Dissertations / Theses on the topic 'Electrochemical deposition'
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Proper, Sebastian. "Development of localized electrochemical deposition." Thesis, Uppsala universitet, Tillämpad materialvetenskap, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-302540.
Full textWagner, Mary Elizabeth S. B. Massachusetts Institute of Technology. "Advanced electrochemical characterization of copper deposition." Thesis, Massachusetts Institute of Technology, 2015. http://hdl.handle.net/1721.1/110960.
Full textThis electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (pages 51-52).
The electrodeposition of copper metal in a concentrated sulfuric acid solution is reported to occur through a four-step mechanism: (I) the dehydration of Cu2+ (H2O)6, (II) the reduction of Cu2+ to cu+, (III) the dehydration cu+ (H2O)6-x, (IV) the reduction of Cu+ to copper metal. The dehydration steps have been found to be responsible for the pH-dependence of the electrodeposition reaction. It is also reported, although not well understood, that the presence of Fe2+ ions affects the reaction kinetics. In this work, the kinetics of copper electrodeposition were studied using alternating current cyclic voltammetry. The reaction was studied at a copper rotating disk electrode with varying concentrations of Cu2+ and Fe2+ . At sufficiently low pH, and a sufficiently high concentration of Fe2+ , the deposition kinetics may be slowed enough to separately observe the two electron transfer steps involved in copper reduction. It was found that Fe2+ ions affect the electrodeposition kinetic by slowing down reaction kinetics, particularly the second electron transfer reaction.
by Mary Elizabeth Wagner.
S.B.
Sawangphruk, Montree. "Electrochemical deposition and properties, of nanostructured materials." Thesis, University of Oxford, 2010. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.526445.
Full textCorni, Ilaria. "Deposition of composite coatings by electrochemical means." Thesis, Imperial College London, 2009. http://hdl.handle.net/10044/1/11983.
Full textTang, Zheng. "Polarized electrochemical vapor deposition (PEVD) and its applications." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk2/tape17/PQDD_0010/NQ34846.pdf.
Full textEskhult, Jonas. "Electrochemical Deposition of Nanostructured Metal/Metal-Oxide Coatings." Doctoral thesis, Uppsala : Acta Universitatis Upsaliensis, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-8186.
Full textSuzuki, Y. "Controlled growth of nanostructure ZnO using electrochemical deposition." Thesis, University College London (University of London), 2013. http://discovery.ucl.ac.uk/1382395/.
Full textAllwright, Emily Marieke. "Electrochemical deposition of small molecules for electronic materials." Thesis, University of Edinburgh, 2014. http://hdl.handle.net/1842/9921.
Full textSharan, Kumar Varun. "Study of Binding Copper Powders by Electrochemical Deposition." University of Cincinnati / OhioLINK, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1471346137.
Full textSunitha, Radhakrishnan Shiv Shailendar. "Study of Localized Electrochemical Deposition Using Liquid Marbles." University of Cincinnati / OhioLINK, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1479820546120994.
Full textTay, En. "Electrochemical deposition of Cu-Zn-Sn-S films." Thesis, Imperial College London, 2015. http://hdl.handle.net/10044/1/30727.
Full textYau, Chun Ho. "Silver electrochemical-deposition on silicon nanowires, characterization & application." access abstract and table of contents access full-text, 2006. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert.pl?msc-ap-b21456306a.pdf.
Full text"Master of Science in Materials Engineering & Nanotechnology dissertation." Title from title screen (viewed on Nov. 21, 2006) Includes bibliographical references.
Kulkarni, Dhananjay Vijay. "Electrochemical deposition of green rust on zero-valent iron." Thesis, Texas A&M University, 2005. http://hdl.handle.net/1969.1/3753.
Full textChoong, C. L. "Electrochemical deposition of polymeric nanostructures and their biosensing applications." Thesis, University of Cambridge, 2011. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.597639.
Full textBalsamy, Kamaraj Abishek. "Study of Localized Electrochemical Deposition for Metal Additive Manufacturing." University of Cincinnati / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1539078938687749.
Full textGe, Xiang. "Electrochemical deposition of fluoridated calcium phosphate on titanium substrates /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20GE.
Full textAttygalle, Dinesh. "Electrochemical Deposition of Transparent Conducting Oxides for Photovoltaic Applications." Connect to full text in OhioLINK ETD Center, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1229464154.
Full textMao, B. W. "In-situ X-ray diffraction studies of electrochemical interfaces." Thesis, University of Southampton, 1987. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.378678.
Full textLiu, Ran. "Synthesis, characterization and properties of nanostructured materials by template-directed method." ScholarWorks@UNO, 2004. http://louisdl.louislibraries.org/u?/NOD,141.
Full textTitle from electronic submission form. "A thesis ... in partial fulfillment of the requirements for the degree of Master of Science in the Department of Chemistry."--Thesis t.p. Vita. Includes bibliographical references.
Deng, Hua. "Electrochemical Deposition of Nanocrystalline Copper and Copper-Based Composite Films." NCSU, 2002. http://www.lib.ncsu.edu/theses/available/etd-20020103-173702.
Full textFree-standing nanocrystalline copper-based composite and particle-free copper films were produced by direct- and pulse-current plating. Nanosize 50-nm Al2O3 or 5-nm diamond particles were codeposited into a copper matrix prepared on a rotating disk electrode (RDE). The electrolytes contained CuSO4.5H2O (0.25 M), H2SO4 (0.56 M or 1.5 M), 50-nm Al2O3 (12.5 g/L or 1.0 g/L) or 5-nm diamond (0.5 g/L) particles, and gelatine (0.1 g/L, 0.05 g/L, or 0.02 g/L). The deposition was carried out at room temperature. The RDE was rotated at 1800 rpm for high-alumina particle baths (12.5 g/L) and 1000 rpm for low-alumina particle (1.0 g/L), diamond particle (0.5 g/L), and particle-free baths. The free-standing composite and copper films were characterized by x-ray diffraction (XRD), scanning electron microscopy (SEM), micro hardness tester, and transmission electron microscopy (TEM). Grain size and crystal texture were obtained by XRD measurement. SEM gave information on surface morphology and composition of films. The hardness of nanocrystalline materials was measured by micro hardness tester. TEM was used to confirm the presence of nanocrystalline copper grains. The uncompensated potential became more cathodic with increasing current density in pulse-current plating. The current efficiency was in the range of 0.93 ¨C 1.09 for both direct- and pulse-current plating. Gelatine concentration, the presence of nanosize dispersoids, and pH have no significant effect on electrode potential and current efficiency. Grain size decreased with increasing current density for particle-free copper and most of the composite films by direct- and pulse-current plating. The microhardness of nanocrystalline materials was increased by decreasing grain size for most of the particle-free copper and composite films. The existence of high-angle grain boundaries in nanocrystalline films resulted in negative Hall-Petch slopes. The presence of low concentration of alumina or diamond particles had no effect on grain size and microhardness. The pH had no obvious influence on grain size, microhardness, and alumina content in composite films. Random crystal texture is observed for Cu-Al2O3 composite and particle-free copper films and the (111) preferred texture for Cu-diamond composite films. The (100) preferred substrate orientation had no effect on deposit texture. The current density for both direct- and pulse-current plating had no significant effect on material texture. The presence of particles has no significant influence on nanocrystalline texture. Surface morphology varied for films made under different bath conditions. High gelatine concentration resulted in low-particle impregnation. Films made using 0.1 g/L gelatine resulted in spherical particles with grain size of 64 nm and porous surface. Films made using 0.02 g/L gelatine resulted in smooth surface with smaller grains of 40 nm. Films with high-alumina particle embedding, for example sample 7/9-1, resulted in porous and dark surface. High-alumina particle concentration (12.5 g/L) with 0.02 g/L gelatine in the deposition baths resulted in high-alumina content (0.11 wt% - 2.76 wt%) in composite films. The higher current density (297 mA/cm2) resulted in the lower alumina particle (0.076 wt%) embedding rate for the same bath parameter setting. The presence of both Al and O was found in copper-alumina composites and C element (diamond) was detected in copper-diamond composite films by EDS.
Rostek, Raimar [Verfasser], and Peter [Akademischer Betreuer] Woias. "Electrochemical deposition as a fabrication method for micro thermoelectric generators." Freiburg : Universität, 2016. http://d-nb.info/1122647638/34.
Full textMadden, John David Wyndham. "Fabrication of three dimensional micro-structures by localized electrochemical deposition." Thesis, McGill University, 1994. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=22661.
Full textIn SCMED, electrodeposition is localized by placing a sharp tipped electrode in a plating substrate, and applying a voltage. Structures are built by moving the electrode appropriately with respect to the substrate.
Electrochemical theory, including mass transport to regions of localized field, is discussed, and a model of deposition profile presented. SCMED is shown to be capable of producing three dimensional polycrystalline nickel structures on the micrometer scale, including a multi-coiled helical spring. Vertical deposition rates of 6 $ mu m$/s are observed, two orders of magnitude greater than those of conventional electrodeposition.
The process can potentially deposit and etch a wide rage of materials including pure metal, alloys and polymers with sub-micrometer resolution, thereby overcoming important limitations or current technology.
Worrall, Stephen. "Anodic deposition of metal-organic framework coatings for electrochemical applications." Thesis, University of Manchester, 2017. https://www.research.manchester.ac.uk/portal/en/theses/anodic-deposition-of-metalorganic-framework-coatings-for-electrochemical-applications(89a9a8b8-161d-428c-896c-4d0acbb72f4c).html.
Full textШумакова, Наталія Іванівна, Наталия Ивановна Шумакова, Nataliia Ivanivna Shumakova, and Z. M. Protsenko. "Electrochemical Deposition of Film Materials Based on Co and Ag." Thesis, Sumy State University, 2012. http://essuir.sumdu.edu.ua/handle/123456789/35008.
Full textPlana, Daniela. "An electrochemical investigation of electroless deposition : the copper-DMAB system." Thesis, University of Manchester, 2010. https://www.research.manchester.ac.uk/portal/en/theses/an-electrochemical-investigation-of-electroless-deposition-the-copperdmab-system(8478ea99-e05f-40c6-8260-2e8788f38efa).html.
Full textVenkatraman, Kailash. "Electrochemical Atomic Layer Deposition of Metals for Applications in Semiconductor Interconnect Metallization." Case Western Reserve University School of Graduate Studies / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=case1543839404490434.
Full textLin, Po-Fu. "Electrochemical Quartz Crystal Microbalance Study Of Bismuth Underpotential Deposition On Ruthenium And On Electrochemically Formed Ruthenium Oxide." Thesis, University of North Texas, 2011. https://digital.library.unt.edu/ark:/67531/metadc103354/.
Full textLindh, Mattias. "Inkjet deposition of electrolyte : Towards Fully Printed Light-emitting Electrochemical Cells." Thesis, Umeå universitet, Institutionen för fysik, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:umu:diva-80272.
Full textHyde, Michael. "Scanning probe microscopy and electrochemical studies of deposition on electrode surfaces." Thesis, University of Oxford, 2005. http://ora.ox.ac.uk/objects/uuid:f8690b52-766f-4f9a-9178-708d50755f09.
Full textFlores, Araujo Sarah Cecilia. "Electrochemical Study of Under-Potential Deposition Processes on Transition Metal Surfaces." Thesis, University of North Texas, 2006. https://digital.library.unt.edu/ark:/67531/metadc5372/.
Full textRodrigues, Patrícia Raquel dos Santos. "Development of oxidoreductase based electrochemical biosensors." Master's thesis, Faculdade de Ciências e Tecnologia, 2013. http://hdl.handle.net/10362/10427.
Full textThis thesis is divided in 2 sections, each describing the development of an oxidoreductase based biosensor. In the first part human Cytochrome P450 1A2 (CYP1A2) electrochemistry was studied, while the second is focused on the optimization of immobilization platforms and operation methods for amperometric biosensors, using cytochrome c nitrite reductase (ccNiR), (Desulfovibrio desulfuricans ATCC 27774) as a model enzyme. The direct electrochemistry of P450s immobilized in water-based sol-gel thin films was described for the first time. The optimization of the film showed that only the combination of the inorganic matrix and the PEG400 enabled the direct electron transfer reaction and electrocatalytic activity towards oxygen. The amount of dissolved oxygen in solution revealed itself a significant feature in CYP’s electrochemistry – in anaerobic conditions, when small amounts of oxygen are added the PFeIII=II signal’s intensity increased, while in aerobic conditions it disappeared; probably PFeIII is not being regenerated. However, this was not observed with the CYPOR complex, indicating that the reductase has an essential role in the CYP’s catalytic cycle completion; this was also sustained by the fact that only in its presence organic substrates catalysis (caffeine) occurs. The hybrid sol-gel developed for CYP, was optimized for a nitrite biosensor. ccNiR was successfully incorporated while promptly displaying catalytic currents. Although the bioelectrode’s response decreases after day one, it was able to maintain a reasonable catalytic activity over a time span of 2 weeks. Another electrode modification strategy, studied with ccNiR, was based on the electrophoretic deposition of macroporous assemblies of single-walled carbon nanotubes. The macroporous structure was created as a result of the presence of polystyrene beads co-deposited with the carbon nanotubes. An increase in the amount of material was correlated with a higher enzyme activity. Finally, an oxygen scavenger system consisting of glucose oxidase, glucose, and catalase was employed for oxygen removal in an open electrochemical cell. The system completely removed oxygen for over 1 h and was successfully applied to a ccNiR based nitrite sensor.
Gouldstone, Andrew. "Electrochemical vapor deposition of a graded titanium oxide-yttria stabilized zirconia layer." Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/39612.
Full textWheeldon, Ruth. "Electrochemical aspects of the deposition of refractory metal carbides from molten chlorides." Thesis, Imperial College London, 1989. http://hdl.handle.net/10044/1/47705.
Full textDaugherty, Ryan E. "Electrochemical Deposition of Nickel Nanocomposites in Acidic Solution for Increased Corrosion Resistance." Thesis, University of North Texas, 2017. https://digital.library.unt.edu/ark:/67531/metadc1011756/.
Full textWang, Chen. "The Revival of Electrochemistry: Electrochemical Deposition of Metals in Semiconductor Related Research." Thesis, University of North Texas, 2005. https://digital.library.unt.edu/ark:/67531/metadc5574/.
Full textYA, HUNG CHUEN, and 洪雀雅. "Electrochemical Deposition of BaTiO3 Films." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/68392818941404624766.
Full text國立中興大學
材料工程學研究所
88
Abstract The aim of this research is to fabricate BaTiO3 films by the electrochemical method in the electrolytes, 0.35M/0.5 M Ba(CH3COO)2 and 2M NaOH. The pH value was greater than 13.5 and the deposition temperature was controlled at 55°C. We firstly applied the scanning current mode varying from 0 to 100 mA to deposite BaTiO3 films in the electrolyte of 0.35M Ba(CH3COO)2 and 2M NaOH to find the suitable deposition conditions. Secondly, we. used a fixed electric content, 432 C to prepare the films. XRD results show that the crystal structures of the films are TiO2 (rutile phase) at 10 mA and BaTiO3 (cubic phase) at 20, 30 and 40 mA. We varied the deposited time from 0.5 to 4 hr at constant current of 30 mA in the electrolyte of 0.5 M Ba(CH3COO)2 and 2M NaOH. TiO2 (rutile phase) existed at 0.5 hr and BaTiO3 (cubic phase) appeared above 1 hr. We believed that TiO2 appeared before the formation of BaTiO3. The optimized condition for depositing BaTiO3 films follows: anodic current at 30 mA and deposited time at 4 hr, where, the thickness of BaTiO3 films reached about 20 mm. The growth of BaTiO3 films possessing small grain size which was formed at low voltage range could be due to the dissolution-recrystallization mechanism. The large grained BaTiO3 films formed at high current (voltage) could attribute to size anodic spark deposition.
Shue, Shiun-Feng, and 許薰丰. "Deposition of Hydroxyapatite by Electrochemical Process." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/28145044908725572091.
Full text國立成功大學
材料科學(工程)學系
86
Hydroxyapatite was deposited on titanium substrate by electrochemical process with pulse power supply. The electrolyte used for electrochemical deposition was prepared by mixing 1L 0.042M Ca(NO3)2and 1L 0.025M NH4H2PO4 solutions. The cathode and anode were titanium substrate and platinum respectively. Various ratios of the time of voltage ON / the time of voltage OFF and various periodic times for pulse power supply were used to cause the ions of the electrolyte well distribution and obtain a hydroxyapatite coatings without introducing other impurities. Then the growth of coatings and the change of coatings after soaking in simulated body fluid were studied. The results show that, when the temperature of electrolyte and the time of deposition are fixed at 40℃and 24 hours respectively, a hydroxyapatite coatings can be obtained without introducing other impurities by the input voltage consisting of 2-s voltage on / 18-s voltage off cycles with an amplitude of 20V. So the growth of coatings by this type of pulse power supply was investigated. The precipitate on the titanium substrate is an amorphous phase at the initial stage of deposition. The crystallization of hydroxyapatite becomes well with the time of deposition. The hydroxyapatite structure contains CO32- and HPO42- groups. The grain size smaller than 1*m of the coatings and the thickness of 30μm can be obtained for 30 minutes deposition. The hydroxyapatite coatings can induce the Ca2+ and PO43- ions to precipitate from the simulated body fluid. The precipitate is an amorphous phase at the initial stage then transforms to hydroxyapatite structure. The ratios of Ca/P obtained is between 1.37 to 1.441.
Xu, Xun-Feng, and 許薰丰. "Deposition of Hydroxyapatite by Electrochemical Process." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/85909404449242106483.
Full textLin, Po-Yuan, and 林博淵. "Nanocrystalline cuprous oxide by Electrochemical Deposition." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/22161110700425733801.
Full text建國科技大學
電子工程系暨研究所
100
Nanocrystalline cuprous oxide (Cu2O) thin films were deposited on conducting tin oxide coated glass plates by electrochemical deposition method at different electrode potential, solution pH, solution concentration, deposition time and temperature. These as deposited films were characterized by X-ray diffraction (XRD), Scanning electron microscope (SEM), Atomic force microscope (AFM), UV-Visible spectrophotometer (UV-Vis), Four-point electrical measurements and Ellipsometer techniques to reveal their structural, morphological and optical properties. The quality of these films was compared and their deposition parameters were optimized. X-ray diffraction results showed that the structural is a mixed structure amorphous/polycrystalline and the preferred orientations along (200) and (111). Moreover, the average grain sizes of the polycrystalline films estimated using Scherrer formula ranged from 20-80 nm. The surface of the Cu2O film becomes rougher as the deposition temperature, solution pH and deposition time increases. The resistivity is minimized to 24.1 Ω-cm when the Cu2O film is grown at room temperature, -0.9 V versus SCE, 9±0.1 pH and the average transmittance in the visible light region is ∼65%. The optical band gap decreases as the deposition temperature increases.
Huang, Yu-An, and 黃佑安. "Anodically electrochemical deposition of nanostructured nickel oxide electrodes for electrochemical capacitors." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/85015557427157811101.
Full text國立高雄應用科技大學
化學工程系碩士班
96
The goal of this research is to deposit nanoporous nickel oxide film by anodically electrochemical deposition route .Their electrochemical performances after annealing at different temperatures are investigated. In addition, the influence of deposition parameters, current and potential,on the specific capacitance of deposited nickel oxide films. Crystal structure of the film deposited at constant current and potential is mainly composed of nickel hydroxide. However, it changes to nickel oxide after annealing at higher temperatures. After XRD analysis, it suggests that there is an apparent change at the annealing temperature of 300℃ that nickel hydroxide changes to nickel oxide . The SEM image shows that the surface morphology of nickel oxide film is highly porous and composed of interconnected nanoflakes. When smaller current or potential is applied, the pore of film is larger. On the other hand, while larger current or potential is applied, the pore of film is smaller. The pore size can be controlled without by deposition parameter such as current and potential mesoporous templates or carbon nanotubes. The capacitor behavior measured by CV and AC impedance shows that an optimum the capacitance behavior of the electrode is obtained after annealing at 300℃. The specific capacitance of the deposited film is about 260 Fg-1, which is much higher than that of deposited by electrochemically cathodic deposition (59Fg-1) reported in literature.
Ho, Chia-Ling, and 何佳玲. "Electrochemical behavior of macroporous manganese oxide electrodes prepared by electrochemical deposition." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/40964400279850333906.
Full text國立高雄應用科技大學
化學工程與材料工程系
98
In this study, the monodispersed polystyrene (PS) spheres are used as the template in anodic electrodeposition to form macroporous manganese oxide electrode. The effects of electrode’s structure on the electrochemical behavior are investigated. Field-emission Scanning electron microscope (FE-SEM) and glancing angle X-ray diffraction (GA-XRD) were used to identify the film surface morphology and crystal structure. The electrochemical performances of the films are characterized by means of cyclic voltammetry, galvanostatic charge/discharge and cycle-life test in 1 M Na2SO4 electrolyte. The SEM image shows that the morphology of manganese oxide film is composed of nanowires. The macroporous, hollow and conductive porous MnO2 electrodes can be obtained by tuning the fabricating process. GA-XRD analysis shows that the crystal structure of the film annealed at 300oC is MnO2 . Porous film structure can enhance significantly the specific surface area and the utilization of MnO2 due to the facilitation of electrolyte penetration and migration through film. Hence, the porous structure has positive effects on the capacitive behavior of film. In addition, depositing the conductive NiO film onto the PS sphere by electrophoretic deposition (EPD) can enhance the capacitive behavior of MnO2 film possibly due to an increased electrical conductivity of film. The electrochemical results show that the specific capacitance of the macroporous, hollow and conductive MnO2 electrodes are approximately 288 Fg-1, 504 Fg-1 and 472 Fg-1, respectively, which are much higher than that of a bare MnO2 film deposited by anodic deposition (257 Fg-1).
Wang, Min-Jyle, and 王明詰. "Porous nickel oxide electrodes prepared by electrochemical deposition and their electrochemical behavior." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/18416470257053007312.
Full text國立高雄應用科技大學
化學工程與材料工程系
97
In this study, nickel oxide (NiO) is deposited onto the stainless steel (SS) substrate by anodic electrodeposition with addition of surfactant. The changes in electrode morphology by adding surfactants are investigated. In addition, the influences of deposition parameters, such as current density and potential, on the specific capacitance of deposited NiO films are also studied. In order to discuss the effects of macroporous NiO structure on the electrochemical performance of electrode, polystyrene spheres with 200 nm in diameter (PS) are deposited on SS substrate as a template by electrophoretic deposition (EPD). Nickel oxide film was deposited on the PS-coated SS substrate. After removal of PS in toluene, the surface of the electrode becomes macroporous structure. Surface morphology of the deposited NiO electrode with addition of surfactant is platelet-like shape observed by SEM. And the morphology of the deposited NiO electrode with PS template is highly macroporous. Besides, when smaller current or potential is applied, the pores of electrodes are larger. While larger current or potential is applied, the pores of electrodes are smaller. After GA-XRD analysis, there is no change in crystal structure by adding the surfactant during deposition. The synthesized nickel hydroxide (Ni(OH)2) is converted into cubic NiO after annealing at 300 ℃ for 1 h. The electrochemical result shows that an optimal addition amount of 1 mM surfactant (CTAB) is obtained in terms of the electrode’s capacitive behavior. Main advantages of adding CTAB in anodic deposition include excellent reversibility, high stability, and long cycle-life. The specific capacitance of the deposited electrodes with surfactant (CTAB) is about 1160 Fg-1, which is much higher than that of deposited by anodic deposition (260Fg-1) reported in literature. Moreover, the macroporous structure of deposited NiO electrode can provide much more surface area for facilitating the electrochemical reaction. Therefore, the specific capacitance of this tailored nickel oxide electrode reaches to 377 Fg-1, which is much better than that reported in literature.
Lee, Rung-Hau, and 李榮浩. "Nanostructured iron oxide electrodes prepared by electrochemical deposition and their electrochemical properties." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/35996920208085787086.
Full text國立高雄應用科技大學
化學工程系碩士班
96
This research uses electrochemical deposition route to deposit nanostructured iron oxide films for high-performance electrode materials. By tuning the deposition parameters, it is possible to deposit iron oxide film with different surface morphologies. Surface morphology of the nanostructured iron oxide films is investigated by SEM. It is found that the iron oxide film deposited at low-current density (lower than 0.025 mA cm-2) is rod-like morphology of 28~38 nm in diameter; at high-current density (higher than 0.125 mA cm-2) is sheet-like morphology of 20~30 nm in thickness. As-deposited iron oxide film shows aggregation of nanorods. The sheet-like morphology is observed by annealing the film at higher temperatures (100 ℃~500 ℃). When the annealing temperature exceeds over 500 ℃, the sheet-shaped structure transforms into the grain structure. The crystal structure of the deposited iron oxide films is identified by GA-XRD pattern. As-deposited iron oxide film is α-FeO(OH). After annealing at 100 ℃ and 200 ℃, the diffraction peak of γ-FeO(OH) can be observed. The iron hydroxide converts into Fe2O3 structure when the annealing temperature is elevated to 300 ℃. The films deposited at different current densities (0.025~0.25 mA cm-2) and then annealed at various temperatures (100~500 ℃) are investigated in their electrochemical behavior. The aqueous and organic electrolytes are used in the electrochemical investigation, respectively. In aqueous system (1 M Li2SO4), an optimum electrochemical property is obtained by depositing the film at 0.125 mA cm-2 and annealing at 300 ℃; its specific capacitance reaches 145.1 F g-1 at a scan rate of 5 mVs-1. On the other hand, when the organic electrolyte (1 M LiClO4) is used in CV scan, there are two distinct reduction and oxidation peaks at 0.85 V vs. Li/Li+. In cycle-life stability test, an optimum electrochemical performance is obtained by depositing the film at 0.125 mA cm-2 and annealing at 500 ℃. Charging and discharging currents are set at 1000 mA g−1. After 10 cycles, the discharging capacity reaches 1000 mAh g-1.
Lin, Yi-Chih, and 林義智. "The study of electrochemical capacity properties of Co3O4 thin film by electrochemical deposition." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/29215742079087334491.
Full text大同大學
材料工程學系(所)
98
Abstract The research and development of capacitor’s electrode materials has got a lot of attention recently. This study’s purpose was to prepare cobalt oxides which were applied on capacitor by electroplate and post oxidation methods, and to compare the pseudo-capacitive characteristics. The pseudo-capacitive characteristics analysis including specific capacitance and pseudo-capacitive stability evaluation, were analyzed by circles voltammetry test which was proceeded in 0.02M KOH solution at room temperature with voltage scan range of 0–1V. And the material characteristics of cobalt oxide films test with different cycle number were analyzed torealize the affect factors on the pseudo-capacitive stability. The specific capacitance and specific capacitive stability and pseudo-capacitive stability of cobalt oxide films with added Ag+ were higher then not added Ag+. The specific capacitance value were 968 F/cm3 and 313 F/cm3 respectively, it shows the capacitance value of cobalt oxide films with added Ag+ were better than not added Ag+
Permanasari, Rina. "Electrochemical deposition of thin film CuGaSe��� for photovoltaics." Thesis, 2004. http://hdl.handle.net/1957/33321.
Full textGraduation date: 2004
Li, Tsung-Cheng, and 李宗澂. "Investigation of Bath Degradation during Copper Electrochemical Deposition." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/53036196701944719421.
Full text國立交通大學
材料科學與工程系
91
The degradation effects on (PEG, SPS)-containing baths are investigated in this study. The baths are analyzed by three methods: in-situ measured v-t curves of galvanostatic plating, AC-impedance scan, and i-E curve scan. The gap-filling capability for the baths was examined by cross-sectional SEM images. By modifying the mechanisms that were presented in previous literatures, some possible models for the degradation are proposed. In the PEG-containing bath, an evident deterioration of the gap-filling yield and of the surface roughness of the deposited film are observed after ECD aging. Two mechanisms are proposed to explain this degradation: 1) crack of long-chain PEGs, and 2) complexing between PEGs and Cu ions. When some long-chain PEGs crack into shot-chain ones, the remained long-chain PEGs still dominate the value of cell voltage, while slight fluctuation in voltages is attributed to the formation of complexes that results from the continuously cleaved short-chain PEGs. In the (PEG, SPS)-containing bath, a modified mechanism of the behaviors of PEG and SPS are proposed and called “Slow adsorption / desorption mechanism.” As the electroplating proceeds, the variation among v-t curves is divided into two trends: the cell voltages are increasing following by decreasing as more samples plated. Besides, the yield of gap-filling is slightly affected by the variation of the bath, and the superfilling could be maintained even after aging of bath. Three possible mechanisms for the trend of degradation are proposed and will be further discussed in this thesis.
馮憲平. "Electrochemical deposition Process for ULSI copper interconnect fabrication." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/21701027568809907608.
Full textHsu, Ming-Yuan, and 許名沅. "Electrochemical Atomic Layer Deposition of Cu-Ru Film." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/9av6wk.
Full text國立虎尾科技大學
材料科學與綠色能源工程研究所
102
Preparation of the atomic layer films by an electrochemical atomic layer deposition (ECALD) can solve step coverage issues. This technique can also be used to prepare copper alloy films for semiconductor process. This study presents copper (Cu) films doped with ruthenium (Ru), and hopes the film have a better stability because Ru has good thermal stability and low resistivity. However, preparation of Cu-Ru films by ECALD is rarely studied. This experiment is to analyze and discuss the Cu-Ru alloy films prepared by ECALD. Cu-Ru films were deposited on Au/Ti/glass substrates by ECALD. The process using surface limited redox replacement (SLRR) and underpotential deposition (UPD) to prepare the films. Pb UPD was formed at -0.54 V versus Ag/AgCl, and in Cu solution at open circuit for 1 minute performing redox replacement of Pb UPD by Cu. After that, Ru was deposited in solution at -0.6 V versus Ag/AgCl for 1 minute. The films were deposited by repeating the above processes. After deposition, the samples were annealed at 400℃ in Ar + H2 (95%+5%) atmosphere for 5 minutes. The sheet resistance of the film was measured by four-point probes, film thickness was measured by Alpha-step, crystal structure was analyzed by XRD, surface morphology and cross-sectional images were observed by FE-SEM, atomic concentration was measured by EDS, and atomic binding energy and quantitative analysis were measured by XPS. The results showed that optimal parameters can be obtained at UPD of Cu sol. : -0.1 V, Pb sol.: -0.54 V, and Ru sol. : -0.6 V from the pH 3.5 solution. Cu deposition gradually decreased when increasing Ru deposition because deposition rate of the Pb was slowed down on the Ru film. Au-Cu alloy was formed after annealing at 400℃ for 5 minutes, which resulted in an increase in resistance and densification of the film.
Singh, Duleshwar. "Electrophoretic Deposition of Graphene on Copper and its Corrosion Behaviour." Thesis, 2016. http://ethesis.nitrkl.ac.in/8226/1/2016-MT-214MM2362-Electrophoretic_Deposition.pdf.
Full textTsui, Manus Pui-Hung. "Calcium phosphate coatings on coronary stents by electrochemical deposition." Thesis, 2006. http://hdl.handle.net/2429/18251.
Full textApplied Science, Faculty of
Materials Engineering, Department of
Graduate