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Journal articles on the topic 'Electroless copper plating'

Author: Grafiati

Published: 4 June 2021

Last updated: 9 February 2022

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1

SAKATA, Takahiro, and Hideo HONMA. "Electroless copper plating by applying electrolysis." Journal of the Surface Finishing Society of Japan 40, no. 3 (1989): 488–89. http://dx.doi.org/10.4139/sfj.40.488.

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2

KAMIYAMA, Hiroharu. "Electroless copper plating." Circuit Technology 4, no. 6 (1989): 318–26. http://dx.doi.org/10.5104/jiep1986.4.318.

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3

Zhang, Jian, Xin Guo Wang, Long Zhi Zhao, and Ming Juan Zhao. "Electroless Plating Copper on SiC Particles." Advanced Materials Research 881-883 (January 2014): 1053–57. http://dx.doi.org/10.4028/www.scientific.net/amr.881-883.1053.

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Abstract. SiCp/Cu composites because of their excellent performance in the aerospace, carrying tools in the field with a wide range of applications, but the poor interfacial bonding limits its application. To improve the interfacial bonding between SiCp and copper, we use Copper Plating on SiCp particles coated handle. The results show that the optimal process parameters for electroless plating copper on SiC particle is followed as:CuSO4•5H2O concentration of 30g/L, EDTA•2Na concentration of 1g/L, potassium ferrocyanide concentration of 2g/L, potassium sodium tartrate concentration 105g/L, plating temperature is 50°C, plating time was 40 minutes.With the increase of the pH from 10 to 13, the uniform dense electroless plating copper exists on SiC particle. With increase of temperature of electroless plating bath, the smooth copper coating on SiC particle can be obtained at 50°C.

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4

MORIKAWA, Takao. "Resists for electroless copper plating." Circuit Technology 4, no. 4 (1989): 211–17. http://dx.doi.org/10.5104/jiep1986.4.211.

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5

FUJINAMI, Tomoyuki. "Electroless Plating. Various Functional Applications of Formalin-Free Electroless Copper Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 387–92. http://dx.doi.org/10.4139/sfj.48.387.

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6

Hu, Ming, Yun Long Zhang, Jing Gao, Lin Shan, and Li Li Tang. "The Effect of Electroless Plating Time on the Coating Performance of SiC Powders." Advanced Materials Research 971-973 (June 2014): 204–7. http://dx.doi.org/10.4028/www.scientific.net/amr.971-973.204.

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In order to improve the interface bonding condition between Cu and SiC powders, electroless copper plating was applied to deposit a Cu coating on SiC powder. The surface morphology of the SiC powder with uncoated and coated copper were investigated. The results showed that the appropriate electroless plating time was necessary for the SiCp with uniform copper-coating. The SiCp/Cu composites were fabricated by hot-press sintering technology. The coated-copper SiCp were uniformly distributed in copper matrix. Key words: Electroless plating, Cu/SiCp composites, Metal coating

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7

Yan, Binggong, Xiaodi Huang, Xuan Song, Lei Kang, Qihe Le, and Kaiyong Jiang. "Laser induced selective electroless copper plating on polyurethane using EDTA-Cu as active material." Journal of Electrochemical Science and Engineering 8, no. 4 (2018): 331–39. http://dx.doi.org/10.5599/jese.564.

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Using EDTA-Cu as the active material and polyurethane as the matrix, flexible cathodes were fabricated by laser-induced electroless copper plating process (LPKF-LDS) and characterized by SEM, X-ray energy spectrum and Auger electron spectroscopy. Flexible cathodes prepared from EDTA-Cu and polyurethane showed good selectivity in copper plating process. Composition and particle morphology of EDTA-Cu, laser power, scanning speed, laser wavelength, laser spot size, pulse frequency etc. are the main factors that affect the fineness of electroless copper plating. By adjusting these parameters, the fineness of the copper plating was improved. X-ray energy spectrum and Auger electron spectroscopy results showed that after the laser scanning, both Cu^0 and Cu^(+1) appeared in the scanning area, revealing thus the mechanism of electroless copper plating for polyurethane-EDTA-Cu flexible cathodes.

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8

Wang, Ying, Jun Tao Zou, and Qing He Zhang. "Preparation of Tungsten-Copper Composite Powder by Electroless Plating." Materials Science Forum 749 (March 2013): 28–34. http://dx.doi.org/10.4028/www.scientific.net/msf.749.28.

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In this paper, tungsten-copper composite powder was prepared on the particle size of 6 ~ 10μm tungsten powder surface by electroless copper plating. The orthogonal experimental results show that the primary and secondary order of factors affecting the deposition rate followwing the sequence: copper sulfate solution concentration > pH value> solution temperature> formaldehyde concentration > complexing agent concentration. The process of the electroless copper plating on the tungsten powder surface was investigated, and the best electroless copper plating solution composition and operation conditions were obtained as follows: plating temperature 323 K, stirring speed 30 r/min, PH =13, loadage 8g/L, CuSO4 5H2O 0.032 mol/L, HCHO 0.274 mol/L, TEA 0.1208 mol/L, 2, 2 'league pyridine 12 mg/L.

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9

Lee, Jae Ho. "Direct Electroless Copper Plating on Polyimide for FPCB Applications." Materials Science Forum 544-545 (May 2007): 709–12. http://dx.doi.org/10.4028/www.scientific.net/msf.544-545.709.

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As electronic devices are getting smaller and lighter, the density of copper lines on flexible printed circuit board (FPCB) is getting higher. Conventionally, subtractive method was used for copper line on a flexible films, however, as the line pitch is getting smaller, the lateral etching of copper cause serious problem. To replace the subtractive method, semi-additive method was used for fine pitch copper line fabrication. In semi additive process, sputtered layer for the electroplating copper was required. The feasibility of electroless plating to replace high cost sputtered copper seed layer was investigated. Electroless depositions of copper were conducted on different substrate to find optimum conditions of electroless copper plating. To find optimum conditions, the effects and selectivity of activation method on several substrates were also investigated. The adhesion strength between polyimide and copper was improved by treating the polyimide surface with butylamines. Pretreatment prior to electroless plating is very sensitive and surface dependent. Surface morphologies were investigated with FESEM.

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10

Tang, Zuo Qin, Su Rong Hu, and Yin Chun Chao. "Electroless Nickel Plating on Copper Foil." Advanced Materials Research 926-930 (May 2014): 103–7. http://dx.doi.org/10.4028/www.scientific.net/amr.926-930.103.

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A pre-cleaning and an electroless nickel plating (EN-HP) were applied to copper foil to improve its tribological behaviour and corrosion resistance. The coating porosity was measured by the corrodkote, tribological behaviour was measured with microhardness tester and a CSM ball-on-disk tribometer, corrosion resistance was measured by potentiodynamic polarization in 3.5 wt.% NaCl solution. Matte nickel plating (mNi) and moderate compact Ni–P coating (EN-MP) were made as comparisons to EN-HP in those tests. By deposition of EN-HP, both coating porosity and tribological behaviour are greatly improved compared to mNi, and the corrosion resistance is distinctly ameliorated to the comparisons. Above research demonstrates that the copper foil with EN-HP coating is good underlay in assemblage of machine.

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11

TOYONAGA, Minoru. "New standard of electroless copper plating." Journal of the Surface Finishing Society of Japan 42, no. 5 (1991): 531–33. http://dx.doi.org/10.4139/sfj.42.531.

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12

WATANABE, Mitsuhiro, Hiroyuki SEIDA, and Hideo HONMA. "Direct Electroless Copper Plating on Glass." Journal of The Surface Finishing Society of Japan 58, no. 10 (2007): 612–14. http://dx.doi.org/10.4139/sfj.58.612.

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13

NAKAYAMA, Tomoharu, and Hisamitsu YAMAMOTO. "Recent Trends of Electroless Copper Plating." Journal of the Surface Finishing Society of Japan 66, no. 11 (2015): 496–98. http://dx.doi.org/10.4139/sfj.66.496.

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14

HONMA, Hideo. "Recent Trend of Electroless Copper Plating." Circuit Technology 7, no. 2 (1992): 112–21. http://dx.doi.org/10.5104/jiep1986.7.112.

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15

FUJINAMI, Tomoyuki, Ken HAGIWARA, and Hideo HONMA. "Electroless Copper Plating on PZT Ceramics." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, no. 7 (1995): 462–66. http://dx.doi.org/10.5104/jiep1995.10.462.

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16

Golovtshanskaya, R. G., S. S. Kruglikov, N. A. Morozova, and N. G. Rekus. "Metal microdistribution in electroless copper plating." Surface and Coatings Technology 29, no. 1 (1986): 73–76. http://dx.doi.org/10.1016/0257-8972(86)90068-x.

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17

Al-Maqdasi, Zainab, Abdelghani Hajlane, Abdelghani Renbi, Ayoub Ouarga, Shailesh Singh Chouhan, and Roberts Joffe. "Conductive Regenerated Cellulose Fibers by Electroless Plating." Fibers 7, no. 5 (2019): 38. http://dx.doi.org/10.3390/fib7050038.

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Continuous metalized regenerated cellulose fibers for advanced applications (e.g., multi-functional composites) are produced by electroless copper plating. Copper is successfully deposited on the surface of cellulose fibers using commercial cyanide-free electroless copper plating packages commonly available for the manufacturing of printed wiring boards. The deposited copper was found to enhance the thermal stability, electrical conductivity and resistance to moisture uptake of the fibers. On the other hand, the chemistry involved in plating altered the molecular structure of the fibers, as was indicated by the degradation of their mechanical performance (tensile strength and modulus).

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18

Koyano, H., M. Kato, and H. Takenouchi. "Electroless Copper Plating from Copper‐Glycerin Complex Solution." Journal of The Electrochemical Society 139, no. 11 (1992): 3112–16. http://dx.doi.org/10.1149/1.2069041.

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19

Dixit, Nitesh Kumar, Rajeev Srivastava, and Rakesh Narain. "Improving surface roughness of the 3D printed part using electroless plating." Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 233, no. 5 (2017): 942–54. http://dx.doi.org/10.1177/1464420717719920.

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The effect of electroless metallic coating on 3D printed acrylonitrile–butadiene–styrene plastic parts surface has been studied. Owing to its excellent toughness, good-dimensional reliability, good-process capability, chemical resistance and cost-effectiveness, acrylonitrile–butadiene–styrene is used for fabrication of parts using a 3D open source printer. These parts are further metallic coated using electroless copper deposition technique. Two different surface preparation processes, namely aluminium paint paste and aluminium epoxy paste have been used for electroless coating. After the surface conditioning of parts using these methods, copper is deposited electrolessly using acidic solution, containing 12.5 wt% copper sulphate with 7.5 wt% of sulphuric acid. Deposition of copper, for two different methods, has been carried out using different temperature conditions and different time of deposition. In the first case, the temperature of the solution is initially kept at 45±2 ℃ and is allowed to come to the room temperature as the deposition is completed. In the second case, the temperature of the solution is maintained at room temperature throughout the process. Further, copper-deposited 3D printed parts were characterized based on their surface roughness measurement, electrical conductivity measurement, scanning electron microscopy, energy dispersive spectroscopy and adhesion evaluation test. It has been found that both the methods used for coating show better electrical performance and more uniform copper deposition. Adhesion between copper layers and 3D printed acrylonitrile–butadiene–styrene substrates is found to have good strength for Al-Epoxy-coated parts.

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20

JI, EUN SUN, YOUNG HWAN KIM, YONG CHEOL KANG, YOUNG SOO KANG, and BYUNG HYUN AHN. "PLATING OF COPPER LAYERS ON POLYIMIDES USING ELECTROLESS PLATING BY SURFACE MODIFICATION." Surface Review and Letters 14, no. 04 (2007): 593–96. http://dx.doi.org/10.1142/s0218625x07009724.

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This work describes electroless deposition of copper layers onto a polyimide (PI) film. The film was modified by etching with 1.0 M KOH solution treatment, and an activated Ag thin film was developed on this surface using 0.1 M AgNO 3. The Cu layers were coated on the activated surface of polyimide films by electroless plating method. The thickness and surface morphology of Cu layers on the PI films were characterized with atomic force microscopy. The surface properties of PI film were identified with contact angle measurements.

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21

Guo, Rong Hui, Wan Qi Yan, and Jian Wu Lan. "Electroless Copper Plating on Polyester Fabric Modified with Silane through Supercritical Carbon Dioxide Process." Materials Science Forum 815 (March 2015): 634–37. http://dx.doi.org/10.4028/www.scientific.net/msf.815.634.

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Polyester fabric was pretreated with 3-aminopropyltrimethoxysilane (APTMS) through supercritical carbon dioxide (scCO2) process before electroless copper plating. APTMS pretreated polyester fibers were characterized by contact angle. Deposit weight, surface morphology and electromagnetic interference (EMI) shielding effectiveness (SE) of electroless copper plated polyester fabrics were investigated. The results show that polyester fibers are covered with APTMS after APTMS modification in scCO2 medium. Copper coatings on the polyester fibers are uniform after copper plating. Electromagnetic interference shielding effectiveness of the copper plated polyester fabric arrives at 60-80dB at frequencies ranging from 2 to 18 GHz.

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22

Zhu, Xiao Yun, Jin Ming Long, and Xian Wan Yang. "Adhesion Property of Copper Paste on Ceramic Radiator Fins." Advanced Materials Research 41-42 (April 2008): 215–20. http://dx.doi.org/10.4028/www.scientific.net/amr.41-42.215.

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Ceramic radiator fins were produced by screen-printing copper paste on ceramic substrate, which could replace the traditional technique of direct bestrow copper and meet the requirements of surface mounted technology. This method could be used to manufacture high density, superior thin and micro-sized molectrons. The key processes were screen-printing copper paste, sintering and electroless plating of nickel. The adhesion of copper film onto the ceramic substrate was often reduced after the process of electroless plating of nickel, resulting in the low quality of manufacturing. In this study, we analyzed the ceramic radiator fins which were obtained by the screen-printing copper paste method and using scanning electron microscopy to examine the surface and the cross-sections of copper film and Cu/Ni film. The adhesive properties of copper film during electroless plating was studied. The corrosion resistance of copper film and sintering glass phase on alumina substrate (96%) was also studied in an electroplating bath. The study revealed that the glass phase of acidity of silicon, softening temperature, the interaction conjunction between glass phase and ceramics were important factors.

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23

MIZUMOTO, Shozo, Hidemi NAWAFUNE, and Kuniyoshi MATSUMOTO. "Chemical equilibria in electroless copper plating bath." Journal of the Surface Finishing Society of Japan 41, no. 9 (1990): 907–11. http://dx.doi.org/10.4139/sfj.41.907.

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24

HAGIWARA, Hideki, Yasunao KINOSHITA, Katsuhiko TASHIRO, and Hideo HONMA. "Morphology Control of Electroless Copper Plating Deposit." Journal of Japan Institute of Electronics Packaging 8, no. 6 (2005): 508–16. http://dx.doi.org/10.5104/jiep.8.508.

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25

FUJINAMI, Tomoyuki, and Hideo HONMA. "Pretreatment for Void-Free Electroless Copper Plating." Journal of the Surface Finishing Society of Japan 43, no. 6 (1992): 595–600. http://dx.doi.org/10.4139/sfj.43.595.

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26

KIKUKAWA, Yusuke, Toshio HONDA, and Rick NICOLES. "Electroless Pd/Au Plating Directly on Copper." Journal of the Surface Finishing Society of Japan 66, no. 11 (2015): 511–13. http://dx.doi.org/10.4139/sfj.66.511.

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27

HONMA, Hideo, Yasunori KOUCHI, and Shinichiro YASUDA. "Direct electroless copper plating on alumina ceramics." Circuit Technology 4, no. 2 (1989): 41–47. http://dx.doi.org/10.5104/jiep1986.4.41.

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28

Xie, Guangwen, Xiaoli Li, and Haixia Jiao. "Template‐Synthesized Copper Nanotubes via Electroless Plating." Journal of Dispersion Science and Technology 29, no. 1 (2008): 120–23. http://dx.doi.org/10.1080/01932690701688664.

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29

TIAN, Qing-hua, and Xue-yi GUO. "Electroless copper plating on microcellular polyurethane foam." Transactions of Nonferrous Metals Society of China 20 (May 2010): s283—s287. http://dx.doi.org/10.1016/s1003-6326(10)60057-x.

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30

Guo, R. H., S. X. Jiang, C. W. M. Yuen, and M. C. F. Ng. "Textile design application via electroless copper plating." Journal of the Textile Institute 103, no. 12 (2012): 1267–72. http://dx.doi.org/10.1080/00405000.2012.675683.

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31

Sharma, Ashutosh, Chu-Seon Cheon, and Jae Pil Jung. "Recent Progress in Electroless Plating of Copper." Journal of the Microelectronics and Packaging Society 23, no. 4 (2016): 1–6. http://dx.doi.org/10.6117/kmeps.2016.23.4.001.

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32

Hung, Aina, and Ker‐Ming Chen. "Mechanism of Hypophosphite‐Reduced Electroless Copper Plating." Journal of The Electrochemical Society 136, no. 1 (1989): 72–75. http://dx.doi.org/10.1149/1.2096617.

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33

Zenkiewicz, Marian, Krzysztof Moraczewski, Piotr Rytlewski, Magdalena Stepczynska, and Bartlomiej Jagodzinski. "Autocatalytic electroless copper plating of polymeric materials." Polimery 62, no. 05 (2017): 371–79. http://dx.doi.org/10.14314/polimery.2017.371.

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34

Li, Jun, and Paul A. Kohl. "The Acceleration of Nonformaldehyde Electroless Copper Plating." Journal of The Electrochemical Society 149, no. 12 (2002): C631. http://dx.doi.org/10.1149/1.1517582.

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35

Ogura, Tetsuya, Mark Malcomson, and Quintus Fernando. "Mechanism of copper deposition in electroless plating." Langmuir 6, no. 11 (1990): 1709–10. http://dx.doi.org/10.1021/la00101a016.

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36

Kim, Dae Geun, Jin Soo Bae, Jae Ho Lee, Yang Do Kim, and Yoo Min Ahn. "Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application." Materials Science Forum 449-452 (March 2004): 393–96. http://dx.doi.org/10.4028/www.scientific.net/msf.449-452.393.

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Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations.

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37

Steinhäuser, Edith, and T. A. Magaya. "Cost-Effective Alternatives to Palladium Activation – A Study on Autocatalytic Electroless Copper Deposition." International Symposium on Microelectronics 2010, no. 1 (2010): 000861–66. http://dx.doi.org/10.4071/isom-2010-tha3-paper6.

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Electroless copper plating is the most important and critical step for through-hole metallization of printed circuit boards. Conventional electroless copper solutions contain formaldehyde as the standard reducing agent. Due to the toxic nature of formaldehyde, there is a need to change to a reducing agent that is more environmentally friendly and safer to use. Many reducing compounds have been proposed to replace formaldehyde. For example, glyoxylic acid has been described in the literature as an especially attractive alternative because of its relative safety. In preparation for electroless copper plating, substrates are typically catalyzed by the adsorption of palladium. However, a change in the reducing agent can also lead to a change in the activation process, primarily because there is no single metal that appears to be a good catalyst for the oxidation of all reducing agents that have been employed for electroless deposition. In the present study, electrochemical measurements were carried out in order to obtain information about the catalytic activity of copper, silver, nickel and palladium in the oxidation reaction of formaldehyde as well as glyoxylic acid. Metals with high catalytic activity for each reductant oxidation can be determined by using cyclic voltammetry. These metals are candidates for an improved activation process. Electrochemical measurements showed that palladium does not have the highest catalytic activity of all tested metals. Therefore, more cost-effective, alternative metals were examined as catalysts for electroless copper plating reactions. The paper presents the results of a PhD thesis, which included tests on cheaper alternatives to palladium for activation of autocatalytic electroless copper deposition. It also includes production scale studies and conclusions on possible replacement of formaldehyde as a reducing agent for electroless copper deposition.

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38

Mori, Tomohiro, Masanobu Endo, and Hajime Kishi. "Surface Modification Using Nano-phase Structures ofEpoxy/block Copolymer Blends for Electroless Copper Plating." Journal of The Adhesion Society of Japan 51, s1 (2015): 237–38. http://dx.doi.org/10.11618/adhesion.51.237.

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39

van den Meerakker, J. E. A. M., and J. W. G. de Bakker. "On the mechanism of electroless plating. Part 3. Electroless copper alloys." Journal of Applied Electrochemistry 20, no. 1 (1990): 85–90. http://dx.doi.org/10.1007/bf01012475.

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40

Taghavi Pourian Azar, Golnaz, Daryl Fox, Yirij Fedutik, Latha Krishnan, and Andrew J. Cobley. "Functionalised copper nanoparticle catalysts for electroless copper plating on textiles." Surface and Coatings Technology 396 (August 2020): 125971. http://dx.doi.org/10.1016/j.surfcoat.2020.125971.

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41

Xiang, Sisi, Weiping Li, Zhiyuan Qian, Liqun Zhu, and Huicong Liu. "The effect of 2-mercaptobenzothiazole on laser-assisted electroless copper plating." RSC Advances 6, no. 45 (2016): 38647–52. http://dx.doi.org/10.1039/c6ra02227h.

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Copper coatings on PET substrates (conductive treatment through laser direct structuring) were prepared from an electroless plating bath. The coatings' morphology and the plating rate were shown in the figure at various concentrations of 2-MBT.

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42

Bae, Sung, Sungsoon Kim, Seong Yi, Injoon Son, Kyung Kim, and Hoyong Chung. "Effect of Surface Roughness and Electroless Ni–P Plating on the Bonding Strength of Bi–Te-based Thermoelectric Modules." Coatings 9, no. 3 (2019): 213. http://dx.doi.org/10.3390/coatings9030213.

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In this study, electroless-plating of a nickel-phosphor (Ni–P) thin film on surface-controlled thermoelectric elements was developed to significantly increase the bonding strength between Bi–Te materials and copper (Cu) electrodes in thermoelectric modules. Without electroless Ni–P plating, the effect of surface roughness on the bonding strength was negligible. Brittle SnTe intermetallic compounds were formed at the bonding interface of the thermoelectric elements and defects such as pores were generated at the bonding interface owing to poor wettability with the solder. However, defects were not present at the bonding interface of the specimen subjected to electroless Ni–P plating, and the electroless Ni–P plating layer acted as a diffusion barrier toward Sn and Te. The bonding strength was higher when the specimen was subjected to Ni–P plating compared with that without Ni–P plating, and it improved with increasing surface roughness. As electroless Ni–P plating improved the wettability with molten solder, the increase in bonding strength was attributed to the formation of a thicker solder reaction layer below the bonding interface owing to an increase in the bonding interface with the solder at higher surface roughness.

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43

Carvalho, Alexsander T., António Pereira Nascimento Filho, Lilian Marques Silva, Maria Lucia Pereira Silva, Joana Catarina Madaleno, and Luiz Pereira. "Use of Electroless Plating Copper Thin Films for Catalysis." Materials Science Forum 514-516 (May 2006): 1328–32. http://dx.doi.org/10.4028/www.scientific.net/msf.514-516.1328.

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Recently, it was demonstrated that copper thin films show good adsorption characteristics for organic polar and non-polar compounds. Also, these films when used in small cavities can favor preconcentration of these organic compounds. It is also known that copper oxide can provide catalysis of organic compounds. Therefore, the aim of this work is the study of copper thin film catalysis when used in small cavities. Copper thin films, 25 nm thick, were deposited on silicon and/or rough silicon. These films do not show oxide on the surface when analyzed by Rutherford backscattering. Also, Raman analysis of these films showed only silicon bands, due to the substrate, however infrared spectroscopy shows oxide bands for films exposed to organic compound aqueous solutions. Cavities with copper films deposited inside were tested with a continuous flow of n-hexane, acetone or 2-propanol admitted in the system. The effluent was analyzed by Quartz Crystal Microbalance. It was shown that n-hexane or acetone can be trapped. The system also shows good reproducibility. Tests of catalysis were carried out using Raman spectroscopy and heating the films up to 300°C during 3 minutes after exposure to n-hexane, 2- propanol and acetophenone – pure or saturated aqueous solution. After the exposure, Raman spectra present intense bands only for 2-propanol, indicating that adsorption easily occurs. However, after heating with all solutions it was not found only silicon bands. Raman microscopy after heating also showed copper oxide cluster formation and, eventually, graphite formation. Although the heating provides oxide copper formation, this reaction does not produce a high amount of residues, which means that catalysis is possible in this condition. Thus, a simple device using copper thin films can be useful as sample pretreatment on microTAS development.

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44

Peng, Xiao, and Kai Yong Jiang. "Laser-Induced Electroless Copper Deposition on Modified Plastic Surface." Advanced Materials Research 424-425 (January 2012): 765–69. http://dx.doi.org/10.4028/www.scientific.net/amr.424-425.765.

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Metallization treating on the plastic surface without the mask technology was created by using a new method combining the laser technique with the electroless copper deposition,this method get rid of palladium as catalyzer in the traditional chemical plating which is high cost and environment unfriendly. The samples are examined carefully by the scanning electron microscopy; resistance and adherence of the Cu plating were inspected and analysised. The result indicated that it was feasible to fabricate compact,uniform,and good conductive Cu plating on the plastic substrate by using potassium sodium tartrate and EDTA2Na as chelating agent; the resistivity of plating is related to the deposition time; adherence is influenced by laser power,the excellent adherence to plastics surface are obtained when the laser power exceeds 5W.

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45

Ren, Yi, and Bo Lai. "Comparative study on the characteristics, operational life and reactivity of Fe/Cu bimetallic particles prepared by electroless and displacement plating process." RSC Advances 6, no. 63 (2016): 58302–14. http://dx.doi.org/10.1039/c6ra11255b.

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ITABASHI, Takeyuki, Haruo AKAHOSHI, Tadashi IIDA, Eiji TAKAI, and Naoki NISHIMURA. "Development of Formaldehyde Free Electroless Copper Plating Solution." Journal of Japan Institute of Electronics Packaging 5, no. 3 (2002): 252–56. http://dx.doi.org/10.5104/jiep.5.252.

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UMEHARA, Koji, Kazuki SHINBO, Toru SAITO, Shoji ARIIZUMI, Koichi KOBAYAKAWA, and Yuichi SATO. "Electroless Copper Plating on Liquid Crystal Polymer Films." Journal of Japan Institute of Electronics Packaging 7, no. 4 (2004): 328–32. http://dx.doi.org/10.5104/jiep.7.328.

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KOJIMA, Kayoko, Takao YAGI, and Nagamasa SHINOHARA. "Analysis of electroless copper plating baths by isotachophoresis." Journal of the Metal Finishing Society of Japan 37, no. 4 (1986): 195–99. http://dx.doi.org/10.4139/sfj1950.37.195.

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Cheng, D. H., W. Y. Xu, Z. Y. Zhang, and Z. H. Yiao. "Electroless copper plating using hypophosphite as reducing agent." Metal Finishing 95, no. 1 (1997): 34–37. http://dx.doi.org/10.1016/s0026-0576(97)81804-1.

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Liao, Yong, Shengtao Zhang, and Robert Dryfe. "Electroless copper plating using dimethylamine borane as reductant." Particuology 10, no. 4 (2012): 487–91. http://dx.doi.org/10.1016/j.partic.2011.09.009.

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