bilayer containing a de-doped PEDTT layer on top of doped PEDOT is analogous to a solution-processed organic semiconductor layer deposited on top of a PEDOT:PSS layer without the acidic PSS polymer. However, the poor solubility of electrochemically deposited PEDTT (or other electropolymerised potential candidates) raises the possibility of depositing a subsequent layer via solution-processing.
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Vranceanu, Diana Maria, Ionut Cornel Ionescu, Elena Ungureanu, Mihai Ovidiu Cojocaru, Alina Vladescu, and Cosmin Mihai Cotrut. "Magnesium Doped Hydroxyapatite-Based Coatings Obtained by Pulsed Galvanostatic Electrochemical Deposition with Adjustable Electrochemical Behavior." Coatings 10, no. 8 (July 24, 2020): 727. http://dx.doi.org/10.3390/coatings10080727.

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The aim of this study was to adapt the electrochemical behavior in synthetic body fluid (SBF) of hydroxyapatite-based coatings obtained by pulsed galvanostatic electrochemical deposition through addition of Mg in different concentrations. The coatings were obtained by electrochemical deposition in a typical three electrodes electrochemical cell in galvanic pulsed mode. The electrolyte was obtained by subsequently dissolving Ca(NO3)2·4H2O, NH4H2PO4, and Mg(NO3)2·6H2O in ultra-pure water and the pH value was set to 5. The morphology consists of elongated and thin ribbon-like crystals for hydroxyapatite (HAp), which after the addition of Mg became a little wider. The elemental and phase composition evidenced that HAp was successfully doped with Mg through pulsed galvanostatic electrochemical deposition. The characteristics and properties of hydroxyapatite obtained electrochemically can be controlled by adding Mg in different concentrations, thus being able to obtain materials with different properties and characteristics. In addition, the addition of Mg can lead to the control of hydroxyapatite bioactive ceramics in terms of dissolution rate.
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Talib, Elyas, Kok Tee Lau, Muhammad Zaimi, Mohd Shahril Amin Bistamam, Nor Syafira Abdul Manaf, Raja Noor Amalina Raja Seman, Nor Najihah Zulkapli, and Mohd Asyadi Azam. "Electrochemical Performance of Multi Walled Carbon Nanotube and Graphene Composite Films Using Electrophoretic Deposition Technique." Applied Mechanics and Materials 761 (May 2015): 468–72. http://dx.doi.org/10.4028/www.scientific.net/amm.761.468.

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This study aims to investigate multi-walled carbon nanotube and graphene composite thin films fabricated using cathodic electrophoretic deposition in aqueous solution. The deposition mechanism and films microstructure were investigated using the cyclic voltammetry (CV) and field emission scanning electron microscope. The depositions yield varied by the deposition time and deposition voltage. The composite films were studied for its application in the electrochemical capacitor. The electrochemical performance showed the capacitive behavior of the films in 6 M potassium hydroxide electrolyte. CV scans were verified from 0 to 1 V at different scan rates. The specific capacitance of 29 Fg-1 was achieved at the scan rate of 1 mVs-1.
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Dissertations / Theses on the topic "Electrochemical deposition"

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Proper, Sebastian. "Development of localized electrochemical deposition." Thesis, Uppsala universitet, Tillämpad materialvetenskap, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-302540.

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In the manufacturing industry, parts are created with high demands on their mechanical properties. To avoid surface defects, components are over-dimensioned and then machined to the desired size. This will give rise to material waste and extra processing steps. Therefore, it is of interest to investigate methods to repair these surface defects without the need of over-dimensioning. In this thesis work, different strategies for localized electrochemical deposition have been investigated with respect to their ability to perform local repair of surface defects. The concepts that have been studied include the application of a microanode, a confined bath, and of liquid marbles. The different methods were tested and the process parameters were optimized to achieve good quality deposits at sufficient growth rates. The best deposits were then further characterized with respect to grain size distribution, crystal orientation and surface quality. The ability to repair a surface defect was also studied along with the possibility of producing thicker deposits. The confined bath method was the most promising concept. At a current density of 3.5 A/dm2, a good quality deposit was achieved. The crystal orientations proved to be random and the average grain size was 115 ± 61 nm. A surface defect with a depth of 33.0 µm and a width of 19.8 µm was successfully repaired using this local deposition method. However, the technique needs further development for the desired application in manufacturing industry.
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Wagner, Mary Elizabeth S. B. Massachusetts Institute of Technology. "Advanced electrochemical characterization of copper deposition." Thesis, Massachusetts Institute of Technology, 2015. http://hdl.handle.net/1721.1/110960.

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Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering, February 2016.
This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (pages 51-52).
The electrodeposition of copper metal in a concentrated sulfuric acid solution is reported to occur through a four-step mechanism: (I) the dehydration of Cu2+ (H2O)6, (II) the reduction of Cu2+ to cu+, (III) the dehydration cu+ (H2O)6-x, (IV) the reduction of Cu+ to copper metal. The dehydration steps have been found to be responsible for the pH-dependence of the electrodeposition reaction. It is also reported, although not well understood, that the presence of Fe2+ ions affects the reaction kinetics. In this work, the kinetics of copper electrodeposition were studied using alternating current cyclic voltammetry. The reaction was studied at a copper rotating disk electrode with varying concentrations of Cu2+ and Fe2+ . At sufficiently low pH, and a sufficiently high concentration of Fe2+ , the deposition kinetics may be slowed enough to separately observe the two electron transfer steps involved in copper reduction. It was found that Fe2+ ions affect the electrodeposition kinetic by slowing down reaction kinetics, particularly the second electron transfer reaction.
by Mary Elizabeth Wagner.
S.B.
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Sawangphruk, Montree. "Electrochemical deposition and properties, of nanostructured materials." Thesis, University of Oxford, 2010. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.526445.

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Corni, Ilaria. "Deposition of composite coatings by electrochemical means." Thesis, Imperial College London, 2009. http://hdl.handle.net/10044/1/11983.

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Tang, Zheng. "Polarized electrochemical vapor deposition (PEVD) and its applications." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk2/tape17/PQDD_0010/NQ34846.pdf.

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Eskhult, Jonas. "Electrochemical Deposition of Nanostructured Metal/Metal-Oxide Coatings." Doctoral thesis, Uppsala : Acta Universitatis Upsaliensis, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-8186.

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Suzuki, Y. "Controlled growth of nanostructure ZnO using electrochemical deposition." Thesis, University College London (University of London), 2013. http://discovery.ucl.ac.uk/1382395/.

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Zinc oxide (ZnO) has become a popular semiconducting material to study because of its wide applications. ZnO Nanorods (NR) in particular are very exciting features because of their unique properties which include the crystal dimensionality, highly optical transparency, tuneable electrical conductivity, integrity into pre-existing technologies and many others. Meanwhile, controlled and reliable synthesis of ZnO NR is still challenging and many methods have been proposed for a cheap growth of ZnO NR in large scale. Recently, electrochemically deposited ZnO film is attracting much attention, as it provides large-scale synthesis while ensuring a good electrical contact. This thesis studied the growth of a single nanostructure zinc oxide (ZnO) using electrochemistry, with special focus on the nanorod and their physical properties. In this work, ZnO was electrochemically deposited on ITO using mainly three electrochemical techniques: potentiodynamic (PD), potentiostatic (PS) and galvanostatic (GS). The time transient current and voltages were recorded in situ and analysed in depth. During our PD studies, we have identified different deposition mechanisms depending on the growth parameters, which are progressive and coalescent nucleation (NC). The Sharifker equation was the model used to describe PS ZnO progressive and NC process while nothing has been suggested for GS. Furthermore, we noticed that the same Sharifker model could no longer hold where the recorded current density was considerably high during the PS ZnO deposition. Here, we propose a model for GS ZnO deposition based on the electrical damping. We also suggest its adaptability for PS ZnO deposition when the charge transfer rate is comparably high. The physical properties of the nanorods were characterized using scanning electron microscope (SEM) and x-ray diffraction (XRD). The morphology of features at different deposition setups were studied and a parameter for was established for obtaining ITO covered with ZnO NR only. AFM and MATLAB program were also used to find a pattern of how for the size and the density of rods are distributed during the ZnO deposition on ITO. We have also investigated the crystal properties of deposited ZnO NR and we discovered that different deposition technique, or current density during the deposition, lead to different levels of Zn(OH)2 incorporation in the NR crystal which was confirmed with FTIR. The electrical conductivity was deduced using scanning tunnelling microscope (STM) at different tip heights, and was found to be 20 Ωcm with a carrier concentration of 3x1015 cm-3. Similar results were also obtained with a conductive atomic force microscope (AFM). In addition, two conduction mechanisms were observed depending on the crystallinity of the sample. The results show that electrochemically grown ZnO nanorods have electrical properties suitable with possibility of tailoring for use in optoelectronic devices such as diodes, varistors, solar cells and transistors. Few optoelectronic devices were designed based on the ECD grown ZnO. ASi: H p-i-n solar cells were deposited after the electrochemical deposition of ZnO on ITO-coated substrates. The results show that the textured solar cell performance was 30% higher than the planar solar cell. We also attempted flexible transparent ZnO based liquid-solid state solar cell (photoelectrochemical cell). Although a photoresponse was observed under UV, it had a poor charge collection efficiency (< 0.5%) which was attributed to the transparency and the thickness of ZnO layer.
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Allwright, Emily Marieke. "Electrochemical deposition of small molecules for electronic materials." Thesis, University of Edinburgh, 2014. http://hdl.handle.net/1842/9921.

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The method of the deposition of films of small molecules for use in electronic applications is just as important as the molecule design itself as the film’s morphology and continuity influence the performance of the devices that they are incorporated in. The purpose of the work in this thesis was to develop a method of electrochemically depositing films of small molecules for potential use in electronic applications. A method of electrochemically depositing films of chemically reduced low solubility dye molecules was successfully pioneered. The process was developed using N,N dibutyl-3,4,9,10-perylene-bis(dicarboxime), a simplified version of 3,4,9,10-perylene-tetracarboxylic bisbenzimidalzole. Both of these dyes have been used in electronic applications, but low solubility makes them difficult to deposit by traditional solution techniques. A series of films was electrochemically deposited onto FTO coated glass and field effect transistors using coulometry. These films were characterised by absorption spectroscopy, photoluminescence, scanning electron microscopy, X-ray diffraction and photo-electrochemistry. The same deposition method was applied to copper phthalocyanine. These films were characterised by absorption spectroscopy, photoluminescence, scanning electron microscopy and X-ray diffraction. The developed method was used to deposit films of bilayers of dyes and to investigate the dye penetration during the deposition of copper phthalocyanine onto porous titanium dioxide. Films of neutral copper and nickel dithiolenes were electrodeposited from air-stable TMA salts to investigate the absorbance of the near infrared species formed, as well as to investigate the conductivity of both complexes and the magnetoresponse of the neutral copper dithiolene which is air unstable when formed chemically.
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Sharan, Kumar Varun. "Study of Binding Copper Powders by Electrochemical Deposition." University of Cincinnati / OhioLINK, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1471346137.

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Sunitha, Radhakrishnan Shiv Shailendar. "Study of Localized Electrochemical Deposition Using Liquid Marbles." University of Cincinnati / OhioLINK, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1479820546120994.

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Books on the topic "Electrochemical deposition"

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Paunovic, Milan, and Mordechay Schlesinger. Fundamentals of Electrochemical Deposition. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2005. http://dx.doi.org/10.1002/0470009403.

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Mordechay, Schlesinger, ed. Fundamentals of electrochemical deposition. 2nd ed. Hoboken, N.J: Wiley, 2006.

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Paunovic, Milan. Fundamentals of Electrochemical Deposition. New York: John Wiley & Sons, Ltd., 2006.

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Mordechay, Schlesinger, and Electrochemical Society, eds. Fundamentals of electrochemical deposition. New York: Wiley, 1998.

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Hovestad, Arjan. Electrochemical deposition of metal matrix composites. Eindhoven: Eindhoven University, 1997.

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Symposium on Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling (1997 Paris, France). Proceedings of the Symposium on Electrochemical Deposition and Dissolution Including Modeling. Edited by Paunovic Milan and Electrochemical Society Electrodeposition Division. Pennington, New Jersey: Electrochemical Society, 1998.

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John, Matlosz Michael, Electrochemical Society Electrodeposition Division, and Symposium on Fundamental Aspects of Electrochemical Deposition and Dissolution (1999 : Honolulu, Hawaii), eds. Fundamental aspects of electrochemical deposition and dissolution: Proceedings of the International Symposium. Pennington, N.J: Electrochemical Society, 2000.

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Georgi, Staikov, and Lorenz W. J, eds. Electrochemical phase formation and growth: An introduction to the initial stages of metal deposition. Weinheim: VCH, 1996.

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Eroglu, Damla. Modeling and Characterization of Rate Phenomena in Complex Electrochemical Systems: Sodium-Metal Chloride Batteries and Ni/SiC Co-Deposition. [New York, N.Y.?]: [publisher not identified], 2013.

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S, Cale Timothy, Pintchovski Fabio S, Blewer R. S, and University of California, Berkeley. Continuing Education in Engineering., eds. Advanced metallization for ULSI applications, 1992: Proceedings of the conference held October 20-22, 1992, in Tempe, Arizona. Pittsburgh, Pa: Materials Research Society., 1993.

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Book chapters on the topic "Electrochemical deposition"

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Rodriguez, Cesar Augusto Duarte, and Germano Tremiliosi-Filho. "Electrochemical Deposition." In Encyclopedia of Tribology, 918–22. Boston, MA: Springer US, 2013. http://dx.doi.org/10.1007/978-0-387-92897-5_700.

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Osaka, Tetsuya, and Hiroki Nara. "Silicon, Electrochemical Deposition." In Encyclopedia of Applied Electrochemistry, 1966–70. New York, NY: Springer New York, 2014. http://dx.doi.org/10.1007/978-1-4419-6996-5_33.

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Chandrasekaran, K., M. J. Hill, W. L. Hamilton, H. V. Nguyen, and R. W. Collins. "Electrochemical Deposition of Photoresists." In ACS Symposium Series, 168–88. Washington, DC: American Chemical Society, 1997. http://dx.doi.org/10.1021/bk-1997-0673.ch013.

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Montenegro, Macarena J., and Thomas Lippert. "Films for Electrochemical Applications." In Pulsed Laser Deposition of Thin Films, 563–84. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/9780470052129.ch22.

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Ogata, Yukio H., and Kazuhiro Fukami. "Porous Silicon and Electrochemical Deposition." In Handbook of Porous Silicon, 1–8. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-04508-5_65-1.

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Fukami, Kazuhiro. "Porous Silicon and Electrochemical Deposition." In Handbook of Porous Silicon, 1–10. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-04508-5_65-2.

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Ogata, Yukio H., and Kazuhiro Fukami. "Porous Silicon and Electrochemical Deposition." In Handbook of Porous Silicon, 629–37. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-05744-6_65.

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Fukami, Kazuhiro. "Porous Silicon and Electrochemical Deposition." In Handbook of Porous Silicon, 951–59. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-71381-6_65.

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Pandit, Bidhan, Emad S. Goda, and Shoyebmohamad F. Shaikh. "Electrochemical Deposition Toward Thin Films." In Simple Chemical Methods for Thin Film Deposition, 245–304. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-0961-2_6.

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Ritzdorf, T. "Electrochemical Deposition Processes and Tools." In Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications, 397–411. New York, NY: Springer New York, 2009. http://dx.doi.org/10.1007/978-0-387-95868-2_27.

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Conference papers on the topic "Electrochemical deposition"

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Xiong, Zishan, Shichen Xie, K. N. Tu, and Yingxia Liu. "Simulation Research on Wafer-Level Electrochemical Deposition Uniformity." In 2024 25th International Conference on Electronic Packaging Technology (ICEPT), 1–6. IEEE, 2024. http://dx.doi.org/10.1109/icept63120.2024.10668495.

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Watkins, John D., Hunaid Nulwala, and Stanko Brankovic. "Electrochemical Deposition of Aluminum-Based Coatings from Aqueous Systems." In Coatings+ 2020, 1–14. SSPC, 2020. https://doi.org/10.5006/s2020-00072.

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Abstract The electroplating of aluminum has represented a challenge for the coatings industry for decades. The reactivity of aluminum metal leads to a very negative reduction potential. This leads to abundant gas evolution instead of aluminum reduction in water. Current aluminum deposition technology overcomes this limitation by excluding oxygen and water from the process with rigorously dry solvent and airtight plating tanks. These adaptations yield metallic aluminum depositions with significant impurities affecting its properties. In addition, this approach requires a great capital investment and cost of process maintenance. An alternative approach to Al electrodeposition has been developed based on the the use of organic ligands to stabilize the Al3+ ion in water-based solutions. By using a ligation approach, we can create aluminum species that remain stable in water while lowering the reduction potential of the aluminum complex by 0.5V. This improvement in reduction potential gives the possibility for the deposition of aluminum without significant competition from hydrogen evolution. With this platform we can deposit highly adherent aluminum-based layers on metal surfaces. The aluminum/aluminum oxide layers appear as thin, coherent and highly adherent coatings. This aluminum/alumina layer can then be chemically treated to achieve desirable surface properties which were previously inaccessible. For example, the coating can be made hydrophobic, highly adherent to different polymer coatings or even dyed using common anodizing dyes.
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Goundar, Jowesh Avisheik, La Thi Ngoc Mai, Moris Yuki, Otake Yugi, Hideo Kosaka, and Fumihiro Inoue. "Electrochemical Deposition of Indium for Scalable 3D Quantum Chiplets." In 2024 International 3D Systems Integration Conference (3DIC), 1–4. IEEE, 2024. https://doi.org/10.1109/3dic63395.2024.10830211.

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Neville, Anne, Arnaud Pierre Morizot, Sebastien Labille, and Gordon Graham. "Optimising Inhibitor Efficiency Using Electrochemical Methods." In CORROSION 2002, 1–11. NACE International, 2002. https://doi.org/10.5006/c2002-02318.

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Abstract The potential of adsorption of scale inhibitor and indeed other cations such as magnesium and calcium, promoted by electrochemical pre-treatment, to effectively protect metallic surfaces from the adhesion and growth of calcium carbonate scale is investigated in this study. An experimental study has examined the effect of pre-treatment of rotating disk electrode (RDE) surfaces in preventing scale deposition. The beneficial effect of the divalent Mg2+ cations, present during pre-treatment has been demonstrated. Visualization of the amount of scale deposition, with and without electrochemical pre-treatment, has been conducted using scanning electron microscopy (SEM). In summary, this paper describes the beneficial effects of using an electrochemical pre-treatment to inhibit scale deposition on metal surfaces and assesses the cation/inhibitor interactions and their effect on inhibitor efficiency.
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Hsia, Chih-Hao, SungHo Park, Soichi Watanabe, Marco Arnold, Zaid El-Mekki, Martine Delande, Ehsan Shafahian, Punith K. M. K. Gowda, Herbert Struyf, and Aleksandar Radisic. "Wafer-Level Electrochemical Deposition and Processing of Nanotwinned Cu RDL." In 2024 IEEE International Interconnect Technology Conference (IITC), 1–3. IEEE, 2024. http://dx.doi.org/10.1109/iitc61274.2024.10732470.

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Huo, Yan, Jinkai Xu, Wanfei Ren, Zhaoqiang Zou, Manfei Wang, and Fan Tong. "Employing Optimized Anode to Improve Bubble Accumulation in Localized Electrochemical Deposition." In 2024 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 1–5. IEEE, 2024. https://doi.org/10.1109/3m-nano61605.2024.10769758.

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Chiang, Kuang-Tsan Kenneth, and Lietai Yang. "High-Temperature Electrochemical Sensor for Online Corrosion Monitoring." In CORROSION 2010, 1–21. NACE International, 2010. https://doi.org/10.5006/c2010-10168.

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Abstract Electrochemical sensors incorporating diamond-like carbon-coated (DLC-coated) electrodes are effective tools for online, real-time corrosion monitoring at high temperatures. A vacuum-based chemical vapor deposition process was used to deposit a DLC thin film coating on the surface of the sensing electrodes. The chemical inertness of the DLC coating on the sensing electrodes produced a crevice-free electrode that can be used at temperatures above 100 °C. In this paper, we present the coating deposition process for sensor electrodes and fabrication of coupled multielectrode array sensors (CMAS) for high-temperature, high-pressure applications. Probes were fabricated using uncoated and DLC-coated Alloy 22 (Ni-22Cr-13Mo-3Fe-3W) and Titanium Grade 7 (Ti-0.2Pd) electrodes. The Alloy 22 probes were tested in high-temperature, high-pressure conditions in a pH 10 caustic solution. The measured non-uniform corrosion rate using the Alloy 22 probe with the DLC-coated electrodes was approximately 2 μm/yr. The Titanium Grade 7 probes were tested in a dilute NaCl solution saturated with H2S-CO2 at high pressures in the temperature range of 39-81 °C and in a saturated solution containing NaCl-NaNO3-KNO3 at 150 °C. The stabilized localized corrosion rates for probes with or without the DLC coating were less than 1 μm/yr in the H2S-CO2 environment, and less than 0.03 μm/yr in the NaCl-NaNO3-KNO3 salt mixture at 150 °C. The test results indicate that Titanium Grade 7 is not subject to crevice corrosion under the testing conditions.
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Eden, D. A., and B. Breene. "On-Line Electrochemical Corrosion Monitoring in Fireside Applications." In CORROSION 2003, 1–10. NACE International, 2003. https://doi.org/10.5006/c2003-03361.

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Abstract Electrochemical corrosion monitoring has been used to evaluate fireside corrosion of coal fired boilers materials under low NOX operations. The reducing environments which are prevalent under these firing conditions can lead to the deposition/formation of non-protective iron sulfide films on the boiler tubes, resulting in excessive corrosion attack. In order to mitigate the boiler tube corrosion problems, it is common practice to weld overlay the boiler tubes with alloy C276. Corrosion of typical boiler tube material and C276 has been monitored electrochemically using a combination of Linear Polarisation Resistance (LPR), Harmonic Distortion Analysis (HDA), Electrochemical Current Noise (ECN), and Solution Resistance (Rs) measurements. The electrochemical corrosion monitoring instrumentation used in this work has been designed to operate under extreme conditions, with embedded algorithms to minimise the effects of electrical interference and provide simplified data analysis. Corrosion measurements for the field trials were updated at five minute intervals to provide a continuous record of the changes in corrosion behaviour. Electrochemical probes, using a two electrode configuration, have been designed specifically for this application where access is restricted. The probes are designed to be inserted into the webbing between the boiler tubes, where they will experience similar temperatures and heat flux as the boiler tubes. Results of both laboratory tests, and field trials in an operating boiler are presented.
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Kay, Robert W., Jack Hoyd-Gigg Ng, Chris Popov, Paul Record, and Marc P. Y. Desmulliez. "Electrochemical deposition of Galfenol." In 2012 14th International Conference on Electronic Materials and Packaging (EMAP). IEEE, 2012. http://dx.doi.org/10.1109/emap.2012.6507838.

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West, Michael. "Controlling Copper Electrochemical Deposition (ECD)." In CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY: 2003 International Conference on Characterization and Metrology for ULSI Technology. AIP, 2003. http://dx.doi.org/10.1063/1.1622519.

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Reports on the topic "Electrochemical deposition"

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Chung, B. W., E. L. Brosha, D. R. Brown, and F. H. Garzon. Vapor deposition of thin-film Y-doped ZrO{sub 2} for electrochemical device applications. Office of Scientific and Technical Information (OSTI), December 1994. http://dx.doi.org/10.2172/10103804.

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Horwood, C. Investigation of Scanning Droplet Cell Technology for Electrochemical Deposition of Custom Three-Dimensional Alloys. Office of Scientific and Technical Information (OSTI), September 2022. http://dx.doi.org/10.2172/1890789.

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Lavin, Judith, Lok-kun Tsui, Qiang Huang, Kama Ahammed, and Emily Weigel. Development of Quantum Computing Interconnect Based on Aerosol Jet Printing and Electrochemical Deposition of Rhenium. Office of Scientific and Technical Information (OSTI), September 2022. http://dx.doi.org/10.2172/1888365.

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Lovchinov, Konstantin, Georgi Marinov, Miroslav Petrov, Nikolay Tyutyundzhiev, Gergana Alexieva, and Tsvetanka Babeva. Influence of Deposition Temperature on the Structural and Optical Properties of Electrochemically Nanostructured ZnO Films. "Prof. Marin Drinov" Publishing House of Bulgarian Academy of Sciences, February 2020. http://dx.doi.org/10.7546/crabs.2020.02.06.

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